IBASE Technology ISR301 User manual

ISR301
Ruggedized Embedded System
with NXP ARM®Cortex®
A53 i.MX8M Quad SoC
User’s Manual
Document Version 1.2
(Oct. 2020)

ISR301 User’s Manual
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Copyright
©2020 IBASE Technology, Inc. All rights reserved.
No part of this publication may be reproduced, copied, stored in a retrieval system, translated
into any language or transmitted in any form or by any means, electronic, mechanical,
photocopying, or otherwise, without the prior written consent of IBASE Technology, Inc.
(hereinafter referred to as “IBASE”).
Disclaimer
IBASE reserves the right to make changes and improvements to the products described in
this document without prior notice. Every effort has been made to ensure the information in
the document is correct; however, IBASE does not guarantee this document is error-free.
IBASE assumes no liability for incidental or consequential damages arising from misuse or
inability to use the product or the information contained herein, and for any infringements of
rights of third parties, which may result from its use.
Trademarks
All the trademarks, registrations and brands mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

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Compliance
The product described in this manual complies with all applicable European Union
(CE) directives if it has a CE marking. For systems to remain CE compliant, only CE-
compliant parts may be used. Maintaining CE compliance also requires proper cable
and cabling techniques.
This product has been tested and found to comply with the limits for a Class B
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with manufacturer’s instructions, may cause
harmful interference to radio communications.
WEEE
This product must not be disposed of as normal household waste, in
accordance with the EU directive of for waste electrical and electronic
equipment (WEEE - 2012/19/EU). Instead, it should be disposed of by
returning it to a municipal recycling collection point. Check local
regulations for disposal of electronic products.
Green IBASE
This product complies with the current RoHS directives restricting the
use of the following substances in concentrations not to exceed 0.1%
by weight (1000 ppm) except for cadmium, limited to 0.01% by weight
(100 ppm).
•Lead (Pb)
•Mercury (Hg)
•Cadmium (Cd)
•Hexavalent chromium (Cr6+)
•Polybrominated biphenyls (PBB)
•Polybrominated diphenyl ether (PBDE)

ISR301 User’s Manual
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Important Safety Information
Carefully read the following safety information before using this device.
Setting up your system:
•Put the device horizontally on a stable and solid surface.
•Do not use this product near water or any heated source.
•Leave plenty of space around the device and do not block the ventilation
openings. Never drop or insert any objects of any kind into the openings.
•Use this product in environments with ambient temperatures between 0˚C and
60˚C.
Care during use:
•Do not place heavy objects on the top of the device.
•Make sure to connect the correct voltage to the device. Failure to supply the
correct voltage could damage the unit.
•Do not walk on the power cord or allow anything to rest on it.
•If you use an extension cord, make sure the total ampere rating of all devices
plugged into the extension cord does not cord’s ampere rating.
•Do not spill water or any other liquids on your device.
•Always unplug the power cord from the wall outlet before cleaning the device.
•Only use neutral cleaning agents to clean the device.
•Vacuum dust and particles from the vents by using a computer vacuum cleaner.
Product Disassembly
Do not try to repair, disassemble, or make modifications to the device. Doing so will
void the warranty and may result in damage to the product or personal injury.
CAUTION
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries by observing local regulations.

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Warranty Policy
•IBASE standard products:
24-month (2-year) warranty from the date of shipment. If the date of shipment
cannot be ascertained, the product serial numbers can be used to determine
the approximate shipping date.
•3rd-party parts:
12-month (1-year) warranty from delivery for 3rd-party parts that are not
manufactured by IBASE, such as CPU, CPU cooler, memory, storage devices,
power adaptor, display panel and touch screen.
＊PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,
IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL BE
TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL BE BILLED
FOR REPAIR AND SHIPPING CHARGES.
Technical Support & Services
1. Visit the IBASE website at www.ibase.com.tw to find the latest information about
the product.
2. If you encounter any technical problems and require assistance from your
distributor or sales representative, please prepare and send the following
information:
•Product model name
•Product serial number
•Detailed description of the problem
•Error messages in text or screenshots if any
•The arrangement of the peripherals
•Software used (such as OS and application software)
3. If repair service is required, please download the RMA form at
http://www.ibase.com.tw/english/Supports/RMAService/.
Fill out the form and contact your distributor or sales representative.

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Table of Contents
Compliance....................................................................................................iii
Important Safety Information.......................................................................iv
CAUTION .......................................................................................................iv
Warranty Policy..............................................................................................v
Technical Support & Services ......................................................................v
Chapter 1 General Information................................................................1
1.1 Introduction...............................................................................................2
1.2 Features ...................................................................................................2
1.3 Packing List..............................................................................................2
1.4 Specifications ...........................................................................................3
1.5 Product View ............................................................................................5
1.6 Dimensions...............................................................................................6
Chapter 2 Hardware Configuration.........................................................7
2.1 Installations...............................................................................................8
2.1.1 Mini-PCIe & M.2 Cards Installation............................................8
2.1.2 WiFi / LTE Antenna Installation .................................................9
2.1.3 Mounting Installation..................................................................9
2.1.4 RS-232/422/485 COM Port......................................................10
2.1.5 COM1 & COM2 Port................................................................11
2.1.6 GPIO Port ................................................................................11
2.2 Setting the Jumpers................................................................................12
2.2.1 How to Set Jumpers ................................................................12
2.3 Jumper & Connector Locations on Motherboard....................................13
2.4 Jumper & Connectors Quick Reference.................................................14
2.4.1 RTC Lithium Cell Connector (P2) ............................................15
2.4.2 RS-232/422/485 Selection (SW3)............................................16
2.4.3 RS-232/422/485 COM Port (P20)............................................17
2.4.4 LVDS Display Connector (P13, P14).......................................18
2.4.5 RS232 COM Port Connector (P19) .........................................19
2.4.6 LVDS Backlight Control Connector (P18)................................20
2.4.7 Audio Line-In & Line-Out Connector (P9)................................21
2.4.8 Internal USB3.0 Connector (P7)..............................................22
2.4.9 Digital I/O (GPIO) Connector (P24) .........................................23

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2.4.10 MIPI-CSI Connector (P10, P26) ..............................................24
2.4.11 MIPI-DSI Connector (P12).......................................................25
2.4.12 I2C Connector (P17).................................................................26
2.4.13 Boot mode select (SW1 Factory use only) ..............................27
2.4.14 RS232 Debug Port (P25).........................................................28
Chapter 3 Software Setup......................................................................29
3.1 Make a Recovery SD Card.....................................................................30
3.1.1 Preparing the Recovery SD card to Install Linux / Android
image into eMMC ....................................................................................30
3.1.2 Upgrade Firmware through the Recovery SD Card.................31
3.2 Display Parameter Setting in Kernel (Feature not ready yet).................33
Chapter 4 BSP Source Guide................................................................34
4.1 Building BSP Source..............................................................................35
4.1.1 Preparation ..............................................................................35
4.1.2 Installing Toolchain..................................................................35
4.1.3 Building release .......................................................................35
For Yocto/uBuntu/Debian ........................................................................35
./build-bsp-4.14.sh...................................................................................35
For Android..............................................................................................35
4.1.4 Installing release to board........................................................36
.......................................................................................................................37
Appendix ......................................................................................................37

1
Chapter 1
General Information
The information provided in this chapter includes:
•Features
•Packing List
•Specifications
•Product View
•Dimensions

General Information
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1.1 Introduction
ISR301 is an ARM®-based embedded system built with NXP Cortex®i.MX8M
A53 processor. The device features 2D, 3D graphics and multimedia
acceleration, aside from the numerous peripheral support it has that are well
suited for industrial applications, including RS-232/422/485, GPIO, USB, USB
OTG, LAN, HDMI interface, M.2 E2230 for wireless connectivity and a mini-
PCIe expansion slot.
1.2 Features
•NXP ARM®Cortex®A53 i.MX8M Quad 1.3GHz industrial-grade processor
•Video output through the HDMI interface
•3GB LPDDR4, 16GB eMMC and SD socket
•Rich I/O interface with RS-232/422/485 GPIO, USB, USB-OTG and Ethernet
•M.2 E2230 & mini-PCIe slots with a SIM socket for wireless connectivity
1.3 Packing List
Your product package should include the items listed below.
•ISR301-Q316I
The user’s manual can be downloaded from the IBASE website.

General Information
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1.4 Specifications
Product Name
ISR301-Q316I
System
Motherboard
IBR210-Q316I-01 3.5” SBC
System
Operating
System
•Android 9.0
•Yocto v2.5
CPU Type
NXP Cortex™ A53 i.MX8M Quad Core 1.3GHz Industrial-Grade
SoC
CPU Speed
1.3 GHz
Memory
•System memory: 3GB LPDDR4
•Data Memory: 16GB eMMC
Video Codec
•4Kp60 HEVC/H.265 main, and main 10 decoder
•4Kp60 VP9 decoder
•4Kp30 AVC/H.264 decoder
•1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS,
MJPEG, H.263 decoder
RTC
IDT 1337AGDVGI8
Wireless
Wi-Fi / BT / 3G / LTE module (Optional)
Power Supply
12V-24V DC-In
Watchdog
Timer
Yes (256 segments, 0, 1, 2…128 secs)
Dimensions
(W x H x D)
162 x 36 x 116 mm (6.38” x 1.42” x 4.57”)
RoHS
Yes
Certification
CE, FCC Class B
I/O Ports
DC Jack
1 x 12V-24V DC jack
Display
1 x HDMI2.0a (up to 4K resolution)
LAN
1 x RJ45 GbE LAN
USB
•2 x USB 3.0 Type A
•1 x USB OTG via mini-USB Type B (Factory use only)
Serial
•1 x RS-232/422/485 COM port (DB9 male connector)
•2 x RS-232 COM ports (DB9 male connector)
Digital IO
8-In/Out
Expansion
Slots
•1 x M.2 E-key (2230)
•1 x Mini-PCIe (interrelated with the SIM socket)
•1 x SD socket (UHS-I SDR-104, 104MB/s max.)