IWILL LE370 User manual

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EC Declaration of Conformity
We
Iwill Corp.
No. 10, Wu Chuan 3rd Rd.,
Hsin Chuang City, Taipei,
Taiwan, R.O.C.
Declare under sole responsibility that the
LE370 motherboard
Meets the intent of Directive 89/336/ECC for Electromagnetic Compatibility. Compliance was
demonstrated to the following specifications as listed in the official Journal of the European
Communities:
EN 50081-1 Emissions:
EN 55022 Radiated, Class B
EN 55022 Conducted, Class B
EN 60555-2 Power Harmonics
EN 50082-1 Immunity:
IEC 801-2 Electrostatic Discharge
IEC 801-3 RF Radiate
IEC 801-4 Fast Transient

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About This Manual
This manual will introduce to the user how this product is consisted. All useful information will be
described in later chapters. Keep this manual for your future upgrade or system re-configuration.
Chapter 0 Overview
The features and specifications of this motherboard
Chapter 1 Quick Installation
The quick reference for experienced users
Chapter 2 Hardware Installation
The detailed information on jumper setting, connection, and hardware installation
Chapter 3 System BIOS Setup
The detail information of the system BIOS setup options
Chapter 4 Software and Tools
The detail information for install software and tools.
Copyright
This manual contains information protected by copyright law. All rights are reserved. No any part
of this document may be used or reproduced in any forms or by any means, or stored in a database
or retrieval system without prior written permission from Iwill Corp.
This manual is subject to change without notice.
Trademark
Intel / Pentium are trademarks of Intel Corporation.
IWILL and IWILL logo are trademarks of IWILL Corp.
Sound Blaster is a registered trademark of Creative Technology Ltd.
Sound Blaster-LINK and SB-LINK are trademarks of Creative Technology Ltd.
And all other product names are trademarks and registered trademarks of their respective owners.
Warning
Most of the features of this product have passed strict verification and are subject to change at any
time without notice. If any malfunction occurs due to the future technical changes made by the
respective component manufacturers, Iwill assumes no responsibility or liability for it.

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Content
CHAPTER 0.................................................................................................5
OVERVIEW.................................................................................................5
0.1 FEATURES ..............................................................................................5
0.2 ENVIRONMENT REQUIREMENTS...............................................................7
0.3 MOTHERBOARD COMPONENTS PLACEMENT.............................................8
0.4 BACK PANEL CONNECTORS...................................................................11
0.5 FORM FACTOR......................................................................................12
CHAPTER 1...............................................................................................13
QUICK INSTALLATION..........................................................................13
CHAPTER 2...............................................................................................16
HARDWARE INSTALLATION ................................................................16
2.1 PREPARATION AND INSPECTION .............................................................16
2.2 UNPACK THE LE370 .............................................................................16
2.3 INSTALLATION PROCEDURES..................................................................16
CHAPTER 3...............................................................................................25
SYSTEM BIOS SETUP..............................................................................25
3.1 INTRODUCTION.....................................................................................25
3.2 MAIN MENU.........................................................................................27
3.3 STANDARD CMOS SETUP ...............................................................27
3.4 BIOS FEATURES SETUP...................................................................30
3.5 CHIPSET FEATURES SETUP ............................................................34
3.6 POWER MANEGEMENT SETUP......................................................37
3.7 PNP/ PCI CONFIGURATION .............................................................41
3.8 INTEGRATED PERIPHERALS ..........................................................43

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3.9 LOAD SETUP DEFAULTS.................................................................46
3.10 IWILL SMART SETTING.................................................................46
3.11 SUPERVISOR / USER PASSWORD SETTING.................................47
3.12 IDE HDD AUTODETECTION..........................................................47
3.13 SAVE & EXIT SETUP.......................................................................47
3.14 EXIT WITHOUT SAVING................................................................47
CHAPTER 4...............................................................................................48
SOFTWARE AND TOOLS........................................................................48
4.1 SOFTWARE INSTALLATION.....................................................................48
4.2 HOW TO MAKE DRIVER DISKETTE ..........................................................49
4.3 VIEW DETAILED MANUAL.....................................................................49
4.4 CPU FREQUENCY SELECTION BY BIOS..................................................50
4.5 HOW TO USE THERMAL SENSOR.............................................................51
4.6 HOW TO INSTALL AUREAL A3D SOUND DRIVER.....................................52

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Chapter 0
Overview
Thank you for purchasing Iwill LE370 motherboard. This operation manual will instruct you how
to configure and install the system properly. It contains an overview about the engineering design
and features of this product. Also, this manual provides useful information for later on upgrade or
configuration change. Keep this for your future need.
YEAR 2000 issue
The IBM compatible PC utilizes a Motorola MC146818 compatible Real-Time Clock (RTC) chip
to maintain the date and time. Unfortunately, the “century”is not manipulated by the RTC. It uses
8-bit of information to report the year and can only hold the last two digits of a year in packed BCD
format. So 1997 is reported solely as 97. Since the RTC also contains non-volatile memory, IBM
specified a location in the memory to hold “century”information. By combining the century data
with the year data, software can obtain a full 4-digit year. When the Year 2000 occurs, the RTC
reports the year as ’00’and the “century”in RTC memory will contain ’19.’Combining the full 4-
digit year yields 1900, not 2000. Any applications which compares dates, or uses relative dates to
perform functions will see an incorrect dates.
Motherboards contain BIOS, which is one of the key ingredients to check for systems designed to
handle the year 2000. All motherboards currently shipped from Iwill contain BIOS capable of
handling the year 2000 date correctly. The BIOS contains a feature that checks the least two
significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the
date and, if less than `80', updates the century byte to `20'. This feature enables operating systems
and applications using the BIOS date/time services to reliably manipulate the year as a four-digit
value.
Be aware that the BIOS capability alone does not ensure that the system will handle the transition
correctly. Other system components such as the operating system and application software also
need to be able to handle the year 2000 date and recognize the date format from other pieces.
0.1 Features
0.1.1 Processor
Socket 370 processes support
Supports 66 MHz bus speed

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0.1.2 Core Logic
Intel 1621 PCI/A.G.P. controller
Integrated DRAM controller
Integrated PCI bus mastering controller
Integrated Accelerated Graphics Port (A.G.P.) bus controller
Intel PCI/ISA/IDE Xcelerator
Multifunction PCI-to-ISA bridge (PCI Rev 2.1 compliant)
Integrated IDE controller with Ultra DMA/33 support
USB host interface with support for two USB ports
Enhanced DMA controller and standard Interrupt controller and Timer function
System Management Bus (SMB) with support for DIMM Serial PD
0.1.3 Main Memory
Three 168-pin DIMM (Dual In Line Memory Module) sockets
Supports up to 768 MB of 3.3 V Unbuffered SDRAM DIMM
Supports up to 384 MB of 3.3 V Extended Data Out (EDO) memory
64-bit data interface with ECC support (SDRAM only)
0.1.4 Multi I/O
Winbond W83977EF super I/O controller
Supports two floppy disk drives (include 3 Mode drive) and / or QIC-80 tape drive
Supports one multi-mode parallel port
Supports two high speed 16550 FIFO serial ports
Integrated keyboard controller
Integrated PS/2 mouse controller
Support Keyboard-Power-On function
Support Power Fail Recovery
0.1.5 Expansion slots
Two ISA slot
Five PCI slot
One A.G.P. slot

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0.1.6 Form Factor
Compliance with ATX Version 2.01 specification
Supports ATX power supply connector
Supports the remote on/off switch
Physical dimensions: length: 189 mm / width: 305 mm
0.1.7 Manageability
Winbond W83781 System Hardware Monitor
Wake on LAN header for use with add-in network interface cards (NICs)
0.1.8 Other features
Award BIOS
Using Flash ROM to provide on-board-upgrade ability without changing components
Plug and Play compatible
Supports Advanced Power Management (APM)
Supports Creative SB-LINK to deliver Sound Blaster 16 compatibility
AUREAL 32-bit PCI audio onboard compatibility
0.2 Environment Requirements
Temperature 0-55 degrees C (operating or storage)
5% to 95% non-condensing relative humidity
At least a 250 W power supply
The power supply must comply with the following recommendations found in the spec.:
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5VSB line
ATX Power supply must comply with ATX spec. 2.01. ( 5VSB >= 1A)

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0.3 Motherboard Components Placement
The following figure shows the location of the motherboard components.
1
1
1
1
NC
NC
VCC
IRRX
GND
IRTX
IRMODE
7
1--2:Normal
2--3:Clear CMOS
1
3
JP1
LID-ON
GND
5VSB
1
3
WOL
FAN1
AGP
S1
SOCKET 370
USB
MS
KB
PWR
DIMM0~2
FDC
FAN2
GND
+12V
SENSE
1
3
IDE0
IDE1
J43
IR
S2
LPT
J55
PCIx
PWR ON
FAN3
JP5
Game/Midi Port
MIC
Line Out
Line In
J52
1
10
11
20
RST ALED
KL
SPKR
Cathode-
Anode+
Reset
GND
VCC
Cathode-
NC
Anode+
Buzz
GND
Keylock
GND
NC PLED
ACPI LED
Anode+ Cathode-
ISAx
SB-LINK
GNT#
1
5
6
2
GND
REQ#
GND
SIRQ
JP44
JP43
JP42
J53
JP45
JP8
1
1
Tmp3
Tmp2

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Location ScreenPrinting Description
J3 Socket 370 Socket 370 connector
J5--J7 DIMM 0--2 168-pin DIMM Sockets
J11 AGP A.G.P. connector
J12-16 PCI1--5 PCI expansion slots
J21-22 ISA 1-2 ISA expansion slots
J28 IDE 0 Primary IDE connector
J29 IDE 1 Secondary IDE connector
J30 FDC Floppy drive connector
J31 S1 Serial 1 connector
J32 S2 Serial 2 connector
J33 LPT Parallel connector
J34 USB Two USB connectors
J35 MS PS/2 mouse connector
J35 KB PS/2 keyboard connector
J37 PWR ATX power connector
J39 FAN1 Processor fan header
J40 FAN2 System fan header
J41 FAN3 System fan header
J42 PWR ON Power on/off header
J43 J43 Front panel I/O header
ACPI LED (pins 1--2): ACPI LED header
ALED (pins 5--6): IDE LED header
RST (pins 9--10): Reset Switch header
PLED (pins 11--13): Power LED header
KL (pins 14--15): Keylock switch header
SPKR (pins 17--20): Speaker header
J44 SB-LINK Creative SB-LINK header
J45 IR IR (infrared) connector
J46 WOL Wake On LAN header
J49 Tmp1 Temp. sensor header
J50 Tmp2 Temp. sensor header
J51 Tmp3 Temp. sensor header
J52 KB ON Keyboard Power On connector
J53 J53 AUX in
J55 J55 CD in
J56 Game_Audio Audio Port Connector/ Joystick/Midi Connector
JP1 CLRTC Clear CMOS jumper
JP5 JP5 PCI compatibility jumper
JP8 JP8 Audio ON/OFF

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JP42 JP42 Keyboard password Power on connector
JP43 JP43 SMBUS Connect
JP44 JP44 Internal Modem Wake up connect.
JP45 JP45 Chassis Intrusion detection header