iWave iW-RainboW-G50M i.MX 93 Installation manual

i.MX 93 or i.MX 91 OSM-Size LF LGA Module Hardware User Guide
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iW-RainboW-G50M
i.MX 93 or i.MX 91
OSM-LF LGA Module
Hardware User Guide
DRAFT VERSION SUBJECT TO CHANGE

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Document Revision History
Document Number
iW-PRHDZ-UM-01-R2.0-REL0.1-Hardware
Revision
Date
Description
0.1
21st June 2023
Draft Release Version
0.2
11th July 2023
Updated i.MX 93 OSM Power Consumption
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others is
strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are hereby
notified that any disclosure, copying distribution or use of any of the information contained within this document is
STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

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Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave
Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
SoC and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : [e-mail]
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bengaluru, Karnataka,
India –560076

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Table of Contents
1. INTRODUCTION ..................................................................................................................................................7
1.1 Purpose.......................................................................................................................................................7
1.2 OSM LGA Module Overview.........................................................................................................................7
1.3 List of Acronyms ..........................................................................................................................................7
1.4 Terminology Description..............................................................................................................................9
1.5 References...................................................................................................................................................9
1.6 Important Note..........................................................................................................................................10
2. ARCHITECTURE AND DESIGN ............................................................................................................................11
2.1 i.MX 93 OSM LGA Module Block Diagram ..................................................................................................11
2.2 i.MX 93 and i.MX 91 SOM Features...........................................................................................................12
2.3 CPU ...........................................................................................................................................................14
2.3.1 i.MX 93 CPU...........................................................................................................................................14
2.3.2 i.MX 91 CPU...........................................................................................................................................15
2.4 PCA9451 PMIC...........................................................................................................................................16
2.5 Memory.....................................................................................................................................................17
2.5.1 LPDDR4X/LPDDR4..................................................................................................................................17
2.5.2 eMMC Flash...........................................................................................................................................17
2.6 Network & Communications features........................................................................................................18
2.6.1 Wi-Fi and Bluetooth Interface ................................................................................................................18
2.6.2 RTC Controller........................................................................................................................................19
2.7 OSM LGA/BGA...........................................................................................................................................20
2.7.1 RGMII Interface......................................................................................................................................38
2.7.2 USB 2.0 OTG Interface............................................................................................................................40
2.7.3 USB 2.0 Host Interface ...........................................................................................................................40
2.7.4 Audio Interface ......................................................................................................................................42
2.7.5 SPI Interface...........................................................................................................................................43
2.7.6 Data UART.............................................................................................................................................43
2.7.7 CAN Interface.........................................................................................................................................44
2.7.8 JTAG Interface (Optional).......................................................................................................................45
2.7.9 I2C Interface ..........................................................................................................................................45
2.7.10 MIPI CSI Interface (Not available in i.MX 91) ..........................................................................................46
2.7.11 LVDS interface (Not available in i.MX 91) ...............................................................................................46
2.7.12 MIPI DSI interface (Not available in i.MX 91) ..........................................................................................47
2.7.13 SD Interface ...........................................................................................................................................48
2.7.14 OSM GPIOs ............................................................................................................................................49
2.7.15 Miscellaneous Pins.................................................................................................................................50
2.7.16 Control Signals.......................................................................................................................................51
2.7.17 Power and GND .....................................................................................................................................51
2.8 Other Features ..........................................................................................................................................53
2.8.1 Programming Header.............................................................................................................................53
2.9 i.MX 93 or i.MX 91 Pin Multiplexing on OSM LGA.......................................................................................55

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3. TECHNICAL SPECIFICATION...............................................................................................................................60
3.1 Electrical Characteristics............................................................................................................................60
3.1.1 Power Input Requirement ......................................................................................................................60
3.1.2 Power Input Sequencing.........................................................................................................................60
3.1.3 Power Consumption...............................................................................................................................61
3.2 Environmental Characteristics ...................................................................................................................63
3.2.1 Environmental Specification...................................................................................................................63
3.2.2 Heat Sink ...............................................................................................................................................63
3.2.3 RoHS Compliance...................................................................................................................................64
3.2.4 Electrostatic Discharge...........................................................................................................................64
3.3 Mechanical Characteristics ........................................................................................................................65
3.3.1 i.MX 93 or i.MX 91 OSM LGA Module Mechanical Dimensions................................................................65
4. ORDERING INFORMATION................................................................................................................................66
5. APPENDIX-I.......................................................................................................................................................67
5.1 i.MX 93 or i.MX 91 SBC ..............................................................................................................................67
6. APPENDIX-II......................................................................................................................................................68
6.1 Design and Assembly recommendations....................................................................................................68

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List of Figures
Figure 1: i.MX 93 OSM LGA MODULE Block Diagram .................................................................................................11
Figure 2: i.MX 93 SoC Block Diagram .........................................................................................................................14
Figure 2: i.MX 91 SoC Block Diagram .........................................................................................................................15
Figure 3: Wi-Fi+Bluetooth Antenna Connector ..........................................................................................................18
Figure 4: OSM LGA/BGA............................................................................................................................................20
Figure 5: Programming Header .................................................................................................................................53
Figure 6: Power Input Sequencing.............................................................................................................................60
Figure 7: Mechanical dimension of Heat Sink ............................................................................................................64
Figure 8: Mechanical dimension of i.MX 93 or i.MX 91 OSM LGA Module..................................................................65
Figure 9: i.MX 93 or i.MX 91 SBC ...............................................................................................................................67
Figure 10: Dimensions of Mounting holes in the Carrier Board..................................................................................68
List of Tables
Table 1: Acronyms & Abbreviations.............................................................................................................................7
Table 2: Terminology ..................................................................................................................................................9
Table 3: OSM Pinouts................................................................................................................................................21
Table 4: Programming header Pin assignment...........................................................................................................53
Table 5: i.MX 93 or i.MX 91 SoC IOMUX for OSM LGA interfaces ...............................................................................55
Table 6: Power Input Requirement............................................................................................................................60
Table 7: i.MX 93 OSM Power Consumption ...............................................................................................................61
Table 7: i.MX 91 OSM Power Consumption ...............................................................................................................62
Table 8: Environmental Specification ........................................................................................................................63
Table 9: Orderable Product Part Numbers.................................................................................................................66

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1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the NXP’s i.MX 93 or i.MX 91 Application processor based OSM V1.1
specification compatible LGA module. This board is fully supported by iWave Systems Technologies Pvt. Ltd. This Guide
provides detailed information on the overall design and usage of the i.MX 93 or i.MX 91 OSM Module from a Hardware
Systems perspective.
1.2 OSM LGA Module Overview
The OSM V1.1 (“Open Standard Modules™”) is a future proof and versatile standard for small size, low-cost embedded
computer modules. Combining the following key characteristics like completely machine processible during soldering,
assembly and testing, Pre-tinned LGA package for direct PCB soldering without connector.
The OSM Module definition targeting application that requires low power, low costs, and high performance. The
Modules are used as building blocks for portable and stationary embedded systems. The core SoC and support circuits,
including DRAM, boot flash, power sequencing, SoC power supplies are concentrated on the Module. The Modules
are used with application specific Carrier Boards that implement other features such as audio CODECs, touch
controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while
still maintaining low costs, low power and small physical size.
NXP’s i.MX 93 or i.MX 91 SoC based OSM LGA Module is rich with i.MX 93 or i.MX 91 features along with on SOM
LPDDR4/4X, eMMC, Wi-Fi/BT module and comes in compact 45mm x 45mm form factor (Size L). The Module PCB has
662 contacts which can be mounted as LGA/BGA on OSM carrier card.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
ARM
Advanced RISC Machine
BT
Bluetooth
CAN
Controller Area Network
CODEC
Coder-Decoder
CPU
Central Processing Unit
CSI
Camera Serial Interface
CTS
Clear to Send
DRAM
Dynamic Random Access Memory
DSI
Display Serial Interface
eMMC
Enhanced Multi Media Card

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Acronyms
Abbreviations
EMS
Electronics manufacturing services
ESAI
Enhanced Serial Audio Interface
FLEXCAN
Flexible Control Area Network
FlexSPI
Flexible Serial Peripheral Interface
GB
Giga Byte
Gbps
Gigabits per sec
GPIO
General Purpose Input Output
GPU
Graphics Processing Unit
I2C
Inter-Integrated Circuit
I2S
Inter-Integrated Sound
IC
Integrated Circuit
JTAG
Joint Test Action Group
LPDDR4
Low Power Double Data Rate4
LVDS
Low Voltage Differential Signal
MHz
Mega Hertz
MIPI
Mobile Industry Processor Interface differential pair signals
OSM
Open Standard Module
OTG
On-The-Go
PCB
Printed Circuit Board
PMIC
Power management integrated circuits
RAM
Random Access Memory
RGMI
Reduced gigabit media-independent interface
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
RTS
Request to Send
SAI
Serial Audio Interface
SD
Secure Digital
SoC
System on Chip
SOM
System On Module
SPDIF
The Sony/Philips Digital Interface
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus

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1.4 Terminology Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
GBE
Gigabit Ethernet Signal
USB
Universal Serial Bus
OD
Open Drain Signal
OC
Open Collector Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On-OSM.
1.5 References
•IMX93IEC_Rev_x.pdf
•IMX91PEC_Revx
•i.MX93RM Rev_x.pdf
•OSM Specification V1.1

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1.6 Important Note
In this document, wherever i.MX 93 or i.MX 91 SoC signal name is mentioned, it is followed as per below format for
easy understanding.
•If SoC pin doesn’t have multiplexing option or used for dedicated functionality then the signal name is
mentioned as functionality name.
“Functionality Name”
Example: ENET1_RGMII_TXC
In this signal, ENET1_RGMII_TXC pad is used for same functionality.
•If SoC pin selected as GPIO function, then the signal name is mentioned as
“Functionality Description (GPIO Number)”
Example: BCONFIG_0(GPIO1_05)
In this signal, BCONFIG_0 is the GPIO functionality and GPIO1_05 is the GPIO number.
Note: The above naming is not applicable for other signals which are not connected to SoC.

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2. ARCHITECTURE AND DESIGN
This section provides detailed information about i.MX 93 or i.MX 91 OSM LGA Module features and Hardware
architecture with high level block diagram.
2.1 i.MX 93 or i.MX 91 OSM LGA Module Block Diagram
iWave Systems Technologies Pvt. Ltd.
[e-mail]
iW-RainboW-G50M- i.MX 93 or i.MX 91 based OSM Block Diagram
i.MX 93 or i.MX 91 SoC
RGMII x 2
LPDDR4X (16bit)
LPDDR4X-2GB
ENET0
ENET1
LVDS*
DDRC
SD1
I2C2
PMIC
PCA9451
SAI1
Debug UART x 1
Boot mode[1:0]
SAI x 1 OSM BGA-Size L
USB2.0 OTG x 1
USB_2
LVDS x 1
MIPI CSI x 1 (2 lane)
CAN1
CAN2
CAN x 2
UART x 2 (with CTS/RTS)
GPIO GPIO x 13
VIN_5V
Boot mode
MMC(8bit)
eMMC –16GB
(Upgradable)
USB2.0 x 1
SD2
MIPI DSI x 1 (4 lane)
SD (4bit) x 1
USB_1
MIPI_DSI*
MIPI_CSI*
SPI4
UART5
UART81
UART1
ADC
Wi-Fi/BT
Module
SDIO SD3
I2C x 2
I2C3
I2C7
ADC x 4
SPI x 1
JTAG x 1
JTAG
UART8
Programming
header FORCE_RECOV#
Debug UART x 1
VIN_5V
USB2.0 OTG x 1
TPM4
RTC Controller
PWM x 1
I2C7
USB2.0
1:4 Hub
USB[0]
USB[2]
USB[1]
USB[3]
UART2 UART x 1 (without CTS/RTS)
Tamper Tamper x 2
I2C2
VRTC_3V
VRTC_3V
VIN_5V
Note:
1. UART8 is muxed with BT module and OSM ball.
By default, it is connected to BT Module
2. SPI is shared between Wi-Fi/BT module & OSM.
If Wi-Fi/BT is required, SPI is not supported at OSM.
* Not supported in i.MX 91 SoC
Wi-Fi/BT
Ant. Conn.
ANT0
ANT0
8-bit Output
Expander
I2C3 GPIO x 3
SPI4
SPI
GPIO x 5
GPIO x 5
Figure 1: i.MX 93 or i.MX 91 OSM LGA MODULE Block Diagram

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2.2 i.MX 93 or i.MX 91 SOM Features
i.MX 93 or i.MX 91 OSM LGA Module supports the following features.
SoC
•i.MX 93 Processor1
oi.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display,
2x Ethernet, 2x USB 2.0, 7x I2S TDM
oi.MX 9351: 1 x Cortex-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display,
2x Ethernet, 2x USB 2.0, 7x I2S TDM
oi.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
oi.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
•i.MX 91 Processor
oi.MX 91: 1x Cortex®-A55, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0
Power
•PCA9451 PMIC
Memory
•LPDDR4/4X - 2GB2,3
•eMMC Flash - 16GB (Expandable)2
Other On-SOM Features
•IEEE 802.11a/b/g/n/ac/ax+ Bluetooth 5.3+ IEEE802.15.44
•USB2.0 1:4 Hub
•Programming Header
OSM LGA Interfaces
•RGMII x 2
•USB2.0 OTG x 1
•USB2.0 Host x 4
•SAI/I2S (Audio Interface) x 1
•SPI x 14
•Data UART with flow control x 2 (1 is optional)5
•Data UART without flow control x 1
•Debug UART x 1
•GPIOs x 16

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•MIPI_DSI(4lane) x 1*
•MIPI_CSI(2lane) x 1*
•SD (4 bit) x 1
•LVDS x 1*
•I2C x 2
•PWM x 1
•ADC x 4 (2 through Vendor defined pins)
•Tamper x 2 (through Vendor defined pins)
General Specification
•Power Supply : 5V, 2.5A
•Form Factor : 45mm X 45mm (OSM V1.1 Specification)
1. There are four configurations of i.MX 93 Processor, hence this document is used to represent either of one based
on SOM Part Number.
2. Memory Size will differ based on iWave’s SOM Product Part Number.
3. i.MX 93 OSM supports LPDDR4X by default and i.MX 91 OSM supports LPDDR4.
4. SPI4 is shared between Wi-Fi/BT module to support IEEE802.15.4 and OSM. If Wi-Fi/BT is required, SPI is not
supported at the OSM. If SPI is required at the OSM, Wi-Fi/BT module will be made DNP in the OSM.
5. UART8 is muxed with BT module and OSM. By default, it is connected to BT Module.
* Not supported in i.MX 91 SoC.

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2.3 CPU
iW-RainboW-G50M i.MX 93 and i.MX 91 OSM LGA Module can support different i.MX 93 or i.MX 91 SoCs from NXP.
2.3.1 i.MX 93 CPU
The i.MX 93 (11 x 11 mm) Family consists of four processors.
•i.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
•i.MX 9351: 1 x Cortex-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
•i.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
•i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet,
2x USB 2.0, 7x I2S TDM
The i.MX 93 includes powerful dual Arm® Cortex®-A55 processors with speeds up to 1.7 GHz integrated with a NPU
that accelerates machine learning inference. A general-purpose Arm® Cortex®-M33 running up to 250 MHz is for real-
time and low-power processing. Memory interfaces supporting 16-bit LPDDR4 and LPDDR4X, eMMC 5.1, SD 3.0 and a
wide range of peripheral IOs providing wide flexibility.
Figure 2: i.MX 93 SoC Block Diagram

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2.3.2 i.MX 91 CPU
The i.MX 91 (11 x 11 mm) Family consists of two processors.
•i.MX 91P1C: Industrial Grade
•i.MX 91P1D: Consumer Grade
The i.MX 91 includes powerful single Arm® Cortex®-A55 processor with speeds up to 1.4 GHz. Robust control networks
are possible via CAN-FD interface. Also, dual 1 Gbps Ethernet controllers, drive gateway applications with low latency.
Memory interfaces supporting 16-bit LPDDR4, eMMC 5.1, SD 3.0 and a wide range of peripheral IOs providing wide
flexibility.
Figure 3: i.MX 91 SoC Block Diagram
Note: The i.MX 93 and i.MX 91 processor offers numerous advanced features, please refer the latest i.MX 93 or i.MX
91 Datasheet & Reference Manual for Electrical characteristics and other information, which may be revised from time
to time.

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2.4 PCA9451 PMIC
The i.MX 93 or i.MX 91 OSM LGA Module uses one PCA9451 PMIC (U4) for module power management. The PCA9451
features six high efficiency step-down regulators and three linear regulators. The PCA9451 is a single chip Power
Management IC (PMIC) specifically designed to support i.MX 93x family processor in both 1 cell Li-Ion and Li-polymer
battery portable application and 5V adapter non-portable applications. Regulator parameters are adjustable through
high-speed I2C after start up offering flexibility for different system states. The PCA9451 PMIC comes in 56-pin HVQFN
package.

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2.5 Memory
2.5.1 LPDDR4X/LPDDR4
The i.MX 93 or i.MX 91 OSM LGA Module supports 2GB LPDDR4X/LPDDR4 memory by using 16bit DDR_CH0 channel
of the SoC. By default, LPDDR4X is supported in i.MX 93 OSM. The i.MX 91 SoC supports only LPDDR4. To customize
the LPDDR4X/LPDDR4 memory size, contact iWave.
2.5.2 eMMC Flash
The i.MX 93 or i.MX 91 OSM LGA Module supports 16GB eMMC as default boot and storage device. This is directly
connected to eMMC controller of the i.MX 93 or i.MX 91 SoC and operates at 1.8V (IO supply) and 3.3V (NAND core
supply) Voltage levels. The memory size of the eMMC Flash can be customised based on the requirement by contacting
iWave Support Team.

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2.6 Network & Communications features
2.6.1 Wi-Fi and Bluetooth Interface
The i.MX 93 or i.MX 91 OSM LGA Module is integrated with Murata’s “LBES5PL2EL-SMP” based Wi-Fi+Bluetooth
module. LBES5PL2EL-SMP module is complaint with IEEE802.11a/b/g/n/ac/ax, SISO, Bluetooth specification v5.3 and
IEEE802.15.4. It supports standard SDIO3.0 interface for WLAN, UART interfaces support for Bluetooth is Host
Controller Interface (HCI) and SPI interface to optionally support IEEE802.15.4. Connection to a host processor is
through SDIO, High-Speed UART interfaces and SPI. The i.MX 93 OSM LGA Module uses processor’s UART8 interface
for Bluetooth and SD3 interface for Wi-Fi in a default configuration. In the OSM LGA module, antenna pins of
LBES5PL2EL-SMP Bluetooth and Wi-Fi is connected to J1 connector and optionally connected to A16th pin of OSM.
Note: SPI4 is shared between Wi-Fi/BT module to support IEEE802.15.4 and OSM. If Wi-Fi/BT is required, SPI is not
supported at the OSM. If SPI is required at the OSM, Wi-Fi/BT module will be made DNP in the OSM.
Figure 4: Wi-Fi+Bluetooth Antenna Connector
Connector Part Number - : MM4829-2702RA4 from Murata.
Antenna Part Number - : 2042811100 from Molex

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2.6.2 RTC Controller
The i.MX 93 and i.MX 91 OSM LGA Module by supports external RTC Controller “PCF85263” On-SOM for Real time
clock support. This external RTC Controller IC (U6) is connected to i.MX 93 SoC through I2C7 Interface and operates at
1.8V voltage level. In SOM power off condition, this device will take power from OSM pin No. W17 (RTC_PWR) coin
cell power input and continues to keep the current time.
Note: RTC cannot be used as wake-up source, as a result RTC alarm won't work.

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2.7 OSM LGA/BGA
OSM LGA/BGA (J3) has standard pinout as per OSM Specification V1.1 The interfaces which are available at 662
contacts are explained in the following sections.
Figure 5: OSM LGA/BGA
Number of contacts - : 662