MSI Hetis G31 Series User manual
ii
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothe
followingtwoconditions:
(1)thisdevicemaynotcauseharmful interference,and
(2)thisdevicemustacceptanyinterferencereceived,including interferencethat
maycauseundesiredoperation.
FCC-BRadio Frequency Interference Statement
Thisequipmenthasbeentestedand
foundtocomplywiththelimitsfora
classBdigitaldevice, pursuanttopart
15 ofthe FCCrules.Theselimitsare
designed toprovidereasonableprotectionagainstharmfulinterferenceinaresidential
installation.Thisequipmentgenerates,usesand canradiateradiofrequencyenergy
and,if notinstalledand usedin accordancewiththeinstructionmanual,maycause
harmful interferencetoradiocommunications.However,thereisnoguarantee that
interferencewill notoccurin aparticularinstallation.If thisequipment doescause
harmfulinterferencetoradioortelevision reception,whichcanbedeterminedby
turning theequipmentoff and on,theuserisencouragedtotrytocorrectthe
interferencebyone ormoreofthemeasureslistedbelow.
=Reorientorrelocatethe receiving antenna.
=Increasetheseparationbetweentheequipmentandreceiver.
=Connectheequipmentintoanoutletonacircuitdifferentfromthattowhichthe
receiverisconnected.
=Consultthedealeroran experiencedradio/televisiontechnicianforhelp.
Notice1
Thechangesormodificationsnotexpresslyapprovedbythepartyresponsiblefor
compliancecould void theuser sauthoritytooperatetheequipment.
Notice2
Shielded interfacecablesandA.C.powercord,if any,mustbeusedin orderto
complywiththeemissionlimits.
VOIRLANOTICED INSTALLATIONAVANT DERACCORDERAURESEAU.
Micro-StarInternational
HetisG31
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iii
Trademarks
Alltrademarksarethepropertiesoftheirrespectiveowners.
Intel®andPentium®areregisteredtrademarksofIntelCorporation.
PS/2and OS®/2areregistered trademarks of InternationalBusinessMachines
Corporation.
Windows®95/98/2000/NT/XP/VistaHomePremiumareregisteredtrademarksof
MicrosoftCorporation.
Netware®isaregisteredtrademarkofNovell,Inc.
Award®isaregisteredtrademarkofPhoenixTechnologiesLtd.
AMI®isaregistered trademarkofAmerican MegatrendsInc.
U.S.PatentNumbers.
4,631,603;4,819,098;4,907,093;5,315,448;and 6,516,132.
Thisproductincorporatescopyrightprotection technologythatisprotectedbyU.S.
patentsandotherintellectualpropertyrights.Useof thiscopyrightprotectiontech-
nologymust be authorizedbyMacrovision,andisintendedforhomeand otherlimited
viewingusesonlyunless otherwiseauthorizedbyMacrovision.Reverseengineer-
ing ordisassemblyisprohibited.
RevisionHistory
Revision RevisionHistory Date
V1.0 Firstrelease August2007
CopyrightNotice
The materialin thisdocumentistheintellectualpropertyof MICRO-STAR
INTERNATIONAL.Wetakeeverycarein thepreparationof thisdocument, butno
guaranteeisgivenastothe correctness of itscontents.Ourproductsareunder
continualimprovementand wereservetherighttomakechangeswithoutnotice.
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iv
1. Alwaysread the safetyinstructions carefully.
2. KeepthisUser sManualfor futurereference.
3. Keepthisequipmentawayfromhumidity.
4. Laythisequipment onareliableflat surfacebeforesetting it up.
5. Theopeningsontheenclosurearefor air convectionhenceprotectsthe
equipmentfromoverheating.DONOTCOVERTHEOPENINGS.
6. Makesurethevoltage of thepowersourceand adjust properly115/230V
beforeconnecting theequipment tothe power inlet.
7. Placethe power cordsuchawaythat peoplecannot steponit. Donot
placeanythingover thepowercord.
8. AlwaysUnplug thePower Cordbeforeinserting any add-oncardor module.
9. All cautionsand warningsontheequipment shouldbenoted.
10. Never pourany liquidintotheopening that coulddamageorcauseelectrical
shock.
11. If any of the following situationsarises,get theequipmentcheckedby a
servicepersonnel:
- Thepower cordor plug isdamaged.
-Liquidhaspenetratedintotheequipment.
- Theequipment hasbeenexposedtomoisture.
- Theequipment hasnot workwell oryoucannot getit workaccording to
User sManual.
-The equipmenthasdroppedanddamaged.
- Theequipment hasobvioussign of breakage.
12. DONOTLEAVETHISEQUIPMENTINANENVIRONMENTUNCONDITIONED,
STORAGETEMPERATUREABOVE400 C(1020F),ITMAYDAMAGETHE
EQUIPMENT.
SafetyInstructions
CAUTION: Dangerofexplosionifbatteryisincorrectlyreplaced.
Replaceonlywiththesameorequivalenttyperecommendedbythe
manufacturer.
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Warning:
1.For everychangesinpowercord susage, pleaseuse an approvedpower
cordwithconditiongreaterorequaltoH05VV-F,3G,0.75mm2.
2.Internalpart ishazardousmoving parts,pleasekeepfingersand other
bodypartsaway.
3.Forpluggableequipment,thesocket-outletshallbeinstallednearthe
equipmentand shall beeasilyaccessible.
4.Donot disabletheprotective earthpinfromthe plug,theequipment must
beconnectedtoanearthedmainssocket-outlet.
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ix
CONTENTS
FCC-BRadioFrequencyInterferenceStatement........................................................ii
Trademarks................................................................................................................iii
U.S.PatentNumbers.................................................................................................iii
RevisionHistory.........................................................................................................iii
CopyrightNotice........................................................................................................iii
SafetyInstructions....................................................................................................iv
WEEEStatement........................................................................................................vi
Chapter1.GettingStarted................................................................................1-1
MainboardSpecifications................................................................................1-2
SystemConfiguration......................................................................................1-4
Thermal Solution..............................................................................................1-7
Chapter2.HardwareSetup..............................................................................2-1
MainboardLayout...........................................................................................2-2
CPU(CentralProcessingUnit)........................................................................2-3
Memory............................................................................................................2-4
PowerSupply.................................................................................................2-5
FrontPanel......................................................................................................2-6
BackPanel......................................................................................................2-7
Connectors......................................................................................................2-9
Jumper.............................................................................................................2-13
Slot..................................................................................................................2-14
Chapter3.System Assembly..........................................................................3-1
Overview........................................................................................................3-2
Installation Procedures....................................................................................3-4
Chapter4.BIOSSetup........................................................................................4-1
EnteringSetup.................................................................................................4-2
The Menu Bar.................................................................................................4-4
Main.................................................................................................................4-5
Advanced........................................................................................................4-6
Boot.................................................................................................................4-12
Security...........................................................................................................4-15
Chipset............................................................................................................4-16
Exit...................................................................................................................4-19
AppendixA.Realtek ALC888 Audio................................................................A-1
Installing theRealtekHD Audio Driver.............................................................A-2
SoftwareConfiguration..................................................................................A-4
HardwareSetup.............................................................................................A-18
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Chapter1
Getting Started
Congratulationsforpurchasing HetisG31 Series(MS-
6470)Barebone.HetisG31Seriesisyourbest SlimPC
choice.Withthefantasticappearanceand small form
factor,itcaneasilybesetanywhere.Thefeaturepacked
platformalsogivesyouanexciting PCexperience.
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MS-6470Barebone
1-2
ProcessorSupport
-Intel SmithfieldPentiumD(8XX), PreslerPentiumD(9XX)and
CoreTM 2Duo /Core2Extreme/Core2Quad processorsinthe
LGA775package.
SupportedFSB
-800/1066/1333MHz
Chipset
-NorthBridge:Intel G31 Chipset
-SouthBridge:Intel ICH7Chipset
MemorySupport
-DDR2667/800 SDRAM(240-pin/ 1.8V)
-2DDR2DIMMs(4GBMax)(unbuffered non-ECC)
LAN
-SupportsGiga LANbyIntel 82573L
IEEE1394
-Chip integrated byVIA VT6308P
-Transferrateisup to400Mbps
Audio
-ChipintegratedbyRealtek ALC888
-Flexible8-channelaudiowithjacksensing
-CompliantwithAzalia1.0Spec
IDE
-1IDEportbyIntel ICH7
-SupportsUltraDMA66/100mode
-SupportsPIO, BusMasteroperationmode
SATA
-2SATAII portsbyIntel ICH7
-SupportstwoSATAdevices
-Supportsstorageanddatatransfersatup to300 MB/s
MainboardSpecifications
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Getting Started
1-3
Connectors
BackPanel
-1PS/2mouseport
-1PS/2keyboardport
-2serialports
-1VGAport
-1DVI port(Optional)
-1LANjack
-1IEEE1394port
-4USB 2.0ports
-6audiojacks
FrontPanel
-2audiojacks
-2USB 2.0ports
-1IEEE1394port
-1ChassisIntrusionSwitch
On-BoardPinheaders/Connectors
-1CD-Inconnector
-1CardReaderpinheader
-1SPDIF-Outpinheader
(ForHDMIGraphics CardAudioLineUseOnly)
Slots
-1PCI-XSlot(ForRiserCardUseOnly)
FormFactor
-Proprietary(334MM x190 MM)
Mounting
-5mounting holes
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MS-6470Barebone
1-4
1.Headphone(Green) 6.HDDLED
2.Microphone(Pink) 7.ODD Eject/Close Button
3.USB2.0Ports 8.OpticalDisk Drive(Optional)
4.IEEE1394Port 9.CardReaderDrive(Optional)
5.PowerButton/PowerLED
FrontView
SystemConfiguration
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Getting Started
1-5
BackView
1.VoltageSelector 9. VGAPort
2.PowerJack 10.Audio Jacks
3.Ventilation Hole 11.PowerSwitch
4.USB2.0Ports 12.SupportBracketSpring
5.PS/2Mouse(Green) 13.LAN Jack (RJ45)
6.PS/2Keyboard(Purple) 14.IEEE1394Port
7.SerialPorts 15.ExpansionSlots
8.DVIPort(Optional)
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MS-6470Barebone
1-6
ChassisDesign
†Dimension:330MM(D)x320MM (W)x94MM (H)
†Minimized screwstructure
†Detachablebayhousing
†Multipleventilation holes
1.CPUFanVentilation Hole 5.SystemVentilation Hole
2.SystemVentilation Hole 6.SystemVentilation Hole
3.SystemFanVentilation Hole 7.SystemVentilation Hole
4.PowerSupplyVentilationHole
Back
Side
Bottom
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Getting Started
1-7
Topreventthesystemfromoverheating,wehaveadoptedaspeciallydesignedCPU
coolerand multipleventilationholesforbettercooling effects. Thefollowingfigures
illustratehowthesystemfaneffectivelyexhaustshotairthrough multipleventilation
holes.
CPUCoolerAirFlowDirection
ThermalSolution
AirOut
AirIn
AirOut
AirOut AirOut
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