IBM Z9 Technical manual

System z9
Processor Resource/Systems Manager
Planning Guide
SB10-7041-03


System z9
Processor Resource/Systems Manager
Planning Guide
SB10-7041-03


Note
Before using this information and the product it supports, be sure to read the general information
under “Safety and Environmental Notices” on page xi and Appendix C, “Notices,” on page C-1.
Fourth Edition (May 2008)
This edition, SB10-7041-03, applies to the IBM®System z9®Servers.
This edition replaces SB10-7041-02. Atechnical change to the text or illustration is indicated by avertical line to the
left of the change.
There may be anewer version of this document in PDF format available on Resource Link™.Go to
http://www.ibm.com/servers/resourcelink and click on Library on the navigation bar. Anewer version is indicated by a
lower-case alphabetic letter following the form number suffix (for example: 00a, 00b, 01a, 01b).
©Copyright International Business Machines Corporation 2005, 2008. All rights reserved.
US Government Users Restricted Rights –Use, duplication or disclosure restricted by GSA ADP Schedule Contract
with IBM Corp.
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Contents
Figures ........................... vii
Tables ............................ix
Safety and Environmental Notices .................xi
Safety Notices .........................xi
World Trade Safety Information ..................xi
Laser Safety Information......................xi
Laser Compliance .......................xi
Environmental Notices ......................xi
Product Recycling and Disposal ..................xi
Refrigeration......................... xiii
Battery Return Program .................... xiii
Flat Panel Display ...................... xiv
Monitors and Workstations ................... xiv
About This Publication ..................... xvii
What is Included in this Publication ................. xix
Related Publications .......................xx
z/Architecture ........................xx
Enterprise Systems Architecture/390 (ESA/390) ............xx
Hardware ..........................xx
Software ..........................xx
How to Send Your Comments ................... xxii
Summary of changes ..................... xxiii
Chapter 1. Introduction to Logical Partitions............. 1-1
Overview ........................... 1-2
Prerequisites for Operation .................... 1-2
PR/SM .......................... 1-2
zSeries Parallel Sysplex Support ................. 1-4
Guest Coupling Simulation ................... 1-5
Control Program Support in aLogical Partition ............ 1-5
Input/Output Configuration Program (IOCP) Support ......... 1-14
Hardware Support ...................... 1-14
Operator Training ...................... 1-14
Logical Partitions ....................... 1-15
Characteristics ....................... 1-15
Potential Applications ..................... 1-18
Compatibility and Migration Considerations .............. 1-20
Device Numbers ...................... 1-20
Multiple Subchannel Sets (MSS)................. 1-20
Control Programs ...................... 1-20
CPU IDs and CPU Addresses ................. 1-22
HSA Allocation ........................ 1-24
HSA Estimation Tool ..................... 1-24
TOD Clock Processing ..................... 1-25
No Sysplex Timer Attached and Server Time Protocol Not Enabled .... 1-25
Sysplex Timer Attached .................... 1-25
Server Time Protocol Enabled ................. 1-25
Sysplex Testing Without aSysplex Timer and Server Time Protocol Not
Enabled ......................... 1-26
©Copyright IBM Corp. 2005, 2008 iii

Synchronized Time Source and the Coupling Facility ......... 1-26
Extended TOD-Clock Facility .................. 1-26
Chapter 2. Planning Considerations ................ 2-1
Overview ........................... 2-3
Planning the I/O Configuration ................... 2-3
Planning Considerations .................... 2-3
Maximum Number of Logical Partitions............... 2-5
Managing Logical Paths for ESCON and FICON Channels ....... 2-7
Managing the Establishment of Logical Paths ............ 2-11
Shared Channel Overview ................... 2-21
Unshared ESCON or FICON Channel Recommendations ....... 2-27
Dynamically Managed CHPIDs ................. 2-27
IOCP Coding Specifications .................. 2-28
Coupling Facility Planning Considerations .............. 2-39
Test or Migration Coupling Configuration.............. 2-39
Production Coupling Facility Configuration ............. 2-40
Internal Coupling Facility (ICF) ................. 2-41
Dynamic Internal Coupling Facility (ICF) Expansion.......... 2-42
Enhanced Dynamic ICF Expansion Across ICFs ........... 2-43
System-Managed Coupling Facility Structure Duplexing ........ 2-44
Single CPC Software Availability Sysplex ............. 2-44
Coupling Facility Nonvolatility .................. 2-45
Coupling Facility Mode Setting ................. 2-45
Coupling Facility LP Definition Considerations ............ 2-46
Coupling Facility LP Storage Planning Considerations ......... 2-47
Dump Space Allocation in aCoupling Facility ............ 2-48
Coupling Facility LP Activation Considerations............ 2-49
Coupling Facility Shutdown Considerations ............. 2-49
Coupling Facility LP Operation Considerations ........... 2-49
Coupling Facility Control Code Commands ............. 2-50
Coupling Facility Level (CFLEVEL) Considerations .......... 2-50
Coupling Facility Resource Management (CFRM) Policy Considerations 2-54
Coupling Facility Channels ................... 2-54
Considerations when Migrating from ICMF to ICs ........... 2-59
Linux Operating System Planning Considerations ........... 2-59
Integrated Facility for Linux (IFL) ................ 2-59
z/VM Version 5Utilizing IFL Features ............... 2-60
System z9 Application Assist Processor (zAAP) ............ 2-60
IBM System z9 Integrated Information Processor (zIIP) ......... 2-61
Concurrent Patch ....................... 2-61
CFCC Enhanced Patch Apply................... 2-62
Dynamic Capacity Upgrade on Demand ............... 2-62
PR/SM Shared Partitions ................... 2-63
Mixed Shared and Dedicated PR/SM Partitions ........... 2-63
Multiple Dedicated PR/SM Partitions ............... 2-64
Shared Internal Coupling Facility ................ 2-64
Dynamic Capacity Upgrade on Demand Limitations........... 2-65
Concurrent Memory Upgrade ................... 2-66
Capacity Backup Upgrade (CBU) Capability ............. 2-66
Enhanced Book Availability.................... 2-67
Preparing for Enhanced Book Availability ............. 2-67
Customer Initiated Upgrade (CIU) ................. 2-70
Concurrent Processor Unit Conversion ............... 2-70
Planning for Hot Plugging Crypto Features .............. 2-71
iv PR/SM Planning Guide

Chapter 3. Determining the Characteristics of Logical Partitions ..... 3-1
Planning Overview ....................... 3-4
Performance Considerations................... 3-4
Recovery Considerations .................... 3-5
Determining the Characteristics .................. 3-5
Control Program Support .................... 3-5
IOCDS Requirements ..................... 3-6
Logical Partition Identifier .................... 3-6
Mode of Operation ...................... 3-7
Storage Configurations..................... 3-7
Central Storage ....................... 3-8
Expanded Storage ...................... 3-10
Dynamic Storage Reconfiguration ................ 3-12
Number of Central Processors ................. 3-28
Central Processor Recommendations for Intelligent Resource Director (IRD) 3-29
Processor Considerations for Linux-Only LPs ............ 3-30
Processor Considerations for Coupling Facility LPs .......... 3-30
Processor Considerations for LPs with Multiple CP Types ....... 3-35
Dedicated Central Processors ................. 3-35
Shared Central Processors................... 3-36
Enforcement of Processing Weights ............... 3-39
Defining Shared Channel Paths ................. 3-48
Dynamic CHPID Management (DCM) Considerations ......... 3-50
I/O Priority Recommendations ................. 3-50
Security-Related Controls ................... 3-50
Dynamic I/O Configuration ................... 3-52
Assigning Channel Paths to aLogical Partition ........... 3-52
Automatic Load for aLogical Partition............... 3-55
Defining Logical Partitions .................... 3-55
Global Reset Profile Definitions ................. 3-57
General .......................... 3-60
Processor Characteristics ................... 3-63
Security Characteristics .................... 3-68
Establishing Optional Characteristics ............... 3-71
Storage Characteristics .................... 3-73
Load Information ...................... 3-75
Cryptographic Characteristics .................. 3-77
Enabling Input/Output Priority Queuing .............. 3-81
Changing Logical Partition Input/Output Priority Queuing Values ..... 3-81
Moving Unshared Channel Paths ................. 3-83
Moving Unshared Channel Paths from az/OS System ........ 3-83
Moving aChannel Path from the Hardware Console ......... 3-83
Releasing Reconfigurable Channel Paths ............. 3-83
Configuring Shared Channel Paths ................. 3-84
Deconfiguring Shared Channel Paths ................ 3-84
Removing Shared Channel Paths for Service ............ 3-84
Changing Logical Partition Definitions ................ 3-84
Changes Available Dynamically to aRunning LP........... 3-84
Changes Available at the Next LP Activation ............ 3-85
Changes Available at the Next Power-On Reset (POR) ........ 3-86
Chapter 4. Operating Logical Partitions............... 4-1
Overview ........................... 4-2
Available Operator Controls .................... 4-2
Operator Controls Not Available .................. 4-4
Operator Tasks ........................ 4-5
Contents v

Editing Activation Profiles .................... 4-5
Activating aCPC ....................... 4-5
Activating an LP ....................... 4-5
Performing aLoad on an LP or Activating aLoad Profile ........ 4-5
Deactivating an LP ...................... 4-6
Locking and Unlocking an LP .................. 4-6
Deactivating aCPC ...................... 4-7
Chapter 5. Monitoring the Activities of Logical Partitions........ 5-1
Overview ........................... 5-2
Monitoring Logical Partition Activity ................. 5-2
Reviewing Current Storage Information............... 5-2
Reviewing and Changing Current Channel Status ........... 5-3
Reviewing and Changing Current Logical Partition Controls ....... 5-3
Reviewing and Changing Current Logical Partition Group Controls .... 5-3
Reviewing and Changing Current Logical Partition Security ....... 5-5
Reviewing Current Logical Partition Cryptographic Controls ....... 5-6
Reviewing Current System Activity Profile Information ......... 5-6
Reviewing and Changing Logical Partition I/O Priority Values ...... 5-7
Logical Partition Performance ................... 5-8
RMF LPAR Management Time Reporting .............. 5-8
Dedicated and Shared Central Processors ............. 5-9
CPENABLE ......................... 5-9
Start Interpretive Execution (SIE) Performance ............ 5-9
Recovery Strategy ....................... 5-10
Operation Considerations ................... 5-10
Application Preservation .................... 5-11
Transparent Sparing ..................... 5-11
Appendix A. Coupling Facility Control Code Support ......... A-1
Legend ........................... A-1
Appendix B. Developing, Building, and Delivering aCertified System B-1
Creating Common Criteria-Based Evaluations ............. B-1
Functional Characteristics .................... B-2
Trusted Configuration ...................... B-2
System z9 PR/SM Characteristics ................. B-4
Central and Expanded Storage .................. B-4
I/O Security Considerations .................... B-5
IOCDS Considerations..................... B-5
Operational Considerations ................... B-6
Input/Output Configuration Data Set (IOCDS) ............ B-8
LPAR Input/Output Configurations ................ B-8
Activation ......................... B-9
Control Authority ....................... B-9
Reconfiguring the System ................... B-10
Trusted Facility Library ..................... B-14
Appendix C. Notices ...................... C-1
Trademarks and Service Marks .................. C-2
Electronic Emission Notices.................... C-3
Glossary .......................... D-1
Index ............................ X-1
vi PR/SM Planning Guide

Figures
1-1. Characteristics of Logical Partitions ...................... 1-17
1-2. Migration of Four Production Systems to LPs .................. 1-19
1-3. Support for Three XRF Systems ....................... 1-19
1-4. CPU ID Format ............................. 1-22
1-5. CPU Identification Number Format ...................... 1-22
2-1. An ESCON Configuration that Can Benefit from Better Logical Path Management ..... 2-9
2-2. AShared ESCON Configuration that Can Benefit from Better Logical Path Management 2-10
2-3. Deactivating Unneeded Logical Partitions .................... 2-14
2-4. Configuring Offline Unneeded Channels or Shared Channels on an LP Basis....... 2-15
2-5. Defining Devices to aSubset of Logical Partitions ................. 2-17
2-6. Defining Devices to aSubset of Logical Partitions ................. 2-18
2-7. Using the ESCD to Manage Logical Paths by Prohibiting Dynamic Connections...... 2-20
2-8. Progression of Busy Condition Management Improvements ............. 2-22
2-9. Consolidating ESCON Channels and ESCON Control Unit Ports ........... 2-24
2-10. Consolidating ESCON Channels and ESCD Ports................. 2-25
2-11. Consolidating ESCON Channels Used for ESCON CTC Communications ........ 2-26
2-12. Shared Devices Using Shared ESCON Channels ................. 2-31
2-13. Physical Connectivity of Shared Device 190 ................... 2-32
2-14. Logical View of Shared Device 190 ...................... 2-33
2-15. LPAR Configuration with Duplicate Device Numbers ................ 2-34
2-16. Duplicate Device Numbers for Console..................... 2-35
2-17. Two Examples of Duplicate Device Number Conflicts ............... 2-36
2-18. Example of aPrepare for Enhanced Book Availability Results Panel .......... 2-68
2-19. Reassign Non-Dedicated Processors Panel ................... 2-70
3-1. Central Storage Layout .......................... 3-14
3-2. Reconfigured Central Storage Layout ..................... 3-15
3-3. Initial Central Storage Layout ........................ 3-16
3-4. Central Storage Layout Following Reconfiguration................. 3-17
3-5. Initial Central Storage Layout ........................ 3-18
3-6. Central Storage Layout Following Reconfiguration................. 3-19
3-7. Expanded Storage Layout ......................... 3-20
3-8. Reconfigured Expanded Storage Layout .................... 3-21
3-9. Expanded Storage Layout ......................... 3-22
3-10. Initial Central Storage Layout ........................ 3-23
3-11. Initial Expanded Storage layout ....................... 3-23
3-12. Central Storage Layout Following Reconfiguration................. 3-24
3-13. Expanded Storage Layout Following Reconfiguration................ 3-25
3-14. Backup Partition Layout Before Nonspecific Deactivation .............. 3-27
3-15. Backup Partition Layout After Nonspecific Deactivation ............... 3-27
3-16. Options Page, Reset Profile ......................... 3-57
3-17. Partitions Page, Reset Profile ........................ 3-59
3-18. General Page, Image Profile ........................ 3-60
3-19. Time Offset, Image Profile ......................... 3-61
3-20. ESA Mode Logical Partition with shared Central Processors (CPs), Integrated Facilities for
Applications (IFAs) and System z9 Integrated Information Processors (zIIPs) ....... 3-63
3-21. Customization for aLinux-Only Mode Logical Partition with shared Integrated Facilities for
Linux (IFLs). There can be both an initial and reserved specification for the IFLs. ..... 3-64
3-22. Customization for aCoupling Facility Mode Logical Partition with Dedicated Internal Coupling
Facilities (ICFs) and shared Central Processors. There can be both an initial and reserved
specification for the ICFs and the Central Processors. ............... 3-65
3-23. Security Page, Image Profile ........................ 3-69
3-24. Options Page, Image Profile......................... 3-71
3-25. Storage Page, Image Profile......................... 3-73
©Copyright IBM Corp. 2005, 2008 vii
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3-26. Load Page, Image Profile.......................... 3-75
3-27. Crypto Page, Image Profile ......................... 3-77
3-28. Enabling I/O Priority Queuing ........................ 3-81
3-29. Change LPAR I/O Priority Queuing ...................... 3-81
5-1. Storage Information Task .......................... 5-2
5-2. Change Logical Partition Controls Page ..................... 5-3
5-3. Change LPAR Group Controls ........................ 5-4
5-4. Change Logical Partition Security Page ..................... 5-5
5-5. View LPAR Cryptographic Controls Page .................... 5-6
5-6. Change LPAR I/O Priority Queuing Page .................... 5-7
5-7. ETR Increasing with CPU Utilization ...................... 5-8
viii PR/SM Planning Guide
||

Tables
1. Terminology Used in This Publication ...................... xvii
1-1. CPU IDs for az9 EC ........................... 1-23
2-1. HCD Function Support ........................... 2-3
2-2. z/VM Dynamic I/O Support for MIF and the Coupling Facility ............. 2-4
2-3. Logical Path Summary by Control Unit ..................... 2-8
2-4. MIF Maximum Channel Requirements ..................... 2-23
2-5. Nonvolatility Choices for Coupling Facility LPs .................. 2-45
2-6. Coupling Facility Mode Setting ........................ 2-46
2-7. Coupling Facility LP Storage Definition Capabilities ................ 2-48
2-8. CPC Support for Coupling Facility Code Levels.................. 2-51
3-1. Control Program Support on z9 ........................ 3-6
3-2. Central Storage Granularity ......................... 3-8
3-3. PR/SM LPAR Processor Weight Management with Processor Resource Capping 3-40
3-4. PR/SM LPAR Processor Weight Management without Processor Resource Capping 3-41
3-5. Example of Maintaining Relative Weight of aCapped Logical Partition ......... 3-42
3-6. Example Selection of Crypto Numbers ..................... 3-79
3-7. LPAR &Crypto Assignments ........................ 3-79
A-1. Coupling Facility Limits at Different Coupling Facility Code Levels ........... A-1
B-1. Trusted Facility Library for PR/SM ...................... B-14
©Copyright IBM Corp. 2005, 2008 ix

xPR/SM Planning Guide

Safety and Environmental Notices
Safety Notices
Safety notices may be printed throughout this guide. DANGER notices warn you of
conditions or procedures that can result in death or severe personal injury.
CAUTION notices warn you of conditions or procedures that can cause personal
injury that is neither lethal nor extremely hazardous. Attention notices warn you of
conditions or procedures that can cause damage to machines, equipment, or
programs.
There are no DANGER notices in this guide.
World Trade Safety Information
Several countries require the safety information contained in product publications to
be presented in their national languages. If this requirement applies to your country,
asafety information booklet is included in the publications package shipped with the
product. The booklet contains the safety information in your national language with
references to the US English source. Before using aUS English publication to
install, operate, or service this IBM product, you must first become familiar with the
related safety information in the booklet. You should also refer to the booklet any
time you do not clearly understand any safety information in the US English
publications.
Laser Safety Information
All System zmodels can use I/O cards such as PCI adapters, ESCON, FICON,
Open Systems Adapter (OSA), InterSystem Coupling-3 (ISC-3), or other I/O
features which are fiber optic based and utilize lasers or LEDs.
Laser Compliance
All lasers are certified in the U.S. to conform to the requirements of DHHS 21 CFR
Subchapter Jfor class 1laser products. Outside the U.S., they are certified to be in
compliance with IEC 60825 as aclass 1laser product. Consult the label on each
part for laser certification numbers and approval information.
CAUTION:
Data processing environments can contain equipment transmitting on system
links with laser modules that operate at greater than Class 1power levels. For
this reason, never look into the end of an optical fiber cable or open
receptacle. (C027)
CAUTION:
This product contains aClass 1M laser. Do not view directly with optical
instruments. (C028)
Environmental Notices
Product Recycling and Disposal
This unit must be recycled or discarded according to applicable local and national
regulations. IBM encourages owners of information technology (IT) equipment to
responsibly recycle their equipment when it is no longer needed. IBM offers a
variety of product return programs and services in several countries to assist
©Copyright IBM Corp. 2005, 2008 xi

equipment owners in recycling their IT products. Information on IBM product
recycling offerings can be found on IBM’s Internet site at http://www.ibm.com/ibm/
environment/products/index.shtml.
Esta unidad debe reciclarse odesecharse de acuerdo con lo establecido en la
normativa nacional olocal aplicable. IBM alos propietarios de equipos de
tecnología de la información (TI) que reciclen responsablemente sus equipos
cuando éstrecomiendaos ya no les sean útiles. IBM dispone de una serie de
programas yservicios de devolución de productos en varios países, afin de ayudar
alos propietarios de equipos areciclar sus productos de TI. Se puede encontrar
información sobre las ofertas de reciclado de productos de IBM en el sitio web de
IBM http://www.ibm.com/ibm/environment/products/index.shtml.
Notice: This mark applies only to countries within the European Union (EU) and
Norway.
Appliances are labeled in accordance with European Directive 2002/96/EC
concerning waste electrical and electronic equipment (WEEE). The Directive
determines the framework for the return and recycling of used appliances as
applicable throughout the European Union. This label is applied to various products
to indicate that the product is not to be thrown away, but rather reclaimed upon end
of life per this Directive.
In accordance with the European WEEE Directive, electrical and electronic
equipment (EEE) is to be collected separately and to be reused, recycled, or
recovered at end of life. Users of EEE with the WEEE marking per Annex IV of the
WEEE Directive, as shown above, must not dispose of end of life EEE as unsorted
municipal waste, but use the collection framework available to customers for the
return, recycling, and recovery of WEEE. Customer participation is important to
minimize any potential effects of EEE on the environment and human health due to
the potential presence of hazardous substances in EEE. For proper collection and
treatment, contact your local IBM representative.
xii PR/SM Planning Guide

Refrigeration
This system contains one or more modular refrigeration units with R-134A
refrigerant and apolyol ester oil. This refrigerant must not be released or vented to
the atmosphere. Skin contact with refrigerant may cause frostbite. Wear appropriate
eye and skin protection. Modular refrigeration units are hermetically sealed and
must not be opened or maintained.
This notice is provided in accordance with the European Union (EU) Regulation
842/2006 on fluorinated greenhouse gases. This product contains fluorinated
greenhouse gases covered by the Kyoto Protocol. Per Annex I, Part 1, of EU
Regulation 842/2006, the global warming potential of R-134A is 1300. Each unit
contains 1.22 kg of R-134A.
Battery Return Program
This product may contain sealed lead acid, nickel cadmium, nickel metal hydride,
lithium, or lithium ion battery(s). Consult your user manual or service manual for
specific battery information. The battery must be recycled or disposed of properly.
Recycling facilities may not be available in your area. For information on disposal of
batteries outside the United States, go to http://www.ibm.com/ibm/environment/
products/index.shtml or contact your local waste disposal facility.
In the United States, IBM has established areturn process for reuse, recycling, or
proper disposal of used IBM sealed lead acid, nickel cadmium, nickel metal hydride,
and other battery packs from IBM Equipment. For information on proper disposal of
these batteries, contact IBM at 1-800-426-4333. Please have the IBM part number
listed on the battery available prior to your call.
For Taiwan:
Please recycle batteries
For the European Union:
Notice: This mark applies only to countries within the European Union (EU)
Batteries or packaging for batteries are labeled in accordance with European
Directive 2006/66/EC concerning batteries and accumulators and waste batteries
and accumulators. The Directive determines the framework for the return and
recycling of used batteries and accumulators as applicable throughout the European
Union. This label is applied to various batteries to indicate that the battery is not to
be thrown away, but rather reclaimed upon end of life per this Directive.
Safety and Environmental Notices xiii

Les batteries ou emballages pour batteries sont étiquetés conformément aux direc-
tives européennes 2006/66/EC, norme relative aux batteries et accumulateurs en
usage et aux batteries et accumulateurs usés. Les directives déterminent la marche
à suivre en vigueur dans l'Union Européenne pour le retour et le recyclage des batte-
ries et accumulateurs usés. Cette étiquette est appliquée sur diverses batteries pour
indiquer que la batterie ne doit pas être mise au rebut mais plutôt récupérée en fin
de cycle de vie selon cette norme.
In accordance with the European Directive 2006/66/EC, batteries and accumulators
are labeled to indicate that they are to be collected separately and recycled at end
of life. The label on the battery may also include achemical symbol for the metal
concerned in the battery (Pb for lead, Hg for mercury, and Cd for cadmium). Users
of batteries and accumulators must not dispose of batteries and accumulators as
unsorted municipal waste, but use the collection framework available to customers
for the return, recycling, and treatment of batteries and accumulators. Customer
participation is important to minimize any potential effects of batteries and
accumulators on the environment and human health due to the potential presence
of hazardous substances. For proper collection and treatment, contact your local
IBM representative.
For Spain:
This notice is provided in accordance with Royal Decree 106/2008. The retail price
of batteries, accumulators, and power cells includes the cost of the environmental
management of their waste.
For California:
Perchlorate Material -special handling may apply. See http://www.dtsc.ca.gov/
hazardouswaste/perchlorate.
The foregoing notice is provided in accordance with California Code of Regulations
Title 22, Division 4.5, Chapter 33. Best Management Practices for Perchlorate
Materials. This product, part, or both may include alithium manganese dioxide
battery which contains aperchlorate substance.
Flat Panel Display
The fluorescent lamp or lamps in the liquid crystal display contain mercury. Dispose
of it as required by local ordinances and regulations.
Monitors and Workstations
New Jersey –For information about recycling covered electronic devices in the
State of New Jersey, go to the New Jersey Department of Environmental Protection
Web site at http://www.state.nj.us/dep/dshw/recycle/Electronic_Waste/index.html.
xiv PR/SM Planning Guide

Oregon –For information regarding recycling covered electronic devices in the
State of Oregon, go to the Oregon Department of Environmental Quality Web site at
http://www.deq.state.or.us/lq/electronics.htm.
Washington –For information about recycling covered electronic devices in the
State of Washington, go to the Department of Ecology Web site at
http://www.ecy.wa.gov/programs/swfa/eproductrecycle,or telephone the Washington
Department of Ecology at 1-800Recycle.
Safety and Environmental Notices xv

xvi PR/SM Planning Guide

About This Publication
This publication is intended for system planners, installation managers, and other
technical support personnel who need to plan for operating in logically partitioned
(LPAR) mode on the IBM System z9 Enterprise Class (z9 EC) and IBM System z9
Business Class (z9 BC).
This publication assumes previous knowledge of the characteristics and functions of
the installed central processor complex (CPC).
To improve readability, we refer to the different CPCs using the following
terminology whenever possible:
Table 1. Terminology Used in This Publication
Terminology Central Processor Complex (CPC)
z9 BC IBM System z9 Business Class
Model R07
Model S07
z9 EC IBM System z9 Enterprise Class
Model S08
Model S18
Model S28
Model S38
Model S54
Some features, panels, and functions are model-dependent, engineering change
(EC) level-dependent, machine change level-dependent (MCL-dependent), or
control program-dependent. For this reason, not all of the functions discussed in
this publication are necessarily available on every CPC.
Sample tasks and panels explained in this publication reference tasks and panels
available from the support element console. However, detailed procedures for
operator tasks and accurate task and panel references are explained in the Support
Element Operations Guide.
Some illustrations and examples in this publication describe operation with as few
as 2logical partitions (LPs), although up to 60 LPs can be defined.
Hardware Management Console operators or support element console operators
should use the appropriate operations guide for instructions on how to perform
tasks. Control program operators should refer to the appropriate control program
publication for information on control program commands.
For information about PR/SM™LPAR mode on prior models, see the following
publications:
vSystem z9 109 Processor Resource/Systems Manager Planning Guide,
SB10-7041-00
vzSeries 890 and 990 Processor Resource/Systems Manager Planning Guide,
SB10-7036
vzSeries 800 and 900 Processor Resource/Systems Manager Planning Guide,
SB10-7033
vS/390®Processor Resource/Systems Manager Planning Guide,GA22-7236
©Copyright IBM Corp. 2005, 2008 xvii

vES/9000®Processor Resource/Systems Manager Planning Guide,GA22-7123
However, for the most current coupling facility control code information for all
models, use this publication.
xviii PR/SM Planning Guide