MSI MS-98G7 User manual

i
MS-98G7
Industrial Computer Board

ii
Preface Industrial Computer Board
Copyright Notice
The material in this document is the intellectual property of MICRO-STAR INTER-
NATIONAL. We take every care in the preparation of this document, but no guar-
antee is given as to the correctness of its contents. Our products are under con-
tinual improvement and we reserve the right to make changes without notice.
Trademarks
All trademarks are the properties of their respective owners.
Revision History
Revision Date
V1.0 2014/10
Technical Support
If a problem arises with your system and no solution can be obtained from the
user’s manual, please contact your place of purchase or local distributor. Alterna-
tively, please try the following help resources for further guidance.
Visit the MSI website for technical guide, BIOS updates, driver updates and other
information, or contact our technical staff via http://www.msi.com/support/

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Preface Industrial Computer Board
Safety Instructions
￭Always read the safety instructions carefully.
￭Keep this User’s Manual for future reference.
￭Keep this equipment away from humidity.
￭Lay this equipment on a reliable at surface before setting it up.
￭The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
￭Make sure the voltage of the power source and adjust properly 110/220V
before connecting the equipment to the power inlet.
￭Place the power cord such a way that people can not step on it. Do not place
anything over the power cord.
￭Always Unplug the Power Cord before inserting any add-on card or mod-
ule.
￭All cautions and warnings on the equipment should be noted.
￭Never pour any liquid into the opening that could damage or cause electrical
shock.
￭If any of the following situations arises, get the equipment checked by ser-
vice personnel:
◯The power cord or plug is damaged.
◯Liquid has penetrated into the equipment.
◯The equipment has been exposed to moisture.
◯The equipment does not work well or you can not get it work according
to User’s Manual.
◯The equipment has dropped and damaged.
◯The equipment has obvious sign of breakage.
￭DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDI-
TIONED, STORAGE TEMPERATURE ABOVE 60oC (140oF), IT MAY DAM-
AGE THE EQUIPMENT.
CAUTION: Danger of explosion if battery is incorrectly replaced. Replace only
with the same or equivalent type recommended by the manufacturer.
警告使用者:
這是甲類資訊產品，在居住的環境中使用時，可能會造成無線電干擾，在這種情
況下，使用者會被要求採取某些適當的對策。

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Preface Industrial Computer Board
Chemical Substances Information
In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 1907/2006 of the European Parliament and the
Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html
Battery Information
European Union:
Batteries, battery packs, and accumulators should not be
disposed of as unsorted household waste. Please use the
public collection system to return, recycle, or treat them in
compliance with the local regulations.
廢電池請回收
Taiwan:
For better environmental protection, waste batteries should
be collected separately for recycling or special disposal.
California, USA:
The button cell battery may contain perchlorate material
and requires special handling when recycled or disposed
of in California.
For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/
Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer.

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Preface Industrial Computer Board
CE Conformity
Hereby, Micro-Star International CO., LTD declares that this device
is in compliance with the essential safety requirements and other
relevant provisions set out in the European Directive.
FCC-A Radio Frequency
Interference Statement
This equipment has been tested and found to comply with the
limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instruction manual, may cause harmful interference
to radio communications. Operation of this equipment in a residential area is
likely to cause harmful interference, in which case the user will be required to
correct the interference at his own expense.
Notice 1
The changes or modications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and AC power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
1) this device may not cause harmful interference, and
2) this device must accept any interference received, including interference that
may cause undesired operation.
WEEE Statement
Under the European Union (“EU”) Directive on Waste Electrical and
Electronic Equipment, Directive 2002/96/EC, which takes effect on
August 13, 2005, products of “electrical and electronic equipment”
cannot be discarded as municipal waste anymore and manufacturers
of covered electronic equipment will be obligated to take back such products at
the end of their useful life. MSI will comply with the product take back require-
ments at the end of life of MSI-branded products that are sold into the EU. You
can return these products to local collection points.

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Preface Industrial Computer Board
Japan JIS C 0950 Material
Declaration
A Japanese regulatory requirement, dened by specication JIS C 0950, man-
dates that manufacturers provide material declarations for certain categories of
electronic products offered for sale after July 1, 2006.
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
日本JIS C 0950材質宣言
日本工業規格JIS C 0950により、2006年7月1日以降に販売される特定分野の
電気および電子機器について、製造者による含有物質の表示が義務付けられま
す。
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
India RoHS
This product complies with the “India E-waste (Management and Handling) Rule
2011” and prohibits use of lead, mercury, hexavalent chromium, polybrominat-
ed biphenyls or polybrominated diphenyl ethers in concentrations exceeding
0.1 weight % and 0.01 weight % for cadmium, except for the exemptions set in
Schedule 2 of the Rule.
Turkey EEE Regulation
Conforms to the EEE Regulations of the Republic Of Turkey
Türkiye EEE yönetmeliği
Türkiye Cumhuriyeti: EEE Yönetmeliğine Uygundur
Ukraine Restriction of Hazardous
Substances
The equipment complies with requirements of the Technical Regulation, ap-
proved by the Resolution of Cabinet of Ministry of Ukraine as of December 3,
2008 № 1057, in terms of restrictions for the use of certain dangerous substances
in electrical and electronic equipment.
Україна обмеження на наявність небезпечних речовин
Обладнання відповідає вимогам Технічного регламенту щодо обмеження
використання деяких небезпечних речовин в електричному та електронному
обладнані, затвердженого постановою Кабінету Міністрів України від 3
грудня 2008 № 1057.

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Preface Industrial Computer Board
Vietnam RoHS
As from December 1, 2012, all products manufactured by MSI comply with Cir-
cular 30/2011/TT-BCT temporarily regulating the permitted limits for a number of
hazardous substances in electronic and electric products.
Việt Nam RoHS
Kể từ ngày 01/12/2012, tất cả các sản phẩm do công ty MSI sản xuất tuân thủ
Thông tư số 30/2011/TT-BCT quy định tạm thời về giới hạn hàm lượng cho phép
của một số hóa chất độc hại có trong các sản phẩm điện, điện tử”

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Preface Industrial Computer Board
Contents
Copyright Notice............................................................................................ ii
Trademarks ................................................................................................... ii
Revision History ............................................................................................ ii
Technical Support.......................................................................................... ii
Safety Instructions.........................................................................................iii
Chemical Substances Information ............................................................... iv
Battery Information....................................................................................... iv
CE Conformity............................................................................................... v
FCC-A Radio Frequency Interference Statement ......................................... v
WEEE Statement .......................................................................................... v
1 Overview.......................................................................................1-1
Specications.............................................................................................1-2
Board Layout..............................................................................................1-4
2 Hardware Setup ...........................................................................2-1
Rear Panel I/O ...........................................................................................2-8
Connector...................................................................................................2-9
Jumper .....................................................................................................2-14
Slot...........................................................................................................2-16
3 BIOS Setup...................................................................................3-1
Entering Setup ...........................................................................................3-2
The Menu Bar ............................................................................................3-4
Main ...........................................................................................................3-5
Advanced ...................................................................................................3-6
Boot..........................................................................................................3-12
Security ....................................................................................................3-13
Chipset.....................................................................................................3-17
Power.......................................................................................................3-18
Save & Exit...............................................................................................3-20
Appendix WDT & GPIO ................................................................... A-1
WDT Sample Code ................................................................................... A-2
GPIO Sample Code .................................................................................. A-4

1-1-1
Thank you for choosing the MS-98G7, an excellent PCI/ISA Single Board
Computer.
Based on the innovative Intel® H81 chipset for optimal system efciency,
the MS-98G7 accommodates the Intel®Core i7/ i5/ i3, Pentium, Celeron
processor and supports 2 DDR3/ DDR3L 1333/ 1600 UDIMM slots to
provide the maximum of 16GB memory capacity.
This PCI/ISA SBC is more maintainable than a conventional motherboard
system and has a much lower mean time to repair (MTTR). It’s easily up-
gradeable and provides conguration control for longer product lifetime.
1Overview

1-2
Overview Industrial Computer Board
Specications
CPU Support
■4th Generation Intel®Core™ i7 / Core™ i5 / Core™ i3 / Pentium®/ Celeron®
processors for LGA 1150 socket
Chipset
■Intel H81 Express Chipset
Memory Support
■2x DDR3 memory slots supporting up to 16GB
■Supports DDR3/ DDR3L 1333/ 1600 MHz
■Dual channel memory architecture
■Supports non-ECC memory
Onboard Graphics
■1x VGA port
■1x DVI-D internal wafter connector
Storage
■2x SATA 6Gb/s ports
■1x SATA 3Gb/s port
■1x mSATA slot full size, share Mini-PCIe slot
Audio
■Realtek ALC887 audio codec
■1x audio wafer connector
LAN
■1x Intel 217-LM GbE LAN PHY
■1x Intel 210-AT GbE LAN Controller
Rear Panel I/O
■1x VGA port
■2x Gigabit LAN jacks
■2x USB 3.0 ports

1-3
Overview Industrial Computer Board
Onboard Pin Headers/ Connectors/ Jumpers
■1x front panel connector
■2x USB2.0 connectors
■2x serial port connectors
■1x parallel port connector
■2x SATA 6Gb/s ports
■1x SATA 3Gb/s port
■1x 4-pin power connector
■1x TPM expansion connector
■1x PS/2 wafer connector
■1x GPIO connector
■1x 4-pin CPU fan connector
■1x 3-pin system fan connector
■1x clear CMOS jumper
■2x COM port power jumpers
■1x AT/ATX select jumper
■1x SIM holder
Expansion Slots
■1x Mini-PCIe slot, share mSATA slot
Golden Finger
■Supports ISA & PCI
Form Factor
■SBC (Single Board Computer): 338 mm x 122 mm
Environmental
■Operating Temperature: 0oC ~ 60oC
■Storage Temperature: -20oC ~ 80oC
■Humidity: 10% ~ 90% RH, Non-Condensing

1-4
Overview Industrial Computer Board
Board Layout
Audio
Connector
PS/2 Port
Connector
GPIO
Connector
AT/ATX
Jumper
TPM Expansion
Connector
mSATA/Mini-PCIe
Slot
SIM Holder
ME Disable
Jumper
Clear CMOS
Jumper
3-pin Fan
Connector
4-pin Fan
Connector
CPU Socket
Front Panel
Connector 1
Front Panel
Connector 2
DVI Connector
NVM LAN
Jumper
VGA
Port
LAN
Ports
USB 3.0
Ports
COM1 Port
Connector
COM2 Port
Connector
USB 2.0
Connector
COM1 Port
Power Jumper
COM2 Port
Power Jumper
4P-12V Power
Connector
UDIMM Slot
SATA 6GB/s
SATA 3GB/s
Parallel Port
Connector
Rear Panel I/O

2-2-1
This chapter provides you with the information about hardware setup
procedures. While doing the installation, be careful in holding the com-
ponents and follow the installation procedures. For some components, if
you install in the wrong orientation, the components will not work prop-
erly.
Use a grounded wrist strap before handling computer components. Static
electricity may damage the components.
2Hardware Setup

2-2
Hardware Setup COM Express Carrier Board
Components Reference Guide
Rear Panel I/O ...................................................................................2-8
Connector..........................................................................................2-9
CPU Power Connector: JPWR1.................................................................2-9
Serial ATA Connector: SATA1 ~ SATA3 .....................................................2-9
Parallel Port Connector: JLPT1................................................................2-10
Serial Port Connector: JCOM1, JCOM2 ..................................................2-10
Fan Power Connectors: CPUFAN1, SYSFAN1........................................2-10
USB 2.0 Connector: JUSB1,JUB2 ........................................................... 2-11
Front Audio Connector: JAUD1................................................................ 2-11
PS/2 Port Connector: JPS1...................................................................... 2-11
GPIO Pin Header: JGPIO1 ......................................................................2-12
TPM Module Connector: JTPM1..............................................................2-12
DVI Connector: DVI1................................................................................2-13
Front Panel Connectors: JFP1, JFP2 ......................................................2-13
Jumper.............................................................................................2-14
Clear CMOS Jumper: JCMOS1 ...............................................................2-14
ME Dsiable Jumper: JIAMT1 ...................................................................2-14
AT/ATX Select Jumper: JAT1...................................................................2-14
COM Port Power Jumper: JCOMP1, JCOMP2........................................2-15
NVM LAN Jumper: JNVM1 ......................................................................2-15
Slot...................................................................................................2-16
mSATA/ Mini-PCIe Slot ............................................................................2-16
SIM Card Holder ......................................................................................2-16

2-3
Hardware Setup COM Express Carrier Board
CPU (Central Processing Unit)
Important
Overheating
Overheating can seriously damage the CPU and board. Always make sure the
cooling fans work properly to protect the CPU from overheating. Be sure to apply
an even layer of thermal paste (or thermal tape) between the CPU and the heat-
sink to enhance heat dissipation.
Replacing the CPU
When replacing the CPU, always turn o󰘯 the system’s power supply and unplug
the power supply’s power cord to ensure the safety of the CPU.
Introduction to the LGA 1150 CPU
The surface of the LGA 1150 CPU has two notches and a golden triangle
to assist in correctly lining up the CPU for board placement. The golden
triangle is the Pin 1 indicator.
Notch
Golden triangle is the Pin 1 indicator
Notch

2-4
Hardware Setup COM Express Carrier Board
CPU & Heatsink Installation
When installing a CPU, always remember to install a CPU heatsink. A CPU heat-
sink is necessary to prevent overheating and maintain system stability. Follow the
steps below to ensure correct CPU and heatsink installation. Wrong installation
can damage both the CPU and the board.
1. Push the load lever down to unclip it and lift to the fully open position.
2. The load plate will automatically lift up as the load lever is pushed to the fully
open position.
Retention tab
Load lever
Load plate
Important
Do not touch the socket contacts or the bottom of the CPU.

2-5
Hardware Setup COM Express Carrier Board
3. Align the notches with the socket alignment keys. Lower the CPU straight
down, without tilting or sliding the CPU in the socket. Inspect the CPU to
check if it is properly seated in the socket.
4. Close and slide the load plate under the retention knob. Close and engage
the load lever.
Alignment Key
CPU notches
Retention knob
5. When you press down the load lever the PnP cap will automatically pop up
from the CPU socket. Do not discard the PnP cap. Always replace the PnP
cap if the CPU is removed from the socket.
6. Evenly spread a thin layer of thermal paste (or thermal tape) on the top of the
CPU. This will help in heat dissipation and prevent CPU overheating.
PnP cap
Thermal paste

2-6
Hardware Setup COM Express Carrier Board
Important
• Con󰘰rm that the CPU heatsink has formed a tight seal with the CPU before
booting your system.
• Whenever the CPU is not installed, always protect the CPU socket pins by
covering the socket with the plastic cap.
• If you purchased a separate CPU and heatsink/ cooler, Please refer to
the documentation in the heatsink/ cooler package for more details about
installation.
7. Locate the CPU fan connector on the board.
8. Place the heatsink on the board with the fan’s cable facing towards the fan
connector and the fasteners matching the holes on the board.
9. Push down the heatsink until the four fasteners get wedged into the holes
on the board. Press the four fasteners down to fasten the heatsink. As each
fastener locks into position a click should be heard.
10. Inspect the board to ensure that the fastener-ends have been properly locked
in place.
11. Finally, attach the CPU fan cable to the CPU fan connector on the board.

2-7
Hardware Setup COM Express Carrier Board
Memory
These DIMM slots are used for installing memory modules.
DIMM1
DIMM2
Dual-Channel mode Population Rule
In Dual-Channel mode, the memory modules can transmit and receive data
with two data bus channels simultaneously. Enabling Dual-Channel mode can
enhance system performance. The following illustrations explain the population
rules for Dual-Channel mode.
DIMM1
DIMM2
Important
• DDR3 memory modules are not interchangeable with DDR2, and the DDR3
standard is not backward compatible. Always install DDR3 memory modules
in DDR3 DIMM slots.
• To ensure system stability, memory modules must be of the same type and
density in Dual-Channel mode.
• Due to chipset resource usage, the system will only detect up to 15+ GB of
memory (not full 16 GB) when all DIMM slots have 8GB memory modules
installed.

2-8
Hardware Setup COM Express Carrier Board
Rear Panel I/O
USB 3.0
Ports
LAN PortsVGA Port
hVGA Port
The DB15-pin female connector is provided for monitor.
hLAN Port
The standard RJ-45 LAN jack is for connection to the Local Area Network (LAN).
You can connect a network cable to it.
Yellow Green/ Orange
LED Color LED State Condition
Left Yellow Off LAN link is not established.
On (steady state) LAN link is established.
On (blinking) The computer is communicating with another
computer on the LAN.
Right Green Off 10 Mbit/sec data rate is selected.
On 100 Mbit/sec data rate is selected.
Orange On 1000 Mbit/sec data rate is selected.
hUSB 3.0 Port
The USB 3.0 port is backward-compatible with USB 2.0 devices and supports
data transfer rate up to 5 Gbit/s (SuperSpeed).