St Spsgrf User manual

This is information on a product in full production.

October 2017 DocID027664 Rev 6 1/24

SPSGRF

Sub-GHz (868 or 915 MHz) low power programmable RF

transceiver modules

Datasheet -production data

Features

Programmable radio features

– Based on Sub-1GHz SPIRIT1 transceiver

and integrated Balun (BALF-SPI-01D3)

– Modulation schemes: 2-FSK, GFSK, MSK,

GMSK, OOk, ASK

– Air data rate from 1 to 500 kbps

– On-board antenna

– Operating temperature range from -40 °C

to 85 °C

RF features

– Receiver sensitivity: -118 dBm

– Programmable RF output power up to

+11.6 dBm

Host interface

– SPI

General I/O

– Up to 32 programmable I/O functions on 4

GPIO programmable module pins

Two typical carrier frequency versions:

– SPSGRF-868 with 868 MHz tuned antenna

– SPSGRF-915 with 915 MHz tuned antenna

Certification:

– CE (SPSGRF-868)

– FCC (SPSGRF-915)

– IC (SPSGRF-915)

Applications

AMR (automatic meter reading)

Home and building automation

WSN (wireless sensor network)

Industrial monitoring and control

Wireless fire and security alarm systems

Point-to-point wireless link

Description

The SPSGRF-868 and SPSGRF-915 are easy-to-

use, low power sub-GHz modules based on the

SPIRIT1 RF transceiver, operating respectively in

the 868 MHz SRD and 915 MHz ISM bands.

The modules provide a complete RF platform in a

tiny form factor.

The SPSGRF series enables wireless

connectivity in electronic devices, requiring no RF

experience or expertise for integration into the

final product. As an FCC, IC, and CE certified

solution, the SPSGRF series optimizes the time-

to-market of end applications. The SPSGRF-915

is an FCC certified module (FCC ID:

S9NSPSGRF) and IC certified (IC 8976C-

SPSGRF), while the SPSGRF-868 is certified CE.

The modules are designed for maximum

performance in minimal space and include 4

programmable I/O pins and SPI serial interfaces.

www.st.com

Contents SPSGRF

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Contents

1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 SPSGRF module functional behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.3 Module current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.4 Module RF compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.5 SPSGRF module RF typical performance . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.6 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2 IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.2.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3 CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7 Module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

9 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

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SPSGRF Block diagram

1 Block diagram

Figure 1. SPSGRF block diagram

SPSGRF module functional behavior SPSGRF

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2 SPSGRF module functional behavior

The SPIRIT1 device in the SPSGRF module is equipped with a built-in main controller which

controls the switching between the two main operating modes: transmit (TX) and receive

(RX).

In shutdown condition, the SPSGRF module can be switched on/off with the external SDN

pin; all other functions/registers/commands are available through the SPI interface and

GPIOs. No internal supply is generated (in order to minimize battery leakage), and therefore

all stored data and configurations are lost.

The GPIO and SPI ports of the module during shutdown are in HiZ. From the SHUTDOWN

state, the SPSGRF module can be switched on from the SDN pin and goes into a READY

state, which is the default, where the reference signal from XO is available.

From the READY state, the SPSGRF module can be moved to a LOCK state to generate

the high precision LO signal and/or TX or RX modes. Switching from RX to TX and vice-

versa can occur only by passing through the LOCK state. This operation is normally

managed by radio control with a single user command (TX or RX).

At the end of the events above, the SPSGRF module can return to its default state (READY)

and can then be put into a sleep condition (SLEEP state), characterized by very low power

consumption.

If no timeout is required, the SPSGRF module can be moved from READY to STANDBY

state, which has the lowest possible current consumption while retaining FIFO, status and

configuration registers. To manage the transitions towards and between these operating

modes, the controller works as a state machine, the state switching of which is driven by SPI

commands.

Figure 2. Module functional state transitions diagram

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SPSGRF Hardware specifications

3 Hardware specifications

3.1 Absolute maximum ratings

General conditions (VIN= 3.3 V and 25 °C)

3.2 Recommended operating conditions

3.3 Module current consumption

Table 1. Absolute maximum ratings

Rating Min. Typ. Max. Unit

Storage temperature range -40 +85 °C

Supply voltage, VIN -0.3 3.9 V

I/O pin voltage -0.3 3.9 V

RF saturation input power +10 dBm

Table 2. Recommended operating conditions

Rating Min. Typ. Max. Unit

Operating temperature range -40 +85 °C

Supply voltage, VIN 1.8 3.3 3.6 V

Signals & I/O pin voltage (according

supply voltage) 1.8 3.6 V

RF frequency bandwidth

(SPSGRF-868) 863 870 MHz

RF frequency bandwidth

(SPSGRF-915) 902 928 MHz

Table 3. SPSGRF-868 module

Symbol Parameter Test conditions Typ. Unit

IDD Supply current

Operating mode

Tx, +11.6 dBm, 2-FSK, 868 MHz 22 mA

Operating mode

Tx, - 7 dBm, 2-FSK, 868 MHz 9mA

Operating mode Rx, 868MHz 10 mA

Command mode 0.6 mA

Shutdown high level -VDD

(with other I/O in High impedance) 0.1 μA

Hardware specifications SPSGRF

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3.4 Module RF compliance limits

The RF compliance limits are those tested for FCC, IC and CE certification using the

dedicated dongle (PC92A.V01). These limits are enforced by the dongle firmware. Care

must be taken with custom application firmware to ensure these limits are not exceeded,

voiding the FCC, IC and CE certification.

Table 4. SPSGRF-915 module

Symbol Parameter Test conditions Typ. Unit

IDD Supply current

Operating mode

Tx, +11.6 dBm, 2-FSK, 915 MHz 22 mA

Operating mode

Tx, - 7 dBm, 2-FSK, 915 MHz 9mA

Operating mode Rx, 915 MHz 10 mA

Command mode 0.6 mA

Shutdown high level -VDD

(with other I/O in high impedance) 0.1 μA

Table 5. RF compliance limits table

Modulation Standards Parameter Max. Unit

2-FSK

GFSK

MSK

FCC Part 15.207 (1)

FCC Part 15.247 (1)

IC RSS-210

EN 300 220-2 V2.4.1 (2)

EN 301 489-01 V1.9.2 (2)

EN 301 489-03 V1.4.1 (2)

1. FCC and IC standards are applicable only to the SPSGRF-915 module.

2. EN standards are applicable only to the SPSGRF-868 module.

Data rate 500 kbps

Output power +11.6 dBm

OOK

ASK

FCC Part 15.207 (1)

FCC Part 15.247 (1)

IC RSS-210

EN 300 220-2 V2.4.1 (2)

EN 301 489-01 V1.9.2 (2)

EN 301 489-03 V1.4.1 (2)

Data rate 250 kbps

Output power +6 dBm

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SPSGRF Hardware specifications

3.5 SPSGRF module RF typical performance

The RF performance of the SPSGRF-868 and SPSGRF-915 modules are dependent on

many factors, related to the customer hardware application board where the module is

connected and also to the customer application firmware. In order to provide some basic

information to the customer integrating the module, it may be useful to provide the RF

measurements taken in an anechoic chamber using a dongle containing a connected

SPSGRF-868 or SPSGRF-915 module.

Table 6. SPSGRF-868 or 915 modules radiated typical performance

Symbol Parameter Test conditions Typ. Unit

Tx RF

power RF radiated power

Operating mode

Tx, +11.6 dBm, 2-FSK, 868,0-868,6 MHz +5.3 dBm

Operating mode

Tx, +11.6 dBm, 2-FSK, 902-928 MHz +2.2 dBm

Hardware specifications SPSGRF

8/24 DocID027664 Rev 6

Table 7. SPSGRF-868 or 915 module conducted typical performance before the RF

antenna circuits (positive RF power signal values measured)

Parameter Test conditions(1) Conducted

programmable value

Measured

conducted

value Typ.

Unit

Tx RF

conducted

power

(before the

antenna

circuits)

Tx, +11.6 dBm, 2-FSK, 868 MHz

Tx, +11.6 dBm, 2-FSK, 915 MHz +11.6 +11.2 dBm

Tx, +11 dBm, 2-FSK, 868 MHz

Tx, +11 dBm, 2-FSK, 915 MHz +11.0 +10.8 dBm

Tx, +10 dBm, 2-FSK, 868 MHz

Tx, +10 dBm, 2-FSK, 915 MHz +10.0 +9.7 dBm

Tx, +9 dBm, 2-FSK, 868 MHz

Tx, +9 dBm, 2-FSK, 915 MHz +9.0 +8.5 dBm

Tx, +8 dBm, 2-FSK, 868 MHz

Tx, +8 dBm, 2-FSK, 915 MHz +8.0 +7.6 dBm

Tx, +7 dBm, 2-FSK, 868 MHz

Tx, +7 dBm, 2-FSK, 915 MHz +7.0 +7.2 dBm

Tx, +6 dBm, 2-FSK, 868 MHz

Tx, +6 dBm, 2-FSK, 915 MHz +6.0 +6.2 dBm

Tx, +5 dBm, 2-FSK, 868 MHz

Tx, +5 dBm, 2-FSK, 915 MHz +5.0 +5.4 dBm

Tx, +4 dBm, 2-FSK, 868 MHz

Tx, +4 dBm, 2-FSK, 915 MHz +4.0 +4.0 dBm

Tx, +3 dBm, 2-FSK, 868 MHz

Tx, +3 dBm, 2-FSK, 915 MHz +3.0 +3.1 dBm

Tx, +2 dBm, 2-FSK, 868 MHz

Tx, +2 dBm, 2-FSK, 915 MHz +2.0 +2.1 dBm

Tx, +1 dBm, 2-FSK, 868 MHz

Tx, +1 dBm, 2-FSK, 915 MHz +1.0 +1.2 dBm

Tx, +0 dBm, 2-FSK, 868 MHz

Tx, +0 dBm, 2-FSK, 915 MHz +0.0 +0.6 dBm

1. Operating mode

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SPSGRF Hardware specifications

Table 8. SPSGRF-868 or 915 module conducted typical performance before the RF

antenna circuits (negative RF power signal values measured)

Parameter Test conditions(1) Conducted

programmable value

Measured

conducted

value Typ.

Unit

Tx RF

conducted

power

(before the

antennas

circuits)

Tx, -1 dBm, 2-FSK, 868 MHz

Tx, -1 dBm, 2-FSK, 915 MHz -1.0 -1.1 dBm

Tx, -2 dBm, 2-FSK, 868 MHz

Tx, -2 dBm, 2-FSK, 915 MHz -2.0 -2.3 dBm

Tx, -3 dBm, 2-FSK, 868 MHz

Tx, -3 dBm, 2-FSK, 915 MHz -3.0 -3.4 dBm

Tx, -4 dBm, 2-FSK, 868 MHz

Tx, -4 dBm, 2-FSK, 915 MHz -4.0 -4.9 dBm

Tx, -5 dBm, 2-FSK, 868 MHz

Tx, -5 dBm, 2-FSK, 915 MHz -5.0 -5.8 dBm

Tx, -6 dBm, 2-FSK, 868 MHz

Tx, -6 dBm, 2-FSK, 915 MHz -6.0 -6.9 dBm

Tx, -7 dBm, 2-FSK, 868 MHz

Tx, -7 dBm, 2-FSK, 915 MHz -7.0 -6.5 dBm

Tx, -8 dBm, 2-FSK, 868 MHz

Tx, -8 dBm, 2-FSK, 915 MHz -8.0 -7.3 dBm

Tx, -9 dBm, 2-FSK, 868 MHz

Tx, -9 dBm, 2-FSK, 915 MHz -9.0 -8.2 dBm

Tx, -10 dBm, 2-FSK, 868 MHz

Tx, -10 dBm, 2-FSK, 915 MHz -10.0 -9.7 dBm

Tx, -15 dBm, 2-FSK, 868 MHz

Tx, -15 dBm, 2-FSK, 915 MHz -15.0 -14.6 dBm

Tx, -20 dBm, 2-FSK, 868 MHz

Tx, -20 dBm, 2-FSK, 915 MHz -20.0 -19.2 dBm

Tx, -25 dBm, 2-FSK, 868 MHz

Tx, -25 dBm, 2-FSK, 915 MHz -25.0 -23.3 dBm

Tx, -30 dBm, 2-FSK, 868 MHz

Tx, -30 dBm, 2-FSK, 915 MHz -30.0 -26.2 dBm

Tx, -35 dBm, 2-FSK, 868 MHz

Tx, -35 dBm, 2-FSK, 915 MHz -35.0 -27.8 dBm

1. Operating mode

Hardware specifications SPSGRF

10/24 DocID027664 Rev 6

3.6 Pin connections

Figure 3. Pin connection diagram

Table 9. Pin assignment

Name Type Pin# Description Alt

function V max. tolerance Initial state

SPI interface

SPI_CLK I 7 SPI CLOCK (Max. 8 MHz) Vin

SPI_MISO O 8 SPI MISO (MASTER in / SLAVE out) Vin

SPI_MOSI I 9 SPI MOSI (MASTER out SLAVE in) Vin

SPI_CS I 10 SPI “Chip Select” (SPI slave select) Vin

Power and ground

Vin 5V

in (1.8V - 3.6V max.)

GND 6 GND

Module shutdown

SDN I 11 Shutdown input (active high) (1.8V - 3.6V max.)

GPIO - general purpose input/output

GPIO [0] I/O 4 Programmable input / output &

analog temperature output (1.8V - Vin max.) Digital output.

Low power

GPIO [1] I/O 3 Programmable input / output (1.8V - Vin max.) Digital output.

Low power

GPIO [2] I/O 2 Programmable input / output (1.8V - Vin max.) Digital output.

Low power

GPIO [3] I/O 1 Programmable input / output (1.8V - Vin max.) Digital output.

Low power

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SPSGRF Mechanical dimensions

4 Mechanical dimensions

Figure 4. Mechanical dimensions

Figure 5. Recommended land pattern

Hardware design SPSGRF

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5 Hardware design

The SPSGRF module supports SPI hardware interfaces.

Note: - All unused pins should be left floating; do not ground.

- All GND pins must be well grounded.

- The area around the module should be free of any ground planes, power planes, trace

routings, or metal for 6 mm from the module antenna position, in all directions.

- Traces should not be routed underneath the module

5.1 Reflow soldering

The SPSGRF is a surface mount sub-1 GHz transceiver module supplied on an 11 pin, 4-

layer PCB. The final assembly recommended reflow profiles are indicated below.

The soldering phase must be executed with care. In order to avoid an undesired melting

phenomenon, particular attention should be given to the setup of the peak temperature.

Table 10 provides suggestions for the temperature profile based on IPC/JEDEC J-STD-

020C, July 2004 recommendations.

Table 10. Soldering recommendations

Profile feature PB-free assembly

Average ramp up rate (TSMAX to Tp) 3°C/ sec max

Preheat

Temperature min (TSmin) 150 °C

Temperature max (TSmax) 200 °C

Time (tSmin to tSmax) (tS) 60-100 sec

Time maintained above:

Temperature TL217 °C

Time tL60-70 sec

Peak temperature (TP) 240 + 0 °C

Time within 5 °C of actual peak temperature (tP) 10-20 sec

Ramp down rate 6 °C/sec

Time from 25 °C to peak temperature 8 minutes max

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SPSGRF Hardware design

Figure 6. Soldering profile

Regulatory compliance SPSGRF

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6 Regulatory compliance

6.1 FCC certification

The SPSGRF-915 module has been tested and found compliant with the FCC part 15 rules.

These limits are designed to provide reasonable protection against harmful interference in

approved installations. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with part 15 of the FCC rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

FCC ID: S9NSPSGRF

In accordance with FCC part 15, the SPSGRF-915 is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with collocation and RF exposure requirements in accordance

with FCC multi-transmitter product procedures. Collocated transmitters operating in portable

RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn

and hand-held devices) may require separate approval.

6.1.1 Labeling instructions

When integrating the SPSGRF-915 into the final product, the OEM must ensure that the

FCC labeling requirements are satisfied. A statement must be included on the exterior of the

final product which indicates that the product includes a certified module. The label should

state the following (or similar wording that conveys the same meaning):

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with part 15 of the FCC rules. Operation is subject to the following two

conditions:

1. this device may not cause harmful interference

2. this device must accept any interference received, including any interference that may

cause undesired operation.

Contains FCC ID: S9NSPSGRF

OR This product contains FCC ID: S9NSPSGRF

DocID027664 Rev 6 15/24

SPSGRF Regulatory compliance

6.1.2 Product manual instructions

This section applies to OEM final products containing the SPSGRF-915 module, subject to

FCC compliance. The final product manual must contain the following statement (or a

similar statement that conveys the same meaning):

“Warning: Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment. (Part. 15.21)”

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

“Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user

is encouraged to try to correct the interference by one or more of the following measures:

– Reorient or relocate the receiving antenna.

– Increase the separation between the equipment and receiver.

– Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

– Consult the dealer or an experienced radio/TV technician for help.”

In the case where an OEM seeks the lesser category of a Class A digital device for the final

product, the following statement must be included in the final product manual:

“Note: This equipment has been tested and found to comply with the limits for a Class A

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference when the equipment is operated in a

commercial environment. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instruction manual, may cause

harmful interference to radio communications. Operation of this equipment in a residential

area is likely to cause harmful interference in which case the user will be required to correct

the interference at his expense.”

6.2 IC certification

The SPSGRF-915 module has been tested and found compliant with the IC RSS-210 rules.

These limits are designed to provide reasonable protection against harmful interference in

approved installations. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with RSS-210 of the IC rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

Regulatory compliance SPSGRF

16/24 DocID027664 Rev 6

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

IC: 8976C-SPSGRF

In accordance with IC RSS-210, the SPSGRF-915 is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with collocation and RF exposure requirements in accordance

with IC multi-transmitter product procedures. Collocated transmitters operating in portable

RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn

and hand-held devices) may require separate approval.

6.2.1 Labeling instructions

When integrating the SPSGRF-915 into the final product, the OEM must ensure that the IC

labeling requirements are satisfied. A statement must be included on the exterior of the final

product which indicates that the product includes a certified module. The label should state

the following (or similar wording that conveys the same meaning):

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

“This device complies with RSS-210 of the IC Rules. Operation is subject to the following

two conditions:

1. this device may not cause harmful interference

2. this device must accept any interference received, including any interference that may

cause undesired operation.”

6.2.2 Product manual instructions

This section applies to OEM final products containing the SPSGRF-915 module, subject to

IC compliance. The final product manual must contain the following statement (or a similar

statement that conveys the same meaning):

“Warning: Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment. (RSS-210)”

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

“Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

Contains IC ID: 8976C-SPSGRF

OR This product contains IC ID: 8976C-SPSGRF

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