Oxford Instruments ANDOR Mosaic3 Installation instructions

Hardware Guide
(covers Mosaic 3 and Innity USB 3.0 models)
Mosaic3
andor.com © Andor Technology Ltd. 2019
Version 3.5 revised 8 May 2019

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TABLE OF CONTENTS
SECTION 1: INTRODUCTION ..................................................... 25
1.1 TECHNICAL SUPPORT..................................................................................... 26
1.2 DISCLAIMER .................................................................................................... 27
1.3 COPYRIGHT AND PROTECTIVE NOTICES ..................................................... 27
1.4 TRADEMARKS AND PATENT INFORMATION ................................................. 27
1.5 SUPPLIED COMPONENTS............................................................................... 28
1.6 OPTIONAL COMPONENTS ............................................................................. 28
SECTION 2: PRODUCT OVERVIEW ........................................... 29
2.1 GENERAL .......................................................................................................... 29
2.2 MOSAIC INFINITY CONFIGURATION .............................................................. 30
2.3 OVERVIEW OF DMD ARRAY TECHNOLOGY .................................................. 31
2.4 SYSTEM COMPONENTS.................................................................................. 32
2.4.1 USB 405 nm LaSer ControLLer................................................................ 32
2.4.2 LaSer Homogenizer .................................................................................. 32
2.4.3 LigHt SoUrCeS .......................................................................................... 32
2.4.4 inpUt SHUtterS ......................................................................................... 32
2.4.5 USB 3.0 CaBLe ........................................................................................ 32
2.4.6 USB 3.0 interfaCe pCi expreSS (pCie) Card (optionaL) ........................... 32
2.5 SYSTEM OVERVIEW......................................................................................... 33
2.6 OPTICAL LAYOUT............................................................................................. 34
2.6.1 moSaiC internaL LigHt patHS .................................................................... 34
2.6.2 SyStem LigHt patH: UprigHt miCroSCope.................................................... 35

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2.6.3 SyStem LigHt patH - inverted miCroSCope.................................................. 36
2.6.4 noteS ...................................................................................................... 36
2.7 SYSTEM CONTROL .......................................................................................... 37
2.8 SOFTWARE REQUIREMENTS.......................................................................... 37
2.9 INTERLOCK SAFETY SYSTEM ........................................................................ 38
SECTION 3: HARDWARE DESCRIPTION................................... 39
3.1 MOSAIC DMD HEAD ........................................................................................ 39
3.1.1 power SwitCH............................................................................................. 39
3.1.2 power ........................................................................................................ 39
3.1.3 dmd aCtive ............................................................................................... 39
3.1.4 ext trigger............................................................................................... 39
3.1.5 externaL interfaCe...................................................................................... 40
3.1.6 CommUniCationS Link ................................................................................... 40
3.1.7 ConneCtor SignaL eLeCtriCaL SpeCifiCation ................................................. 40

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SECTION 4: INSTALLATION........................................................ 41
4.1 LOCATION AND MOUNTING............................................................................ 41
4.2 VENTILATION .................................................................................................... 41
4.3 ASSEMBLY........................................................................................................ 41
4.4 POWER CONNECTION AND PROTECTIVE EARTHING.................................. 41
4.5 MOSAIC CABLING............................................................................................ 42
4.6 MOSAIC OPTICAL FIBRE................................................................................. 42
4.7 SOFTWARE INSTALLATION ............................................................................. 42
4.8 REMOTE INTERLOCK ...................................................................................... 42
4.9 SYSTEM COMPONENTS AND ACCESSORIES............................................... 42
SECTION 5: OPERATION ............................................................ 43
5.1 EMERGENCY DISCONNECTION ..................................................................... 43
5.2 POWER-UP SEQUENCE................................................................................... 43
5.3 POWER-DOWN SEQUENCE ............................................................................ 43
5.4 USING THE MOSAIC ........................................................................................ 44
5.4.1 ControL ..................................................................................................... 44
5.4.2 operationaL mode....................................................................................... 44
5.4.3 maSk referenCing modeS ........................................................................... 45
5.4.4 trigger modeS ........................................................................................... 45
5.4.5 invert mode................................................................................................ 46
5.4.6 SeqUenCing ................................................................................................. 46

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5.4.7 overLap mode ............................................................................................47
5.4.8 externaL triggering ...................................................................................47
5.4.9 externaL frame addreSSing ........................................................................47
5.4.10 deviCe SynCHronization (dmd aCtive oUtpUt) ...........................................47
5.4.11 Beam SpLitter pLUg operation ..................................................................47
5.4.12 Lamp HoUSe fiLterS (not avaiLaBLe on moSaiC infinity)................................48
5.5 CONDITIONS REQUIRED FOR LASER EMISSION..........................................49
5.6 OPTICAL ALIGNMENT......................................................................................49
5.6.1 iLLUmination magnifiCation/power denSity ControL .....................................49
5.6.2 Centration of tHe LaSer iLLUmination on tHe dmd.......................................50
5.6.3 Centration of tHe iLLUmination to tHe miCroSCope .......................................51
5.6.4 Software regiStration/CaLiBration .............................................................51
5.7 CHANGING THE DICHROIC POSITION (MOSAIC INFINITY) .......................... 52
5.8 RISK MITIGATION .............................................................................................52
5.8.1 interLoCk Safety SyStem teSting ................................................................52
5.8.2 meCHaniCaL HoUSing ...................................................................................52
SECTION 6: MAINTENANCE....................................................... 53
6.1 OPTICAL ELEMENTS........................................................................................53
6.2 REGULAR CHECKS ..........................................................................................53
6.3 ANNUAL ELECTRICAL SAFETY CHECKS ....................................................... 54
6.4 CHANGING THE DICHROIC (MOSAIC INFINITY) ............................................54
SECTION 7: TROUBLESHOOTING ............................................. 55
7.1 TROUBLESHOOTING EXAMPLES ...................................................................55
7.2 PROBLEM REPORTING FORM........................................................................56

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SECTION 8: TECHNICAL SPECIFICATIONS.............................. 57
8.1 AC/DC POWER SUPPLY REQUIREMENTS ....................................................57
8.2 POWER CONSUMPTION..................................................................................57
8.3 ELECTRICAL SPECIFICATIONS (I/O)...............................................................57
8.4 OPERATING CONDITIONS ...............................................................................58
8.5 STORAGE AND TRANSPORTATION ................................................................58
8.6 PERFORMANCE SPECIFICATIONS .................................................................58
8.7 LASER SOURCES .............................................................................................58
APPENDIX A: MECHANICAL DRAWINGS ................................. 59
APPENDIX B: GLOSSARY ........................................................... 61
APPENDIX C: OTHER INFORMATION ....................................... 62

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Revision History
Version Released Description
1.0 24 Sep 2010 Initial Release
1.1 15 Feb 2012 Conversion into InDesign format
1.2 09 Jul 2013 Minor updates (All sections)
2.0 10 Oct 2013 Updated Laser Safety Information.
Updated presentation (All sections)
Added PDF Functionality to improve navigation
3.0 19 Dec 2013 Fully revised and updated information to match latest Mosaic3model features and
functionality (all sections)
3.1 11 Feb 2015 Updated to include to cover the Mosaic Innity models
3.2 18 Feb 2016 Updated to cover USB 3.0 functionality.
3.3 09 Mar 2016 Updated power consumption values (Section 8.2)
3.4 27 Sep 2016 Corrected DMD image diagram (Section 2.3)
Changed references of active illumination to Photostimulation.
Minor branding and address details edits.
Corrected document numbering (Section 6)
3.5 8 May 2019 Updated USA and Asia-Pacic Addresses.
Updated Laser Safety Information.

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Safety and Warning Information
PLEASE READ THIS INFORMATION FIRST
CAUTION – USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN
THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.
1. If the equipment is used in a manner not specied by Andor, the protection provided by the equipment may be
impaired.
2. Do not position this product so that it is difcult to operate the Mains disconnecting device. See SECTION 5.1,
“Emergency Mains Disconnection”.
3. Before using the system, please follow and adhere to all warnings, safety, manual handling and operating
instructions located either on the product or in this Hardware Guide.
4. Keep this Hardware Guide in a safe place for future reference.
5. Users must be authorised and trained personnel only; otherwise this may result in personal injury, and/ or
equipment damage and impaired system performance.
6. There are no user-serviceable parts inside the product and the enclosure must not be opened. Only authorised
service personnel may service this equipment.
7. This product may be used with lasers, which are very hazardous, so please read the laser safety information
following this section very carefully.
8. IEC Technical Document IEC TR 60825-14 recommends the presence of a Laser Safety Ofcer (LSO). However,
national guidelines should be referred to.
9. This equipment has not been designed and manufactured for the medical diagnosis of patients.
10. Do not attempt to bypass any system safety interlocks. They are provided to comply with the safety
requirements of various regulatory agencies and must be employed to protect the operator.
11. Protective earth is an integral part of the protection against electric shock in this product, and is provided via
the earth pin of the external power supply. Ensure that this is plugged into the building earth system via the
mains socket. Do not tamper with any of the earthing measures.
12. Any AC/DC Power Supply used with this product must meet the requirements of Section 8.1.
13. Only use a mains cord certied to the safety regulations for your region and suitably rated for the mains supply
specied in Section 8.1.
14. Make sure the power supply cord is located so that it will not be subject to damage. If replacement of the
detachable power supply cord is required, ensure replacement is of same type and rating.
15. Locate the laser source and any other connected devices within 2 m of each other so that the interconnecting
bres are not stretched, bent, or constrained.
16. While running an experiment, try to keep room temperature as stable as possible.
17. Performance of the system may be adversely affected by rapidly changing environmental conditions or
operation outside of the operating conditions specied in SECTION 8 “TECHNICAL SPECIFICATIONS”
18. Electromagnetic Compatibility: This is a Class A product. In a domestic environment this product may cause
electromagnetic interference, in which case the user may be required to take adequate measures.

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19. This product has been designed and tested to perform successfully in a normal (basic) electromagnetic
environment, e.g. a typical life science test laboratory, as per the EU EMC Directive. It is not designed to
operate in a harsh electromagnetic environment, e.g. close to the following equipment: EMI/RFI generators,
electrostatic eld generators, electromagnetic or radioactive devices, plasma sources, arc welders, x-ray
instruments, intense pulsed sources, or other similar sources of high energy elds whose emissions are not
within the normal range expected under the EU EMC Directive.
20. Please note that this product is not designed to provide protection from ionising radiation. Any customer using
this product in such an application should provide their own protection.
21. Your product is a precision scientic instrument containing fragile components. Always handle it with care.
22. Ensure bre cables are not bent tightly as this may damage the internal optical bre. For transport or storage,
bre cables should be coiled with a diameter of 300mm or greater.
23. If noise patterning or optical uctuations are seen, contact Andor Customer Support for advice.
24. Do not wet or spill liquids on the product, and do not store or place liquids on the product.
25. If spillage occurs on the product, switch off power immediately, and wipe off with a dry, lint-free cloth.
26. If any ingress of liquids has occurred or is suspected, unplug the mains cables, do not use, and contact Andor
Customer Support.
27. Do not expose the product to extreme hot or cold temperatures.
28. Do not expose the product to open ames.
29. Do not allow objects to fall on the product.
30. See SECTION 6.1, “Cleaning and Decontamination”.

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Laser safety speciaL Warnings
CAUTION – USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN
THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE
This product includes lasers or is designed to be upgraded with lasers, so you must be aware of the hazards associated
with the use of the powerful laser radiation that can be emitted by this product. Laser radiation differs from ordinary light
primarily because its optical power can be concentrated into a narrow, low-divergence beam, whereas, for example, a
standard light bulb diffuses its light in all directions and thus spreads out its power. It’s a bit like the difference between
walking outside on a sunny day versus having the sun’s light concentrated on your skin using a magnifying glass.
Skin damage or deeper injury can be caused by lasers, but the eye is especially susceptible as laser light can
be collimated into a narrow beam that can enter the eye and permanently damage the retina with life-changing
consequences.
Be aware that visible laser light is dangerous as well as invisible and that this laser product is not fully safe as you
usually have access to hazardous laser radiation. Laser safety for this type of product is about reducing risk, rather than
being able to eliminate it because access is required for the performance of this product.
It is important to remember to beware reections from objects such as tools or clips placed close to the laser beam
emitted from the microscope objective.
Andor strongly recommend that all facilities have an established system for the safe use of lasers as per their national
regulations and occupational health and safety legislation. IEC TR 60285-14 Safety of laser products – Part 14: A user’s
guide and the American National Standard for the Safe Use of Lasers (ANSI Z136.1) are standard references for good
practice.
Laser product safety standards
If your product contains lasers, it has been designed and manufactured to comply with the international laser product
safety standard IEC 60825-1 and the U.S. CDRH Regulation 21CFR § 1040.10 to reduce risk as far as is reasonably
practicable. Our Customer Support Team install the system according to the same standards, but if there has been
an agreement that you should install all or part of the laser product system, then you take responsibility to install this
according to the same standards.