ADLINK Technology cExpress-KL User manual

Leading EDGE COMPUTING
cExpress-KL
User’s Manual
COM Express Compact Size Type 6 Module with
Mobile 7th Gen Intel® Core™ and Celeron® Processor
Manual Rev.: 1.1
Revision Date: January 3, 2020
Part Number: 50-1J085-1010

ii Preface
Preface
Copyright © 2019-2020 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are reserved. No part of this
manual may be reproduced by any mechanical, electronic, or other means in any form without prior written
permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with
the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to
ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them
in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2019-07-03 JC
1.1 Update specifications, pin description, BIOS 2020-01-03 JC

cExpress-KL
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
2. Specifications............................................................................................................3
2.1. Core System ...............................................................................................................3
2.2. Expansion Busses ......................................................................................................3
2.3. Video...........................................................................................................................4
2.4. Audio...........................................................................................................................4
2.5. LAN.............................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. Serial I/O on Module (need BIOS RD help) ...............................................................5
2.8. Trusted Platform Module (TPM) .................................................................................5
2.9. SEMA Board Controller ..............................................................................................5
2.10. Debug......................................................................................................................5
2.11. Power Specifications ...............................................................................................6
2.12. Power Consumption ................................................................................................6
2.13. Operating Temperatures .........................................................................................6
2.14. Environmental .........................................................................................................6
2.15. Specification Compliance ........................................................................................6
2.16. Operating Systems..................................................................................................6
2.17. Functional Diagram .................................................................................................7
2.18. Mechanical Drawing ................................................................................................8
3. Pinouts and Signal Descriptions..............................................................................9
3.1. AB/CD Pin Definitions.................................................................................................9
3.2. Signal Description Terminology ................................................................................12
3.3. AB Signal Descriptions .............................................................................................13
3.4. CD Signal Descriptions.............................................................................................23
4. Connector Pinouts on Module................................................................................29
4.1. Connector, Switch and LED Locations .....................................................................29
4.2. 40-pin Debug Connector...........................................................................................30
4.3. Status LEDs..............................................................................................................31
4.4. XDP Debug Header .................................................................................................. 32
4.5. Fan Connector ..........................................................................................................33

iv Preface
4.6. BIOS Setup Defaults Reset Button...........................................................................34
4.7. Switch Settings .........................................................................................................35
5. Smart Embedded Management Agent (SEMA) .....................................................37
5.1. Board Specific SEMA Functions...............................................................................38
6. System Resources ..................................................................................................41
6.1. System Memory Map................................................................................................41
6.2. Direct Memory Access Channels..............................................................................41
6.3. I/O Map .....................................................................................................................41
6.4. Interrupt Request (IRQ) Lines...................................................................................43
6.5. PCI Configuration Space Map ..................................................................................44
6.6. PCI Interrupt Routing Map ........................................................................................46
6.7. SMBus Address Table ..............................................................................................46
7. BIOS Setup...............................................................................................................47
7.1. Menu Structure .........................................................................................................47
7.2. Main ..........................................................................................................................48
7.3. Advanced..................................................................................................................53
7.4. Security.....................................................................................................................71
7.5. Boot ..........................................................................................................................71
7.6. Save & Exit ...............................................................................................................74
8. BIOS Checkpoints, Beep Codes.............................................................................75
8.1. Status Code Ranges.................................................................................................76
8.2. Standard Status Codes.............................................................................................76
8.3. OEM-Reserved Checkpoint Ranges......................................................................... 83
9. Mechanical Information...........................................................................................85
9.1. Board-to-Board Connectors......................................................................................85
9.2. Thermal Solution.......................................................................................................86
9.3. Mounting Methods ....................................................................................................89
9.4. Standoff Types..........................................................................................................90
Safety Instructions...........................................................................................................91
Getting Service.................................................................................................................92

cExpress-KL
Preface v
List of Figures
Figure 1: cExpress-KL Functional Block Diagram....................................................................................7
Figure 1: cExpress-KL Mechanical Drawing ............................................................................................8
Figure 1: cExpress-KL Connector, Switch and LED Locations ............................................................. 29
Figure 1: cExpress-KL and the DB40 Debug Module ........................................................................... 29
Figure 1: cExpress Switch Locations .................................................................................................... 35
Figure 1: COM Express Mounting Methods ..........................................................................................89
Figure 1: COM Express Standoff Types................................................................................................ 90

vi Preface
List of Tables
Table 1: cExpress-KL AB/CD Pin Definitions ...........................................................................................9
Table 1: 40-pin Debug Connector Pin Definition ................................................................................... 30
Table 1: cExpress-KL LED Descriptions ............................................................................................... 31
Table 1: XDP Debug Header Pin Definition .......................................................................................... 32
Table 1: Fan Connector Pin Definition .................................................................................................. 33
Table 1: BIOS Select and Mode Configuration Switch Settings............................................................ 35
Table 1: SEMA Onboard Voltage Monitor ............................................................................................. 38
Table 1: SEMA BMC Status .................................................................................................................. 38
Table 1: SEMA Exception Codes .......................................................................................................... 39
Table 1: SEMA BMC Flags.................................................................................................................... 39

cExpress-KL
Introduction 1
1. Introduction
The cExpress-KL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th
Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly “Kaby Lake U”) with
CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the
7th generation Intel® Core™ and Celeron™ System-on-Chip, the cExpress-KL is specifically designed for
customers who need optimum processing and graphics performance with suitable power consumption using Intel’s
Configurable TDP in a long product life solution. The cExpress-KL’s Intel® processors support Intel® Hyper-
Threading Technology (up to 2 cores, 4 threads) and up to 32 GB of non-ECC DDR4 dual-channel memory at
1866/2133 MHz in dual stacked SODIMM sockets to provide excellent overall performance.
Integrated Intel® Generation 9 Low Power Graphics includes features such as OpenGL 4.4/4.3, DirectX 11.3/11,
Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration
(DXVA2) support for AVC/VC1/MPEG2/HEVC/VP8/JPEG hardware decode and AVC/MPEG2/HEVC/VP8/JPEG
hardware encode. Graphics outputs include dual-channel 18/24-bit LVDS (eDP by build option), two DDI ports
supporting HDMI/DVI/DisplayPort and VGA (by build option, support by project basis). The cExpress-KL is
specifically designed for customers with high-performance processing graphics requirements who want to
outsource the custom core logic of their systems for reduced development time.
The cExpress-KL features a single onboard Gigabit Ethernet port, up to six PCIe Gen3 ports (build option), four
USB 3.0 ports, four USB 2.0 ports, and three SATA 6Gb/s ports. Support is provided for SMBus and I2C. The
module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote
console, CMOS backup, hardware monitor, and watchdog timer.

2 Introduction
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cExpress-KL
Specifications 3
2. Specifications
2.1. Core System
CPU 7th Generation Intel® Core™ and Celeron® processor SoC (formerly “Kaby Lake U”)
•Intel® Core™ i7-7600U 2.8 GHz (3.9 GHz Turbo), 15W (cTDP support) (2C/GT2)
•Intel® Core™ i5-7300U 2.6 GHz (3.5 GHz Turbo), 15W (cTDP support) (2C/GT2)
•Intel® Core™ i3-7100U 2.4 GHz (no Turbo), 15W (cTDP support) (2C/GT2)
•Intel® Celeron® 3965U 2.2 GHz (no Turbo), 15W (cTDP support) (2C/GT1)
Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64
Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel®
AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel®
Secure Key, Intel® TSXNI
Note: Availability of features may vary between processor SKUs.
L3 Cache 4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron®
Memory Dual channel non-ECC 1866/2133 MHz DDR4 memory up to 32 GB in dual SODIMM
socket
BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support (AMT
supported on i7/i5 SKUs only)
Platform Controller Hub Integrated PCH-LP
2.2. Expansion Busses
PCI Express 5x PCI Express x1 Gen3 (AB):
Lanes 0/1/2/3/4, supports x4, x2, x1 configuration
(up to 6x PCI Express x1 Gen3 support by build option, in place of GbE)
Other •LPC bus
•SMBus (system)
•I2C (user)

4 Specifications
2.3. Video
Integrated on Processor Intel® Generation 9 Low Power Graphics core architecture (Intel® HD Graphics 620/610)
GPU Feature Support •3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS/VGA
monitors (eDP & VGA by build option, support by project basis)
•Encode/transcode HD content
•Playback of high definition content including Blu-ray Disc
•Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant with 3D)
•DirectX Video Acceleration (DXVA2) support for accelerated video processing
•AVC/VC1/MPEG2/HEVC/VP8/JPEG HW decode
•AVC/MPEG2/HEVC/VP8/JPEG HW encode
•Advanced Scheduler 2.0, 1.0, XPDM support
•DirectX 11.3, OpenGL 4.4, OpenGL ES 2.0 and OpenCL 2.0
•Multi Display Support: 3 independent displays
Note: Availability of features may vary between processor SKUs.
Display Types •Single/dual channel 18/24-bit LVDS via eDP-to-LVDS chip, supports DE mode and H/V-
Sync mode display. Resolution up to 1920x1200 with dual channel LVDS.
(eDP 4 lanes available as build option in place of LVDS)
•2x Digital Display Ports:
DDI1 supports DisplayPort/HDMI/DVI
DDI2 supports DisplayPort/HDMI/DVI
•VGA (build option) via DP-to-VGA chip. Resolution up to 1920x1200. in place of DDI 2
Note: Supports HDMI 1.4, DP 1.2 and eDP 1.3.
2.4. Audio
Integrated Intel® HD Audio integrated on SoC
Codec Located on carrier Express-BASE6 (ALC886 standard support)
2.5. LAN
Integrated MAC integrated on SoC
Intel PHY Intel® Ethernet Controller I219-LM or I219-V (only LM version support iAMT)
Interface 10/100/1000 Mbit/s connection
2.6. Multi I/O and Storage
I/O Hub Integrated on SoC
USB 4x USB 3.0 ports (USB0,1,2,3) and 4x USB 2.0 ports (USB4,5,6,7)
All USB support by XHCI controller.
SATA 3x SATA 6Gb/s ports, RAID 0/1/5 support
GPIO 4 GPO and 4 GPI, GPI with interrupt