Huawei Ascend Y300 User manual

Y300 Maintenance Manual
Issue
1.0
Date
2013-01-24
HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2013-01-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
i
Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
[email protected]

Y300 Maintenance Manual
About This Document
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ii
About This Document
Purpose
Prepared by
Date
Reviewed by
Date
Approved by
Date
Change History
Date
Version
Revision Reason
Changed
Chapter
Description
Author
2012-11-14
V1.0
2013-01-06
V2.0

Y300 Maintenance Manual
Contents
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Contents
About This Document.................................................................................................................... ii
1 Product Overview .........................................................................................................................1
1.1 Appearance.......................................................................................................................................................1
1.2 Specifications...................................................................................................................................................2
2 Applicable Scope and Precautions ............................................................................................4
2.1 Applicable Scope..............................................................................................................................................4
2.2 Precautions.......................................................................................................................................................4
2.3 How to Obtain Product and Repair Information ..............................................................................................4
3 Exploded View...............................................................................................................................5
4 Components on the Main PCB ...................................................................................................8
5 Software Upgrade .......................................................................................................................11
5.1 Upgrade Preparation.......................................................................................................................................11
5.2 Hardware Connection.....................................................................................................................................11
5.3 Upgrade Using the USB Driver......................................................................................................................12
5.3.1 Installing the USB Driver .....................................................................................................................12
5.3.2 Performing a Normal Upgrade..............................................................................................................14
5.3.3 Performing a Forcible Upgrade.............................................................................................................17
5.4 Upgrade Using the microSD Card..................................................................................................................17
5.4.1 Performing a Normal Upgrade..............................................................................................................17
5.4.2 Performing a Forcible Upgrade.............................................................................................................18
5.5 Troubleshooting Upgrade Failures .................................................................................................................18
6 Repair Tools .................................................................................................................................20
7 Disassembly Procedure..............................................................................................................22
8 Assembly Procedure ...................................................................................................................25
9 Principles and Failure Analysis ...............................................................................................28
9.1 Y300 Conceptual Block Diagram and Introduction .......................................................................................28
9.2 Baseband Unit................................................................................................................................................29
9.2.1 Startup Management Circuit .................................................................................................................29
9.2.2 Charging Management Circuit..............................................................................................................34

Y300 Maintenance Manual
Contents
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9.2.3 Clock Circuit.........................................................................................................................................38
9.2.4 Flash Memory Circuit...........................................................................................................................40
9.3 RF Unit...........................................................................................................................................................45
9.4 Peripheral Circuits..........................................................................................................................................54
9.4.1 LCD Circuit ..........................................................................................................................................54
9.4.2 Motor Circuit ........................................................................................................................................57
9.4.3 Receiver and Speaker............................................................................................................................59
9.4.4 Microphone...........................................................................................................................................63
9.4.5 Headset Circuit......................................................................................................................................65
9.4.6 SIM Card Circuit...................................................................................................................................67
9.4.7 I/O Interface Circuit..............................................................................................................................70
9.4.8 microSD Card Port Circuit....................................................................................................................71
9.4.9 FM and Bluetooth Circuit .....................................................................................................................72
10 Solder Points on the PCB and BGA Chip.............................................................................76
11 Functional Tests.........................................................................................................................86
11.1 Keys..............................................................................................................................................................86
11.2 MMI Tests ....................................................................................................................................................87
11.3 Voice Call Test..............................................................................................................................................87

Y300 Maintenance Manual
1 Product Overview
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1 Product Overview
1.1 Appearance
Figure 1-1 shows the appearance of the Y300.
Figure 1-1 Appearance of theY300

Y300 Maintenance Manual
1 Product Overview
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1.2 Specifications
Table 1-1 lists the Y300 specifications.
Table 1-1 Y300 specifications
Item
Description
Dimensions (H x W x D)
11.1 mm x 124.5 mm x 63.8 mm (0.44 in. x 4.90 in. x
2.51 in.)
Technical standard
WCDMA
Frequency bands
Y300-0000:
GSM: 850/900/1800/1900 MHz
WCDMA: 900/2100 MHz
Y300-0100:
GSM: 850/900/1800/1900 MHz
WCDMA: 900/2100 MHz
Y300-0151:
GSM: 850/900/1800/1900 MHz
WCDMA: 850/1900/2100 MHz
Weight
About 120 g (with battery)
Type
Bar-type
Antenna
Built-in
Charger
5 V, 550 mA
Flash memory
ROM: 4 GB
RAM: 512 MB
Camera
Y300-0000: 5 MP full-frame rear camera
Y300-0100 and Y300-0151: 5 MP autofocus rear camera
and 0.3 MP full-frame front camera
Bluetooth
WCN2243
Bluetooth v2.1
Wi-Fi
802.11b/g/n
Battery
Lithium-ion
battery
1730 mAh
Display
Resolution
800 ×480 pixels
LCD type
IPS
Color
16.7 M
LCD size
4.0 inches
Ports
Charging port
Micro-USB port

Y300 Maintenance Manual
1 Product Overview
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Item
Description
USB port
Micro-USB port
microSD card
slot
microSD card slot
Headset jack
3.5-mm headset jack
Temperature
Operating temperature: –10°C to +55°C
Storage temperature: –40°C to +70°C
Humidity
Operating humidity: 5% to 95% RH

Y300 Maintenance Manual
2 Applicable Scope and Precautions
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2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by
Huawei. Being Huawei proprietary, this document is accessible only for authorized service
centers and companies. Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, contact
Huawei's customer service.
2.2 Precautions
Only qualified technicians are allowed to perform repair and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
Ensure that all the components, screws, and insulators are properly installed after repair
and calibration, and that all cables and wires are installed and connected correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do
ESD is the main cause of damage to electrostatic-sensitive components. Each
ASC must exercise caution to avoid ESD damage and comply with the ESD
protection requirements in this manual.

Y300 Maintenance Manual
3 Exploded View
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3 Exploded View
Figure 3-1 shows the exploded view of the Y300.
Figure 3-1 Exploded view
Table 3-1 lists components in the exploded view.
Table 3-1 Components in the exploded view
No.
Description
Quantity
1
Touch panel
1