Huawei Ascend Y300 User manual

Y300 Maintenance Manual
Issue
1.0
Date
2013-01-24
HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2013-01-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
[email protected]

Y300 Maintenance Manual
About This Document
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About This Document
Purpose
Prepared by
Date
Reviewed by
Date
Approved by
Date
Change History
Date
Version
Revision Reason
Changed
Chapter
Description
Author
2012-11-14
V1.0
2013-01-06
V2.0

Y300 Maintenance Manual
Contents
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Contents
About This Document.................................................................................................................... ii
1 Product Overview .........................................................................................................................1
1.1 Appearance.......................................................................................................................................................1
1.2 Specifications...................................................................................................................................................2
2 Applicable Scope and Precautions ............................................................................................4
2.1 Applicable Scope..............................................................................................................................................4
2.2 Precautions.......................................................................................................................................................4
2.3 How to Obtain Product and Repair Information ..............................................................................................4
3 Exploded View...............................................................................................................................5
4 Components on the Main PCB ...................................................................................................8
5 Software Upgrade .......................................................................................................................11
5.1 Upgrade Preparation.......................................................................................................................................11
5.2 Hardware Connection.....................................................................................................................................11
5.3 Upgrade Using the USB Driver......................................................................................................................12
5.3.1 Installing the USB Driver .....................................................................................................................12
5.3.2 Performing a Normal Upgrade..............................................................................................................14
5.3.3 Performing a Forcible Upgrade.............................................................................................................17
5.4 Upgrade Using the microSD Card..................................................................................................................17
5.4.1 Performing a Normal Upgrade..............................................................................................................17
5.4.2 Performing a Forcible Upgrade.............................................................................................................18
5.5 Troubleshooting Upgrade Failures .................................................................................................................18
6 Repair Tools .................................................................................................................................20
7 Disassembly Procedure..............................................................................................................22
8 Assembly Procedure ...................................................................................................................25
9 Principles and Failure Analysis ...............................................................................................28
9.1 Y300 Conceptual Block Diagram and Introduction .......................................................................................28
9.2 Baseband Unit................................................................................................................................................29
9.2.1 Startup Management Circuit .................................................................................................................29
9.2.2 Charging Management Circuit..............................................................................................................34

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9.2.3 Clock Circuit.........................................................................................................................................38
9.2.4 Flash Memory Circuit...........................................................................................................................40
9.3 RF Unit...........................................................................................................................................................45
9.4 Peripheral Circuits..........................................................................................................................................54
9.4.1 LCD Circuit ..........................................................................................................................................54
9.4.2 Motor Circuit ........................................................................................................................................57
9.4.3 Receiver and Speaker............................................................................................................................59
9.4.4 Microphone...........................................................................................................................................63
9.4.5 Headset Circuit......................................................................................................................................65
9.4.6 SIM Card Circuit...................................................................................................................................67
9.4.7 I/O Interface Circuit..............................................................................................................................70
9.4.8 microSD Card Port Circuit....................................................................................................................71
9.4.9 FM and Bluetooth Circuit .....................................................................................................................72
10 Solder Points on the PCB and BGA Chip.............................................................................76
11 Functional Tests.........................................................................................................................86
11.1 Keys..............................................................................................................................................................86
11.2 MMI Tests ....................................................................................................................................................87
11.3 Voice Call Test..............................................................................................................................................87

Y300 Maintenance Manual
1 Product Overview
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1 Product Overview
1.1 Appearance
Figure 1-1 shows the appearance of the Y300.
Figure 1-1 Appearance of theY300

Y300 Maintenance Manual
1 Product Overview
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1.2 Specifications
Table 1-1 lists the Y300 specifications.
Table 1-1 Y300 specifications
Item
Description
Dimensions (H x W x D)
11.1 mm x 124.5 mm x 63.8 mm (0.44 in. x 4.90 in. x
2.51 in.)
Technical standard
WCDMA
Frequency bands
Y300-0000:
GSM: 850/900/1800/1900 MHz
WCDMA: 900/2100 MHz
Y300-0100:
GSM: 850/900/1800/1900 MHz
WCDMA: 900/2100 MHz
Y300-0151:
GSM: 850/900/1800/1900 MHz
WCDMA: 850/1900/2100 MHz
Weight
About 120 g (with battery)
Type
Bar-type
Antenna
Built-in
Charger
5 V, 550 mA
Flash memory
ROM: 4 GB
RAM: 512 MB
Camera
Y300-0000: 5 MP full-frame rear camera
Y300-0100 and Y300-0151: 5 MP autofocus rear camera
and 0.3 MP full-frame front camera
Bluetooth
WCN2243
Bluetooth v2.1
Wi-Fi
802.11b/g/n
Battery
Lithium-ion
battery
1730 mAh
Display
Resolution
800 ×480 pixels
LCD type
IPS
Color
16.7 M
LCD size
4.0 inches
Ports
Charging port
Micro-USB port

Y300 Maintenance Manual
1 Product Overview
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Item
Description
USB port
Micro-USB port
microSD card
slot
microSD card slot
Headset jack
3.5-mm headset jack
Temperature
Operating temperature: –10°C to +55°C
Storage temperature: –40°C to +70°C
Humidity
Operating humidity: 5% to 95% RH

Y300 Maintenance Manual
2 Applicable Scope and Precautions
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2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by
Huawei. Being Huawei proprietary, this document is accessible only for authorized service
centers and companies. Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, contact
Huawei's customer service.
2.2 Precautions
Only qualified technicians are allowed to perform repair and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
Ensure that all the components, screws, and insulators are properly installed after repair
and calibration, and that all cables and wires are installed and connected correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do
ESD is the main cause of damage to electrostatic-sensitive components. Each
ASC must exercise caution to avoid ESD damage and comply with the ESD
protection requirements in this manual.

Y300 Maintenance Manual
3 Exploded View
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3 Exploded View
Figure 3-1 shows the exploded view of the Y300.
Figure 3-1 Exploded view
Table 3-1 lists components in the exploded view.
Table 3-1 Components in the exploded view
No.
Description
Quantity
1
Touch panel
1

Y300 Maintenance Manual
3 Exploded View
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No.
Description
Quantity
2
Front cover assembly
1
3
Power key flexible printed circuit (FPC)
1
4
Receiver
1
5
LCD
1
6
Proximity sensor sheath
1
7
PCB
1
8
Water-indicating label
1
9
LCD conductive foam
2
10
Conductive foam of the rear camera
1
11
Rear camera
1
12
Speaker
1
13
Rear cover assembly
1
14
Tamper-resistant label
1
15
GPS antenna
1
16
Wi-Fi antenna
1
17
Battery cover
1
18
Battery
1
19
Product label
1
20
Volume key FPC
1
21
Screws
8
22
Main antenna
1
23
SIM card FPC
1

Y300 Maintenance Manual
3 Exploded View
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No.
Description
Quantity
24
BB shielding cover
1
25
RF shielding cover
1
26
Front camera (for the Y300-0100 and Y300-0151 only)
1
27
PM shielding cover
1
The components listed in Table 3-1 are structural parts of the phone, and cannot be used as reference
when requesting spare parts.

Y300 Maintenance Manual
4 Components on the Main PCB
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4 Components on the Main PCB
6
13 14
15
17

Y300 Maintenance Manual
4 Components on the Main PCB
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9
7
5
10
3
2
4
1
11
12
88
16
The following component list is for your reference only and subject to changes without
notices. The latest component list is available in Huawei's ITEM information system. If you
have any question, contact your local technical support center.
Table 4-1 lists components on the main PCB.

Y300 Maintenance Manual
4 Components on the Main PCB
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Table 4-1 Components on the main PCB
No.
BOM
Description
1
40060324
MCP, 4 GB eMMC, 52 MHz, 1024 KB, 3.3 V/1.8 V, FBGA153(Pb
free), 4 Gb (128 M*32) LPDDR1, Terminal Dedicated
2
39200401
Terminal Baseband process IC, WCDMA/GSM Dual mode
BASEBAND PROCESSOR MSM8225-0, 1.2 V/1.8 V/2.85 V, 576
NSP(Pb free)
3
12020125
Crystal, 0.032768MHz, 12.5pF+/-30ppm, 60/80kohm, 3.2*1.5 SMD,
Terminal Dedicate, ELOM, TS16949
4
12070013
Temperature Compensated Crystal Oscillator, 19.2 MHz, +/-0.2 ppm,
2.8 V, +/-2.0 ppm, Terminal Dedicated
5
39200333
Terminal Dedicated IC, WCMDA/GSM Radio
Transceiver(RTR6285A), 2.7 V/2.6 V/2.1 V, 137CSP, Terminal
Dedicated
6
47100464
RF Power Amplifying Module, 1920 MHz~1980 MHz, 28 dB type. at
Pout = 28 dBm, 28 dBm, QFN, Terminal Dedicated
7
47140048
RF Switch, 824~960 MHz/1710~2170 MHz, SP9T FEM, 1.2/1.35,
1.8:1, QFN, Terminal Dedicated
8
39210039
Terminal peripheral IC, Single Band 2.4 GHz WLAN chip-AR6005,
1.3 V 1.8 V 3.3 V, BGA67-16, Terminal Dedicated
9
39200332
Power Management IC(PM8029), 3.0~4.4 V, 140WLNSP (pb-free),
Terminal Dedicated
10
47100586
RF Power Amplifying Module, 824—849 MHz, 880~915 MHz,
1710~1785 MHz, 1850~1910 MHz-35 dBm, LGA, Terminal
Dedicated
11
23060084
CMOS, 5 Mega pixels, Terminal Dedicated
12
39210040
Terminal peripheral IC, Single Band 2.4 GHz BT/FM chip, 1.3 V 1.8 V
3.3 V, BGA58-22, Terminal dedicated
13
38140064
Semiconductor Sensor, Accelerometer, LGA, 3axis, Terminal
Dedicated
14
22050091
Microphone, -44 dB, D4*1.5 mm, wideband, terminal
15
38140032
Semiconductor Sensor, APS/ALS/IR Sensor, QFN8, Terminal
Dedicated
16
32050032
Oscillating Motor, SMT, 2.7, 75 A, 14000 rpm, 11 mm*4.4 mm*3.6
mm, Null, 28ohm
17
14240646
IO Connector, Micro_B-Female, 5 pin, 1.77 mm Height from PCB Top
Side, SMT, Terminal Dedicated

Y300 Maintenance Manual
5 Software Upgrade
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5 Software Upgrade
5.1 Upgrade Preparation
Table 5-1 lists the items to be prepared for a software upgrade.
Table 5-1 Items to be prepared
Item
Description
Remarks
Upgrade environment
Battery
The battery level must be more than two bars.
microSD card
512 MB or more
Computer
Used to copy upgrade files.
Upgrade package
Main upgrade
package
This version is provided for reference only.
Use the latest released version.
Customization
package
Upgrade the software using the customization
package provided by the operator.
Upgrade method
Upgrading using
the microSD card
Normal upgrade
Forcible upgrade
5.2 Hardware Connection
Figure 5-1 shows the hardware connection.

Y300 Maintenance Manual
5 Software Upgrade
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Figure 5-1 Hardware connection
Y300
USB cable Computer
1PC
5.3 Upgrade Using the USB Driver
5.3.1 Installing the USB Driver
To install the USB driver:
Step 1 Double-click DriverSetup.exe to display the dialog box shown in Figure 5-2, and click
Install to start the installation.
Figure 5-2 Installing the USB driver
Figure 5-3 shows the installation progress.

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Figure 5-3 Installation progress
Step 2 After the installation is completed, click Close, as shown in Figure 5-4.
Figure 5-4 Closing the dialog box
Step 3 Power on the Y300, connect it to the computer using a USB cable, and click Device Manager
to display the Computer Management window. Then, check that the port information is
correct, as shown in Figure 5-5.

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Figure 5-5 Computer Management window
----End
5.3.2 Performing a Normal Upgrade
To perform a normal upgrade:
Step 1 Power on the Y300, and use a USB cable to connect the Y300 to the computer on which the
USB driver and 10KNewMu have been installed.
Step 2 Double-click 10KNewMu.
Step 3 Click to display the Open dialog box, select the upgrade file, and click Next, as shown
in Figure 5-6.

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5 Software Upgrade
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Paths shown in Figure 5-6 are examples.
Figure 5-6 Select Bin File dialog box
Step 4 Click Scan && Download to start the upgrade, as shown in Figure 5-7.
Figure 5-7 Starting the upgrade
Figure 5-8 shows the upgrade progress.