Hytera PNC 550 User manual

PNC550 Smart PoC Radio
Service Manual

Preface
This manual describes the information related to the product repair. It is intended for use by qualified
technicians only. Before repairing the product properly, please read this manual carefully.
This manual is applicable to the following product:
PNC550 Smart PoC Radio

Copyright Information
Hytera is the trademark or registered trademark of Hytera Communications Corporation Limited (the
Company) in the People's Republic of China (PRC) and/or other countries or areas. The Company retains
the ownership of its trademarks and product names. All other trademarks and/or product names that may
be used in this manual are properties of their respective owners.
The product described in this manual may include the Company's computer programs stored in memory or
other media. Laws in PRC and/or other countries or areas protect the exclusive rights of the Company with
respect to its computer programs. The purchase of this product shall not be deemed to grant, either directly
or by implication, any rights to the purchaser regarding the Company's computer programs. The
Company's computer programs may not be copied, modified, distributed, decompiled, or
reverse-engineered in any manner without the prior written consent of the Company.
Disclaimer
The Company endeavors to achieve the accuracy and completeness of this manual, but no warranty of
accuracy or reliability is given. All the specifications and designs are subject to change without notice due
to continuous technological development. No part of this manual may be copied, modified, translated, or
distributed in any manner without the prior written consent of the Company.
We do not guarantee, for any particular purpose, the accuracy, validity, timeliness, legitimacy or
completeness of the third-party products and contents involved in this manual.
If you have any suggestions or would like to receive more information, please visit our website at:
http://www.hytera.com.

Documentation Information
This section describes conventions and revision history of this document.
Conventions
Icon Conventions
Icon Description
Indicates information that can help you make better use of your product.
Indicates references that can further describe the related topics.
Indicates situations that could cause data loss or equipment damage.
Indicates situations that could cause minor injury.
Indicates situations that could cause major personal injury or even death.
Notation Conventions
Notation Description Example
Boldface
Denotes menus, tabs, parameter
names, window names, dialogue
names, and hardware buttons.
To save the configuration, click Apply.
The Log Level Settings dialogue appears.
Press the PTT key.
" "
Denotes messages, directories, file
names, folder names, and
parameter values.
The screen displays "Invalid Battery!"
Open "PDT_PSS.exe".
Go to "D:/opt/local".
In the Port text box, enter "22".
>
Directs you to access a multi-level
menu.
Go to File > New.
Italic Denotes document titles.
For details about using the DWS, refer to
Dispatch Workstation User Guide.
Courier New
Denotes commands and their
execution results.
To set the IP address, run the following
command:
vos-cmd - m name IP

Revision History
Version Release Date Description
V00 March 2020 Initial release.

B9
Contents
i
Contents
1. Product Layout...................................................................................................................................... 1
2. Disassembly and Reassembly ............................................................................................................. 2
2.1 Precautions........................................................................................................................................ 2
2.2 Tools.................................................................................................................................................. 2
2.3 Procedures ........................................................................................................................................ 3
3. Exploded View and Packaging Guide.................................................................................................. 7
3.1 Exploded View................................................................................................................................... 7
3.2 Packaging Guide ............................................................................................................................. 10
4. Specifications ...................................................................................................................................... 11
5. Circuit Description .............................................................................................................................. 14
5.1.1 Baseband Section ................................................................................................................. 14
5.1.2 RF Section............................................................................................................................. 18
6. Troubleshooting Flowchart ................................................................................................................ 22
6.1.1 Main Board Circuit ................................................................................................................. 22
6.1.2 Main Circuit............................................................................................................................ 23
6.1.3 Diversity Circuit...................................................................................................................... 24
6.1.4 LCD Circuit ............................................................................................................................ 26
6.1.5 Camera Circuit....................................................................................................................... 27
6.1.6 Receiver Circuit ..................................................................................................................... 28
6.1.7 Speaker Circuit ...................................................................................................................... 29
6.1.8 Top Microphone Circuit .......................................................................................................... 30
6.1.9 Bottom Microphone Circuit .................................................................................................... 31
6.1.10 Proximity Sensor/Ambient Light Sensor/LED Circuit ........................................................... 32
6.1.11 USB Circuit .......................................................................................................................... 33
6.1.12 Earpiece Circuit ................................................................................................................... 34
6.1.13 GPS/WLAN/BT Circuit ......................................................................................................... 35
7. Interface Definition.............................................................................................................................. 37
8. Tuning Description.............................................................................................................................. 38
8.1 Installing the Driver .......................................................................................................................... 38
8.1.1 Preparation ............................................................................................................................ 38
8.1.2 Procedure .............................................................................................................................. 38
8.1.3 Port Verification ..................................................................................................................... 42
8.2 Upgrading Software in Low Level Format ........................................................................................ 42
8.2.1 Preparation ............................................................................................................................ 42
8.2.2 Procedure .............................................................................................................................. 42
8.2.3 MMI Test ................................................................................................................................ 44
9. PCB View ............................................................................................................................................. 49

Contents
B9
ii
10. Block Diagram ................................................................................................................................... 53
11. Schematic Diagram ........................................................................................................................... 54
12. Part List.............................................................................................................................................. 73
12.1 Main Board .................................................................................................................................... 73
12.1.1 Baseband ............................................................................................................................ 73
12.1.2 RF & GPS............................................................................................................................ 80
12.1.3 WLAN .................................................................................................................................. 85
12.1.4 NFC ..................................................................................................................................... 87
12.2 Deputy Board (Earpiece Board)..................................................................................................... 89

B9
Product Layout
1
1. Product Layout

Disassembly and Reassembly
B9
2
2. Disassembly and Reassembly
This chapter describes how to disassemble the radio. To reassemble the radio, do vice versa.
When reassembling the radio, make sure that the waterproof ring is evenly inserted into the original
position to ensure the waterproof performance of the radio.
2.1 Precautions
Waterproof Test
If the same level of protection as the original is required, waterproof test must be performed on the
repaired products.
The radio can be repaired and tested only by the technicians trained and certified by the Company.
Otherwise, the waterproof performance may be affected. Only authorized maintenance center can
guarantee the same level of protection as the original for repaired products.
If your dealer cannot conduct the waterproof test, send the product back to our company or contact
any authorized maintenance center nearby for help.
Reassembly
Ensure that each FPC connector is in place. It is prohibited to replace the connector PORON.
Make sure that the board-to-board connector is assembled properly and no damage is caused to
the FPC.
It is prohibited to process any sealing position.
Do not process chassis on your own. Use chassis only provided by the Company.
2.2 Tools
Phillips screwdriver
T5 screwdriver
Tweezers

B9
Disassembly and Reassembly
3
2.3 Procedures
1. Remove the battery.
a. Turn off the radio.
b. Slide the battery latch to the position ○ 1, and then remove the battery cover ○ 2 .
c. Press the buckle position on the bottom of the battery, and lift up ○
3to remove the battery ○ 4.
2. Disassemble the chassis.
a. Use a tweezers to remove the two screw stoppers on the top ○
5 .
Do not scratch the rear cover during operation.
b. Use a T5 screwdriver to remove the 10 screws ○ 6 .
c. Remove the chassis ○
7 .

Disassembly and Reassembly
B9
4
3. Disassemble the main board kit.
a. Use a Phillips screwdriver to remove the two screws on the main board ○
8 .
b. Remove the three FPC connectors (LCM FPC, key FPC, and main-deputy board FPC) ○
9 .
c. Remove the RF cable connector and RF cable ○
10 .
d. Remove the main board ○
11 .
4. Disassemble the speaker kit.
a. Remove the connector on the Type-C adapter board ○
12 .
b. Use a Phillips screwdriver to remove the four screws on the speaker bracket ○
13 .
c. Remove the speaker connector ○
14 .
d. Remove the speaker module ○
15 .

B9
Disassembly and Reassembly
5
5. Use a Phillips screwdriver to remove the three screws on the Type-C adapter board ○
16 , and then
remove the adapter board ○
17 .
6. Disassemble the deputy board kit.
a. Remove the FPC connector on the deputy board ○
18 .
b. Use a Phillips screwdriver to remove the two screws on the deputy board ○
19 .
c. Remove the deputy board ○
20 .

Disassembly and Reassembly
B9
6

B9
Exploded View and Packaging Guide
7
3. Exploded View and Packaging Guide
3.1 Exploded View
No. Part No. Description Qty No. Part No. Description Qty
1 50100200060101 TP LCM 1 33 5116000002909A SIM card clip 2
2 5113040060021A Receiver dustproof net 1 34 5116000002755A Flashlight lens 1
3 5113070060021A TP double-sided
adhesive tape 1
35 5113010060221A Battery latch PC pad 2
4 5116000002846A Front housing 1 36 51049900000559 Pogo pin connector 1
5 5116000001428A Emergency key bracket 1 37 5116000002847A Chassis 1
6 5110020000076A Silicone rubber
emergency key 1
38 5110030060285A Waterproof ring for
screw 4
7 5113030060001A
Waterproof and
breathable film for
silicone rubber Mic
3
39 5107000060028A Machine screw 10

Exploded View and Packaging Guide
B9
8
No. Part No. Description Qty No. Part No. Description Qty
8 5110010060061A
Waterproof and
breathable film for
silicone rubber Mic
2 40 5110990060129A Screw plug 2
9 50100500060001 Front camera 1 41 5113070000052A
Double-sided
adhesive tape for rear
camera
2
10 11500000005576 Keyboard FPC 1 42 5116000000843A Camera lens 2
11 5110030060104A Waterproof ring 1 43 5121000060167A NFC antenna 1
12 5112010060004A Metal dome 1 44 5116000002850A Battery cover 1
13 5113020060025A Floodlight diffuser film 1 45 5116000002851A Battery latch 1
14 5110010000044A Light-sensitive silicone
rubber case 1
46 5113050060021A Buffer foam 2
15 11500000005575 Light-sensitive and
tricolor light FPC 1
47 5111000002417A Fixing sheet 1
16 5113070060028A
Double-sided adhesive
tape for light-sensitive
FPC
1 48 32010000000243 Smart Li-ion battery
pack 1
17 5116000002910A Photosensitive light
bracket 1
49 5116000060010A Diversity antenna
FPC 1
18 5113070060122A
Double-sided adhesive
tape for photosensitive
light bracket
1 50 5113050000275A BTB preloaded foam 10
19 5116000002848A PTT key bracket 1 51 5105050060126A RF cable 1
20 51020500000011 Receiver 1 52 11500000005573 Main-deputy board
FPC 1
21 5115020060043A Main board conductive
foam 1 1
53 5107000000041A Self-tapping screw 5
22 5115020060044A Main board conductive
foam 2 1
54 11500000005572 Type-C switching
FPC 1
23 5115020060085A Main board conductive
foam 3 1 55 5116000002849A PTT key cover 1
24 54991010002021 Main board 1 56 11500000005570 Deputy board
(earpiece board) 1
25 5116000060021A LTE antenna and bracket 1 57 5116000002911A P&R key 1
26 5107000000371A Machine screw 6 58 51020600000141 Speaker 1
27 50100500060022 Rear camera 1 59 5116000002857A Speaker bracket 1
28 5113990000157A Front camera foam 1 60 5110030060105A Waterproof ring for
speaker 1
29 5113990060123A Preloaded foam for
flashlight FPC 1 61 5113040060022A Speaker dustproof net
1
30 11500000005574 Flashlight FPC 1 62 5111000002418A Charger spring plate 2
31 5113070060027A
Double-sided adhesive
tape for flashlight FPC
pin
1 63 5118000000294A Charging piece 2

B9
Exploded View and Packaging Guide
9
No. Part No. Description Qty No. Part No. Description Qty
32 5113070060024A Double-sided adhesive
tape for flashlight FPC 1 64 5110030000086A Waterproof ring for
radio charging piece 2
The part number is subject to change without notice due to product upgrade.

Exploded View and Packaging Guide
B9
10
3.2 Packaging Guide

B9
Specifications
11
4. Specifications
General
Operating system Android OS 8.1
CPU Qualcomm platform: 1.8 GHz
Storage
External memory 32 GB ROM and 3 GB RAM
Extended memory 64 GB at most
Dimensions (H x W x
D)
156.5 mm x 76 mm x 14 mm
Weight (with standard
battery)
< 250 g
Display
Size: 5.0 inch
Resolution: 1280 x 720
Touch screen
Battery Li-Ion battery: 4000 mAh
Charge mode Desktop charger or multi-unit charger
Operating voltage 3.3–4.35 V
SIM card
Type: Nano SIM card
Quantity: 2
Audio
Microphone
Quantity: 2
Noise reduction
Speaker
Receiver: 1
Speaker: 1
Max. audio power: 2 W
Camera
Front camera 8MP FF
Rear camera 13MP AF
Antenna Internal; MISO

Specifications
B9
12
Sensor
Proximity sensor
Ambient light sensor
Gravity sensor
Compass
Accessory port
Type-C USB (data and charging)
Audio connector: 3.5 mm
Network
Network All networks
Frequency band
GSM: 850/900/1800/1900
W-CDMA: B2/B4/B5
TDD-LTE: B38
FDD-LTE: B2/B3/B4/B5/B7/B12/B13/B17/B26/B28
LTE protocol 3GPP
Speed class CAT4
Wireless Module
BT BT4.1
WLAN 2.4 GHz, 802.11 b/g/n
GPS
Tracking sensitivity: < –156 dB
Time to First Fix (cold start): < 50s@–130 dBm
Time to First Fix (hot start): < 5s@–130 dBm
Recapture: < 5s@–130 dBm
Positional accuracy: < 10 m@–130 dBm
Environment
Storage temperature –30°C to +70°C
Operating temperature –20°C to +60°C
Drop protection 1.2 m

B9
Specifications
13
Electrostatic discharge
(ESD)
IEC 61000-4-2 (level 4)
±12 kV (air)
±8 kV (contact)
Water & Dust
Protection
IP67
Wet, Shock & Vibration
Protection
MIL-STD-810 G
All specifications are tested according to applicable standards, and subject to change without
notice due to continuous technological development.