Laird MSD45N Quick setup guide

Laird MSD45N
Hardware Integration Guide
Version 1.1
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com
Americas: [phone] Option 2
Europe: [phone]
Asia: [phone]
www.lairdtech.com/wireless

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Laird Technologies
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Europe: [phone]
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REVISION HISTORY
Version
Revision Date
Change Description
1.0 25 July 2014 Initial Release
1.1 5 August 2014 Added note to SDIO Timing Requirements regarding SDIO bus clock rate.

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
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CONTENTS
Scope............................................................................................................................................................. 4
Operational Description.............................................................................................................................. 4
Block Diagram.............................................................................................................................................. 5
Specifications ............................................................................................................................................... 5
Recommended Operating Conditions and DC Electrical Characteristics ................................................. 8
SDIO Timing Requirements......................................................................................................................... 9
Pin Definitions............................................................................................................................................ 10
MSD40NBT and MSD45N Pin Comparison Table...................................................................................... 13
Integration Considerations ....................................................................................................................... 14
Mechanical Specifications ......................................................................................................................... 15
Connector Overview ................................................................................................................................ 15
MSD45N Attached to T-Board ............................................................................................................. 15
Mounting 16
RF Layout Design Guidelines..................................................................................................................... 16
Regulatory.................................................................................................................................................. 17
Certified Antennas ................................................................................................................................... 17
Documentation Requirements.................................................................................................................. 17
FCC 17
Industry Canada................................................................................................................................... 19
European Union................................................................................................................................... 21
Appendix A: Schematic.............................................................................................................................. 24

Laird MSD45N
Hardware Integration Guide, version 1.1
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SCOPE
This document describes key hardware aspects of the Laird MSD45N radio module. This document is
intended to assist device manufacturers and related parties with the integration of this radio into their host
devices. Data in this document is drawn from a number of sources and includes information found in the
Qualcomm Atheros (QCA) AR6003 data sheet issued in January 2010, along with other documents provided
from Qualcomm Atheros.
The information in this document is subject to change. Please contact Laird Technologies or visit
http://www.lairdtech.com/wireless to obtain the most recent version of this document.
OPERATIONAL DESCRIPTION
This device is a Laird MSD45N radio module which supports IEEE 802.11a/b/g/n
standards via an SDIO (Secure Digital Input/Output) interface. The radio operates
in unlicensed portions of the 2.4 GHz and 5 GHz radio frequency spectrum. The
device is compliant with IEEE 802.11a, 802.11b, 802.11g, and 802.11n standards
using Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency
Division Multiplexing (OFDM). The device supports all 802.11a, 802.11b,
802.11g, and 802.11n data rates and automatically adjusts data rates and
operational modes based on various environmental factors.
When operating on channels in the UNII-2 and UNII-2 Extended bands that are in
the 5GHz portion of the frequency spectrum and are subject to Dynamic Frequency Selection requirements,
the MSD45N fully conforms to applicable regulatory requirements. In the event that specified types of radar
are detected by the network infrastructure, the MSD45N fully conforms to commands from the infrastructure
for radar avoidance.
The MSD45N interfaces to host devices via a 60-pin connector. The device is based on the Qualcomm
Atheros AR6003 chip which is an integrated device providing a Media Access Controller (MAC), a Physical
Layer Controller (baseband or BB processor), and fully integrated dual-band radio transceiver. To maximize
operational range, the MSD45N incorporates external 2.4 and 5 GHz power amplifiers (PA) to increase
transmit power. The frequency stability for both 2.4 GHz (802.11b and 802.11g) and 5 GHz (802.11a)
operation is +/- 20 ppm.
On the interface connector (Molex 60-pin connector; pin 21), an I/O voltage level configuration (either 3.3 V
or 1.8 V) is required from the host platform to configure the SDIO bus signal to run at a 3.3 V or 1.8 V signal
level. The MSD45N also provides the 3-wire Wi-Fi/BT coexistence signals to ensure the performance of Wi-Fi
and BT system when they reside in the same platform. A cellular coexistence filter is implemented on the
MSD45N to provide robust performance when implemented with a cellular system.
The MSD45N has its own RF shielding and does not require shielding provided by the host device into which
it is installed in order to maintain compliance with applicable regulatory standards. As such, the device may
be tested in a standalone configuration via an extender card.
The device buffers all data inputs so that it will comply with all applicable regulations even in the presence of
over-modulated input from the host device. Similarly, the MSD45N incorporates power regulation to comply
with all applicable regulations even when receiving excess power from the host device.
The MSD45N combines the 2.4 and 5 GHz signal path to signal U.FL type antenna connectors to support dual
band transmission and receive. An antenna diversity function is NOT supported in this product. Supported
host device antenna types include dipole and monopole antennas.
Regulatory operational requirements are included with this document and may be incorporated into the
operating manual of any device into which the MSD45N is installed. The MSD45N is designed for installation
into mobile devices such as vehicle mount data terminals (which typically operate at distances greater than 20
cm from the human body) and portable devices such as handheld data terminals (which typically operate at
distances less than 20 cm from the human body). See “Documentation Requirements” for more information.

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Hardware Integration Guide, version 1.1
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BLOCK DIAGRAM
Figure 1: MSD45 Block Diagram
Note: Transmitter frequencies for Wi-Fi are 2412-2462 MHz and 5180-5805 MHz.
SPECIFICATIONS
Table 1: Specifications
Feature
Description
Physical Interface
Molex 54722-0607 60-pin connector (mates to Molex 55560-0607 60-pin
connector)
Wi-Fi Interface
1-bit or 4-bit Secure Digital I/O
Note:
Can support 1.8 V or 3.3 V depending on the supply voltage on VDDIO
(pin-21).
Antenna Interface
1 Hirose U.FL connector
Main Chip
Qualcomm Atheros AR6003 single-chip client
Input Voltage Requirements
3.3 VDC ± 5% (core)
I/O Signalling Voltage
3.3 VDC ± 5%
1.8 VDC ± 5%
Average Current
Consumption
(At maximum transmit
power setting)
Note:
Standby refers to the
radio operating in PM1
powersave mode.
Mode
1.8 V
3.3 V
Avg.
Current
Max.
Current
Avg.
Current
(mA)
Max.
Current
(mA)
802.11a
Transmit
0.11
0.11
496
500
Receive
0.11
-
0.2
-
Standby
TBD
TBD
TBD
TBD
802.11b
Transmit
0.11
0.11
380
420
Receive
0.11
-
0.2
-
Standby
TBD
TBD
TBD
TBD
802.11g
Transmit
0.11
0.11
355
410
Receive
0.11
-
0.2
-
Standby TBD TBD TBD TBD

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Hardware Integration Guide, version 1.1
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Feature
Description
802.11n
(2.4 GHz)
Transmit
0.11
0.11
342
420
Receive
0.11
-
0.2
-
Standby
TBD
TBD
TBD
TBD
802.11n
(5 GHz)
Transmit 0.11 0.11 422 500
Receive
0.11
-
0.2
-
Standby
TBD
TBD
TBD
TBD
Sleep
N/A
TBD
TBD
TBD
TBD
Operating Temperature
-20° to 70°C (-4° to 158°F)
Operating Humidity
10 to 90% (non-condensing)
Storage Temperature
-40° to 85°C (-40° to 185°F)
Storage Humidity
10 to 90% (non-condensing)
Maximum Electrostatic
Discharge
Maximum Contact Discharge (CD): 4 kV
Maximum Air Discharge (AD): 8 kV
Length
32 mm (1.26 in.)
Width
22 mm (0.87 in.)
Thickness
3.38 mm (0.17 in.)
Weight
0.2 g (0.08 oz.)
Mounting
60-pin connector, three grounded mounting holes (M2 screws)
Wi-Fi Media
Direct Sequence-Spread Spectrum (DSSS)
Complementary Code Keying (CCK)
Orthogonal Frequency Divisional Multiplexing (OFDM)
Wi-Fi Media Access Protocol
Carrier sense multiple access with collision avoidance (CSMA/CA)
Network Architecture Types
Infrastructure and ad hoc
Wi-Fi Standards
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n
Wi-Fi Data Rates Supported
802.11a (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b (DSSS, CCK): 1, 2, 5.5, 11 Mbps
802.11g (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM,HT20,MCS 0-7): 6.5,13,19.5, 26, 39,52, 58.5, 72.2 Mbps
7.2,14.4, 21.7, 28.9,43.3, 57.8, 65 Mbps
Wi-Fi Modulation
BPSK @ 1, 6, 6.5, 7.2 and 9 Mbps
QPSK @ 2, 5.5, 11, 12, 13, 14.4,18, 19.5 and 21.7 Mbps
16-QAM @ 24, 26, 28.9, 36, 39 and 43.3 Mbps
64-QAM @ 48, 52, 54, 57.8, 58.5, 65, and 72.2 Mbps
802.11n Spatial Streams
1x1 SISO (Single Input, Single Output)
Regulatory Domain Support
FCC (Americas, Parts of Asia, and Middle East)
ETSI (Europe, Middle East, Africa, and Parts of Asia)
MIC (Japan) (formerly TELEC)
KC (Korea) (formerly KCC)
2.4 GHz Frequency Bands
ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.483 GHz
MIC (Japan): 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz

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Hardware Integration Guide, version 1.1
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Feature
Description
2.4 GHz Operating
Channels
ETSI:13 (3 non-overlapping)
FCC:11 (3
non-overlapping)
MIC (Japan):14 (4 non-overlapping)
KCC:13 (3 non-overlapping)
5 GHz Frequency Bands
ETSI
5.15 GHz to 5.35 GHz
5.47 GHz to 5.725 GHz
FCC
5.15 GHz to 5.35 GHz
5.725 GHz to 5.82 GHz
MIC 5.15 GHz to 5.35 GHz
KC 5.15 GHz to 5.35 GHz
5.47 GHz to 5.725 GHz
5.725 GHz to 5.82 GHz
5 GHz Operating Channels
ETSI:1
9 non-overlapping)
FCC: 23 non
-overlapping
MIC: 8 non-overlapping
KC: 8 non-overlapping
Transmit Power
Note:
Transmit power
varies according to
individual country
regulations. All values
nominal, +/-2 dBm.
Note:
Laird 45 series radios
support a single
spatial stream and 20
MHz wide channels
for N rates.
802.11a:
6 Mbps 15 dBm (32 mW)
54 Mbps 15 dBm (32 mW)
802.11b:
1 Mbps 16 dBm (40 mW)
11 Mbps 16 dBm (40 mW)
802.11g:
6 Mbps 16 dBm (40 mW)
54 Mbps 14 dBm (25 mW)
802.11n
(2.4 GHz): 6.5 Mbps (MCS0) 16 dBm (40 mW)
65 Mbps (MCS7) 12 dBm (16 mW)
802.11n
(5 GHz): 6.5 Mbps (MCS0) 15 dBm (32 mW)
65 Mbps (MCS7) 12 dBm (16 mW)
Typical Receiver Sensitivity
Note:
All values nominal,
+/-3 dBm.
802.11a:
6 Mbps -91 dBm
54 Mbps -73 dBm (PER <=10%)
802.11b:
1 Mbps -92 dBm
11 Mbps -84 dBm (PER <=10%)
802.11g:
6 Mbps -91 dBm
54 Mbps -74 dBm (PER <=10%)
802.11n
(2.4 GHz): MCS0 Mbps -89 dBm
MCS7 Mbps -71 dBm
802.11n
(5 GHz): MCS0 Mbps -89 dBm
MCS7 Mbps -71 dBm
Operating Systems
Supported
Android, Linux, Windows CE, Windows Mobile (NDIS5)
Security
Standards
Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)
Note:
Support for Federal Information Processing Standards (FIPS) is pending.
Encryption
Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)
Encryption Key Provisioning
Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic

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Hardware Integration Guide, version 1.1
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Feature
Description
802.1X Extensible Authentication Protocol Types
EAP
-FAST
EAP
-TLS
EAP
-TTLS
PEAP-GTC
PEAP-MSCHAPv2
PEAP-TLS
LEAP
Compliance
ETSI Regulatory Domain
EN 300 328
EN 301 489-1
EN 301 489-17
EN 301 893
EN 60950-1
EN 62311
EU 2002/95/EC (RoHS)
FCC Regulatory Domain
FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz & 5.8 GHz
FCC 15.407 UNII – 802.11a (Wi-Fi) – 2.4 GHz & 5.4 GHz
Industry Canada
RSS-210 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz
Certifications
Note:
These certifications
are pending.
Wi-Fi Alliance
802.11a, 802.11b, 802.11g , 802.11n
WPA Enterprise
WPA2 Enterprise
Cisco Compatible Extensions (Version 4)
Warranty
Limited Lifetime
All specifications are subject to change without notice
RECOMMENDED OPERATING CONDITIONS AND DC ELECTRICAL CHARACTERISTICS
Table 2: Absolute Maximum Ratings
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC3_3
Power supply voltage with respect to ground
-0.3
-
4.0
V
VDD_IO
Power supply voltage with respect to ground
-0.3
-
4.0
V
Voltage Ripple
+/-2%, 10KHz~100KHz
Max. values not exceeding Operating voltage
-
-
2
%
RFin
Maximum RF input (reference to 50 ohm) - -+10 dBm
Table 3: Recommended Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC3_3
Power supply voltage with respect to ground
3.14
3.3
3.46
V
VDD_IO
Power supply voltage with respect to ground
1.71
3.14
1.8
3.3
1.89
3.46
V
V
Note: VDD_IO is a voltage from the host platform to configure the I/O signal level. It can be set 1.8 or 3.3 V.

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SDIO Timing Requirements
The following figure (Figure 1) and table display SDIO default mode timing.
Note: The SDIO bus should not exceed a 25 MHz clock rate.
Figure 2: SDIO Default Mode Timing
Note: Timing is based on CL ≤40 pF load on CMD and Data.
Table 4: SDIO Timing Requirements
Symbol
Parameter
Min.
Typ.
Max.
Unit
fPP Frequency – Data Transfer mode 0 - 50 MHz
tWL Clock low time 7 - - ns
tWH Clock high time 7 - - ns
tTLH Clock rise time - - 10 ns
tTHL Clock low time - - 10 ns
Inputs: CMD, DAT (referenced to CLK)
tISU Input setup time 6 - - ns
tIH Input hold time 2 - - ns
Outputs: CMD, DAT (referenced to CLK)
tODLY Output delay time – Data Transfer mode 0 - 14 ns

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PIN DEFINITIONS
Table 5: Pin Definitions
Pin
#
Name
I/O
Default
State
Ref.
Description
If Unused
1 GND
-
Ground
Must be
connected to
GND
2 No Connect - - No internal connection. Leave it open Leave open
3 BT_PRIORITY I Hi-Z VDD_IO 3-Wire Wi-Fi/BT coexistence signal
BT_PRIORITY for Bluetooth coexistence
4 No Connect - - No internal connection. Leave it open Leave open
5 No Connect - - No internal connection. Leave it open Leave open
6 No Connect - - No internal connection. Leave it open Leave open
7 No Connect - - No internal connection. Leave it open Leave open
8 No Connect - - No internal connection. Leave it open Leave open
9 No Connect - - No internal connection. Leave it open Leave open
10 No Connect - - No internal connection. Leave it open Leave open
11 No Connect - - No internal connection. Leave it open Leave open
12 No Connect - - No internal connection. Leave it open Leave open
13 VCC3_3 - 3.3 V Module Power
14 No Connect - - No internal connection. Leave it open Leave open
15 No Connect - - No internal connection. Leave it open Leave open
16 No Connect - - No internal connection. Leave it open Leave open
17 No Connect - - No internal connection. Leave it open Leave open
18 No Connect - - No internal connection. Leave it open Leave open
19 No Connect - - No internal connection. Leave it open Leave open
20 No Connect - - No internal connection. Leave it open Leave open
21 VDD_IO - I/O bus voltage configuration;
Either 3.3 V or 1.8 V
22 No Connect - - No internal connection. Leave it open Leave open
23 No Connect No internal connection. Leave it open Leave open
24 No Connect - - No internal connection. Leave it open Leave open
25 No Connect No internal connection. Leave it open Leave open
26 No Connect - - No internal connection. Leave it open Leave open
27 SDIO_DATA_2 I/O Pull-H VDD_IO
SDIO Data2
Note:
See “Integration Considerations” for additional
integration information.
28 WL_ACTIVE O Low VDD_IO
3-Wire Wi-Fi/BT coexistence signal;
WLAN_ACTIVE for Bluetooth
coexistence
29 VCC3_3 - 3.3 V Module Power

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Pin
#
Name
I/O
Default
State
Ref.
Description
If Unused
30 GND
-
Ground
Must be
connected to
GND
31 GND
-
Ground
Must be
connected to
GND
32 No Connect - - No internal connection. Leave it open Leave open
33 No Connect - - No internal connection. Leave it open Leave open
34 No Connect - - No internal connection. Leave it open Leave open
35 No Connect - - No internal connection. Leave it open Leave open
36 BT_ACTIVE I Hi-Z VDD_IO 3-Wire Wi-Fi/BT coexistence signal;
BT_ACTIVE for Bluetooth coexistence
37 No Connect - - No internal connection. Leave it open Leave open
38 No Connect - - No internal connection. Leave it open Leave open
39 No Connect - - No internal connection. Leave it open Leave open
40 No Connect - - No internal connection. Leave it open Leave open
41 No Connect - - No internal connection. Leave it open Leave open
42 WL_LED_ACT/
ANTE O LOW VCC3_3
Used for the following:
Antenna switch control signal when
sharing antenna with BT signal. See
“Sharing Antenna Implementation”
for more information.
LED indicator for Wi-Fi is active
(sending a signal).
43 No Connect - - No internal connection. Leave it open Leave open
44 No Connect - - No internal connection. Leave it open Leave open
45 No Connect - - No internal connection. Leave it open Leave open
46 No Connect - - No internal connection. Leave it open Leave open
47 No Connect - - No internal connection. Leave it open Leave open
48 CHIP_PWD_L I Pull-H VDD_IO
Input signal to power down the
module. Active low
See Note 1.
See Note Regarding CHIP_PWD_L.
49 No Connect - - No internal connection. Leave it open Leave open
50 No Connect - - No internal connection. Leave it open Leave open
51 No Connect - - No internal connection. Leave it open Leave open
52 No Connect - - No internal connection. Leave it open Leave open
53 No Connect - - No internal connection. Leave it open Leave open
54 No Connect - - No internal connection. Leave it open Leave open
55 SDIO_CMD I/O Pull-H VDD_IO SDIO Command

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Pin
#
Name
I/O
Default
State
Ref.
Description
If Unused
56 SDIO_CLK I Hi-Z VDD_IO SDIO Clock (25 MHz max)
57 SDIO_DATA_0 I/O Pull-H VDD_IO SDIO Data 0
58 SDIO_DATA_3 I/O Pull-H VDD_IO SDIO Data 3
59 SDIO_DATA_1 I/O Pull-H VDD_IO SDIO Data 1
60 GND
-
Ground
Must be
connected to
GND
Note 1: If the following lines are available on the radio you are integrating into your system, you must
connect and control them with the host device.
CHIP_PWD_L
SYS_RST_L
BT_RST_L
VDDIO_DR
If the radio stays powered up and the host goes down or is reset, communications cannot be re-
established with the radio. The host SDIO controller must re-establish communication with the
radio by reloading the radio firmware after a power-on or a reset.
Note Regarding CHIP_PWD_L: During power on/down period, the CHIP_PWD_L must be held in low state
longer than 5 µsec (TAand TB) after the VCC3_3 reaches its high state. See Figure 3.
To reset the MSD45N, set the CHIP_PWD_L in low state longer than 5 µsec (TC). See Figure 4.
Figure 3: Power on/down timing
Figure 4: Reset timing

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MSD40NBT and MSD45N Pin Comparison Table
Pin #
Pin Name
Pin Name
Pin #
Pin Name
Pin Name
MSD40NBT
MSD45N
MSD40NBT
MSD45N
1
GND GND 31 GND GND
2
BT_UART_TXD No Connect
32
BT_RST_L
No Connect
3
BT_PRIORITY
BT_PRIORITY
33
No Connect
No Connect
4
BT_GPIO_6 No Connect 34 No Connect No Connect
5
BT_UART_RTS_N No Connect
35
No Connect
No Connect
6
BT_UART_RXD
No Connect
36
RSVD
BT_ACTIVE
7
BT_HOST_WAKE_B No Connect 37 No Connect No Connect
8
RSVD No Connect
38
No Connect
No Connect
9
RSVD No Connect
39
No Connect
No Connect
10
BT_PCM_OUT No Connect 40 No Connect No Connect
11
BT_UART_CTS_N No Connect
41
No Connect
No Connect
12
BT_WAKE_B
No Connect
42
RSVD
WL_LED_ACT/ANTE
13
VCC3_3 VCC3_3 43 No Connect No Connect
14
No Connect No Connect
44
No Connect
No Connect
15
No Connect
No Connect
45
No Connect
No Connect
16
No Connect No Connect 46 No Connect No Connect
17
No Connect No Connect
47
No Connect
No Connect
18
No Connect No Connect
48
CHIP_PWD_L
CHIP_PWD_L
19
No Connect No Connect 49 No Connect No Connect
20
BT_PCM_SYNC No Connect
50
RSVD
No Connect
21
No Connect
VDD_IO
51
No Connect
No Connect
22
BT_PCM_IN No Connect 52 RSVD No Connect
23
No Connect No Connect
53
RSVD
No Connect
24
BT_PCM_CLK
No Connect
54
RSVD
No Connect
25
No Connect No Connect 55 SDIO_CMD SDIO_CMD
26
SYS_RST_L No Connect
56
SDIO_CLK
SDIO_CLK
27
SDIO_DATA_2 SDIO_D2
57
SDIO_DATA_0
SDIO_D0
28
RSVD WL_ACTIVE 58 SDIO_DATA_3 SDIO_D3
29
VCC3_3 VCC3_3
59
SDIO_DATA_1
SDIO_D1
30
GND
GND
60
GND
GND

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Integration Considerations
The following Wi-Fi information should be taken into consideration when integrating the MSD45N.
Series resistors are recommended in all six SDIO lines (27-56 ohms typically):
SDIO_CLK
SDIO_CMD
SDIO_DATA_0
SDIO_DATA_1
SDIO_DATA_2
SDIO_DATA_3
Also note the following:
Rout the SDIO bus as short and as similar in length as possible.
Keep the clock trace separate from other signal traces.
Note: Although these values may vary with the properties of your host interface and the PCB, they
are a reasonable starting point.
Note:
The series resistors in the SDIO bus provide several design benefits:
If a host controller has too high of a drive strength, then bus ringing may result. Series
resistors can reduce this ringing on the I/O lines.
Adding 27-56 ohms of series resistance on the SDIO bus will reduce sharp transitional
edges, which may reduce EMI.
Having the series resistors in the PCB layout allows for design flexibility; if they are later
found to be unnecessary, zero (0) ohm jumpers may be used in their place.
Notes:
No pull-up is required on the CLK line.
Make sure to apply the proper voltage on the VDD_IO input to the SiP to match the
signalling voltage of the SDIO host interface (1.8V or 3.3V typically, but it can be
anything in between these values).
The SDIO host must wait a minimum of 5 µsec before initiating access to the MSD45N
after VCC3_3 ramps up and settles

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/wireless
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MECHANICAL SPECIFICATIONS
Connector Overview
MSD45N connector: Molex 54722-0607 60-pin connector
Mating connector (on board): Molex 55560-0607 60-pin connector
Figure 5: Mechanical Drawing
MSD45N Attached to T-Board
Figure 6: MSD45N attached to T-board
Units are millimeters

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Mounting
The MSD45N connects to the host via a 60-pin connector. In addition, there are three mounting holes used
to secure the device to the host using 2 mm mounting screws.
Laird recommends a 1.5 mm metal spacer (bushing) with a conductive mounting screw to connect the
exposed ground pads of the radio circuit board to the host ground plane. A 1.5 mm conductive metal spacer
with a maximum OD of 4 mm maximizes grounding of the radio and helps to reduce emissions from the
radio circuit board. The spacer may also prevent the MSD board from slanting and breaking the connection
to the host device when the board is attached to the host.
Figure 7: Mounting Recommendations
RF LAYOUT DESIGN GUIDELINES
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into
your device.
Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the
devices as far apart from each other as possible.
Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird
radio from the antenna. In addition, do not place antennas directly above or directly below the radio.
Laird recommends the use of a double shielded cable for the connection between the radio and the
antenna elements.
Laird has provided three plated mounting holes that can be used for grounding. When additional ground
plane is required, you may use some or all of these grounded mounting holes.
Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Laird Technologies
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Europe: [phone]
Hong Kong: [phone] x026
REGULATORY
Certified Antennas
The MSD45N will be tested to the regulatory standards defined in the “Certifications” section of the
Specifications table above. Laird Technologies plans to conduct these tests with the following antennas:
Model
Type
Connector
Maximum Gain
MAG.LAYERS
EDA-1513-25GR2-B2-CY
Dipole SMA
Jack Reverse
2 dBi
MAG.LAYERS
PCA-4606-2G4C1-A13-CY
PCB Dipole TNOV 2.2 dBi
Laird
NanoBlade-IP04
PCB Dipole IPEX MHF
2.4-2.5 GHz:
2 dBi
5.15-5.35 GHz:
3.9 dBi
5.6 GHz:
4 dBi
Laird
MAF95310 Mini NanoBlade Flex
PCB Dipole IPEX MHF
2.4 GHz:
2.79 dBi
5 GHz:
3.38 dBi
Laird
NanoBlue-IP04
PCB Dipole IPEX MHF
2.5 GHz only:
2 dBi
Ethertronics
WLAN_1000146
Magnetic
Dipole IPEX MHF
2.4-2.5 GHz:
2 dBi
4.9-5.1 GHz:
3.5 dBi
5.15-5.35 GHz:
3.5 dBi
5.7-5.9 GHz:
3.5 dBi
Antennas of differing types and higher gains may be integrated as well. If necessary, with the Laird
Manufacturing Utility software utility, OEMs may reduce the transmit power of the MSD45N to account for
higher antenna gain. In some cases, OEMs may be able to reduce certification efforts by using antennas that
are of like type and equal or lesser gain to the above listed antennas.
Documentation Requirements
In order to maintain regulatory compliance, when integrating the Laird MSD45N into a host device and
leveraging Laird’s grants and certifications, it is necessary to meet the documentation requirements set forth
by the applicable regulatory agencies. The following sections (FCC, Industry Canada, and European Union)
outline the information that may be included in the user’s guide and external labels for the host devices into
which the MSD45N is integrated.
FCC
Note: You must place “Contains FCC ID: SQG-MSD45N” on the host product in such a location that it
can be seen by an operator at the time of purchase.
User’s Guide Requirements
When integrating the MSD45N into a host device, the integrator must include specific information in the
user’s guide for the device into which the MSD45N is integrated. The integrator must not provide information
to the end user regarding how to install or remove this RF module in the user’s manual of the device into
which the MSD45N is integrated. The following FCC statements must be added in their entirety and without
modification into a prominent place in the user’s guide for the device into which the MSD45N is integrated:

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Laird Technologies
Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone] x026
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
1. Reorient or relocate the receiving antenna.
2. Increase the separation between the equipment and receiver.
3. Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
4. Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device is restricted to indoor use when operated in the 5.15 to 5.25 GHz frequency range.
FCC requires this product to be used indoors for the frequency range 5.15 to 5.25 GHz to reduce the
potential for harmful interference to co-channel Mobile Satellite systems.
This device does not permit operations on channels 116-128 (5580 – 5640 MHz) for 11na and 120-128
(5600-5640 MHz) for 11a which overlap the 5600 -5650 MHz band.
IMPORTANT NOTE: FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20 cm is maintained between the antenna and users, and
The transmitter module may not be co-located with any other transmitter or antenna,
For all products marketed in the United States, the OEM must limit the operation channels from
CH1 to CH11 for 2.4 GHz band by the supplied firmware programming tool. The OEM shall not
supply any tool or information to the end-user regarding Regulatory Domain change.

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Laird Technologies
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Europe: [phone]
Hong Kong: [phone] x026
As long as the three conditions above are met, further transmitter testing is not required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
IMPORTANT NOTE: In the event that these conditions cannot be met (for example, certain laptop
configurations or co-location with another transmitter), then the FCC authorization
is no longer considered valid and the FCC ID cannot be used on the final product.
In these circumstances, the OEM integrator is responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna is installed such that 20 cm is
maintained between the antenna and users. The final end product must be labeled in a visible area with the
following: “Contains FCC ID: SQG-MSD45N”.
Manual Information to the End User
The OEM integrator may NOT provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warnings as show in this Hardware
Integration Guide.
Industry Canada
Note: You must place “Contains IC ID: 3147A-MSD45N” on the host product in such a location that it
can be seen by an operator at the time of purchase.
User’s Guide Requirements (for Model # MSD45N)
RF Radiation Hazard Warning
To ensure compliance with FCC and Industry Canada RF exposure requirements, this device must be installed
in a location where the antennas of the device will have a minimum distance of at least 20 cm from all
persons. Using higher gain antennas and types of antennas not certified for use with this product is not
allowed. The device shall not be co-located with another transmitter.
Installez l'appareil en veillant à conserver une distance d'au moins 20 cm entre les éléments rayonnants et les
personnes. Cet avertissement de sécurité est conforme aux limites d'exposition définies par la norme CNR-
102 at relative aux fréquences radio.
Maximum Antenna Gain – If the integrator configures the device such that the antenna is detectable from
the host product.
This radio transmitter (identify the device by certification number, or model number if Category II) has been
approved by Industry Canada to operate with the antenna types listed below with the maximum permissible
gain and required antenna impedance for each antenna type indicated. Antenna types not included in this
list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with
this device.
Antenna list refer to Certified Antennas.
Le présent émetteur radio (IC: XXXXX-XXXXXXXXX) a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise
pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au
gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

Laird MSD45N
Hardware Integration Guide, version 1.1
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
20
Laird Technologies
Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone] x026
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20 cm is maintained between the antenna and users, and
The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les
utilisateurs, et
Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions cannot be met (for example certain laptop configurations or co-
location with another transmitter), then the Canada authorization is no longer considered valid
and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du
Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final.
Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20
cm may be maintained between the antenna and users. The final end product must be labeled in a visible
area with the following: “Contains IC: ”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être
installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le
produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: ".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.