Panasonic KX-TG4111CB User manual

© Panasonic System Networks Co., Ltd. 2011
Unauthorized copying and distribution is a violation
of law.
ORDER NO. KM41103329CE
F1
Telephone Equipment
Model No. KX-TG4111CB
KX-TG4112CN
KX-TG4113CB
KX-TG4114CB
KX-TGA410CB
KX-TGA410CN
Digital Cordless Phone
B: Black Version
N: Champagne Gold Version
(for Canada)
Call Display Compatible
Model No Base Unit Handset Charger Unit Expandable
KX-TG4111
1 (TG4111) 1 (TGA410) Up to 6
KX-TG4112
1 (TG4111) 2 (TGA410) 1 Up to 6
KX-TG4113
1 (TG4111) 3 (TGA410) 2 Up to 6
KX-TG4114
1 (TG4111) 4 (TGA410) 3 Up to 6
KX-TGA410
* 1 (TGA410) 1
Configuration for each model
Information for optional accessories
You can expand your phone system by registering optional
handsets (KX-TGA660C / KX-TGA659C) to a single base unit.
Optional handsets and the supplied handset are different model
so that some functions may not be available.
Refer to each Operating Instruction for details.
*KX-TGA410 is also an optional accessory, which contains a
handset and a charger.
(Handset)
KX-TGA410CB/CN KX-TG4111CB/CN
(Base Unit)
(Charger Unit)

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KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
LWhen you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
LThe illustrations in this Service Manual may vary slightly from the actual product.

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KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Location of Controls and Components ------------------- 7
5 Installation Instructions ---------------------------------------- 7
6 Operating Instructions------------------------------------------ 7
7 Schematic Diagram ---------------------------------------------- 8
7.1. For Schematic Diagram---------------------------------- 8
7.2. Schematic Diagram (Base Unit_Main) --------------10
7.3. Schematic Diagram (Handset_Main) ----------------12
7.4. Schematic Diagram (Charger Unit) -----------------14
8 Exploded View and Replacement Parts List -----------15

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KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
1 Safety Precautions
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component
Component
pin
Solder
Remove all of the
excess solder
(Slice View)

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KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

6
KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
•Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
•Analog telephone connection: Telephone Line
Power source
Receiving Method
Oscillation Method
Detecting Method
Tolerance of OSC Frequency
Modulation Method
ID Code
Ringer Equivalence No. (REN)
Dialing Mode
Redial
Speed Dialer
Power Consumption
Operating Conditions
Dimensions (H x W x D)
Mass (Weight)
AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
13.824 MHz ± 100 Hz
Frequency Modulation
40 bit
0.1
Standby: Approx. 0.7 W
Maximum: Approx. 3.5 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 77 mm × 126 mm × 90 mm
Approx. 140 g
Rechargeable Ni-MH battery
AAA (R03) size (1.2 V 550 mAh)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
13.824 MHz ±100 Hz
Frequency Modulation
40 bit
Tone (DTMF)/Pulse
Up to 48 digits
Up to 24 digits (Phonebook)
11 days at Standby,
13 hours at Talk
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 159
mm × 49 mm × 29 mm
Approx. 130 g
Base Unit Handset Charger
AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz)
Standby: Approx 0.1 W
Maximum: Approx 2.0 W
0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity
(dry)
Approx. 43 mm × 73 mm × 76 mm
Approx. 50 g
Duplex procedure:
TDMA (Time Division Multiple Access)
Channel spacing:
1.728kHz
Bit rate:
1.152 kbit/s
Modulation:
GFSK (Gaussian Frequency Shift Keying)
RF transmission power:
115 mW (max)
Voice coding:
ADPCM 32 kbit/s
Tone (DTMF)/Pulse
Up to 48 digits
■
■
■
■
■
■
■Standard:
DECT 6.0 (Digital Enhanced Cordless
Telecommunications 6.0)
■Number of channels:
60 Duplex Channels
■Frequency range:
1.92 GHz to 1.93 GHz

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KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
4 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
5 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Operating Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

8
KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
7 Schematic Diagram
7.1. For Schematic Diagram
7.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
7.1.2. Handset (Schematic Diagram (Handset_Main))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
7.1.3. Charger Unit (Schematic Diagram (Charger Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
Important Safety Notice:
Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
Important Safety Notice:
Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.

9
KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
Memo

10
KX-TG4111CB/KX-TG4112CN/KX-TG4113CB/KX-TG4114CB/KX-TGA410CB/KX-TGA410CN
7.2. Schematic Diagram (Base Unit_Main)
NC: No Components
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_TCK
JTAG_RTCK
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_RTCK
JTAG_TDO
URX
UTX
MSG_LED
ANS_LED
LCD_BLTR
LCD_BLTL
SPI2_CLK
SPI2_DO
LCD_CD
LCD_CS
LCD_RST
KEYS_E
KEYS_C
KEYIN2
KEYS_D
KEYIN3
KEYIN1
GND
RA502
10k
1 2 3 45
6 7 8
C859
2.2p
C825
10p
TXn
C663 NC
RA501 33
1
2
3
45
6
7
8
VBAT
GND
C826
10p
C811
10p
ANT1
C896
2.2p
GND
VDDC
SPP
C477 10p
STM/CKM/P15
C820
1.5p
CL1
C478 10p
GND
RXn
GND
DA802
1
2
3
C892
5p
+3.0V
C810
2.4p
GND
ANT2
C515
K1u
GND
R891
470
C827
10p
RXn
LCD_BLT2
VBAT
GND
R807
470
GND
GND
C518 0.1u
GND
R892
470
CL2
NC2
RXON
C813
2p
GND
TXn
RSTN
C822
10p
GND
RXON
TXON
TXp
GND
C665 NC
GND
LCD_BLT1
RXp
GND
C664 NC
C863
1.5p
C662 NC
C806
2.7p
C812
0.9p
GND
GND
+3.0V
ANT1
C891
5p
L809
7.5n
ANT2
GND
R512
NC
C517 0.1u
C661 NC
TXp
C895
1.2p
SPN
DA801
1
2
3
GND
C516 0.1u
C805
2.7p
GND
TXON
R806
470
RXp
LCD_CS
LCD_VDD
LCD_RST
LCD_CD
LCD_SCL
LCD_SIO
LCD_GND
*WBX02
AP1
10pin
PARALLEL WIRE
R502
33
TCK URX TDI RTCK TMS UTX TDO UGND
C670
NC
*WBX01
AP1
10pin
PARALLEL WIRE
C652 NC
*SW1
LOCATOR
12
NC
KEYIN2
KEYS_C
C660 NC
KEYS_D
C653 NC
KEYS_E
C654 NC
ANS_LED
MSG_LED
LED_VDD
VBAT
C655 NC
KEYIN3
KEYIN1
C656 NC C651 NC
L661 NC
L662 NC
L663 NC
L664 NC
*R651 NC
*R652 NC
L665 NC
+3.0V
*R507
1k
*C666 NC
*Q651 NC
NC
1
2
3
4
5
*Q652
1
2
3
4
5
D473 NC
D472 NC
A K A K
ANT1
ANT2
1 2 1 2
45 TXp
46 RXp
47 RXn
48 GND_RF
49 TRSW_p
50 ANT_n
51 ATST_n
52 ATST_p
53 TEST
54 RSTN
55 NC
56 VCC_VCO
57 GPIO[27]
58 VDDUSB
59 DM_USB/GPI28
60 DP_USB/GPI29
61 VDDC1
62 JTAG_TDO
63 JTAG_TDI
64 JTAG_TCK
65 JTAG_TMS
66 JTAG_RTCK
C894
10p
C893
10p
W 0.2mm
L mm
1st layer
W 0.2mm
L 10mm
1st layer
W 0.15mm
L 5.0mm
1st layer
W 0.2mm
L mm
1st layer
W 0.15mm
L 5.0mm
1st layer
W 0.15mm
L 20mm
3rd layer
TO RF BLOCK
W 0.2mm
L 10mm
1st layer
W 0.2mm
L 10.0mm
1st layer
10
1
10
1
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
* BBIC initialization ψ stand-by status
* When "SFR" command
is executed, 13.824MHz
frequency will be output.