iWave iW-RainboW-G34M Installation manual

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i.MX 8M Mini SODIMM SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
iW-RainboW-G34M
i.MX 8M Mini SODIMM System On Module
Hardware User Guide

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i.MX 8M Mini SODIMM SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Document Revision History
Document Number
iW-PRFYZ-UM-01-R1.0-REL1.0-Hardware
Revision
Date
Description
1.0
20th Nov 2019
Initial Release Version
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others is
strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are hereby
notified that any disclosure, copying distribution or use of any of the information contained within this document is
STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

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Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave
Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
CPU and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : [e-mail]
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bangalore, Karnataka,
India –560076

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Table of Contents
1. INTRODUCTION ............................................................................................................................................7
1.1 Purpose .............................................................................................................................................................7
1.2 SODIMM SOM Overview...................................................................................................................................7
1.3 List of Acronyms................................................................................................................................................7
1.4 Terminology Description...................................................................................................................................9
1.5 References ........................................................................................................................................................9
1.6 Important Note ...............................................................................................................................................10
2. ARCHITECTURE AND DESIGN....................................................................................................................... 11
2.1 i.MX 8M Mini SODIMM SOM Block Diagram..................................................................................................11
2.2 i.MX 8M Mini SODIMM SOM Features...........................................................................................................12
2.3 i.MX 8M Mini CPU...........................................................................................................................................14
2.4 BD71847AMWV PMIC.....................................................................................................................................15
2.5 Memory...........................................................................................................................................................15
2.5.1 LPDDR4 RAM...............................................................................................................................................15
2.5.2 eMMC Flash ................................................................................................................................................15
2.5.3 Micro SD Connector (Optional) ...................................................................................................................15
2.5.4 QSPI Flash (Optional) ..................................................................................................................................16
2.6 RTC Controller.................................................................................................................................................16
2.7 Wi-Fi and Bluetooth Interface.........................................................................................................................17
2.8 SODIMM PCB Edge Connector........................................................................................................................18
2.8.1 Gigabit Ethernet..........................................................................................................................................22
2.8.2 PCIe Interface ..............................................................................................................................................24
2.8.3 SD Interface.................................................................................................................................................25
2.8.4 USB Interface...............................................................................................................................................26
2.8.5 MIPI CSI Camera..........................................................................................................................................27
2.8.6 MIPI DSI Display Interface...........................................................................................................................28
2.8.7 Audio Interface............................................................................................................................................29
2.8.8 UART Interface ............................................................................................................................................30
2.8.9 SPI Interface ................................................................................................................................................31
2.8.10 I2C Interface................................................................................................................................................32
2.8.11 JTAG Interface .............................................................................................................................................32
2.8.12 GPIO Interface.............................................................................................................................................33
2.8.13 SPDIF Interface............................................................................................................................................33
2.8.14 Boot Setting.................................................................................................................................................34
2.8.15 Management Pins .......................................................................................................................................35
2.8.16 Miscellaneous Signals .................................................................................................................................36
2.8.17 Power and GND...........................................................................................................................................37
2.9 i.MX 8M Mini Pin Multiplexing on SODIMM Edge..........................................................................................38
3. TECHNICAL SPECIFICATION.......................................................................................................................... 43
3.1 Electrical Characteristics .................................................................................................................................43

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3.1.1 Power Input Sequencing..............................................................................................................................43
3.2 Power Consumption........................................................................................................................................44
3.3 Environmental Characteristics........................................................................................................................45
3.3.1 Environmental Specification........................................................................................................................45
3.3.2 Heat Sink .....................................................................................................................................................45
3.3.3 RoHS Compliance ........................................................................................................................................46
3.3.4 Electrostatic Discharge................................................................................................................................46
3.4 Mechanical Characteristics .............................................................................................................................47
3.4.1 i.MX 8M Mini SODIMM SOM Mechanical Dimensions ...............................................................................47
4. ORDERING INFORMATION .......................................................................................................................... 48
5. APPENDIX I................................................................................................................................................. 50
5.1 Guidelines to insert the SOIDMM SOM into carrier board.............................................................................50
5.2 Guidelines to remove the SOIDMM SOM into carrier board..........................................................................50
6. APPENDIX II................................................................................................................................................ 51
6.1 i.MX 8M Mini SODIMM SOM Development Platform ....................................................................................51

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List of Figures
Figure 1: i.MX 8M Mini SODIMM SOM Block Diagram...................................................................................................11
Figure 2: i.MX 8M Mini Block Diagram ...........................................................................................................................14
Figure 3: Micro SD Connector.........................................................................................................................................16
Figure 4: Wi-Fi and Bluetooth Antenna Connector.........................................................................................................17
Figure 5: SODIMM Edge Connector................................................................................................................................18
Figure 6: Power Input Sequencing..................................................................................................................................43
Figure 7: Mechanical dimension Heat Sink.....................................................................................................................46
Figure 8: Mechanical dimension of i.MX 8M Mini SODIMM SOM Top View..................................................................47
Figure 9: Mechanical dimension of i.MX 8M Mini SODIMM SOM- Side View................................................................47
Figure 10: Module Insertion Procedure..........................................................................................................................50
Figure 11: Module Removal Procedure ..........................................................................................................................50
Figure 12: i.MX 8M Mini SODIMM SOM Development Platform ...................................................................................51
List of Tables
Table 1: Acronyms & Abbreviations..................................................................................................................................7
Table 2: Terminology ........................................................................................................................................................9
Table 3: SODIMM Edge Connector Pinouts ....................................................................................................................19
Table 4: Boot Mode Pin Settings Truth Table .................................................................................................................34
Table 5: i.MX 8M Mini CPU IOMUX for SODIMM Edge Connector interfaces................................................................38
Table 6: Power Input Requirement.................................................................................................................................43
Table 7: Power Sequence Timing....................................................................................................................................43
Table 8: Power Consumption..........................................................................................................................................44
Table 9: Environmental Specification .............................................................................................................................45
Table 10: Orderable Product Part Numbers ...................................................................................................................48

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1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the SODIMM SOM based on the NXP’s i.MX 8M Mini Application
processor. This board is fully supported by iWave Systems Technologies Pvt. Ltd. This Guide provides detailed
information on the overall design and usage of the i.MX 8M Mini SODIMM SOM from a Hardware Systems perspective.
1.2 SODIMM SOM Overview
The SODIMM (“Small outline dual in line memory module”) is a versatile small form factor computer Module definition
targeting application that require low power, low costs, and high performance. The Modules are used as building
blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash,
power sequencing, CPU power supplies, GBE and single channel MIPI display transmitter are concentrated on the
Module. The Modules are used with application specific Carrier Boards that implement other features such as audio
CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and
upgradability while still maintaining low costs, low power and small physical size.
NXP’s i.MX 8M Mini SoC based SODIMM System on Module is rich with i.MX 8M Mini features along with on SOM
LPDDR4, eMMC, Dual Ethernet PHY and comes in compact 67.6mm x 37mm form factor. The Module PCB has 200
edge fingers that mate with a low profile 200 pin 0.5mm pitch right angle connector.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
ARM
Advanced RISC Machine
BT
Bluetooth
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
CTS
Clear to Send
CSI
Camera Serial Interface
DSI
Display Serial Interface
eMMC
Enhanced Multi Media Card
GB
Giga Byte
Gbps
Gigabits per sec
GPIO
General Purpose Input Output
GPU
Graphics Processing Unit
I2C
Inter-Integrated Circuit

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Acronyms
Abbreviations
I2S
Inter-Integrated Sound
IC
Integrated Circuit
JTAG
Joint Test Action Group
LPDDR4
Low Power Double Data Rate4
MHz
Mega Hertz
MIPI
Mobile Industry Processor Interface
OTG
On-The-Go
PCB
Printed Circuit Sheet
PCIe
Peripheral Component Interconnect express
PMIC
Power management integrated circuits
RAM
Random Access Memory
RGMI
Reduced gigabit media-independent interface
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
RTS
Request to Send
SAI
Serial Audio Interface
SD
Secure Digital
SODIMM
Small outline dual in line memory module
SOM
System On Module
TBD
To Be Defined
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
USB OTG
USB On The Go
Wi-Fi
Wireless Fidelity

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1.4 Terminology Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
GBE
Gigabit Ethernet Signal
LVDS
Low Voltage Differential Signal
MIPI
Mobile Industry Processor Interface Signal
OD
Open Drain Signal
OC
Open Collector Signal
PCIe
Peripheral Component Interconnect Express Signal
USB
Universal Serial Bus Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On-SODIMM SOM.
1.5 References
•IMX8MMIEC_Revx.x.pdf
•IMX_8M_Mini_RM_Revx.x.pdf

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1.6 Important Note
In this document, wherever i.MX 8M Mini CPU signal name is mentioned, it is followed as per below format for easy
understanding.
•If CPU pin doesn’t have multiplexing option or used for dedicated functionality then the signal name is
mentioned as functionality name.
“Functionality Name”
Example: ENET_TXC
In this signal, ENET_TXC pad is used for same functionality.
•If CPU pin selected as GPIO function, then the signal name is mentioned as
“Functionality Description (GPIO Number)”
Example: BCONFIG_0(GPIO1_9)
In this signal, BCONFIG_0 is the GPIO functionality which we are using and GPIO1_9 is the GPIO number.
Note: The above naming is not applicable for other signals which are not connected to CPU.

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2. ARCHITECTURE AND DESIGN
This section provides detailed information about i.MX 8M Mini SODIMM SOM features and Hardware architecture
with high level block diagram.
2.1 i.MX 8M Mini SODIMM SOM Block Diagram
Figure 1: i.MX 8M Mini SODIMM SOM Block Diagram
SODIMM
Edge
Connector
(200Pin)
iW-RainboW-G34M –i.MX 8M Mini SODIMM SOM Block Diagram
i.MX 8M Mini
Ethernet PHY Gigabit Ethernet
RGMII
LPDDR4 (32bit)
LPDDR4-1GB
(Upgradable) ENET
Micro SD
(Optional)
PCIe4
USB1 USB2.0 OTG x 1
DDRC
MMC (8bit)
eMMC –8GB
(Upgradable) uSDHC3
QSPI
QSPI Flash
(Optional) QSPIA
UART11,UART2,
UART3,UART4
UART x 4
PCIe to GBE
PHY (Optional)
Gigabit Ethernet
PCIe
PCIe x 1
PWM x 2
JTAG
I2C x 2
I2C2, I2C3
PWM1, PWM2
eCSPI x 3
USB2.0 OTG x 1
eCSPI1,eCSPI2
eCSPI3
I2C
RTC Controller
I2C1
USB2
SD x 1
uSDHC2
SAI53I2S x1
WiFi-BT
Module
uSDHC12
UART11
Note:
1. UART1 is shared between SODIMM Edge connector and Bluetooth Module, by default it will be connected to Bluetooth Module
2. uSDHC1 is shared between Wi-Fi module and micro SD connector, by default it will be connected to Wi-Fi Module.
3. SAI5 is shared between SODIMM Edge connector and Bluetooth Audio, by default it will be connected to SODIMM Edge.
4. PCIe is shared between SODIMM Edge Connector and on-SOM PCIe to Ethernet PHY, by default PCIe is connected to SODIMMEdge
PMIC I2C
JTAG
UART
SD1 (4bit)
MIPI DSI MIPI DSI[3:0]
MIPI CSI MIPI CSI[3:0]
SPDIF SPDIF x 1
SAI1 SAI x 1
GPIO GPIOs
SAI53
I2S/PCM

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2.2 i.MX 8M Mini SODIMM SOM Features
i.MX 8M Mini SODIMM SOM supports the following features.
CPU
•i.MX 8M Mini Q/QL/D/DL/S/SL Processor1:
oi.MX 8M Mini Quad : 4 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Quad Lite : 4 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
oi.MX 8M Mini Dual : 2 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Dual Lite : 2 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
oi.MX 8M Mini Solo : 1 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Solo Lite : 1 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
Power
•BD71847AMWV PMIC
Memory
•LPDDR4 - 1GB (Expandable up to 4GB)2,3
•eMMC Flash - 8GB (Expandable)3
•Micro SD slot (Optional)4
•QSPI Flash (Optional)
Other On-SOM Features
•WiFi 802.11a/b/g/n/ac + Bluetooth 5.0 Module4,5
•Gigabit Ethernet PHY Transceiver
•PCIe to Ethernet PHY (Optional)6
•RTC Controller
SODIMM PCB Edge Interfaces
•Gigabit Ethernet x 2 Ports (One is Optional)6
•PCIe x 1 Port6
•SD (4bit) x 1 Port
•USB 2.0 OTG x 1 Port
•USB 2.0 Host x 1 Port
•MIPI CSI x 1 Channel
•MIPI DSI x 1 Channel
•SAI/I2S (Audio Interface) x 1 Port
•Data UART (with CTS & RTS) x 2 Port(One is optional)

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•Data UART (without CTS & RTS) x 2 Port (One port is used as Debug Port)
•eCSPI x 3 Port
•I2C x 2 Port
•SPDIF x 1
•JTAG
•PWM x 2 Port
•Power & Management Signals
General Specification
•Power Supply : 3V3, 4A
•Form Factor : 67.6mm X 37mm
1. There are six configurations of i.MX 8M Mini Processor are supported by NXP, hence in this document i.MX 8M
Mini Q/QL/D/DL/S/SL is used to represent either of one based on SOM Part Number.
2. The i.MX 8M Mini CPU can support up to 8GB RAM but considering the available LPDDR4 Chips, SOM can support
up to 4GB (32Gb) RAM.
3. Memory Size will differ based on iWave’s SOM Product Part Number.
4. uSDHC1 is shared between Wi-Fi module and micro SD connector, by default it will be connected to Wi-Fi Module.
So on SOM microSD will be an optional feature.
5. UART1 interface of i.MX 8M Mini is connected to on SOM Bluetooth module in the default configuration. One more
UART can be supported with CTS and RTS in SODIMM Edge if Bluetooth is not supported.
6. In i.MX8M Mini SODIMM SOM, PCIe interface signals are connected to both SODIMM PCB Edge Connector and
PCIe to Ethernet controller to support 2nd Gigabit Ethernet Port, by default PCIe is connected to SODIMM Edge.

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2.3 i.MX 8M Mini CPU
iW-RainboW-G34M i.MX 8M Mini SODIMM SOM can support different i.MX 8M Mini CPUs from NXP. The i.MX 8M
Mini Family consists of six processors: i.MX 8M Mini Quad, Quad Lite, Dual, Dual Lite, Solo, Solo Lite. The Major
difference between i.MX 8M Mini CPUs are:
•i.MX 8M Mini Quad : 4 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Quad Lite : 4 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
•i.MX 8M Mini Dual : 2 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Dual Lite : 2 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
•i.MX 8M Mini Solo : 1 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Solo Lite : 1 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
The i.MX 8M Mini Family supports ARM Cortex-A53 Core @ 1.6 GHz, ARM Cortex-M4F Core @ 400 MHz, 1080p, VPU,
and dual fail over-ready display controllers, 1× 1080p display, including MIPI-DSI. Memory interfaces supporting
LPDDR4, DDR4, DDR3L, Quad SPI/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD, and a wide range of peripheral
I/Os such as PCIe 2.0 provide wide flexibility.
Figure 2: i.MX 8M Mini Block Diagram
Note: The i.MX 8M Mini processor offers numerous advanced features, please refer the latest i.MX 8M Mini Datasheet
& Reference Manual for Electrical characteristics and other information, which may be revised from time to time.

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2.4 BD71847AMWV PMIC
i.MX 8M Mini SODIMM SOM uses Rohm’s BD71847AMWV PMIC for on-SOM Power management. The BD71847AMWV
is a Power Management Integrated Circuit (PMIC) designed specifically for powering single-core, dual-core, and quad-
core SoC’s such as NXP-i.MX 8M Mini.
The BD71847AMWV is a power management integrated circuit (PMIC) features six high efficiency buck converters and
six linear regulators (LDOs) for powering the processor, memory and miscellaneous peripherals. Built-in one-time
programmable memory stores key start up configurations, drastically reducing external components typically used to
set output voltage and sequence of external regulators. Regulator parameters are adjustable through high-speed
1MHz I2C after start up offering flexibility for different system states. The BD71847AMWV (U10) comes in 56pin 7x7
QFN Package and placed on Top side of SOM.
2.5 Memory
LPDDR4 RAM
The i.MX 8M Mini SODIMM SOM supports 1GB RAM using 32bit LPDDR4 IC connected to DDR controller of CPU to
support LPDDR4 clock up to 1.5 GHz. The LPDDR4 IC (U6) placed on Top side of the SOM. The RAM size can be
expandable up to maximum of 4GB. To customize the LPDDR4 memory size, contact iWave.
eMMC Flash
The i.MX 8M Mini SODIMM SOM supports 8GB eMMC as default boot device and storage device. This is connected to
eMMC0 version5.1v controller of the i.MX 8M Mini CPU and operates at 1.8V (I/O supply) and 3.3V (NAND core supply)
Voltage levels.
The eMMC flash (U16) memory is physically located on bottom side of the SODIMM SOM. The memory size of the
eMMC Flash can be customised based on the requirement by contacting iWave Support Team.
Micro SD Connector (Optional)
The i.MX 8M Mini SODIMM SOM optionally supports Micro SD slot which can be used to connect Micro SD card as
optional boot device as well as Mass storage device. Micro SD card connector (J2) is directly connected to the USDHC1
controller of the i.MX 8M Mini CPU. The main power to Micro SD Card Connector is 3.3 Voltage. The i.MX 8M Mini
SODIMM SOM supports configurable I/O voltage levels (3.3V/1.8V) for USDHC1 lines through gpioGPIO1_3. If GPIO1_3
is set to low, then 3.3V IO level is selected for uSDHC1 lines. If GPIO4_3 is set to high, then 1.8V IO level is selected for
uSDHC1 lines. The micro SD Connector is physically located on Top side of the i.MX 8M Mini SODIMM SOM as shown
below.

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Note: In default configuration USDHC1 is used for on board Wi-Fi module. Contact iWave Support team if microSD
feature is required.
Figure 3: Micro SD Connector
QSPI Flash (Optional)
The i.MX8M Mini SODIMM SOM optionally supports 2MB QSPI Flash and can be used as optional boot device This is
connected to QSPI_A controller of the i.MX8M Mini processor and operates at 1.8V Voltage levels. The QSPI flash
(U14) is physically located on Bottom side of the SODIMM SOM. The QSPI Flash size can be expandable. For customised
QSPI Flash support, contact iWave
2.6 RTC Controller
The i.MX 8M Mini SODIMM SOM supports external RTC Controller “PCF85263” On-SOM for Real time clock support.
This external RTC Controller IC (U1) is connected to i.MX8M Mini CPU through I2C1 Interface and operates at 3.3V
voltage level. In SOM power off condition, this device will take power from SODIMM PCB Edge- Pin No. 183 (VRTC_3V0)
coin cell power input and continues to keep the current time.

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2.7 Wi-Fi and Bluetooth Interface
The i.MX 8M Mini SODIMM SOM is integrated with Murata’s “LBEE5HY1MW” based Wi-Fi & Bluetooth module. The
LBEE5HY1MW module is a very high-performance module based on Cypress CYW43455 combo chipset which supports
WiFi IEEE 802.11a/b/g/n/ac + Bluetooth 5.0 BR/EDR/LE standard.
The LBEE5HY1MW module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols and supports single
stream 1x1 IEEE 802.11 a/b/g/n/ac mode providing up to 390Mbps. The LBEE5HY1MW module features small form
factor when integrating Power Amplifier (PA), Low Noise Amplifier (LNA), Transmit/Receive switch, Power
Management. The LBEE5HY1MW module need external Antenna but it requires a 32.768 kHz clock for sleep operation.
The LBEE5HY1MW module (U3) provides Secure Digital Input Output (SDIO) for interfacing with the host controller for
Wi-Fi and UART interface for Bluetooth. The i.MX 8M Mini SODIMM SOM uses processor’s UART1 interface for
Bluetooth and USDHC1 interface for Wi-Fi in default configuration. In i.MX 8M Mini SODIMM SOM, antenna pin of Wi-
Fi & Bluetooth module is connected to J1 Connector.
Figure 4: Wi-Fi and Bluetooth Antenna Connector
Connector Part Number - : RECE-20449-001E-01 from Taoglas Limited.
Antenna Part Number - : FXP830.24.0100B from Taoglas Limited

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Note: The LBEE5HY1MW module supports operating temperature -20°C to 75°C with the default module’s firmware.
To set the module temperature to industrial grade in firmware, please contact iWave.
2.8 SODIMM PCB Edge Connector
i.MX 8M Mini SODIMM SOM Supports JEDEC Physical Standard 200pin SODIMM PCB edge connector for interfaces
expansion. The interfaces which are available at SODIMM Edge connector are explained in the following sections.
Figure 5: SODIMM Edge Connector
Number of Pins - : 200
Connector Part - : Not Applicable (On Board PCB Edge connector)
Mating Connector - : 1473005-1 from TE Connectivity

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Table 3: SODIMM Edge Connector Pinouts
Signal
SODIMM Pin
(Top)
SODIMM Pin
(Bottom)
Signal
GND
1
2
GPHY1_ATXRXM
VDVDH_GPHY1*
3
4
GPHY1_ATXRXP
GND
5
6
GPHY1_BTXRXM
UART3_RXD
7
8
GPHY1_BTXRXP
UART3_TXD
9
10
NC
GPHY1_LINK_LED2
11
12
GPHY1_ACTIVITY_LED1
GND
13
14
GPHY1_CTXRXM
GPHY1_DTXRXM
15
16
GPHY1_CTXRXP
GPHY1_DTXRXP
17
18
I2C3_SCL*
I2C3_SDA*
19
20
VIN_3V3
NC
21
22
NC
NC
23
24
NC
NC
25
26
NC
GND
27
28
NC
NC
29
30
GPHY2_ACTIVITY_LED1*
NC
31
32
VIN_3V3
GPHY2_LINK_LED2*
33
34
GPHY2_ATXRXM*
GPHY2_BTXRXM*
35
36
GPHY2_ATXRXP*
GPHY2_BTXRXP *
37
38
UART2_CTS_B(SAI3_RXC)
USB2_OTG_OC(GPIO1_15)
39
40
GND
Key
Key
GND
41
42
GPHY2_CTXRXM*
GPHY2_DTXRXM*
43
44
GPHY2_CTXRXP*
GPHY2_DTXRXP*
45
46
VIN_3V3
SAI1_RXD0
47
48
MIPI_DSI_DATA0_N
VDVDH_GPHY2*
49
50
MIPI_DSI_DATA0_P
GND
51
52
MIPI_DSI_DATA1_N
MIPI_DSI_DATA2_N
53
54
MIPI_DSI_DATA1_P
MIPI_DSI_DATA2_P
55
56
MIPI_DSI_DATA3_N
MIPI_DSI_CLK_N
57
58
MIPI_DSI_DATA3_P
MIPI_DSI_CLK_P
59
60
VIN_3V3
SAI5_RX_DATA0(SAI5_RXD0)
61
62
ECSPI2_SS0
ECSPI2_MISO
63
64
GPIO_CLK(SAI5_MCLK)
GND
65
66
ECSPI2_SCLK
SAI5_TX_DATA0(SAI5_RXD3)
67
68
SAI1_RXD2
NC
69
70
ECSPI2_MOSI
GPIO1_6
71
72
VIN_3V3
GPIO1_7
73
74
SAI1_RXC
UART2_RTS_B(SAI3_RXD)
75
76
USB1_OTG_OC(GPIO1_13)
USB1_ID
77
78
USB1_OTG_PWR(GPIO1_12)

REL1.0
Page 20 of 52
i.MX 8M Mini SODIMM SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Signal
SODIMM Pin
(Top)
SODIMM Pin
(Bottom)
Signal
GND
79
80
ECSPI1_SCLK
USB1_DP
81
82
CLKOUT1
USB1_DN
83
84
CLKOUT2
CLKIN1
85
86
NC
CLKIN2
87
88
VIN_3V3
SAI5_TX_SYNC(SAI5_RXD1)
89
90
SAI5_TX_BCLK(SAI5_RXD2)
SAI5_RX_BCLK(SAI5_RXC)
91
92
SAI5_RX_SYNC(SAI5_RXFS)
NC
93
94
ECSPI1_MISO
GND
95
96
ECSPI1_MOSI
ECSPI1_SS0
97
98
UART1_TXD*
UART1_RXD*
99
100
UART1_CTS_B*
UART1_RTS_B*
101
102
UART2_TX(SAI3_TXC)
UART2_RX(SAI3_TXFS)
103
104
SAI1_RXFS
SD2_CD_B
105
106
VIN_3V3
SD2_DATA0
107
108
SD2_CMD
SD2_CLK
109
110
NC
SD2_DATA1
111
112
SD2_DATA2
GND
113
114
SD2_DATA3
I2C2_SDA
115
116
I2C2_SCL
UART4_RXD
117
118
UART4_TXD
NC
119
120
NC
BCONFIG_1(GPIO5_1)*
121
122
NC
SAI1_RXD5
123
124
VIN_3V3
PWM2_OUT(I2C4_SCL)
125
126
BCONFIG_0(GPIO1_9)*
PCIE_TXP
127
128
PCIE_RXP
PCIE_TXN
129
130
PCIE_RXN
GND
131
132
GPIO_RESET(GPIO5_2)
W_DISABLE(GPIO1_11)
133
134
PCIE_WAKE_B(GPIO1_10)
PCIE_REFCLK_DP
135
136
GPIO1_1
PCIE_REFCLK_DM
137
138
PWM1_OUT(I2C4_SDA)
USB2_ID
139
140
USB2_OTG_PWR(GPIO1_14)
USB_OTG2_VBUS
141
142
VIN_3V3
SAI1_TXFS
143
144
SAI1_RXD7
SAI1_MCLK
145
146
GPIO1_8
GPIO1_5
147
148
SAI1_RXD3
SAI1_RXD4
149
150
MIPI_CSI_CLK_N
GND
151
152
MIPI_CSI_CLK_P
I2C3_SCL
153
154
SAI1_TXD7
I2C3_SDA
155
156
SAI1_TXD0
SAI1_TXC
157
158
SAI1_RXD1
MIPI_CSI_DATA1_N
159
160
VIN_3V3