Osram SYNIOS P2720 Series Installation and operating instructions

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SYNIOS P2720 –General Information
Application Note
Abstract
This application note provides insight into
the LED product family of the SYNIOS
P2720 (KxDMLy31).
A basic overview of the construction,
handling and processing of the SYNIOS
P2720 is presented.
Content
1. Construction
2. Handling
3. Storage
4. Cleaning
5. Processing
Construction of the SYNIOS P2720
The product family SYNIOS P2720 is
especially developed for use as small size
light source with a wide range of operating
currents, with its slim design suitable for a
big variety of applications –from mid- to
high-power.
The common package of the product family
consists of an Au-plated lead frame and a
white epoxy mold compound in which a
highly efficient semiconductor chip is
mounted and electrically connected (Fig1.).
Fig. 1: Design of the SYNIOS P2720
Depending on the brightness requirements
the SYNIOS P2720 is available in three
different chip sizes (500µm, 750µm &
1000µm).
The product group comprises the colors
white, converted yellow, yellow, red and
super red, whereas the red color group
covers an extended wavelength range
starting at λdom = 612nm to 628nm.
The color coordinates of the white version
(KWDMLy31.SG) is within the white field of
UNECE/FMVSS.
The final encapsulation of the LED is
silicone depending on the type either clear
or converter filled.
Figure 2 shows an overview about the
available variants of the SYNIOS P2720 and
their specific designation.
Fig 2: Overview of SYNIOS P2720 family
Within the product family there are also
differences in the ESD stability of the
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devices. In the versions white and converted
yellow the LED features an ESD protection
diode, which provides ESD stability of up to
8kV according to JESD22-A114-F (HBM).
All other of the product group provides ESD
robustness of 2kV.
Nevertheless as a matter of principle the
common ESD safety precautions have to be
observed during handling, assembly and
production of electronic devices.
The common QFN-like design with identical
solder pad layout and equal small
dimensions (2.7mm x 2.0mm x 0.6mm)
involves an additional benefit concerning
design flexibility due to the exchangeability.
With one circuit board layout, for example,
several applications with different brightness
requirements can be implemented. With the
same layout either the brightness by
different chip sizes can be adapted at the
end of the development phase or later after
some years.
Also with the same board layout different
requirements in brightness like for UNECE
and FMVSS regulation can be fulfilled by the
wide brightness range of the family for each
color.
As a small LED without lens the SYNIOS
P2720 is also perfectly suited for light guide
applications.
As with all LEDs from OSRAM Opto
Semiconductors, the SYNIOS P2720
product group also fulfills the current RoHS
guidelines (European Union & China).
Handling
Accessorily to general guidelines for the
handling of LEDs, additional care should be
taken that mechanical stresses (e.g.
sheering forces) to the elastic silicone
encapsulation must be eliminated or
reduced to the greatest extent possible (see
also application note "Handling of Silicone
Resin LEDs").
In general, all types of sharp objects (e.g.
forceps, fingernails, etc.) should be avoided
in order to prevent stress to or penetration of
the encapsulation, since this can lead to
impairment of the component.
Fig. 3: Manual Handling of the SYNIOS
P2720
For manual assembly and placement –in
the production of prototypes, for example –
the use of so-called vacuum tweezers is
recommended (Figure 4). The effective
mechanical stress on the LED is minimized
by individually exchangeable soft rubber
suction tips.
Fig. 4: Examples of vacuum styluses
If there is no alternative to the exceptional
use of a tweezers (anti-static), the LED must
be picked and handled only at the epoxy
housing (Figure 3).
Please note even after being soldered on
the PCB board touching of the silicon must
be avoided in order to avoid damages of the
bond wire or of the LED housing.
As it can be seen in Figure 5, the SYNIOS
P2720 is packaged in tape and reel.
When processing by means of automated
placement machines, care should be taken
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to use an appropriate pick and place tool
and to ensure that the process parameters
are conform to the package's characteristics.
Figure 6 shows the recommended design of
the placement tool for damage-free process-
ing of the SYNIOS P2720.
Fig. 5: Position of the LED in the tape –method of taping
Fig. 6: Design proposals of the pick and place tool for the SYNIOS P2720 (dimensions in
mm)
If possible, the tool should pick up the LED
across the entire surface or along the package rim (Figure 7). The same applies when depositing or placing the LED. Forces
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should be applied over the entire surface or
along the rim.
Fig. 7: Recommended pick-up area for
SYNIOS P2720
Since the SYNIOS P2720 is generally
supplied in tape with dry pack, it should be
factory-sealed when stored.
The hermetic pack should only be opened
for immediate mounting and processing,
after which the remaining LEDs should be
repacked according to the moisture level in
the datasheet (q.v. JEDEC J-STD-033B.1 -
Moisture Sensitivity Levels).
Storage
PCBs or assemblies containing LEDs should
not be stacked such that force is applied to
the LED, or should not be handled directly at
the LED.
Fig. 8: Incorrect storage of LEDs
Generally, all LED assemblies should be
allowed to return to room temperature after
soldering, before subsequent handling, or
the next process step.
Fig. 9: Correct storage of assemblies with
LEDs
Cleaning
From today's perspective any direct
mechanical or chemical cleaning of the
SYNIOS P2720 is forbidden.
Isopropyl alcohol (IPA) can be used if
cleaning is mandatory. Other substances or
especially ultrasonic cleaning of SYNIOS
P2720 are generally not recommended.
For dusty LEDs, a simple cleaning by means
of purified compressed air (e.g. central
supply or spray can) is recommended here.
In any case, all materials and methods
should be tested beforehand, particularly as
to whether or not damage is associated with
the component.
Notes concerning cleaning can be also
found in the corresponding data sheets.
Processing
Generally, the SYNIOS P2720 product
family is compatible with existing industrial
SMT processing methods, so that current
populating techniques can be used for the
mounting process.
The individual soldering conditions for each
LED type according to JEDEC can be found
in the respective data sheet.
A standard reflow soldering process with
forced convection under standard N2
atmosphere is recommended for mounting
the component, in which a typical lead-free
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SnAgCu metal alloy is used as solder.
Figure 10 shows the temperature profile for
lead-free soldering with the recommended
peak temperature of 245°C.
In this context, it is recommended to check
the profile on all new PCB materials and
designs. As a good starting point, the
recommended temperature profile provided
by the solder paste manufacturer can be
used. The maximum temperature for the
profile as specified in the data sheet should
not be exceeded, however.
When developing the circuitry, special
attention should be given to the position and
orientation of the LED on the circuit board.
Depending on the position and orientation of
the LED, the mechanical stress on the LED
can vary.
In general, it is recommended that all
twisting, warping, bending and other forms
of stress to the circuit board should be
avoided after soldering in order to prevent
breakage of the LED housing or solder
joints.
Therefore, separation of the circuit boards
should not be done by hand, but should
exclusively be carried out with a specially
designed tool.
For further information such as regarding
PCB type, solder pad, solder stencil, voids,
post reflow inspection and verification of the
design please see also application notes
“Processing of SMD LEDs”.
The SYNIOS P2720 features a good self
alignment during soldering additionally
supported by the four wetting indicators (Fig.
11).
Fig. 10: Temperature profile for lead-free reflow soldering according to JEDEC JSTD-020
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Fig. 11: bottom only-terminated contacts
with wetting indicators
Fig 12 shows the LED before and after the
IR soldering process.
Fig. 12: Self alignment of the SYNIOS
P2720 during soldering
If a narrow LED clustering is requested in
the application, please note a direct side by
side contact between the housings has to be
avoided due to the risk of short circuits.
Summary
The SYNIOS P2720 LED family is designed
as small size high-flux light source. The
design of the package enables the use of
various chip sizes to satisfy different
brightness levels and a wide range of
operating currents as well.
With primary focus on automotive
applications the LED is qualified based on
the guidelines of IEC 60810, “Lamps for
road vehicles - Performance requirements”.
In addition the SYNIOS P2720 group
features an improved corrosive robustness
according to the following test conditions:
40°C / 90% rh / 15ppm H2S / 336h;
= Stricter than IEC 60068-2-43 (H2S) [25°C /
75% rh / 10ppm H2S / 21 days]
= Regarding relevant gas (H2S) stricter than
EN 60068-2-60 (method 4) [25°C / 75% rh /
200ppb SO2, 200ppb NO2, 10ppb Cl2/ 21
days]).
The relevant information can also be found
in the datasheet of the LED product.
Currently the product group comprises the
automotive preferred colors white, yellow,
red and super red.
Generally supplied in tape and reel, the
SYNIOS P2720 is compatible with existing
industrial SMT processing methods, so that
all customary populating techniques can be
used for assembly.
It should also be kept in mind that the LED is
not suitable for any direct mechanical or
chemical cleaning.
During handling and processing mechanical
stress to the silicone encapsulation must be
reduced or eliminated to the greatest extent
possible. Penetration of the silicone should
be avoided. Either can lead to impairment of
the component.
OSRAM Opto Semiconductors supports its
customers during their development and
design process in finding the best solution
for a specific application.
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Appendix
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for information or worldwide partners for your LED Lighting project.
www.ledlightforyou.com
Revision History
Date
Revision History
Sept. 2014
Release application note
Authors: Andreas Stich, Norbert Häfner, Kurt-Jürgen Lang
ABOUT OSRAM OPTO SEMICONDUCTORS
OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its
subsidiary, OSRAM Opto Semiconductors GmbH in Regensburg (Germany), offers its customers
solutions based on semiconductor technology for lighting, sensor and visualization applications.
Osram Opto Semiconductors has production sites in Regensburg (Germany), Penang (Malaysia)
and Wuxi (China). Its headquarters for North America is in Sunnyvale (USA), and for Asia in Hong
Kong. Osram Opto Semiconductors also has sales offices throughout the world.
For more information go to www.osram-os.com.
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Application Note Number: AN038