NXP Semiconductors AN11524 Installation and operating instructions

AN11524
NXQ1TXA6 Evaluation Board
Rev. 1 — 17 February 2015 Application note
Document information
Info Content
Keywords NXQ1TXA6, NWP2081, Wireless Charging, Qi, mobile devices, base
station, magnetic coupled power transfer
Abstract This document illustrates how to create a Qi A6 wireless power base
station. It uses the NXQ1TXA6 charging controller and its evaluation board
that can deliver up to 5 W effective output at the wireless mobile device
side

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Application note Rev. 1 — 17 February 2015 2 of 54
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
Revision history
Rev Date Description
v. 1.0 20150217 Initial version

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NXQ1TXA6 Evaluation Board
1. Introduction
The ubiquity of mobile phones, increases the requirement of a convenient way to charge
these devices while on the move. Especially the fast risingnumber of smart phones widely
used and relied upon in daily life. Wireless charging is introduced into smart phones and
tablets.
Wireless charging represents the future of public and private charging.
Qi (pronounced as "Chee") is a wireless charging standard developed by Wireless Power
Consortium (www.wirelesspowerconsortium.com) for inductive power.
The Qi system (see Figure 1) comprises a base station or a transmitter (TX) pad and a
mobile device or a compatible receiver (RX), such as a mobile phone. To use the system,
the mobile device is placed on top of the base station pad which charges the device via
electromagnetic induction.
The market demand for the convenience and safety of standard-compliant wireless power
systems continues to grow rapidly.
NXP offers Qi-compliant base station reference designs to set you immediately on your
way to a successful project. NXP supports several types of Qi base stations. This
document describes the application of an A6 type base station using NXQ1TXA6 charging
controller.
Fig 1. Wireless charging system as defined by Wireless Power Consortium
aaa-014485
BASE STATION
TRANSMITTER
COMM
messages
reflected load
power
CONTROL
SYSTEM
POWER CONVERSION
demod
MOBILE DEVICE
RECEIVER
CONTROLCOMM
LOAD
POWER PICK-UP
mod

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
2. Scope
This document discusses the design of a WPC Qi A6 type base station based on the NXP
NXQ1TXA6 Evaluation Board. The NXQ1TXA6 Evaluation Board is Qi certified and it
complies with EMI regulation - EN55022 and FCC part 18.
The document is intended to provide engineers with real life practical design applications
and get them started on the right note immediately.
For all topics covered, hints are provided to ensure system-level best performance,
excellent EMC and lowest application cost.
Near Field Communication (NFC) option for tap to power on to enable zero power standby
and Bluetooth pairing is included. There are many other use cases and possibilities with
NFC technology but they are not within the scope of this application note.

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
3. Getting started
3.1 Package contents
The evaluation kit contains the following items:
•NXP NXQ1TXA6 wireless charger evaluation board containing, see Figure 2:
–NXQ1TXA6 charger controller IC
–NWP2081 half-bridge level shift controller IC
–NX2020 MOSFETs
–NT3H1201 NTAG-I2C NFC forum tag
•AC 110 V/220 V – DC 12 V power supply containing:
–TEA1720B3T HV start-up fly-back controller for ultra-low no-load charger
applications up to 12 W
A mobile device to receive the power is not included in the evaluation package. Refer to
the WPC website for a list of certified Qi receivers to be used with the evaluation board. To
demonstrate NFC tap to power on, ensure that the receivers support both Qi wireless
charging and NFC technology.
Fig 2. Overview of the charging pad
aaa-015876

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
3.2 Main features
The NXQ1TXA6 Evaluation Board demonstrates:
•A reference design with key components from NXP for wireless charging applications
based on inductive power transfer standard Qi.
•Shows additional benefits resulting from integration of NFC with wireless charging.
Enabling for example zero power standby with the “tap to power on” feature.
3.3 System efficiency
In Figure 3, the system efficiency of the evaluation board is shown using a standard off the
shelf receiver.
System efficiency is measured as the ratio of output power of the receiver to the input
power of the transmitter. Input power is averaged to take into account variation due to
communication between receiver and transmitter.
The quality of the components used in both the transmitter and the receiver, determine the
efficiency of the system.
3.4 Board overview
The evaluation board is shown in Figure 4. The left-hand side contains the charging area
where the mobile device should be placed. The top right side has the electronics to drive
the charging coil and communicate with the mobile device.
(1) outer coil 1
(2) center coil
(3) outer coil 2
Fig 3. System efficiency
output power (mW)
0 5,0004,0002,000 3,0001,000
aaa-015880
40
20
60
80
η
(%)
0
(1)
(2)
(3)

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
The function of the switch and push buttons as well as the meaning of the status LED is
explained in the next subsections.
Fig 4. Switch, buttons and status LED location overview
aaa-015882
LED
stand-by power
mode switch
12 V DC
input
FOD
button
reset
button
charging area

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
3.5 Stand-by power mode switch
The switch on the top of the board is not a power on/off switch. The switch is for
alternating between the “Normal” and the NFC “tap to power on” position as illustrated in
Figure 5.
In the Normal mode, the charging pad periodically monitors the coil for the presence of a
Qi receiver. It starts power transfer, once a Qi power receiver is detected.
In the NFC tap to power on mode, the charging pad electronics are disconnected from the
12 V supply. The presence of an NFC enabled phone, switches on the 12 V system
supply, enabling zero power in standby mode.
Important:
The present generation of NFC phones only performs periodic NFC operations when the
display of the phone is on and unlocked. It is only under this condition that the charging
pad is woken-up to start power transfer.
3.6 Reset button
Pressing the reset button marked SW101 on the board performs a reset of the charging
pad.
3.7 Foreign object detection button
By pressing the left-most button marked SW102 on the board, the charging pad enables
or disables Foreign Object Detection (FOD). This feature should be removed for final
products.
While charging, the green status LED indicates whether FOD is activated. When FOD is
active, the green LED blinks with a rate of 1 Hz. When FOD is disabled, the green LED
blinks with a rate of 3 Hz.
Fig 5. Standby-by power mode switch
aaa-015883
normal mode
position
NFC tap to
power on position

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NXQ1TXA6 Evaluation Board
3.8 Status LED
An overview of the status signaled by the LEDs is given in the following table:
3.9 NFC functionality
The evaluation board provides a passive tag functionality with NT3H1201 NTAG-I2C. The
NTAG-I2C is preprogrammed with a URL link to the NXP website. When most NFC
phones are put on the charger pad while the screen is active, an automatic link to the NXP
website is made.
Other content can be programmed into NTAG IC by using, for example, NXPs TagWriter.
Table 1. LED status indicator
LED status Description
Off If a 12 V DC supply is present, the pad is in the
operation mode as defined by the mode switch
Green blinking 1 Hz Ongoing power transfer - charging mobile
device, FOD enabled
Green blinking 3 Hz Ongoing power transfer - charging mobile
device, FOD disabled
Green permanently On Mobile device charged
Red blinking No power transfer
Error detected: Foreign object, temperature or
Receiver indicated error

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NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
4. NXP product offering
The NXQ1TXA6 evaluation board was designed based on the NXP products listed in
Table 2. The part numbers are hyperlinked to the NXP website to provide quick access to
product information and data sheets.
Table 2. NXP components for wireless charger application
Type number Function Package Ordering
information
Version Description 12NC
NXQ1TXA6/001 Wireless charger
controller SOT865 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7 7 0.85 mm
9353 039 36551
NWP2081T Half-bridge level-shift
controller IC SOT96 plastic small outline package; 8 leads; body width 3.9 mm 9353 021 87518
NX3008NBKW 30 V, single N-channel
Trench MOSFET SOT323 plastic surface-mounted package; 3 leads 9340 656 35115
NX2020N2 30 V, single N-channel
Trench MOSFET SOT1220 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals 9340 682 45115
BAS21 High-voltage switching
diodes SOT23 plastic surface-mounted package; 3 leads 9335 020 40215
BAT54S Schottky barrier diodes SOT23 plastic surface-mounted package; 3 leads 9339 763 80215
TL431 Adjustable precision
shunt regulator SOT23 plastic surface-mounted package; 3 leads 9352 932 76215
Optional
NT3H1201 NTAG-I2C NFC forum
type 2 Tag compliant IC
with I2C interface
SOT902 plastic extremely thin quad flat package; no
leads; 8 terminals 9353 028 43125
NX3008CBKS 30 V complementary N/P
channel Trench
MOSFET
SOT363 plastic surface-mounted package with
increased, 6 leads 9340 682 44115
NX2020P1 30 V, single P-channel
Trench MOSFET SOT1220 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals 9340 656 39115
BAT54C Schottky barrier (double)
diodes SOT23 plastic surface-mounted package; 3 leads 9339 763 70215
TDA3663 LDO (or use DC-to-DC
RT8295A) SOT223 plastic surface-mounted package with increased heatsink; 4 leads 9352 629 68135
TEA1720B3T 12 W HV start-up fly
back controller (SMPS) SOT96 plastic surface-mounted package; 8 leads 9353 026 97118

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NXQ1TXA6 Evaluation Board
5. System overview
The NXQ1TXA6 Evaluation Board is a WPC Qi A6 type base station, powered by a +12 V
AC-to-DC adapter.
It works on the basic principle of inductively coupled power transfer. An alternating current
generated from the half-bridge driver is passed through the base station coil. It creates a
magnetic field which induces a voltage in the mobile device coil. The mobile device
communicates information related to power management and control to the base station.
When the NFC tap to power on feature is enabled, the evaluation board consumes zero
power in standby mode.
A block diagram of the NXQ1TXA6 evaluation board is depicted in Figure 6. Each
subblock is described in Section 5.1 to Section 5.8.

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NXQ1TXA6 Evaluation Board
The block diagram does not depict all semiconductor components used to build up the system. See the related application note
for details.
The NXQ1TXA6/001 supports the A6 single-coil and 3-coil configurations.
Fig 6. NXQ1TXA6 evaluation board block diagram
aaa-014209
NFC TAG IF
NXQ1TXA6
UI CTRL
NXP component
Optional NXP components for
NFC control and zero standby power
MONITOR
HALF-BRIDGE
CONTROL
CONTROLLER
DEMODULATOR ASK DETECTION
MODE SELECT
MODE SELECT
AND
VOLTAGE
REFERENCE
SEL3 SEL2 SEL1 OPT2 OPT1
CL_MON
ASK
HALF-BRIDGE
DRIVER
EN_HB1
EN_HB2
EN_HB3
PWM
3V3
Vout
VSNS ISNS NTC
NWP2081
EN_NFC
3V3
3V3
RESET
LED1
LED2
DC/DC
NX3008NBKW
NX2020P1
NX2020N2
3 x BAS21
NX2020N2
HALF-BRIDGE
DRIVER
NWP2081
NX2020N2
NX2020N2
HALF-BRIDGE
DRIVER
NWP2081
NX2020N2
NX2020N2
RSense
12 V
OPTIONAL
CURRENT
MONITOR
NFC
NT3H1201
AC/DC
TEA1720
mains
110 - 230 V ~
(TL431BFDT)
BUZZ
buzzer
l
2
C
NX3008CBKS

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NXQ1TXA6 Evaluation Board
5.1 NXQ1TXA6 charging controller
The NXQ1TXA6 is a wireless charger controller for A6 type base stations. It offers WPC
1.1 Qi-compliant communication and safety functions including Foreign Object Detection
(FOD), over-temperature protection and more. The controller supports ping mode during
standby to detect potential mobile devices. It also works with the NXP NT3H1201 to
enable tap to power on with an NFC enabled phone.
Settings are available via resistor networks for Foreign Object Detection (FOD) level, LED
blinking and other options. Refer to NXQ1TXA6 data sheet for further information.
5.2 Half Bridge driver
There are 3 half-bridge driver stages in the NXQ1TXA6 Evaluation Board. Control signals
EN_HB1, EN_HB2 and EN_HB3 enable the driver stages independently. At any one time,
only one driver stage is enabled for either pinging to detect the presence of a mobile
device or active charging. The half-bridge driver stage is designed to output about ~7 W
power to ensure minimum 5 W output is received at the mobile device.
NXP NWP2081T half-bridge controller IC and NX2020N2 N-channel Trench MOSFETs
are the two key semiconductor components. They drive the A6 type primary coil and
series capacitance (LC tank circuit) at operating frequency between 115 kHz to 205 kHz.
Frequency and duty cycle is varied via Pulse-Width Modulated (PWM) signal from the
NXQ1TXA6 charging controller
The NXQ1TXA6 Evaluation Board can be configured to support A6 type single coil base
station by shorting R117 and R118 in Figure 7 to ground. In this configuration, only
half-bridge driver for coil 1 is active. Resistors R117 and R118 are not populated for an A6
type 3-coil base station configuration.
5.3 Amplitude-Shift Keying (ASK) envelope demodulator
One-directional communication from the mobile device to the base station is achieved via
back-scattered Amplitude-Shift Keying modulation as illustrated in Figure 1.
The mobile device modulates the magnetic field of the base station using either capacitive
or resistive load, at a rate of 2 kbits/sec.
An envelope detector is used to demodulate the communication data. The demodulated
output is sent to the NXQ1TXA6 charging controller for further processing.
High voltages up to 100 Vp-p can be observed at the input of the envelope detector.
5.4 +12 V universal mains adapter
The power supply design is based on NXP TEA1720 low cost Switched Mode Power
Supply (SMPS) controller IC. It is optimized for fly back converter topology to provide
high-efficiency over the entire load range with ultra-low power consumption in the no-load
condition.

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NXQ1TXA6 Evaluation Board
5.5 Current measurement
The current flowing into the power stage is determined by measuring the voltage across a
22 mcurrent sense resistor. The current measurement is needed for Foreign Object
Detection (FOD). If FOD is not required, it can be disabled by configuring the resistor
networks (refer to NXQ1TXA6 data sheet). The current measurement circuits can be
removed. Connect the unused ISNS pin to ground, i.e. not left open. Note that FOD is
required to pass Qi certification.
5.6 Bandgap reference voltage
NXQ1TXA6 wireless charging controller needs a band gap reference voltage (0.5 %
tolerance) for critical processing. The TL431 shunt regulator is used in the NXQ1TXA6
Evaluation Board to provide this reference voltage.
5.7 DC-to-DC converter
A DC-to-DC buck converter steps the +12 V input down to +3.3 V, to supply the
NXQ1TXA6 charging controller and other +3.3 V circuits.
A Richtek RT8295A DC-to-DC converter is used in the NXQ1TXA6 evaluation board. An
option for a linear regulator TDA3663 is available on board. Take note however, that at
operating currents of the NXQ1TXA6 evaluation board, the efficiency of the applied
DC-to-DC converter is better than a linear regulator.
5.8 Near Field Communication (NFC) zero power in Standby mode
When using the optional feature "NFC tap to power on", the base station is designed for
zero power consumption in standby mode. It uses an NT3H1201 NTAG-I2C NFC forum
passive tag.
When this feature is enabled, there is no pinging to detect the presence of a mobile device
on the charger pad. Instead, an NFC enabled mobile device, for example a phone, wakes
up the base station via the NT3H1201. Power transfer takes place with a certified Qi
mobile device.
To enable more functions such as Bluetooth pairing, smart advertisements, and
connection handovers, the passive tag can be programmed with the NXP TagWriter
application (see Section 3.9 “NFC functionality”).

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Application note Rev. 1 — 17 February 2015 15 of 54
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NXQ1TXA6 Evaluation Board
6. Schematics and Bill Of Materials
Customers should start directly from NXQ1TXA6 Evaluation Board as this board is
optimized in terms of functional performance and EMI.
Deviations are possible, but they should be kept minimal, carefully weighed and
associated potential risks considered. Where possible, customers are encouraged to send
their schematics to NXP for review. Contact the nearest NXP application support team in
your area for support in designing your wireless charging base station.
During schematic capture, indicate critical components clearly in the schematics so that
they are not forgotten during procurement and production. For example, 68 nF C0G/NP0
capacitor, 100 k1 % tolerance resistor and 100 V rated components.
Certain critical components and PCB layout details are crucial to the success of the
project and deserve special attention. In the later part of the document, these details are
elaborated. Refer to Section 7 “Critical components”and Section 8 “PCB layout
guidelines”in the subsequent pages.
For development of prototype boards, it is best practice to include test points on key signal
nodes. For production runs, these test points can be removed from the final PCB.
At the very minimum, create test point for the following signal nodes:
•Power supplies - +3.3 V and +12 V supply nodes
•Output of ASK demodulator - AM signal node
•Output of current sense amplifier - ISOUT signal node
•Pulse Width Modulation - PWM signal node
•The half-bridge driver stage enable - nEN_HB1, 2 and 3 signal node
•System and power grounds - GND, GNDI

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NXQ1TXA6 Evaluation Board
6.1 Schematics
Fig 7. NXQ1TXA6 charging controller schematic
aaa-015885
2RESET
3SEL3
8PWR_ON
9LED_G
10 SCL
11 SDA
15 EN_HB1
16 LP_VSUP
17 PWM_HIN
18 TAG_ FD
19 n.c.
21 ISENSE
22 ASK
23 CL_DET
24 NTC1
25 n.c.
26 VSNS
30 SEL1
31 RXD
32 TXD
7EN_NFC
12 BUZZER
20 OPT0
27 OPT1
28 LED_R
1SEL2
13 EN_HB2
14 EN_HB3
SW1
ASEL3
PWR_ON [6]
LED_G
SCL
SDA
LP_VSUP
EN_HB1 [1, 2]
IS- [2, 3, 4]
EXPIO1
+3V3 TESTIO
TESTCLK
SW1
PWM_HIN [1, 2, 3, 4]
TAG_FD [7]
TESTCLK
ISOUT
AM [1, 5]
AML [1, 5]
NTC
TESTIO
measure power supply
R103
100 kΩ
1%
R104
100 kΩ
1 %
R106
33.2 kΩ
1 %
R113
23.2 kΩ
1 %
R114
33.2 kΩ
1 %
BUZ
R105
100 kΩ
1%
U102
TL431BFDT
C104
10 nF
R116
91 kΩ
1 %
R112
10 kΩ
BUZ101
PS1240P02CT3
R115
510 kΩ
1 %
ASEL1
RXD
TXD
EN_NFC [7]
BUZ
OPT1
ASEL1
ASEL2
ASEL3
OPT2
LED_R
ASEL2
EN_HB2 [1, 3]
EN_HB3 [1, 4]
U101
NXQ1TXA6/001
JP101
C102
220 nF
C101
220 nF
XTALIN
XTALOUT
VSS
4
5
VDD1
+3V3
+3V3
+3V3
6
VDD2 29
33
C103
220 nF
R102
47 kΩ
R119
180 Ω
1%
R107
n.c.
short R107 to GND
for 1 LED option
short R117, R118 to GND
for A6 1-coil base station
configuration setting
R117
n.c.
R118
n.c.
C105
10 nF
C106
10 nF
3
2
4
6
8
10
1
3
5
7
9
SCL
SDA
EXPIO1
LP_VSUP
TP101
ONLY FOR DEBUG
SW101 B3FS-1000
SV101
SW1
4
1
2
3
SW102 B3FS-1000
ASEL3
4
1
2
9
7
5
3
1
10
8
6
4
2
TEST101
R101
n.c.
2
3
4
5
6RTSn
RXD
TXD
VCC
TXD
RXD
CTSn
UART101
1GND
LED_R
+3V3
R109
RED
GRN
R111
1 kΩ
470 Ω
LED_G
LED101
LSG T676
ONLY FOR DEBUG
TP102 TP103 TP104 TP105 TP106 G101
GNDAMLAM
EN_HB3EN_HB2EN_HB1
PWM_HIN

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NXQ1TXA6 Evaluation Board
Fig 8. Half bridge driver stage of coil 1 and current sense schematic
aaa-015888
C211
68 nF
COG 100 V
C210
68 nF
COG 100 V
C217
100 nF
C216
22 μF
C214
n.c.
C213
n.c.
[5]UC1_2
COIL1CCOIL1T
CL1CCL1T
1
2
3
4
GL
NWP2081
R205
R206
1 Ω
1 Ω
G201 G202
C207
220 nF
SH
GH
FS
VDD
GND
SD
CLK
8
7
6
5
C203
100 nF
C201
10 nF
R201
10 kΩ
C206
22 μF
1210
C218
n.c.
GNDI
GNDI GNDI
GNDI GNDI GNDI GNDI
GNDI
GNDI
GNDI GND
GNDI
GND
C205
100 nF
T201
NX3008NBKW
R203
330 kΩ
[1, 3, 4]PWM_HIN
+12 V
[1]EN_HB1
GNDIGNDl
3
4
1
6
OUT
MAX44284HAUT+
*only U202 or U203 is
mounted. Not both.
ISOUT[1]
TP203
U202*
C202
100 nF
R204
0E022
1 %
RS+
RS-
VDD
SHDN
GND
5
C221
100 nF
R202
2.2 kΩ
C215
10 nF
R210
U201
+3V3
n.c.
R207
Kelvin contacts
R208
10 Ω
10 Ω
NTC201
measure
temperature
LP_VSUP
NTC[1]
1
2
2
3
4
5
1
OUT
INA214AIDCKT
U203*
V+
IN+
IN-
REF
GND
6
2
L1-1
C208
n.c.
C209
n.c.
R209
22 kΩ
G
G
D
S
D
S
T203
NX2020N2
T204
NX2020N2
NODEBRIDGE
JP603
[1, 3, 4]IS-

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AN11524 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Application note Rev. 1 — 17 February 2015 18 of 54 NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
Fig 9. Half bridge driver stage of coil 2 and 3
aaa-015889
C308
68 nF
COG 100 V
C307
68 nF
COG 100 V
C312
100 nF
C311
22 μF
C310
5.6 nF
COG 100 V
C309
5.6 nF
COG 100 V
[5] UC2_2
COIL2CCOIL2T
CL2CCL2T
1
2
3
4
GL
NWP2081
R304
R303
1 Ω
1 Ω
G301 G302
C304
220 nF
SH
GH
FS
VDD
GND
SD
CLK
8
7
6
5
C303
100 nF
GNDI GNDI
GNDI GNDI GNDI GNDI
GNDI
GNDI GNDI
C302
100 nF
T301
NX3008NBKW
R302
330 kΩ
[1, 2, 4] PWM_HIN
+12 V
[1] EN_HB2
GNDIGNDl
U301
L1-2
C305
n.c.
C306
n.c.
R305
22 kΩ
G
G
D
S
D
S
T302
NX2020N2
T303
NX2020N2
JP605
[1, 2, 4] IS-
C408
68 nF
COG 100 V
C407
68 nF
COG 100 V
C412
100 nF
C411
22 μF
C410
n.c.
C409
n.c.
[5] UC3_2
COIL3CCOIL3T
CL3CCL3T
1
2
3
4
GL
NWP2081
R403
R404
1 Ω
1 Ω
G401 G402
C404
220 nF
SH
GH
FS
VDD
GND
SD
CLK
8
7
6
5
C403
100 nF
GNDI GNDI
GNDI GNDI GNDI GNDI
GNDI
GNDI GNDI
C402
100 nF
T401
NX3008NBKW
R402
330 kΩ
[1, 2, 3] PWM_HIN
+12 V
[1] EN_HB3
U401
L1-3
C405
n.c.
C406
n.c.
R405
22 kΩ
G
G
D
S
D
S
T402
NX2020N2
T403
NX2020N2
[1, 2, 3] IS-

AN11524 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Application note Rev. 1 — 17 February 2015 19 of 54
NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
Fig 10. Amplitude Shift Keying (ASK) envelope detector schematic
aaa-015890
UC1_2[2]
AML[1]
AM[1]
+ 3V3
REMARK: MAX. VOLTAGE 100 V
UC2_2[3]
UC3_2[4]
D501
BAS21
R501
470 Ω
100 V
C502
10 nF
100 V
C504
220 nF
C503
470 pF
C501
1 nF
100 V
R502
100 kΩ
100 V
1 %
R507
1 MΩ
R506
1 MΩ
R505
10 kΩ
100 V
D501
BAS21 D506
BAT545
D501
BAS21
R503
4.7 kΩ
1 %

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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
AN11524 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Application note Rev. 1 — 17 February 2015 20 of 54 NXP Semiconductors AN11524
NXQ1TXA6 Evaluation Board
Fig 11. DC supply schematic
aaa-015891
+12V
VIN BOOT TP601 +3V3
SW
FB
COMP
21
3
5
6
7
8
4
9
EN
SS
GND
GNDPAD
12
12
J601
C601
10 μF
SJ601
SJ602
3
4
2
1
C602
10 μF
C603
100 nF
L601
WE_744273222
JP602
TAG_VOUT [7]
D
S
PWR_ON [1]
D601
BAT54C
JP601
R602
220 kΩ
R603
47 kΩ
R601
220 kΩ
C611
100 nF
T602
NX2020P1
R604
22 Ω
100 kΩ
T601
NX3008NBKW
SW601
SLIDE-SPDT
C604
4.7 μF
31
2
C605
100 nF
C606
100 nF
R605 L602
NR4012T100M
R607
24 kΩ
1 %
R608
75 kΩ
1 %
R606
6.8 kΩ
C608
3.3 nF
C609
22 μF
C610
100 nF
OPTION FOR LDO
(ALTERNATIVE FOR DC/DC)
TDA3663
U602
1
24
3 VOUT
GND
GND
GND
VIN
U601 C607
100 nF
RT8295A