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  9. Panasonic 2SA1739 User manual

Panasonic 2SA1739 User manual

Transistors
1
Publication date: March 2003 SJC00027BED
2SA1739
Silicon PNP epitaxial planar type
For high speed switching
Complementary to 2SC3938
■Features
•High speed switching
•Low collector-emitter saturation voltage VCE(sat)
•S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
■Absolute Maximum Ratings Ta=25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO −15 V
Collector-emitter voltage (Base open) VCEO −15 V
Emitter-base voltage (Collector open) VEBO −4V
Collector current IC−50 mA
Peak collector current ICP −100 mA
Collector power dissipation PC150 mW
Junction temperature Tj150 °C
Storage temperature Tstg −55 to +150 °C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base cutoff current (Emitter open)
ICBO VCB =−8 V, IE=0 −0.1 µA
Emitter-base cutoff current (Collector open)
IEBO VCE =−3 V, IC=0 −0.1 µA
Forward current transfer ratio hFE1 *VCE =−1 V, IC=−10 mA 50 150 
hFE2 VCE =−1 V, IC=−1 mA 30
Collector-emitter saturation voltage VCE(sat) IC=−10 mA, IB=−1 mA −0.1 −0.2 V
Transition frequency fTVCB =−10 V, IE=10 mA, f =200 MHz 800 1
500 MHz
Collector output capacitance Cob VCB = −5 V, IE= 0, f = 1 MHz 1 pF
(Common base, input open circuited)
Turn-on time ton Refer to the switching time 12 ns
Turn-off time toff measurement circuit 20 ns
Storage time tstg 19 ns
■Electrical Characteristics Ta=25°C ±3°C
Unit: mm
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
2.1±0.1
1.3±0.1
0.3+0.1
–0.0
2.0±0.2
1.25±0.10 (0.425)
1
3
2
(0.65) (0.65)
0.2±0.1
0.9±0.10 to 0.1
0.9+0.2
–0.1
0.15+0.10
–0.05
5˚
10˚
Rank Q R No-rank
hFE1 50 to 120 90 to 150 50 to 150
Marking symbol AXQ AXR AX
Marking Symbol: AX
Product of no-rank is not classified and have no marking symbol for rank.
1: Base
2: Emitter
3: Collector
EIAJ: SC-70
SMini3-G1 Package
This product complies with the RoHS Directive (EU 2002/95/EC).
2SA1739
2SJC00027BED
ICVCE VCE(sat) ICVBE(sat) IC
PCTa
hFE ICfTIECob VCB
Switching time measurement circuit
ton , toff Test circuit tstg Test circuit
508 Ω30 Ω
51 Ω
VBB =−10 V
VIN
VCC =−3 V
VIN =9.0 VVIN =−5.8 V
VBB =Ground
VIN =9.8 V
VBB =−8.0 V
VOUT
0.1 µF34 Ω
VIN 0
0
VOUT
VIN
VOUT
90%
90%
90% 10%
10%
tstg
ton toff
90%
2 kΩ62 Ω
51 Ω
VBB
VIN
VCC =−1.5 V
VOUT
0.1 µF52 Ω
0 16040 12080
0
200
160
120
80
40
Collector power dissipation P
C
(mW)
Ambient temperature T
a
(°C)
0−12−10−8−2−6−4
0
−60
−50
−40
−30
−20
−10
T
a
=25°C
−300 µA
−500 µA
−400 µA
−100 µA
−200 µA
I
B
=−600 µA
Collector current I
C
(mA)
Collector-emitter voltage V
CE
(V)
−1−10 −100 −1 000
−0.01
−0.1
−1
−10
−100 I
C
/ I
B
=10
25°C
−25°C
T
a
=75°C
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC(mA)
−1−10 −100 −1 000
−0.01
−0.1
−1
−10
−100 IC/ IB=10
25°C
−25°C
Ta=75°C
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC(mA)
−0.1 −1−10 −100
0
240
200
160
120
80
40
V
CE
=−10 V
T
a
=75°C
25°C
−25°C
Forward current transfer ratio h
FE
Collector current I
C
(mA)
1 10 100
0
2 400
2 000
1 600
1 200
800
400
VCB =−10 V
f =200 MHz
Ta=25°C
Transition frequency fT(MHz)
Emitter current IE(mA)
−1−10 −100
0
2.4
2.0
1.6
1.2
0.8
0.4
IE=0
f =1 MHz
Ta=25°C
Collector-base voltage VCB (V)
Collector output capacitance
(Common base, input open circuited) Cob (pF)
This product complies with the RoHS Directive (EU 2002/95/EC).
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.

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