Siemens SITRANS TDL User manual

Continuous gas analysis
In situ Laser Gas Analyzers
SITRANS TDL
Operating Instructions
7MB6431 (SITRANS TDL)
05/2023
A5E51429088_AA
Getting started 1
Introduction 2
Safety notes 3
Description 4
Installing/mounting 5
Connecting 6
Commissioning 7
Operating 8
Parameter assignment 9
Service and maintenance 10
Diagnostics and
troubleshooting 11
Technical speci󹪝cations 12
Dimension drawings 13
Product documentation
and support A
Technical reference B
Communication C
Remote operation D

Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will
be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to
property damage.
Quali󹪝ed Personnel
The product/system described in this documentation may be operated only by personnel quali󹪝ed for the speci󹪝c
task in accordance with the relevant documentation, in particular its warning notices and safety instructions.
Quali󹪝ed personnel are those who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended or
approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and maintenance
are required to ensure that the products operate safely and without any problems. The permissible ambient
conditions must be complied with. The information in the relevant documentation must be observed.
Trademarks
All names identi󹪝ed by ® are registered trademarks of SiemensAG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software
described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the
information in this publication is reviewed regularly and any necessary corrections are included in subsequent
editions.
Siemens AG
Digital Industries
Postfach 48 48
90026 NÜRNBERG
GERMANY
Document order number:A5E51429088
Ⓟ 04/2023 Subject to change
Copyright © SiemensAG 2023.
All rights reserved

Table of contents
1 Getting started ...................................................................................................................................... 9
1.1 Getting started .................................................................................................................... 9
2 Introduction ......................................................................................................................................... 11
2.1 Purpose of this documentation .......................................................................................... 11
2.2 Items supplied ................................................................................................................... 12
2.3 Security information .......................................................................................................... 13
2.4 Transportation and storage ................................................................................................ 13
2.5 Notes on warranty ............................................................................................................. 14
3 Safety notes ......................................................................................................................................... 15
3.1 Preconditions for use ......................................................................................................... 15
3.1.1 Warning symbols on the device.......................................................................................... 15
3.1.2 Laws and directives............................................................................................................ 15
3.1.3 Conformity with European directives.................................................................................. 16
3.1.4 Conformity with UK regulations ......................................................................................... 16
3.1.5 Improper device modi󹪝cations............................................................................................ 17
3.2 Requirements for special applications................................................................................. 17
4 Description........................................................................................................................................... 19
4.1 Overview SITRANS TDL....................................................................................................... 19
4.2 System con󹪝guration ......................................................................................................... 20
4.3 SITRANS TDL mechanical assembly .................................................................................... 21
4.4 Applications....................................................................................................................... 22
4.5 Approvals .......................................................................................................................... 23
5 Installing/mounting ............................................................................................................................. 25
5.1 Basic safety notes............................................................................................................... 25
5.1.1 Installation location requirements ...................................................................................... 26
5.1.2 Proper mounting................................................................................................................ 27
5.2 Installation instructions...................................................................................................... 28
5.2.1 Purging.............................................................................................................................. 28
5.2.2 Housing purging (optional)................................................................................................ 29
5.2.3 Tube and process purging .................................................................................................. 30
5.2.4 Purging tubes .................................................................................................................... 33
5.2.5 Emitter unit ....................................................................................................................... 34
5.2.6 Receiver unit...................................................................................................................... 34
5.2.7 Emitter unit - electrical terminals ....................................................................................... 35
5.2.8 Installing process 󹪞anges ................................................................................................... 35
5.2.8.1 Safety information ............................................................................................................. 35
5.2.8.2 Change of laser class.......................................................................................................... 36
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5.2.8.3 Installing process 󹪞anges ................................................................................................... 36
5.2.8.4 Flange installation ............................................................................................................. 37
5.2.8.5 Alignment of SITRANS TDL ................................................................................................. 39
5.2.8.6 Alignment kit .................................................................................................................... 40
5.2.8.7 Alignment procedure ......................................................................................................... 40
5.3 Sensor mounting ............................................................................................................... 44
5.3.1 Mounting conditions ......................................................................................................... 44
5.3.2 Optical path length determination ..................................................................................... 45
5.3.3 Sensor mounting .............................................................................................................. 46
5.4 Disassembly....................................................................................................................... 47
5.4.1 Incorrect disassembly......................................................................................................... 47
6 Connecting .......................................................................................................................................... 49
6.1 Basic safety notes............................................................................................................... 49
6.1.1 Improvement of interference immunity.............................................................................. 51
6.2 Connecting SITRANS TDL.................................................................................................... 52
6.2.1 Electrical connections ........................................................................................................ 52
6.2.2 Available interfaces............................................................................................................ 53
6.2.3 Electrical terminals............................................................................................................. 53
6.2.4 Emitter unit - electrical terminals ....................................................................................... 54
6.2.5 Power supply ..................................................................................................................... 55
6.2.6 Analog outputs and inputs ................................................................................................ 56
6.2.7 Active analog outputs ....................................................................................................... 58
6.2.8 Passive analog outputs ...................................................................................................... 59
6.2.9 Active analog inputs .......................................................................................................... 59
6.2.10 Passive analog inputs ........................................................................................................ 60
6.2.11 Digital outputs................................................................................................................... 60
6.2.12 Resistance temperature detectors....................................................................................... 61
6.2.13 Loop cable connection ...................................................................................................... 63
6.2.14 Receiver unit - loop cable installation instruction ............................................................... 63
6.2.15 Emitter unit - loop cable installation instruction ................................................................. 65
6.2.16 Customer cable connection ............................................................................................... 66
6.2.17 Customer cable installation instruction .............................................................................. 67
6.2.18 Ethernet connection ......................................................................................................... 68
6.2.19 Ethernet cable installation instruction ............................................................................... 69
6.2.20 Industrial protocols connection ......................................................................................... 69
7 Commissioning .................................................................................................................................... 71
7.1 Basic safety notes............................................................................................................... 71
7.2 General requirements ........................................................................................................ 72
7.3 Local operation.................................................................................................................. 72
7.4 Device startup ................................................................................................................... 73
7.4.1 Access control.................................................................................................................... 75
7.5 Local commissioning.......................................................................................................... 76
7.5.1 Wizard order ...................................................................................................................... 76
7.5.2 Wizard overview ................................................................................................................ 76
7.5.3 Quick commissioning......................................................................................................... 78
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8 Operating............................................................................................................................................. 81
8.1 Local operation.................................................................................................................. 81
8.1.1 Local display ...................................................................................................................... 81
8.1.1.1 Access control.................................................................................................................... 81
8.1.1.2 Display views ..................................................................................................................... 82
8.1.2 Process values.................................................................................................................... 92
8.1.3 Inputs and outputs............................................................................................................. 94
8.1.3.1 Current output .................................................................................................................. 94
8.1.3.2 Digital output .................................................................................................................... 96
8.1.4 Diagnostics........................................................................................................................ 96
8.1.5 Maintenance...................................................................................................................... 96
8.1.5.1 Diagnostic log.................................................................................................................... 97
8.1.6 Memory card ..................................................................................................................... 97
8.1.7 Security ............................................................................................................................. 97
8.2 Remote operation .............................................................................................................. 97
8.2.1 Modbus RTU ...................................................................................................................... 98
8.2.2 Web browser...................................................................................................................... 98
8.2.2.1 Establishing communication with the device ...................................................................... 98
8.2.2.2 User access level .............................................................................................................. 101
8.2.2.3 Self-Monitoring and diagnosis tab .................................................................................... 102
8.2.2.4 Measurements tab........................................................................................................... 103
8.2.2.5 Parameters tab ................................................................................................................ 105
8.2.2.6 Settings tab ..................................................................................................................... 110
8.2.2.7 Factory con󹪝g tab ............................................................................................................ 110
8.2.2.8 About tab ........................................................................................................................ 111
9 Parameter assignment....................................................................................................................... 113
9.1 Quick start (1) ................................................................................................................. 114
9.1.1 Quick commissioning (1.1) .............................................................................................. 114
9.1.1.1 Medium pressure ............................................................................................................. 114
9.1.1.2 Medium temperature....................................................................................................... 115
9.1.1.3 Path length...................................................................................................................... 116
9.2 Setup (2) ......................................................................................................................... 116
9.2.1 Medium pressure (2.1)..................................................................................................... 116
9.2.1.1 Source (2.1.1).................................................................................................................. 116
9.2.1.2 Fixed value (2.1.2)........................................................................................................... 116
9.2.1.3 Current value (2.1.3) ....................................................................................................... 116
9.2.2 Medium temperature (2.2)............................................................................................... 116
9.2.2.1 Source (2.2.1).................................................................................................................. 116
9.2.2.2 Fixed value (2.2.2)........................................................................................................... 117
9.2.2.3 Current value (2.2.3) ....................................................................................................... 117
9.2.3 Path length (2.3) ............................................................................................................. 117
9.2.4 Limits (2.4)...................................................................................................................... 117
9.2.4.1 Limit 1 (2.4.1).................................................................................................................. 117
9.2.4.2 Limit 2 (2.4.2) to Limit 10 (2.4.10)................................................................................... 119
9.2.5 Noise reduction (2.5)....................................................................................................... 119
9.2.5.1 Damping value T90 (2.5.1) .............................................................................................. 119
9.2.6 Inputs and outputs (2.6) .................................................................................................. 119
9.2.6.1 Current input (2.6.1)........................................................................................................ 119
9.2.6.2 Current output (2.6.2) ..................................................................................................... 120
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9.2.6.3 Digital output (2.6.3) ....................................................................................................... 121
9.2.7 Date and time (2.7).......................................................................................................... 121
9.2.7.1 Current date and time (2.7.1)........................................................................................... 121
9.2.7.2 Set date and time (2.7.2) ................................................................................................. 121
9.2.8 Local display (2.8)............................................................................................................ 122
9.2.8.1 Brightness (2.8.1) ............................................................................................................ 122
9.2.8.2 Backlight (2.8.2) .............................................................................................................. 122
9.2.8.3 Contrast (2.8.3) ............................................................................................................... 122
9.2.8.4 View 1 (2.8.4).................................................................................................................. 123
9.2.8.5 View 2 (2.8.5).................................................................................................................. 125
9.2.8.6 View 3 (2.8.5) to View 6 (2.8.9) ....................................................................................... 127
9.3 Maintenance and diagnostics (3)...................................................................................... 127
9.3.1 Identi󹪝cation (3.1) ........................................................................................................... 127
9.3.1.1 Manufacturer (3.1.1) ....................................................................................................... 127
9.3.1.2 Product name (3.1.2)....................................................................................................... 127
9.3.1.3 Article number (3.1.3) ..................................................................................................... 127
9.3.1.4 Serial number (3.1.4)....................................................................................................... 127
9.3.1.5 Local display (3.1.7)......................................................................................................... 127
9.3.2 Diagnostics (3.2).............................................................................................................. 128
9.3.2.1 Device status (3.2.1)........................................................................................................ 128
9.3.2.2 Diagnostic log (3.2.2) ...................................................................................................... 128
9.3.2.3 Clear diagnostic log (3.2.3) .............................................................................................. 128
9.3.3 Monitoring (3.3).............................................................................................................. 128
9.3.3.1 Sensor (3.3.1).................................................................................................................. 128
9.3.3.2 Process values (3.3.2) ...................................................................................................... 129
9.3.3.3 Inputs (3.3.3) .................................................................................................................. 129
9.3.3.4 Outputs (3.3.4)................................................................................................................ 130
9.3.3.5 Limits (3.3.6)................................................................................................................... 130
9.3.4 Memory card (3.7)........................................................................................................... 130
9.3.4.1 Installed (3.7.1) ............................................................................................................... 130
9.3.4.2 Capacity (3.7.3) ............................................................................................................... 130
9.3.4.3 Free space (3.7.4)............................................................................................................ 131
9.4 Communication (4).......................................................................................................... 131
9.4.1 Ethernet (4.1).................................................................................................................. 131
9.4.1.1 IP address (4.1.1)............................................................................................................. 131
9.4.1.2 IP subnet mask (4.1.2) ..................................................................................................... 131
9.4.1.3 Default gateway (4.1.3) ................................................................................................... 131
9.5 Security (5)...................................................................................................................... 131
9.5.1 Change user PIN (5.1) ...................................................................................................... 131
9.5.2 Change expert PIN (5.2)................................................................................................... 131
9.5.3 Recovery ID (5.3) ............................................................................................................. 132
9.5.4 PIN recovery (5.4) ............................................................................................................ 132
9.5.5 Enable user PIN (5.5) ....................................................................................................... 132
9.5.6 Auto logout (5.7)............................................................................................................. 132
9.5.7 Logout (5.8) .................................................................................................................... 132
10 Service and maintenance .................................................................................................................. 133
10.1 Basic safety notes............................................................................................................. 133
10.1.1 Maintenance.................................................................................................................... 133
10.1.2 Dust layers above 5 mm ................................................................................................... 133
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10.2 Cleaning.......................................................................................................................... 134
10.3 Maintenance and repair work........................................................................................... 134
10.4 Replacing the device ........................................................................................................ 136
10.5 Transport......................................................................................................................... 137
10.6 Return procedure............................................................................................................. 137
10.7 Disposal........................................................................................................................... 137
11 Diagnostics and troubleshooting....................................................................................................... 139
11.1 Calibration information ................................................................................................... 139
11.2 Device status symbols ...................................................................................................... 139
12 Technical speci󹪝cations ..................................................................................................................... 141
12.1 Construction.................................................................................................................... 141
12.2 Power.............................................................................................................................. 142
12.3 Performance.................................................................................................................... 142
12.4 Inputs/Outputs................................................................................................................. 143
12.5 Customer interface .......................................................................................................... 143
12.6 Reference operating conditions........................................................................................ 143
12.7 Purging............................................................................................................................ 143
12.8 Packaging........................................................................................................................ 144
12.9 Approvals non-hazardous................................................................................................. 145
13 Dimension drawings.......................................................................................................................... 147
13.1 Emitter and receiver dimensions ...................................................................................... 147
13.2 Dimension drawings ........................................................................................................ 148
A Product documentation and support ................................................................................................ 151
A.1 Product documentation ................................................................................................... 151
A.2 Technical support............................................................................................................. 152
B Technical reference............................................................................................................................ 153
B.1 Principle of operation ...................................................................................................... 153
B.2 Calibration and calibration certi󹪝cate ............................................................................... 153
B.3 Diagnostic LEDs ............................................................................................................... 154
C Communication ................................................................................................................................. 155
C.1 Modbus RTU .................................................................................................................... 155
C.1.1 Introduction..................................................................................................................... 155
C.2 PROFIBUS......................................................................................................................... 155
C.2.1 Introduction..................................................................................................................... 155
C.2.2 PROFIBUS communication................................................................................................ 155
Table of contents
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Operating Instructions, 05/2023, A5E51429088_AA 7

D Remote operation .............................................................................................................................. 157
D.1 Modbus RTU (RS485) ...................................................................................................... 157
D.2 Modbus TCP .................................................................................................................... 157
D.3 SIMATIC PDM ................................................................................................................... 158
D.3.1 Overview SIMATIC PDM.................................................................................................... 158
D.3.2 Updating the Electronic Device Description (EDD) or Field Device Integration (FDI)............ 159
D.3.3 Check SIMATIC PDM version ............................................................................................. 159
Index .................................................................................................................................................. 161
Table of contents
SITRANS TDL
8Operating Instructions, 05/2023, A5E51429088_AA

Getting started 1
1.1 Getting started
Condition
You have read the following safety instructions:
• General safety information (Page15)
• Basic safety information: Installing/mounting (Page25)
• Basic safety information: Connecting (Page49)
• Basic safety information: Commissioning (Page71)
Read the entire document in order to achieve the optimum performance of the device.
Procedure
1. Install/mount the device.
Installating/mounting (Page25)
2. Connect the device.
Connecting (Page49)
3. Power up the device.
Device startup (Page73)
4. Commission the device.
Commissioning (Page71)
Startup is complete.
SITRANS TDL
Operating Instructions, 05/2023, A5E51429088_AA 9

Getting started
1.1Getting started
SITRANS TDL
10 Operating Instructions, 05/2023, A5E51429088_AA

Introduction 2
2.1 Purpose of this documentation
These instructions contain all information required to commission and use the device. Read the
instructions carefully prior to installation and commissioning. In order to use the device
correctly, 󹪝rst review its principle of operation.
The instructions are aimed at persons mechanically installing, connecting and
commissioning the device, as well as service and maintenance engineers.
The following table shows major changes in the documentation compared to the previous
edition.
Edition Remark
04/2023 First edition
HMI Firm‐
ware (HMI-
FW) revision
Menu Structure
Firmware (HMI-
MS) revision
Date Changes
1.00.00 1.00.00 April 2023 • Initial release
The following table describes compatibility between manual edition, device revision,
engineering system and associated Electronic Device Description (EDD).
Man‐
ual ed‐
ition
Remarks Device revision Compatible version of device integration pack‐
age
04/202
3
First edition HMI-FW: 5.06.14-28 or lat‐
er
HMI-MS: 0.00.00-28 or lat‐
er
Device revision A01 or lat‐
er
SIMATIC PDM: 8.2 SP1 or
later
EDD: 1.00.00 or later
SITRANS TDL
Operating Instructions, 05/2023, A5E51429088_AA 11

2.2 Items supplied
• SITRANS TDL gas analyzer







• Siemens Process Analytics documentation
disk containing certi󹪝cates, and manuals.
(All device manuals and certi󹪝cates can be
found by scanning the QR code on the de‐
vice or at Instructions and manuals (https://
www.siemens.com/
processinstrumentation/documentation).)
Note
Scope of delivery may vary, depending on version and add-ons. Make sure the scope of delivery
and the information on the nameplate correspond to your order and the delivery note.
Use the device in accordance with the information on the nameplate and in the Technical
speci󹪝cations (Page141).
1. Check the packaging and the delivered items for visible damages.
2. Report any claims for damages immediately to the shipping company.
3. Retain damaged parts for clari󹪝cation.
4. Check the scope of delivery by comparing your order to the shipping documents for
correctness and completeness.
WARNING
Using a damaged or incomplete device
Risk of explosion in hazardous areas.
• Do not use damaged or incomplete devices.
NOTICE
Use in a domestic environment
This Class A Group 1 equipment is intended for use in industrial areas.
In a domestic environment this device may cause radio interference.
Introduction
2.2Items supplied
SITRANS TDL
12 Operating Instructions, 05/2023, A5E51429088_AA

2.3 Security information
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is
necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial
security concept. Siemens’ products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems,
machines and networks. Such systems, machines and components should only be connected
to an enterprise network or the internet if and to the extent such a connection is necessary
and only when appropriate security measures (e.g. 󹪝rewalls and/or network segmentation)
are in place.
For additional information on industrial security measures that may be implemented, please
visit
https://www.siemens.com/industrialsecurity (https://www.siemens.com/industrialsecurity).
Siemens’ products and solutions undergo continuous development to make them more
secure. Siemens strongly recommends that product updates are applied as soon as they are
available and that the latest product versions are used. Use of product versions that are no
longer supported, and failure to apply the latest updates may increase customer’s exposure
to cyber threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS
Feed under
https://www.siemens.com/industrialsecurity (https://www.siemens.com/industrialsecurity).
2.4 Transportation and storage
To guarantee su󹪟cient protection during transport and storage, observe the following:
• Keep the original packaging for subsequent transportation.
• Devices/replacement parts should be returned in their original packaging.
• If the original packaging is no longer available, ensure that all shipments are properly
packaged to provide su󹪟cient protection during transport. Siemens cannot assume liability
for any costs associated with transportation damages.
NOTICE
Insu󹪟cient protection during storage
The packaging only provides limited protection against moisture and in󹪝ltration.
• Provide additional packaging as necessary.
Special conditions for storage and transportation of the device are listed in Technical
speci󹪝cations (Page141).
Introduction
2.4Transportation and storage
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Operating Instructions, 05/2023, A5E51429088_AA 13

2.5 Notes on warranty
The contents of this manual shall not become part of or modify any prior or existing agreement,
commitment or legal relationship. The sales contract contains all obligations on the part of
Siemens as well as the complete and solely applicable warranty conditions. Any statements
regarding device versions described in the manual do not create new warranties or modify the
existing warranty.
The content re󹪞ects the technical status at the time of publishing. Siemens reserves the right
to make technical changes in the course of further development.
Introduction
2.5Notes on warranty
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14 Operating Instructions, 05/2023, A5E51429088_AA

Safety notes 3
3.1 Preconditions for use
This device left the factory in good working condition. In order to maintain this status and to
ensure safe operation of the device, observe these instructions and all the speci󹪝cations relevant
to safety.
Observe the information and symbols on the device. Do not remove any information or
symbols from the device. Always keep the information and symbols in a completely legible
state.
3.1.1 Warning symbols on the device
Symbol Explanation
Consult operating instructions
Hot surface
Dangerous electrical voltage
Isolate the device from power using a circuit-breaker
Protect the device from impact otherwise loss of degree of protection
Protective insulation; device in protection class II
3.1.2 Laws and directives
Observe the test certi󹪝cation, provisions and laws applicable in your country during connection,
assembly and operation. These include, for example:
• National Electrical Code (NEC - NFPA 70) (USA)
• Canadian Electrical Code (CEC Part I) (Canada)
SITRANS TDL
Operating Instructions, 05/2023, A5E51429088_AA 15

Further provisions for hazardous area applications are for example:
• IEC60079-14 (international)
• EN60079-14 (EU and UK)
• For Korea only:
$
3.1.3 Conformity with European directives
The product described in this document is in conformity with the relevant harmonization
legislation, and its amendments, of the European Union.
Electromagnetic compatibili‐
ty directive EMC
2014/30/EU
Directive of the European Parliament and of the Council on the
harmonisation of the laws of the Member States relating to elec‐
tromagnetic compatibility
Low voltage directive LVD
2014/35/EU
Directive of the European Parliament and of the Council on the
harmonisation of the laws of the Member States relating to the
making available on the market of electrical equipment designed
for use within certain voltage limits
The applicable directives can be found in the EU Declaration of Conformity of the speci󹪝c
device.
3.1.4 Conformity with UK regulations
Conformity with UK regulations
The product described in this document is in conformity with the relevant harmonization
legislation, and its amendments, of the United Kingdom. The applicable regulations can be
found in the UKCA declaration of conformity of the speci󹪝c device.
Safety notes
3.1Preconditions for use
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16 Operating Instructions, 05/2023, A5E51429088_AA

3.1.5 Improper device modi󹪝cations
WARNING
Improper device modi󹪝cations
Risk to personnel, system, and environment can result from modi󹪝cations to the device,
particularly in hazardous areas.
• Only carry out modi󹪝cations that are described in the instructions for the device. Failure to
observe this requirement cancels the manufacturer's warranty and the product approvals.
Do not operate the device after unauthorized modi󹪝cations.
3.2 Requirements for special applications
Due to the large number of possible applications, each detail of the described device versions for
each possible scenario during commissioning, operation, maintenance or operation in systems
cannot be considered in the instructions. If you need additional information not covered by
these instructions, contact your local Siemens o󹪟ce or company representative.
Note
Operation under special ambient conditions
We highly recommend that you contact your Siemens representative or our application
department before you operate the device under special ambient conditions as can be
encountered in nuclear power plants or when the device is used for research and development
purposes.
Pressure safety
For pressure speci󹪝cations, refer to the Technical speci󹪝cations (Page141).
WARNING
Damage to operating sta󹪜
Whenever the optics housings heads are to be opened or disconnected from the process
interface or the gas tubing, make sure that any overpressure in the optics housings heads is
removed prior to any work. Opening optics housings under overpressure may result in
dangerous injuries to the operator.
WARNING
Damaged optics
The high pressure-proof glass in the optics housings must not be subject to any mechanical
impact which might cause damage to the glass (scratch, gash etc.). Only use a soft cloth for
cleaning of the glass. Make sure that it is safe to dismount the optics housing before cleaning.
Safety notes
3.2Requirements for special applications
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Operating Instructions, 05/2023, A5E51429088_AA 17

WARNING
Malfunction of sealing
Make sure all plugs and tube 󹪝ttings are sealed with the enclosed pipe thread sealant.
Instructions given on the sealant tube must be carefully followed.
WARNING
Manipulation of the device
Physical access to the device enables undesired manipulations of the device. As a result of this,
the device can lose its measuring properties and become unusable.
• Ensure that the device is located in a protected area to which only authorized persons have
access.
• If no settings need be carried out, lock the device.
SITRANS TDL is classi󹪝ed as a Class 1 laser product. The emitted laser radiation is invisible (near
infrared) and not hazardous to an unprotected eye. SITRANS TDL has warning labels placed at
positions speci󹪝ed in the EN 60825-1:2014-11 norm.
NOTICE
Class 1 - Laser Product
Internal invisible IR laser is a Class I product.
Safety notes
3.2Requirements for special applications
SITRANS TDL
18 Operating Instructions, 05/2023, A5E51429088_AA

Description 4
4.1 Overview SITRANS TDL
The laser based SITRANS TDL analyzer is a versatile tunable diode laser (TDL) gas analyzer for
industrial process applications. SITRANS TDL is normally mounted directly on the process using
a pair of process 󹪞anges.
SITRANS TDL
Operating Instructions, 05/2023, A5E51429088_AA 19

4.2 System con󹪝guration
The SITRANS TDL analyzer consists of a pair of cross-duct sensors - an emitter unit and a receiver
unit. The emitter unit releases laser radiation directly through the process containing the
constituents of interest. The receiver unit collects the laser radiation on the other side of the
process duct. The receiver unit is connected to the emitter unit by means of a loop cable
(included). The device uses an internal in-line reference gas cell for real time veri󹪝cation of the
calibration status.

①Emitter unit ④Cables for industrial protocols
②Receiver unit ⑤Ethernet cable
③Loop cable ⑥Customer cable
Description
4.2System con󹪝guration
SITRANS TDL
20 Operating Instructions, 05/2023, A5E51429088_AA