Laird BL600-SA Quick setup guide

Single Mode Bluetooth Low
Energy (BLE) Module
Part # BL600-SA, BL600-SC, BL600-ST
HARDWARE INTEGRATION GUIDE
VERSION 2.1
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REVISION HISTORY
Version
Revision Date
Change History
1.0
16 April13
Initial Release
1.1
5 July13
Added:
To Table 1, smart BASIC runtime engine FW upgrade via UART.
To Table 1, smart BASIC application download via OTA.
Section 3.3.4 OTA (Over the Air) smart BASIC application download
Updated:
Table 1,make it clear number of SPI (x1), I2C(x1) interfaces and ADC channels.
Table 2 (pin list), footnote mentions SIO_7 has Internal Pull down (default in
FW).
Section 5.2 (clocks), corrected 32.768 crystal accuracy to +/-20ppm. Added
16MHz crystal accuracy (+/-10ppm).
Section 6.1 Circuit – circuit HW integration suggestion), on SIO_7 pin and Over
the Air smart BASIC application download feature.
Figure 13: BL600 Mechanical drawings – BL600 Mechanical drawing to add
measurements of the half-moon shaped positioning holes.
1.2
25 Oct 2013
Updated Recommended Operating Parameters notes to reflect 2.7 ms rather
than 2.7 µs.
1.3
12 Dec 2013
Added baking schedule information.
1.4
20 Dec 2013
Added:
ADC (AIN) input impedance into Table 6, Section 0.
AIN (ADC) impedance and external voltage divider setup into section 6.1
Circuit.
1.5
10 Jan 2014
Updated TOC with correct page numbers.
Added noted regarding smartBASIC firmware’s lack of support for GPIO high
drive state.
1.6
06 Feb 2014
Updated Bluetooth SIG Qualification section.
1.7
18 Feb 2014
Updated Operating temperature range
1.8
04 April2014
Updated or added the following for the BL600-Sx-04:
Lower power consumption figures (standby doze, deep sleep) and lower
peripheral (UART, SPI, I2C, ADC) block currents for the BL600-Sx-04
(new Nordic silicon).
Improved UART with deep RX buffer (6 bytes instead of 2 bytes).
Increased the Absolute Max rating on the VCC pin from 3.6V to 3.9V.
Added a note for External 12K resistor to GND on SWDCLK pin NOT
required on BL600-Sx-04.
Added the following for all BL600 module revisions to align with FW features:
Section on PWM output and FREQ output signals.
Note on GPIO high drive strength (5 mA).
Note regarding internal DCDC convertor turned OFF on
recommendation from chipset supplier until further notice. Updated
Peak current consumption figures with DCDC turned OFF (with internal
LDO ON).
Added in the pin list the newly FW (1.5.66.0, April 2014) enabled
internal pull-ups to prevent inputs from floating and to help with the
issue of Standby Doze current drifting with time.

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Version
Revision Date
Change History
Note on added coming out from Deep Sleep to Standby Doze through
GPIO signal through the reset vector.
New function to detect GPIO change with no current consumption, so
UART closed but still able to detect for incoming data and be woken up
so that the UART can be re-opened at the expense of losing that first
character.
Note that SIO_7 and AutoRUN (SIO_28) are not both high (externally),
otherwise cannot load smart BASIC application script.
Note on each module GND pin that must be connected to host PCB
GND.
1.9
11 June 2014
Updated BT SIG information
2.0
2 July 2014
Important information on pin 22 (reset) and pin 23 (SWDCLK).
2.1
14 July 2014
Updated SIO VIL max value in table 5

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CONTENTS
1Overview and Key Features.................................................................................................................... 6
1.1 Features & Benefits.................................................................................................................... 6
1.2 Application Areas ...................................................................................................................... 6
2Specification ............................................................................................................................................ 7
2.1 Specification Summary .............................................................................................................. 7
3Hardware Specifications ....................................................................................................................... 10
3.1 Block Diagram and Pin-out ...................................................................................................... 10
3.2 Pin Definitions ......................................................................................................................... 11
3.3 Electrical Specifications............................................................................................................ 14
3.3.1 Absolute Maximum ratings...................................................................................................... 14
3.3.2 Recommended Operating Parameters ..................................................................................... 14
3.3.3 nAutoRUN pin and Operating Modes ...................................................................................... 16
3.3.4 OTA (Over the Air) smart BASIC application download ............................................................ 17
4Power Consumption ............................................................................................................................. 17
4.1 Power Consumption................................................................................................................ 17
4.2 Measured Peak Current Waveforms during Advertising and Connection ................................. 20
4.3 Peripheral Block Current Consumption .................................................................................... 23
5Functional Description.......................................................................................................................... 24
5.1 Power management (includes brown-out and power on reset)................................................ 24
5.2 Clocks and TIMERS.................................................................................................................. 25
5.2.1 Clocks ..................................................................................................................................... 25
5.2.2 TIMERS.................................................................................................................................... 25
5.3 Memory for smart BASIC Application Code ............................................................................. 25
5.4 RF............................................................................................................................................ 25
5.5 UART Interface ........................................................................................................................ 25
5.6 SPI Bus .................................................................................................................................... 26
5.7 I2C Interface ........................................................................................................................... 27
5.8 General Purpose I/O, ADC, PWM/FREQ and Quadrature Decoder ............................................ 27
5.8.1 GPIO ....................................................................................................................................... 27
5.8.2 Quadrature Decoder................................................................................................................ 28
5.8.3 ADC ........................................................................................................................................ 28
5.8.4 PWM and FREQ signal output on upto 2 SIO pins.................................................................... 28
5.9 nRESET pin .............................................................................................................................. 29

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5.10 nAutoRUN pin......................................................................................................................... 29
5.11 Miscellaneous (Hidden JTAG)................................................................................................... 29
5.12 BL600-SA on-board chip antenna characteristics ..................................................................... 30
6Hardware Integration Suggestions...................................................................................................... 31
6.1 Circuit ..................................................................................................................................... 31
6.2 PCB Layout on Host PCB - General .......................................................................................... 34
6.3 PCB Layout on Host PCB for BL600-SA.................................................................................... 34
6.3.1 Antenna keep-out on host PCB ............................................................................................... 34
6.3.2 Antenna keep-out and Proximity to Metal or Plastic ................................................................ 35
6.4 50-Ohms RF trace on Host PCB for BL600-ST .......................................................................... 36
6.5 External Antenna Integration with BL600-SC and BL600-ST .................................................... 37
7Mechanical Details................................................................................................................................ 38
7.1 BL600 Mechanical Details........................................................................................................ 38
7.2 Host PCB Land Pattern and Antenna Keep-out for BL600-SA .................................................. 39
8Application Note for Surface Mount Modules ................................................................................... 41
8.1 Introduction ............................................................................................................................ 41
8.2 Shipping.................................................................................................................................. 41
8.3 Reflow Parameters .................................................................................................................. 42
9FCC and IC Regulatory Statements ...................................................................................................... 43
9.1 Power Exposure Information.................................................................................................... 44
9.2 OEM Responsibilities ............................................................................................................... 44
10 Japan (MIC) Regulatory ........................................................................................................................ 46
10.1 Antenna Information............................................................................................................... 46
11 CE Regulatory........................................................................................................................................ 47
11.1 Antenna Information............................................................................................................... 47
12 EU Declarations of Conformity ............................................................................................................ 48
12.1 BL600-SA / BL600-SC / BL600-ST ............................................................................................ 48
13 Ordering Information ........................................................................................................................... 48
13.1 General Comments ................................................................................................................. 49
14 Bluetooth SIG Qualification ................................................................................................................. 49
14.1 Additional Assistance .............................................................................................................. 50

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1OVERVIEW AND KEY FEATURES
Every BL600 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy (BLE) to
small, portable, power-conscious devices. The BL600 modules are enabled with Laird’s smart BASIC, an
event-driven programming language that enables OEMs to make their BLE product development quicker and
simpler, significantly reducing time to market. smart BASIC enables customers to develop a complete
embedded application inside the compact BL600 hardware, connecting to a wide array of external sensors via
its I2C, SPI, UART, ADC or GPIO interfaces.
Based on the world-leading Nordic Semiconductor nRF51822 chipset, the BL600 modules provide ultra-low
power consumption with outstanding wireless range via 4 dBm of transmit power. A broad range of BLE
profiles including Temperature and Heart Rate are available and smart BASIC provides the ideal mechanism to
support any BLE profile development of your choice. This document should be read in conjunction with the
smart BASIC user manual.
1.1 Features & Benefits
1.2 Application Areas
Bluetooth v4.0 - Single Mode
External or Internal Antennas
smartBASIC programming language
Full Bluetooth EPL
Compact Footprint
Programmable TX power 4 dBm to -20 dBm
TX whisper mode (-30 dBm, -55 dBm)
RX sensitivity: -91 dBm
Ultra low power consumption
TX: 11.6 mA peak (at +4 dBm) (refer to Note1 in Power
Consumption section)
RX: 8.8 mA peak (refer to Note1 in Power Consumption
section)
Standby Doze: 2.6 uA typical
Deep Sleep: 0.6 uA (refer to Note4 in Power Consumption
section)
UART, GPIO, ADC, PWM, FREQ output, TIMERS, I2C, and SPI
interfaces
Fast Time to Market
FCC, CE, IC, Taiwan (-SA version only) and Japan certified;
other regulatory certifications on request
No external components required
Medical devices
Wellness devices
iOS “appcessories”
Fitness sensors
Location Awareness
Home automation

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2SPECIFICATION
2.1 Specification Summary
Table 1: Specifications
Categories
Feature
Implementation
Wireless Specification
Bluetooth®
V4.0 –Single Mode
Slave (from base FW v1.1.50.0 onwards)
Frequency
2.402 - 2.480 GHz
Maximum Transmit Power
Setting
4 dBm
Conducted BL600-SA
4 dBm
Conducted BL600-SC
~2.5 dBm
Conducted BL600-ST (RSMA
connector on dev board)
Minimum Transmit Power
Setting
-20 dBm (in 4 dB steps) with smart BASIC command
-16 dBm
-12 dBm
- 8 dBm
- 4 dBm
0 dBm
TX Whisper Mode1
Transmit Power
-30 dBm (min) with smart BASIC command
TX Whisper Mode2
Transmit Power
-55 dBm (min) with smart BASIC command
Receive Sensitivity
(0.1% BER)
-91 dBm typical
Link Budget
95 dB (@ 1 Mbps)
Range
Up to 100 m in free space
TX Whisper Modes
Range reduction feature with TX Whisper Modes
with smart BASIC command.
Range
(TX Whisper Mode 2)
<~30 cm
Raw Data Rates
1 Mbps (over the air)
Host Interface and
Peripherals
TOTAL
28 x Multifunction I/O lines
UART
TX, RX, CTS, RTS
DCD, RI, DTR, DSR, CTS, RTS (Note 1)
Default 9600, n,8, 1
From 1,200 to 115,200bps
BL600-Sx-04 onwards has improved UART with
Deep RX buffer (6 bytes instead 2 bytes).
GPIO
Up to 28, with configurable: I/O direction,
O/P drive strength (standard 0.5 mA or high 5 mA),
Pull-up /pull-down
ADC
Six 10-bit channels (including ADC reference)
10 bit resolution
1.2 V internal reference

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Categories
Feature
Implementation
1/1, 2/3, 1/3 pre-scaling
PWM or FREQ output
Output a PWM or FREQ output on up to two GPIO
output pins.
PWM output duty cycle
0%-100%
PWM output frequency
Up to 500 kHz (Note 7)
FREQ output frequency
0 MHz-4 MHz
(50% duty cycle)
I2C
One I2C interface (up to 400 kbps) (Note 2)
SPI
One SPI Master interface (up to 4 Mbps) (Note 3)
Profiles
Services supported
(Note 4)
(FW v1.1.50.0)
Heart Rate Service
Health Thermometer Service
Battery Alert Service
Blood Pressure Service
Device Information Service
Immediate Alert Service
IOPT (Interoperability)
Link Loss Service
Transmit Power Service
Custom services (from base FW v1.2.54.0
onwards)
FW upgrade
smart BASIC runtime
engine FW upgrade
(Note 5)
Via JTAG. Using the supplied J-link programmer.
Via UART.
Programmability
smart BASIC
On-board programming language similar to BASIC.
smart BASIC application
download
(1) Via UART.
(2) Via Over the Air (if SIO_7 pin is pulled high
externally).
Control Protocols
Any
User defined via smart BASIC
Operating Modes
Self-contained Run mode
Selected by nAutoRun pin status:
LOW (0V). Then runs $autorun$ ( smart BASIC
application script) if it exists.
Interactive / development
mode
HIGH (VCC). Then runs via at+run (and “file name”
of smart BASIC application script).
Supply Voltage
Supply (VCC)
2.1 –3.6 V –internal DCDC converter (Note 5)
1.8 –3.6 V –internal LDO
DCDC switched on if VCC>2.1V at power-up.
Power Consumption
(Note 5
Active Modes Peak
Current (for Max TX PWR
4 dBm)
Advertising or
Connected mode
11.6 mA peak TX
8.9 mA peak RX
Active Modes Peak
Current for TX Whisper
mode2 PWR -55 dBm)
Advertising or
Connected mode
5 mA peak TX
8.5 mA peak RX
Active Modes Average
Current
Depends on many factors, see Power Consumption.
Ultra Low Power Modes
Standby Doze
Deep Sleep
2.6 uA typical (Note 6)
600 nA (Note 6)

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Categories
Feature
Implementation
Antenna Options
Internal
Ceramic chip monopole antenna –on-board
BL600-SA
External –Option 1
Dipole antenna (with IPEX connector)
Dipole PCB antenna (with IPEX connector)
Connection via IPEX MH4 –BL600-SC
External –Option 2
Dipole antenna (with RSMA connector)
Connection via Trace Pads –BL600-ST
Physical
Dimensions
Weight
19 mm x 12.5 mm x 3 mm
<1 gram
Environmental
Operating
-25 ˚C to +75 ˚C (VCC 1.8V-3.6V)
-40 ˚C to +85 ˚C (VCC 3.3V+/-10%)
Storage
-40 ˚C to +85 ˚C
Miscellaneous
Lead Free
Lead-free and RoHS compliant
Warranty
1 Year
Development Tools
Development Kit
Development Kit DVK-BL600-Sx and
Free Software Tools
Approvals
Bluetooth®
End Product Listing (EPL)
FCC / IC / CE / MIC
All BL600 Series
Note 1: DSR, DTR, RI, and DCD can be implemented in the smart BASIC application.
Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be connected
externally as per I2C standard.
Note 3: SPI interface (master) consists of SPI MOSI, SPI MISO and SPI CLK. SPI CS is created by customer
using any spare SIO pin within their smart BASIC application script allowing multi-dropping.
Note 4: BL600 module comes loaded with smart BASIC runtime engine FW, but does not come loaded
with any smart BASIC application script (as that is dependent on customer end application or
use). Laird provides many sample smart BASIC application scripts covering the services listed.
Additional BLE services being added every quarter.
Note 5: smart BASIC runtime engine firmware v1.2.54.0(Jun2013) and subsequent versions, the internal
DCDC convertor was switched off on recommendation from the chipset provider until future
notice.
Note 6: Measured with BL600-Sx-04.
Deep Sleep current for BL600-Sx-02 and BL600-Sx-03 ~1000nA (typical).
Standby Doze current for BL600-Sx-02 and BL600-Sx-03 Standby Doze current 3.5uA (typical).
Note 7: PWM output signal has a frequency and duty cycle property. PWM output is generated using
32-bit hardware timers. The timers are clocked by a 1MHz (1uS period) clock source.
Trade-off PWM output frequency with resolution. For example:
PWM output frequency of 500kHz (2uS) results in resolution of 1:2
PWM output frequency of 100kHz (10uS) results in resolution of 1:10
PWM output frequency of 10kHz (100uS) results in resolution of 1:100
PWM output frequency of 1kHz(1000uS) results in resolution of 1:1000
Refer to the smart BASIC user manual for details.

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3HARDWARE SPECIFICATIONS
3.1 Block Diagram and Pin-out
Figure 1: Functional HW and SW block Diagram for BL600 series BLE smart BASIC module
Figure 2: BL600-Sx module pin-out (top view).
Note: Pin 30 (RF_ANT) is for BL600-ST only. On the BL600-SA and BL600-SC, pin 30 is NC.

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3.2 Pin Definitions
Table 2: Pin definitions
Pin #
Pin
Name
Default
Function
Alt.
Funct.
Default
Direction
Note14
Pull-up /
Pull-down
Note14
Notes
Comment
1
GND
2
SIO_1
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution. Voltage
scaling 1/1, 2/3, 1/3.
3
GND
4
SIO_2
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution. Voltage
scaling 1/1, 2/3, 1/3.
5
SIO_3
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution, Voltage
scaling 1/1, 2/3, 1/3.
6
SIO_4
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution, Voltage
scaling 1/1, 2/3, 1/3.
7
SIO_5
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution, Voltage
scaling 1/1, 2/3, 1/3.
8
SIO_6
DIO
AIN
IN
PULL-UP
1,2,3,4,5
8,9,10 bit
resolution, Voltage
scaling 1/1, 2/3, 1/3
9
SIO_7
DIO
IN
PULL-DOWN
1,2, 12, 13
Internal Pull down
(default)
10
VCC
11
GND
12
SIO_8
DIO
I2C SDA
IN
PULL-UP
1,2,4,5,6
I2COPEN() in
smart BASIC selects
I2C function
13
SIO_9
DIO
I2C SCL
IN
PULL-UP
1,2,4,5,6
14
SIO_10
DIO
SPI MOSI
IN
PULL-UP
1,2,4,5,6
SPIOPEN() in
smart BASIC selects
SPI function, MOSI
and CLK will be
outputs when in SPI
master mode. See
Note 11.
15
SIO_11
DIO
SPI MISO
IN
PULL-UP
1,2,4,5,6
16
SIO_12
DIO
SPI CLK
IN
PULL-UP
1,2,4,5,6
17
GND
18
SIO_13
DIO
IN
PULL-UP
1,2
19
SIO_14
DIO
IN
PULL-UP
1,2
20
SIO_15
DIO
IN
PULL-UP
1,2
Laird Devkit : Buzzer
output
21
SIO_16
DIO
IN
PULL-UP
1,2
Laird Devkit : Button
0 input
22
nRESET
IN
9,10
System Reset (Active
low)
23
NC
9
DO NOT CONNECT
24
SIO_17
DIO
IN
PULL-UP
1,2
Laird Devkit : Button
1 input

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Pin #
Pin
Name
Default
Function
Alt.
Funct.
Default
Direction
Note14
Pull-up /
Pull-down
Note14
Notes
Comment
25
SIO_18
DIO
IN
PULL-UP
1,2
Laird Devkit : LED 0
26
SIO_19
DIO
IN
PULL-UP
1,2
Laird Devkit : LED 1
27
SIO_20
NC
Reserved for future
use
28
GND
29
GND
30
RF_ANT
8
Used on BL600-ST
only.
31
GND
32
SIO_21
DIO
UART TX
OUT
Set high in
FW
1,2,4,6,7
UARTCLOSE() selects
DIO functionality
and UARTOPEN()
selects uart comms
behaviour
33
SIO_22
DIO
UART RX
IN
PULL-UP
1,2,4,6,7
34
SIO_23
DIO
UART RTS
OUT
Set low in FW
1,2,4,6,7
35
SIO_24
DIO
UART CTS
IN
PULL-DOWN
1,2,4,6,7
36
SIO_25
DIO
IN
NONE
1,2
Laird Devkit :
UART_DTR via
CON12
37
GND
38
SIO_26
NC
Reserved for future
use. Do NOT
connect.
39
SIO_27
NC
40
SIO_28
nAutoRUN
IN
NONE
IN ONLY
Laird Devkit:
UART_DSR via
CON12
41
SIO_29
DIO
IN
NONE
1,2
Laird Devkit :
UART_DCD via
CON12
42
SIO_30
DIO
IN
NONE
1,2
Laird Devkit :
UART_RI via CON12
43
GND
44
SIO_0
DIO
IN
PULL-UP
1,2
Note 1: Secondary function is selectable in smart BASIC application.
Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC.
Note 3: AIN = Analog Input
Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smart BASIC.
Note 5: AIN configuration selected using GpioSetFunc() function.
Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC.
Note 7: SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up.
Note 8: RF_ANT pin (pin30) is on theBL600-ST module only. Customer MUST use 50-Ohm trace from
RF_ANT pin to RSMA RF connector on host PCB. More details on 50-Ohm trace design refer to
section 50-OhmsRF Trace on Host PCB for BL600-ST.

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Note 9: Hidden JTAG (2-wire interface), pin22 (SWDIO) and pin23 (SWDCLK). Used for upgrading
smart BASIC runtime engine FW only with Laird supplied J-link programmer. Using this hidden
JTAG requires 12K resistor to GND (on pin23 SWDCLK) for BL600-Sx-02 and BL600-Sx-03 on
customers host PCB and header connector Samtech FTSH-105-01-L-DV, refer to section
Miscellaneous (hidden JTAG) for details. 12K resistor is NOT required on customers host PCB
when using the BL600-Sx-04.
Note 10: Pull the nRESET pin (pin 22) low for minimum 100 mS in order for the BL600 to reset.
For BL600-Sx-02 or BL600-Sx-03: To ensure nReset functions properly, you MUST place a 12K
resistor to GND on BL600 pin 23 (NC/SWDCLK) on your host board.
For BL600-Sx-04: Do not fit a resistor to GND on BL600 pin 23 (NC/SWDCLK).
Note11: SPI CS is created by customer using any spare SIO pin within their smart BASIC application script
allowing multi-dropping.
Note12: SIO_7 pin has to be pulled high externally to enable OTA (over the Air) smart BASIC application
download. Refer to the latest FW release documentation for details.
Note13: User must ensure that SIO_7 and AutoRUN(SIO_28) are NOT BOTH HIGH (externally), otherwise
in that state the UART is bridged to Virtual Serial Port service and so the BL600 module will not
respond to AT commands and therefore cannot load smart BASIC application scripts (applies to
all versions of the smart BASIC runtime engine firmware.
Note14: smart BASIC runtime engine FW 1.5.66.0(Apr2014) has DIO (Default Function) INPUT pins, have
by default PULL-UP enabled. This was done to avoid floating inputs (which can also cause
current consumption in low power modes (e.g. StandbyDoze) to drift with time. In any case
customer can disable the PUL-UP through their smart BASIC application.
ALL smart BASIC runtime engine FW versions before 1.5.66.0(Apr2014), the INPUT DIO pins
have NO pull-up or pull-down enabled and would require the customer to enable pull-up
through smart BASIC application script.
All the SIO pins (with a default function of DIO are inputs –apart from SIO_21 and SIO_23,
which are outputs):
-SIO_21 (alternative function UART_TX) is an output, set high (in FW).
-SIO_23 (alternative function UART_RTS) is an output, set low (in FW).
-SIO_22 (alternative function UART_RX) is an input, set with internal pull-up (in FW).
-SIO_24 (alternative function UART_CTS) is an input, set with internal pull-down (in
FW).
-SIO_7 is an input, set with internal pull-down (in FW). It is used for over the air
downloading of smart BASIC applications. Refer to the latest FW release documentation for
details.

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The BL600 module is delivered with the integrated smart BASIC runtime engine FW loaded (but no onboard
smart BASIC application script). Because of this, it starts up in AT command mode by default.
At reset, all SIO lines are configured as the defaults shown above.
SIO lines can be configured through the smart BASIC application script to be either inputs or outputs with
pull-ups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not
allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on
I2C SDA and I2C SCL MUST be connected externally as per I2C standard.
UART_RX, UART_TX, UART_CTS are 3.3 V level logic (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For
example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and
RTS at 0 V are treated as assertions.
Pin 40 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL600-sx) it is connected so
that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to
select between the following two BL600 operating modes:
Self-contained Run mode (nAutoRUN pin held at 0 V).
Interactive / development mode (nAutoRUN pin held at VCC).
smart BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low
and if there is a smart BASIC application script named $autorun$, then the smart BASIC runtime engine FW
executes the application script automatically; hence the name S elf-contained Run Mode .
3.3 Electrical Specifications
3.3.1 Absolute Maximum ratings
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are
listed below; exceeding these values causes permanent damage.
Table 3: Maximum Current Ratings
Parameter
Min
Max
Unit
Voltage at VCC pin
-0.3
+3.6
(Note1)
V
Voltage at GND pin
0
V
Voltage at SIO pin
-0.3
VCC+0.3
V
Storage temperature
-40
+85
ºC
Note 1: Absolute Max Rating for VCC pin (max) is 3.6V for BL600-Sx-02 and BL600-Sx-03.
Absolute Max Rating for VCC pin (max) is 3.9V for BL600-Sx-04.
3.3.2 Recommended Operating Parameters
Table 4: Power Supply Operating Parameters
Parameter
Min
Typ
Max
Unit
VCC (with internal LDO)1
1.8
3
3.6
V
VCC (with internal DCDC enabled)1
2.1
3
3.6
V
VCC Maximum ripple or noise2
10
mV
VCC rise time (0 to 1.8V)3
60
mS
Operating Temperature Range
3.3V +/- 10%
(contact Laird with any queries) 1.8V
-40
-25
-
-
+85
+75
ºC
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Note 1: Internal DCDC is used if VCC >2.1 V on power-up; otherwise internal LDO is used. 4.7 uF
internal to module on VCC. smart BASIC runtime engine firmware v1.2.54.0(Jun2013) and
subsequent versions, the internal DCDC convertor was switched off on recommendation from
the chipset provider until future notice.
Note 2: The maximum VCC ripple or noise (at any frequency) that does not disturb the radio.
Note 3: The on-board power-on reset circuitry may not work for rise times outside the noted interval.
Time reset is active from VCC reaches 1.7 V with 50 mS rise time is 29 mS typical.
Time reset is active from VCC reaches 1.7 V with 1 uS rise time is 2.7 mS typical.
Table 5: Signal Levels for Interface, SIO
Parameter
Min
Typ
Max
Unit
VIH Input high voltage
0.7VCC
VCC
V
VIL Input low voltage
VSS
0.3
V
VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1)
VCC-0.3
VCC-0.3
VCC
VCC
V
V
VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA) (Note 1)
VSS
VSS
0.3
0.3
V
V
Pull up resistance
11
13
16
kΩ
Pull down resistance
11
13
16
kΩ
Note 1: Maximum number of pins with 5mA high drive is three.
smart BASIC firmware 1.5.65.0(Feb2014) and subsequent versions support high drive (as well
standard drive).
Table 6: SIO pin alternative function AIN (ADC) specification
Parameter
Min
Typ
Max
Unit
ADC Internal reference voltage
-1.5%
1.2 V
+1.5%
%
ADC pin input
internal selectable scaling
1/1, 1/3, 2/3
scaling
ADC input pin (AIN) voltage maximum
without damaging ADC w.r.t
VCC Prescaling
3.6 V 1/1
3.6 V 2/3
3.6 V 1/3
3.3 V 1/1
3.3 V 2/3
3.3 V 1/3
1.8 V 1/1
1.8 V 2/3
1.8 V 1/3
2.4
3.6
3.6
2.4
3.6
3.6
2.1
2.1
2.1
V
V
V
V
V
V
V
V
V

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Parameter
Min
Typ
Max
Unit
ADC input pin (AIN) voltage maximum
without saturating ADC (with 1.2V internal
reference)1
1/1 prescaling
2/3 prescaling
1/3 prescaling
1.2
1.8
3.6
V
V
V
Time required to convert single sample in
10bit mode
9bit mode2
8bit mode2
68
36
20
uS
uS
uS
ADC input impedance (during operation)3
1/1 prescaling:
2/3 prescaling:
1/3 prescaling:
275
350
550
kOhm
kOhm
kOhm
Note 1: Stay within internal 1.2 V reference voltage with given prescaling on AIN pin and do not violate
ADC maximum input voltage (for damage) for a given VCC, e.g. If VCC is 1.8 V can only expose
AIN pin to 2.1 V (VCC+0.3).
Note 2: Currently, the smart BASIC runtime engine firmware only allows 10-bit mode.
Note 3: ADC input impedance is estimated mean impedance of the ADC (AIN) pins. The tolerance is
+/-20%. The ADC is highly sensitive to the impedance of the source. The ADC (AIN) input
impedance is 200k-600k depending on your ADC gain (prescaling) setting. Normally, when not
sampling, the ADC (AIN) impedance will have very high value and can consider it to be an open
circuit. The moment ADC is sampling, ADC(AIN) impedance is 200k-600k.
3.3.3 nAutoRUN pin and Operating Modes
Operating modes (refer to the smart BASIC manual for details):
Self-contained mode
Interactive / Development mode
Table 7: nAutoRUN pin
Signal Name
Pin No
I/O
Comments
nAutoRUN (SIO_28)
28
I
Input with active low logic.
Operating mode selected by nAutoRun pin status:
If Low (0V), runs $autorun$ if it exists;
If High (VCC), runs via at+run (and “file name” of application).
Pin 40 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BL600-sx) it is connected
so that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be externally held high or low
to select between the two BL600 operating modes:
Self-contained Run mode (nAutoRUN pin held at 0V).
Interactive / Development mode (nAutoRUN pin held at VCC).
smart BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low
and if there is a smart BASIC application named $autorun$ then the smart BASIC runtime engine executes the
application automatically; hence the name self-contained run mode .

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3.3.4 OTA (Over the Air) smart BASIC application download
Refer to latest FW release documentation (FW release notes and smart BASIC user manual) for details. This
feature was first added the smart BASIC runtime engine firmware (v1_2_54_0-r2).
Table 8: OTA mode
Signal Name
Pin No
I/O
Comments
(SIO_7)
9
I
Internal pull down (default).
OTA mode selected by externally pulling SIO_7 pin:
High (VCC), then OTA smart BASIC application download is possible.
The OTA smart BASIC application download feature can be useful for a customer’s production because it
allows the module to be soldered into an end product without preconfiguration; the application can then be
downloaded over the air once the product has been pre-tested.
Note: It is the smart BASIC application that is downloaded over the air and NOT the firmware. Due to
this principle reason for use in production, to facilitate multiple programming stations in a
locality the transmit power is limited (to lower Tx power), refer to smart BASIC user manual for
more details.
4POWER CONSUMPTION
Data taken at VCC 3.3V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON (see Note1)
and 25ºC.
4.1 Power Consumption
Table 9: Power consumption
Parameter
Min
Typ
Max
Unit
Active mode ‘peak’current –Note1
(Advertising or Connection)
TX only run peak current @TXpwr= +4 dBm
TX only run peak current @T pwr= 0 dBm
TX only run peak current @TXpwr= -4 dBm
TX only run peak current @TXpwr= -8 dBm
TX only run peak current @TXpwr= -12 dBm
TX only run peak current @TXpwr= -16 dBm
T X only run peak current @TXpwr= -20 dBm
TX Whisper mode 1(Note2)
TX only run peak current @TXpwr= -30 dBm
TX Whisper mode 2(Note2)
TX only run peak current @TXpwr= -55 dBm
With LDO(withDCDC)
16 (11.6)
10.5 (8.4)
8 (7.1)
7 (6.9)
6.5 (6.4)
6 (6.1)
5.5 (5.5)
5.5 (5.4)
5 (5.0)
mA
mA
mA
mA
mA
mA
mA
mA
mA
Active Mode
RX only ‘peak’current (Note2)
8.7 (8.7)
mA
Ultra Low Power Mode1(Note3)
Standby Doze
2.6
uA
Ultra Low Power Mode2(Note4)
Deep Sleep (no RAM retention)
600 (Note 4)
nA

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Parameter
Min
Typ
Max
Unit
Active Mode Average current (Note5)
Advertising Average Current draw
Max, with advertising interval (min) 20 mS
Min, with advertising interval (max) 10240 mS
Connection Average Current draw
Max, with connection interval (min) 7.5 mS
with connection interval 67.5 mS
Min, with connection interval (max) 4000 mS
~800
~2.6-4.1
~400
~2.6-4.1
uA
uA
uA
uA
uA
Note 1: With VCC 3.3V with internal LDO ON (or with internal DCDC ON). If VCC reduces to 2.1V
(operating range of DCDC, the peak current consumption would increase from 11.6mA to
~15.5mA for TX power setting of +4dBm.
smart BASIC runtime engine firmware v1.2.54.0(Jun2013) and subsequent versions, the internal
DCDC convertor was switched off on recommendation from the chipset provider until future
notice.
Note 2: Firmware version 1.1.50.0 (only) has an issue that TX PWR settings need to -40 dBm to produce
-30 dBm and -65 dBm to produce -55 dBm.
Note 3: BL600-Sx-02 and BL600-Sx-03: Standby Doze current 3.5uA typical.
BL600-Sx-04: Standby Doze is 2.6uA typical. Standby Doze is entered automatically (when
waitevent statement is encountered within a smart BASIC application script). In Standby Doze, all
peripherals that are enabled stay on and may re-awaken the chip. Depending on active peripherals,
current consumption ranges from ~2-4 µA to > 1 mA. See individual peripherals current
consumption in tables in section Peripheral block current consumption 4.3 . Since smart BASIC
runtime engine firmware v1.3.57.0 (Sept. 2013) has added new function to detect GPIO change
with no current consumption cost which means it is possible to close the UART and get to the
2.6-4 uA current consumption regime and yet still be able to detect for incoming data and be
woken up so that the UART can be re-opened at expense of losing that first character.
Note 4: In Deep Sleep, everything is disabled and the only wake-up sources are reset and changes on pins
on which sense is enabled. The current consumption seen is ~600 nA typical in BL600-Sx-04.
BL600-Sx-02 and BL600-Sx-03 this figure is ~1000nA.
smart BASIC runtime engine firmware v1.1.50.0 requires a hardware reset to come out of deep
sleep. smart BASIC runtime engine firmware v1.2.54.0(Jun2013) release allows coming out from
Deep Sleep to Standby Doze through GPIO signal through the reset vector. Deep Sleep mode is
entered (with a command in smart BASIC application script).
Note 5: Data taken with TX power 4 dBm and all peripherals off (UART OFF after radio event), slave latency
of 0 (in a connection). Average current consumption depends on a number of factors [including TX
power, VCC accuracy of 16 MHz and 32.768 kHz). With these factors fixed, the largest variable is
the advertising or connection interval set.
Advertising Interval range:
20 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_IND and ADV_DIRECT_IND.
100 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_SCAN_IND and
ADV_NONCONN_IND.
For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to 1.28
seconds (1280 ms).

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For an advertising event:
- the minimum average current consumption is when the advertising interval is large 10240 mS
(although this may cause long discover times (for the advertising event) by scanners
- the maximum average current consumption is when the advertising interval is small 20 mS
Other factors that are also related to average current consumption include the advertising payload
bytes in each advertising packet and whether continuously advertising or periodically advertising.
Connection Interval range:
7.5 ms to 4000 ms in multiples of 1.25 ms.
For a connection event:
- the minimum average current consumption is when the connection interval is large 4000 mS
–the maximum average current consumption is with the shortest connection interval of 7.5 ms; no
slave latency.
Other factors that are also related to average current consumption include whether transmitting 6
packets per connection interval & each packet contains 20 bytes (which is the maximum for each
packet) and an inaccurate 32 kHz master clock accuracy would increase the average current
consumption.

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4.2 Measured Peak Current Waveforms during Advertising and Connection
The following figures illustrate current waveforms observed as the BL600 module performs advertising and
connection functionality.
Figure 3: Typical peak current consumption profile (with DCDC ON) during advertising in slave mode @ TX PWR +4dBm.
UART is OFF. Last spike is DCDC being turned off.
Figure 4: Typical peak current consumption profile (with DCDC ON) during
data connection event in slave mode @ TX PWR +4dBm. UART is ON. Last
spike is DCDC being turned off.