
WAGO-I/O-SYSTEM 750 XTR Table of Contents 3
750-469/040-000 2AI Thermocouple configurable /XTR
Manual
Version 1.3.0
Table of Contents
1Notes about this Documentation.............................................................5
1.1 Validity of this Documentation.................................................................5
1.2 Copyright................................................................................................5
1.3 Symbols .................................................................................................6
1.4 Number Notation ....................................................................................8
1.5 Font Conventions ...................................................................................8
2Important Notes ........................................................................................9
2.1 Legal Bases............................................................................................9
2.1.1 Subject to Changes............................................................................9
2.1.2 Personnel Qualifications ....................................................................9
2.1.3 Use of the 750 Series in Compliance with
Underlying Provisions ........................................................................9
2.1.4 Technical Condition of Specified Devices.........................................10
2.1.4.1 Disposal ......................................................................................10
2.1.4.1.1 Electrical and Electronic Equipment........................................10
2.1.4.1.2 Packaging...............................................................................11
2.2 Safety Advice (Precautions) .................................................................12
3Device Description..................................................................................15
3.1 View .....................................................................................................17
3.2 Connectors...........................................................................................18
3.2.1 Data Contacts/Local Bus..................................................................18
3.2.2 Power Jumper Contacts/Field Supply ..............................................19
3.2.3 CAGE CLAMP®Connectors.............................................................19
3.3 Display Elements..................................................................................21
3.4 Operating Elements..............................................................................22
3.5 Schematic Diagram..............................................................................22
3.6 Technical Data .....................................................................................23
3.6.1 Device Data.....................................................................................23
3.6.2 Supply..............................................................................................23
3.6.3 Communication................................................................................23
3.6.4 Inputs...............................................................................................24
3.6.5 Connection Type..............................................................................24
3.6.6 Mechanical Conditions.....................................................................25
3.6.7 Climatic Environmental Conditions...................................................25
3.7 Approvals .............................................................................................26
3.8 Standards and Guidelines ....................................................................27
4Process Image.........................................................................................33
4.1 Configurable I/O Module 750-469/040-000...........................................33
4.2 Types ...................................................................................................36
4.3 Voltage Measurement (mV)..................................................................41
5Mounting..................................................................................................43
5.1 Mounting Sequence..............................................................................43
5.2 Inserting and Removing Devices..........................................................44
5.2.1 Inserting the I/O Module...................................................................44