
1
1OVERVIEW ......................................................................................... 3
1.1 Advantages................................................................................. 3
1.2 Main Application &Testing Range............................................. 4
1.2.1 Main Application .................................................................... 4
1.2.2 Testing Range.......................................................................... 4
1.3 Technical Specifications............................................................. 5
1.4 Configuration............................................................................. 6
1.5 Working Conditions.................................................................... 6
1.6 Safety Instructions...................................................................... 6
2STRUCTURE FEATURE &TESTING PRINCIPLE...................................... 7
2.1 Structure Feature ....................................................................... 7
2.1.1 The Hardness Tester Appearance............................................ 7
2.1.2 D Type Impact Device............................................................. 7
2.1.3 Different Types of Impact Device............................................ 8
2.2 Main Screen............................................................................... 8
2.3 Keypad Definitions .................................................................... 9
2.4 Leeb Hardness Testing Principle ............................................... 9
3PREPARATION ................................................................................... 10
3.1 Instrument Preparation and Inspection ................................... 10
3.2 Preparation of the Sample Surface ...........................................11
4TESTING PROGRAM .......................................................................... 12
4.1 Start-Up ................................................................................... 12
4.2 Loading.................................................................................... 12
4.3 Localization ............................................................................. 12
4.4 Testing...................................................................................... 12
4.5 Read Measured Value............................................................... 13
4.6 Notification .............................................................................. 13