Siemens SL10 User manual

Private Communication Systems
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Service Manual
SL 10
V 1.1
Service Manual SL10 V1.1 PN MP ST
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1Table of Contents
1 TABLE OF CONTENTS....................................................................................................................................2
1 TECHNICAL DATA...........................................................................................................................................3
2 GENE AL INFO MATION.............................................................................................................................4
3 MECHANICAL CONCEPT...............................................................................................................................4
3.1 MECHANICAL DRAWING OF THE SL10
.........................................................................................................................................................................5
3.2 DISASSEMBLING THE SL10...............................................................................................................................6
3.2.1 Necessary ools........................................................................................................................................6
3.2.2 Disassembling he Mobile.......................................................................................................................6
3.2.3 Disassembling he Slide
...........................................................................................................................................................................7
3.2.4 Disassembling he Top Par of he Base.................................................................................................8
3.2.5 Disassembling he Bo om Par of he Base
.........................................................................................................................................................................10
3.3 ASSEMBLING THE SL10.................................................................................................................................10
3.3.1 Assembling he Bo om Par of he Base
.........................................................................................................................................................................10
3.3.2 Assembling he Top Par of he Base....................................................................................................11
3.3.3 Assembling he Slide
.........................................................................................................................................................................11
3.3.4 Assembling he Mobile..........................................................................................................................12
3.4 HANDSET DATECODES...................................................................................................................................13
4 HA DWA E CONCEPT
.................................................................................................................................................................................15
4.1 BLOCK DIAGRAM..........................................................................................................................................15
4.2 HARDWARE DESCRIPTION...............................................................................................................................16
4.3 POWER SUPPLY CONCEPT...............................................................................................................................17
4.4 LIMITS OF VOLTAGE AND CURRENT .................................................................................................................18
5 BATTE Y..........................................................................................................................................................19
5.1 SPECIFICATION..............................................................................................................................................19
5.2 SHORT CIRCUIT PROTECTION...........................................................................................................................19
5.3 DEEP DISCHARGE.........................................................................................................................................19
5.4 BATTERY DATECODES....................................................................................................................................20
6 SOFTWA E P OG AMMING.....................................................................................................................21
6.1 DESCRIPTION OF SOFTWARE BOOTING
.......................................................................................................................................................................21
6.2 LANGUAGE GROUPS......................................................................................................................................22
7 UNBLOCKING .................................................................................................................................................22
7.1 SIEMENS HOTLINE.........................................................................................................................................22
7.2 INTERNET SOLUTION.......................................................................................................................................23
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1Technical Data
Length: 129 mm
Width: 50 mm
Thickness: 26 mm
Volume: 121 cm³
Weight: 138 grams
Performance: GSM class 4 (2 Wa )
Frequency ange: Tx 890-915 MHz
Rx 935-960 MHz
Power supply: Li hium Ion ba ery (3,6V/550mAh)
Standby time: Up o 35 hours
Talk time: Up o 3 hours.
Charging time: approx. 1 hour
Display: LCD high-resolu ion colour graphic display
SIM Card Type: Plug-In, 3V or 5V
Antenna: Non-re rac able, Lambda/2 helix ype

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2 eneral Information
The SL10 is he firs Siemens mobile GSM elephone using
he new MCM chipse echnology. I fur her consis s of a
slide mechanism, he so called ProSLIDETM system, which
e.g. suppor s ON-Hook and OFF-hook func ion. As in
S10ac ive, he SL10 also fea ures a real ime clock.
Addi ionally i is equipped wi h an infrared in erface e.g. for
da a ransmission.
3Mechanical Concept
Note: All part numbers refer to mechanical drawin in section 4.1! These numbers are not
valid for orderin spare parts. For appropriate orderin numbers please refer to the official
spare part list. If you have questions re ardin spare parts, please contact your service
mana er.
The SL10 consis s of wo major par s: The slide uni and he base uni . User in erface
compared o o her Siemens mobiles is no realised by jus one MMI board con aining all
necessary componen s, bu is separa ed in o a MMI board (1010) inside he slide uni which
carries display and a par of he keypad (1250), and a second keypad (1240) inside of he base
uni . Microphone (1200) also is loca ed in he base uni .
The connec ion be ween MMI board and RF&Con rol board is no es ablished by a normal
connec or wi h plug-in con ac s or an in erconnec or (e.g. like in S6), bu by a flexible cable.
The same kind of cable is used o connec he keypad (1240) and microphone (1200) inside of
he base uni o he RF&Con rol board (1000). The one end of hese cables is soldered o he
appropria e board, he o her end is plugged in o a ZIF-connec or (ZIF= Zero Inser ion Force).
Attention:
The flexible cables are very sensi ive o any kind of mechanical mis rea men . Please be
careful no o damage hem during he repair process of he elephone! Various kinds of
failures can come up even if hese cables are only bended.
The shielding concep is similar o he one of S6. The upper case (1040) of he base uni is
coa ed wi h a conduc ive ma erial and conduc ive rubber. This es ablishes he shielding of he
one side of RF&Con rol module (1010). On he opposi e side of his board here is a shielding
screen (1160) above he relevan area, which is fixed by four screws (1280). The an enna
(1230) is direc ly screwed in o he lower case (1050) of he base uni .
The keypad (1240), he loudspeaker (1220), dus pro ec ion frame (1070) and MMI board
(1010) are moun ed in o he upper case (1020) of he slide uni . Please make sure while
assembling he slide uni ha he me al con ac s of he dus pro ec ion frame (1070) are
properly ben up when moun ing.
When urning in he screws (1270, 1280, 1290) make sure ha he righ orque is used
(1280, 1290: (0,08+0,02)Nm; 1270: (0.2+0,05)Nm).
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3.1Mechanical drawing of the SL10
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3.2Disassembling the SL10
Caution!
Inside he elephone here are hree flexible cables, which are very sensi ive o any kind of
mechanical damage. Please be careful during all he disassembling process no o damage
hem e.g. by bending or snapping.
3.2.1Necessary tools
For disassembling he SL10 he following ools are
manda ory:
- Me al blade
- Ca ch lever
- Screwdriver Torx 6
- Tweezer
3.2.2Disassembling the Mobile
1. Remove ba ery and SIM-Card
2. Unscrew an enna.
1. Remove he wo coun ersunk-head screws a he lower end of he elephone (below ven plug) and inside
he ba ery depar men .
2. Move slide all he way o he open posi ion.
3. Undo he slide s op by inser ing he me al s rip on he lef side be ween he slide
and he base.
1. Turn he mobile over and push he me al s rip hrough un il i is visible above he keypad.
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1.
Then use your humb o press he slide up o separa e i from he base. The second s op which
is moun ed a he bo om of he slide has o be released a he same ime. To do so, push
he bo om of slide upwards and con inue pushing he slide wi h he humb.
The me al blade can be removed when he s op on he op of base is visible comple ely.
1. Remove spring and s op from op of base.
Attention:
Flexible cable is very sensi ive o any kind of mechanical
damage (e.g. bending, snapping).
1. Use he ca ch lever o unlock he six ca ches (see figures
below) in order o separa e he op par of he base from he
bo om par of he base.
1. Now de ach he flexible cable from he plug on he con rol module by
undoing he re aining clip on he plug and hen pulling he
cable ou .
1. Now you have separa ed he hree major par s of he
elephone
a) Slide, b) Top of base, c) Bo om of base
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12
a) b) c)
34
56

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3.2.3Disassembling the Slide
1. Unscrew he coun ersunk-head screw (A)
2. Nex , release he lower ca ch (B)
3. Then release he six la eral ca ches (1-6 )
1. Af er releasing he ca ches, remove he bo om par of he slide.
2. Now remove he MMI board from he bo om par of he slide by
raising he board (1.) and pushing i oward he keypad (2.).
Attention: Do no crease or damage he flexible cable
on he lower side of he MMI.
1. Finally, remove he dus pro ec ion frame, he keypad
ma and he loudspeaker from he op par of he slide.
You now have disassembled he slide comple ely.
3.2.4Disassembling the Top Part of the Base
1. Firs remove he microphone holder and he flexible
microphone cable a ached o i from he microphone
housing.
1. Then de ach he flexible keypad cable from he ZIF-plug (ZIF=Zero Inser ion Force).
To do so, please firs open he re aining clip and pull ou he cable af erwards.
2. Remove he ringer gaske .
3. Now remove he four orx fla -head screws on he screen lid and he wo orx coun ersunk-
head screws on he side of he microphone.
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1.
2.
AB
4 1
5 2
6 3

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1. Now remove he con rol module and he screen lid.
2. Finally, remove he microphone.
Now you comple ed disassembling he Top of base.
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3.2.5Disassembling the Bottom Part of the Base
1. Firs remove he ba ery basepla e.
2. Then remove he ba ery con ac s rip.
3. Finally, remove he charge con ac s.
3.3Assembling the SL10
Caution!
Inside he elephone here are hree flexible cables, which are very sensi ive o any kind of
mechanical damage. Please be careful during all he assembling process no o damage hem
e.g. by bending or snapping.
3.3.1Assembling the Bottom Part of the Base
Inser he charge con ac s, he ba ery con ac s rip and he
ba ery basepla e.
Make sure ha you inser he basepla e in he righ way, because
o herwise you will have o reopen he phone again (See figures
below).
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Not o.k.
o.k.

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3.3.2Assembling the Top Part of the Base
1. Firs inser he microphone in o he op par of he base.
2. Now inser he con rol module, moun he screen lid and screw in
he six screws.
3. Moun he ringer gaske .
4. Connec he flexible keypad cable o he plug on he con rol
module and press he re aining clip down.
5. Finally, moun he flexible microphone cable on o he
microphone housing
3.3.3Assembling the Slide
1. Firs inser he loudspeaker and he keypad ma in o he
device.
1. Inser he dus pro ec ion frame in o he op par of he slide.
Caution!
- The copper side mus poin oward he housing.
- The s rap mus be ben in a way ha i lies on he keypad
ma (see figure beside).
1. Thread he flexible cable of he MMI in o he lower
par of he slide, moun he MMI board and lock i in
place. Pull he flexible cable carefully ou all he way.
Caution!
Do no crease or damage he flexible cable e.g. like
shown in he figure beside.
1. Wi h i s op edge leading, inser he lower par of he
slide in o he op par of he slide, le ing he ca ches
snap in o place one af er he o her from op o bo om.
2. Finally, screw in he orx coun ersunk-head screw.
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3.3.4Assembling the Mobile
1. Firs inser he slide s op and he spring in o he op of he base. The spring has o be
inser ed in o he gap which is closer o he upper end of he elephone (where he infrared
in erface is loca ed)
1. Now moun he slide on he guide rails in he op par of he base.
Caution!
Applying oo much pressure will damage he plas ic
par s, especially he upper par of he slide is very
sensi ive.
1. Close he slide.
1. Connec he flexible cable o he plug on he con rol
module and affix he re aining clip o he plug.
1. Inser he in erconnec ed slide/ op of he base in o he bo om of
he base
Caution!
Firs secure he ca ch o he op edge of he housing so
ha he flexible cable is no damaged. Af erwards fix
he ca ches (see figures below).
2. Screw he orx coun ersunk screws in o he ba ery
compar men and in o he housing. Cover he housing
screw wi h he plas ic cap.
3. Finally, screw in he an enna and inser he SIM card rack bearing he SIM card.
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3.4Handset Datecodes
Siemens is using he indus rial s andard DIN EN 60062 o indica e he produc ion / service
da es. The code is prin ed on he IMEI s icker loca ed in he ba ery compar men .
The firs charac er of he da ecode indica es he year of produc ion:
F = 1995
H = 1996
J = 1997
K = 1998
The second charac er indica es he mon h of produc ion:
1-9 = january to september
O = october
N = november
D = december
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-> YY = Da ecode

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Example: „JO“ means ha he se was produced in oc ober of 1997.
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4Hardware Concept
4.1Bloc Diagram
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4.2Hardware Description
The handse consis s of five major in egra ed circui s. Some of hem - beside o hers - are
in egra ed in o jus one single IC, he so called Multi Chip Module (MCM).
1) HiGOLD PMB 2800 (inside MCM)
This IC is a combina ion of microprocessor and signalprocessor.
The microprocessor is responsible for con rolling he keyboard, SIM-Card, EEPROM, Flash
and RAM.
Fur hermore i con rols he power up/power down of he RF module and se s he
amplifica ion of he PA.
The signal processor is responsible for processing he Rx I/Q signals (fil ering, equalizing,
speech and channel decoding).
Fur hermore i does he speech and channel encoding and he GSMK modula ion of he Tx
I/Q signals.
3) GAIM PMB 2905 (inside MCM)
The GAIM provides he in erface be ween he analogue signals (I/Q, voiceband, PA-con rol)
and i s digi al represen a ion.
4) Receiver Circui (PMB 2409)
This circui provides he following main func ionali ies:
xLow Noise Amplifier (LNA) wi h a fixed amplifica ion of +20dB o amplify he
inpu RF signal.
Mixer o mix down he RF signal o he In ermedia e Frequency (IF)
XProgrammable IF amplifier wi h a dynamic range of 60dB ( -10dB o +50dB in
s eps of 2dB)
èMixer o mix down he IF signal o he baseband, genera ing and inphase (I) and a
quadra ure (Q) signal.
¸Offse compensa ion for he I/Q signals.
5) Transmi er Circui PMB 2240/45
This circui provides he IF syn hesizer, he I/Q modula or, prescalers o regula e he RF
syn hesizer and a buffer s age o feed he PA.
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4.3Power Supply Concept
The SL10 has wo main power inpu s (see blockdiagram):
1) Ba ery Vol age (3.6 Vol s) connec ed a he ba ery con ac s
2) Charging Vol age (6.5 Vol s) delivered by he desk op charger (using he charging con ac s
a he bo om of he phone)
Since he ba ery vol age is supplying he power supply asic, i is a mus o have he ba ery
(or service adap er) inser ed o opera e he phone.
You cannot switch on the handset if the battery voltage is not present.
From he 3.6V ba ery vol age, all o her supply vol ages of he SL10 are derived, con rolled
by he power supply ASIC.
The RF module needs 6.0V for i s PA: This vol age is genera ed by a s ep-up conver er.
The logic module, MMI and IrDA circui use 2.8V, genera ed by a linear regula or inside he
ASIC. The opera ing vol age for he display illumina ion (100Vpk) is derived from his 2.8V
also.
Fur hermore he ASIC genera es he supply vol age for he Chip-card and he supply vol age
for he Flash.
The ASIC also checks he presence of he wa chdog signal from he µP and provides he
swi ching on-func ionali y (ON/OFF bu on or imer signal).
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The 2.8V power supply of TCXO, Receiver and Modula or is derived direc ly from he
ba ery vol age by a separa e linear regula or.
During es ing is is advisable o use he service adap er, connec ed o a power supply
delivering +4V, max 3A. Make sure ha you connec he service adap er wi h he righ
polari y, he red plug o +4V and he blue plug o ground.
CAUTION!
If you use a voltage higher than +7V, or with wrong polarity, the phone can e destroyed!
4.4Limits of Voltage and Current
a) Battery Voltage:
If he ba ery vol ages rises above 6.2 Vol s, he phone will swi ch off and i canno be
swi ched on again before he vol age is lower han 6.2 Vol s.
If he ba ery vol age rises above 7 Vol s he phone can be des royed.
b) Charging Current:
The charging curren mus no rise above 1 A or he phone (fuse) will be inoperable.
 Be careful wi h foreign accessories or chargers!
 Make sure ha he charging curren is limi ed o a value below 1A!
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5Battery
5.1Specification
The SL10 ba ery is a Li hium-Ion ype wi h a vol age of
3.6 Vol s and a capaci y of 550mAh.
The connec ions BATT+ and GND are used o supply he
mobile, while RCODE is used o de ec he ba ery
echnology. BATT_TEMP is used o measure he ba ery
empera ure.
Charging he ba ery can be impossible, if he empera ure of he ba ery cells is oo high (e.g.
in car use during summer) or oo low. This is o preven he ba ery from being damaged
during fas charge process. To enable he charging process again, he ba ery only needs o
cool down/warm up. A replacemen of ba ery is no necessary.
5.2Short Circuit Protection
The ba ery is shor -circui pro ec ed by an elec ronic fuse.
The rese ing of he fuse can be done by he following procedures:
HPlug he ba ery in o he desk op charger.
or
ˆApply +5 Vol s be ween he BATT+ and GND con ac s (see drawing!)
Caution! Limi he curren o 10mA.
5.3Deep Discharge
If he ba ery is deeply discharged i can be recharged by he following procedure:
•Inser fla ba ery in o handse and connec ravel charger. The charging symbol
will no be visible. Wai for appr. 1 hour and disconnec charger af erwards.
•Remove ba ery and reinser i . If you connec he ravel charger now, he charging
symbol mus be visible on he handse display.
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BATT+
CODE
BATT_TEMP
GND

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5.4Battery Datecodes
The da ecode prin ed on he ba ery will give you he following informa ion:
Example: TOS 8 G9 VA 1
TOS = Ba ery cells supplied by Toshiba
8 = Revision level
G9 = Datecode (see below)
VA = Var a (ba ery manufac urer)
1 = Place of manufac uring (1=Germany ,2= Novibor, Czech Republic)
Datecode:
Charac er 1: Year of produc ion (J= 1997, K= 1998)
Charac er 2: Mon h of produc ion
(1-9 means January o Sep ember; O=Oc ober; N=November ;
D=December)
Example: TOS 8 K4 VA 1 This ba ery was produced in april of 1998!
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