Advantech ROM-5721 User manual

User Manual
ROM-5721
RISC-based SMARC 2.0/2.1
Module with NXP i.MX8 ARM®
Cortex™ A53 Processor

ROM-5721 User Manual
2
Copyright
The documentation and the software included with this product are copyrighted 2020
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. Information provided in this manual is intended to be accurate and reliable. How-
ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-
ments of the rights of third parties, which may result from its use.
Acknowledgements
ARM is trademarks of ARM Corporation.
NXP is trademarks of Qualcomm Corporation.
Microsoft Windows are registered trademarks of Microsoft Corp.
Ubuntu are registered trademarks of Canonical Corp.
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants to you, the original purchaser, that each of its products will be
free from defects in materials and workmanship for two years from the date of pur-
chase.
This warranty does not apply to any products which have been repaired or altered by
persons other than repair personnel authorized by Advantech, or which have been
subject to misuse, abuse, accident or improper installation. Advantech assumes no
liability under the terms of this warranty as a consequence of such events.
Because of Advantech’s high quality-control standards and rigorous testing, most of
our customers never need to use our repair service. If an Advantech product is defec-
tive, it will be repaired or replaced at no charge during the warranty period. For out-
of-warranty repairs, you will be billed according to the cost of replacement materials,
service time and freight. Please consult your dealer for more details.
If you think you have a defective product, follow these steps:
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages you get when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain an RMA (return merchandize
authorization) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a fully-completed Repair and Replacement
Order Card and a photocopy proof of purchase date (such as your sales receipt)
in a shippable container. A product returned without proof of the purchase date is
not eligible for warranty service.
5. Write the RMA number visibly on the outside of the package and ship it prepaid
to your dealer.
Part No. TBD Edition 1
Printed in Taiwan Jan 2020
ii

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ROM-5721 User Manual
Declaration of Conformity
FCC Class B
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installa-
tion. This equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful inter-
ference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interfer-
ence to radio or television reception, which can be determined by turning the equip-
ment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Packing List
Before setting up the system, check that the items listed below are included and in
good condition. If any item does not accord with the table, please contact your dealer
immediately.
1 ROM-5721
4 Screws for ROM-5721
Optional Accessories
Part No. Description
96PSA-A36W12R1 Power Adapter 100-240V 36W 12V
1700001524 Power cord 3P UL 180cm
170203183C Power Code 3P EU 183cm
170203180A Power Cord 3P UK 183cm
1700008921 Power Cord 3P PSE 183cm
1701100300 D-SUB 9P(M) 30cm for COM Port
1700019474 A cable D-SUB 9P for RS232/RS485
9696MEG510E Audio daughter board
9680015491 PCIe to miniPCIe adapter card
iii

ROM-5721 User Manual
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Development Board
Part No. Description
ROM-DB5901 Development carrier board for SMARC 2.0 module
x.
Ordering Information
Model Number Description
Commercial grade
Part No.
ROM-5721CQ-REA1E
ROM-5721CD-RDA1E
CPU
i.MX8M Mini Quad
i.MX8M Mini Dual
Memory
2GB LPDDR4
1GB LPDDR4
eMMC
16GB eMMC
8GB eMMC
MIPI DSI
(Option)
1
HDMI
(Option)
(Option)
LVDS
1
(Option)
PCIe
1
1
USB Host
5
5
USB OTG
1
1
I2S
2
2
GPIO
12
12
Serial
4
4
CAN
1
1
I2C
4
4
SDIO
1
1
Operation
temperature
0~60°C
0~60°C
iV

ROM-5721 User Manual
6
Safety Instructions
1. Read these safety instructions carefully.
2. Keep this User Manual for later reference.
3. Disconnect this equipment from any AC outlet before cleaning. Use a damp cloth. Do not use
liquid or spray detergents for cleaning.
4. For plug-in equipment, the power outlet socket must be located near the equip-ment and must
be easily accessible.
5. Keep this equipment away from humidity.
6. Put this equipmenton a reliable surfaceduring installation.Dropping it or letting it fall may cause
damage.
7. The openings on the enclosure are for air convection. Protect the equipment from
overheating. DO NOT COVER THE OPENINGS.
8. Make sure the voltage of the power source is correct before connecting the equipment to the
power outlet.
9. Position the power cord so that people cannot step on it. Do not place anything over the power
cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipmentis not used for a long time, disconnectit from the power source to avoid damage
by transient overvoltage.
12. Never pour any liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be opened only by
qualified service personnel.
14. If one of the following situations arises, get the equipment checked by service personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment does not work well, or you cannot get it to work according to the user's
manual.
The equipment has been dropped and damaged.
The equipment has obvious signs of breakage.
DISCLAIMER: This set of instructions is given according to IEC 704-1. Advantech disclaims all
responsibility for the accuracy of any statements contained herein.
Safety Precaution - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from damage.
To avoid electrical shock, always disconnect the power from your PC chassis before you work
on it. Don't touch any components on the CPU card or other cards while the PC is on.
Disconnect power before making any configuration changes. The sudden rush of power as you
connect a jumper or install a card may damage sensitive elec- tronic components.
V

7
ROM-5721 User Manual
Contents
Chapter
1
Product Overview................................1
1.1
Introduction ............................................................................................... 2
1.2
Product Features....................................................................................... 3
1.3
Mechanical Specifications ......................................................................... 4
1.4
Electrical Specifications ............................................................................ 4
1.5
Environmental Specifications .................................................................... 4
Chapter
2
H/W Installation....................................5
2.1
2.2
Board Connectors ..................................................................................... 6
2.1.1 Connector List ............................................................................... 6
Board Block Diagram ................................................................................ 8
Figure 2.1 ROM-5721 Block Diagram.......................................... 8
Chapter
3
Software
Functionality ........................9
3.1
Test Tools ............................................................................................... 10
3.1.1 Display Test................................................................................ 10
3.1.2 Audio Test ................................................................................... 12
3.1.3 PCI-e Test ................................................................................... 13
3.1.4 Battery Test................................................................................. 15
3.1.5 RS-232 Test ................................................................................ 15
3.1.6 I2C Test ...................................................................................... 16
3.1.7 USB Test..................................................................................... 17
3.1.8 RTC Test..................................................................................... 18
3.1.9 MMC (eMMC/SD) Test ............................................................... 20
3.1.10 Ethernet Test .............................................................................. 22
3.1.11 CAN Test .................................................................................... 22
3.1.12 GPIO Test ................................................................................... 23
3.1.13 Watchdog Test ............................................................................ 25
3.2 Package Content..................................................................................... 26
3.2.1 Source Code Package ................................................................ 26
3.3 Setting up a Build Environment ............................................................... 29
3.3.1 Conventions ................................................................................ 30
3.3.2 Introducing BSP .......................................................................... 30
3.3.3 Build Instructions......................................................................... 33
3.3.4 Creating boot-up on-board flash from pre-built image ................ 34
3.3.5 Creating boot-up on-board flash from built sdcard image ........... 34
3.4 Customization ......................................................................................... 36
3.4.1 Package addition ........................................................................ 36
3.4.2 Setting up SDK ........................................................................... 36
3.4.3 Setting up cross compiling environment..................................... 36
3.4.4 Building & updating u-boot manually .......................................... 36
3.4.5 Building & updating kernel/modules/dtb manually....................... 36
3.4.6 Replace Kernel &dts……………………………………………….. 38
3.5 System Recovery .................................................................................... 39
3.6 Debug Message ...................................................................................... 39
3.7 Linux Software AP and Testing on ROM-5721 ....................................... 40
3.7.1 “Hello World!”Application and Execution .................................... 40
3.7.2 Watchdog Timer Sample Code.................................................... 41
3.7.3 GPIO Setting................................................................................ 42
3.7.4 RS232 Initial Code ....................................................................... 42
3.7.5 Display Output Setting ................................................................. 43
3.7.6 Network Setup............................................................................. 45
3.7.7 Storage (eMMC/SD Card) ........................................................... 46
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ROM-5721 User Manual
viii
Chapter
4
System Recovery .............................. 48
4.1
System Recovery .................................................................................... 48
Chapter
5
Advantech Services
.......................... 50
5.1
RISC Design-in Services ........................................................................ 50
5.2
Contact Information................................................................................. 54
5.3
Technical Support and Assistance.......................................................... 55

Chapter 1
1 Product Overview
Thischapter briefly
introduces the
ROM-5721 platform.
Sections include:
Introduction
Specification

ROM-5721 User Manual
2
1.1 Introduction
Advantech ROM-5721 SMARC 2.0/2.1 Computer-on-Module is powered by NXP i.MX8M
Mini SOC which includes up to 4 Arm Cortex-A53 cores in combination with one Cortex-M4
real time processor and Vivante GC320 , GC NanoUltra 3D graphics engine. It provides
USB2.0, Gigabit Ethernet, MIPI-CSI, PCI Express, Dual channel LVDS shared with MIPI-DSI for
embedded applications
ROM-5721 is paired with Advantech ROM-DB5901 carrier board for faster end product
peripheral integration and time-to-market. The reference schematics and layout checklists
documentations for carrier board development will be provided along with the open-
sourced Linux BSP, test utilities, hardware design utilities and reference drive
HMI (Human Machine Interface)
Industrial controller
IoT gateway engine
Medical Application
The main features of ROM-5721 as following
NXP i.MX 8M Mini processor with up to 4 Arm Cortex A53 cores
1 x Arm Cortex-M4 cores
Onboard 2GB LPDDR4 memory and eMMC 8GB
1 x Dual channel LVDS; 1 x 4 lane MIPI-CSI
4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1x Gigabit LAN
Support OpenGL ES 2.0/1.1 by hardware accelerators
Low power consumption design
Support Linux, Ubuntu and Android BSP

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ROM-5721 User Manual
Chapter 1
Product Overview
1.2 Product Features
Compatible Module SMARC 2.1
Processor System CPU NXP ARM Cortex-A53 i.MX8M mini 1.8GHz
Technology LPDDR4 1866
Memory
Capacity On-board 2GB/1GB
Flash 8/ GB eMMC
Graphics Engine Vivante GC320, GC NanoUltra 3D GPU
Decoder:,
Graphic
H/W Video Codec H.265, H.264, VP8/9 1080p
Encoder:
H.264, VP8 1080p
Ethernet
HDMI -
Display 1 dual channel 24bits LVDS or 1 x 4-lane
MIPI-DSI or 1 Display Port up to 1080P
Chipset NXP i.MX8M mini integrated RGMII
Speed 1 10/100/1000 Mbps,
Watch Dog Timer Yes
PCIe PCIe x 1
SATA -
USB 4 USB 2.0, 1 USB2.0 OTG
Audio I2S
SDIO 1
I/O
Serial Port 4
CAN -
GPIO 12
I2C 4 I2C
- -
O.S Linux & Android
Power Supply Voltage +5 V
Operation 0 ~ 60° -40~85 C
Environment
Physical
Operating Humidity 5% ~ 95% relative humidity, non-condensing
Characteristics Dimensions (WxD) 82 x 55 mm
Camera Input MIPI CSI 1 MIPI-CSI 4 Lane

ROM-5721 User Manual
4
1.3 Mechanical Specifications
Dimensions: SMARC 2.1 form factor size, 82mm (W) x 50 mm(D)
Height on Top: Under 3.0 mm base on SPEC definition (without heatsink)
Height on Bottom: Under 1.3 mm base on SPEC definition
1.4 Electrical Specifications
Power supply Voltage:
–Voltage requirements: +5 V
Power supply Current:
Model
Kernel idle
Maximum mode
ROM-5721
0.841W
2.173W
Test Condition:
1. Test temperature: room temperature
2. Test voltage: rated voltage AC 110V/60Hz
3. Test loading:
3.1 Maximum load mode: Running programs.
3.2 Idle mode: DUT power management off and no running any program.
4. OS: Linux
5. Test software: cd ../tools/ ./power_run
1.5 Environmental
Specifications
Operating temperature: 0 ~ 60°C / -40 ~85°C
The operating temperature refers to the environmental temperature for the
model.
Operating Humidity: 5% ~ 95% relative humidity, non-condensing
Storage temperature: -40~85°C
Storage Humidity:
–Relative humidity: 95% @ 60°C

Chapter 2
2H/W Installation
This chapter gives mechanical
and connector information on the
ROM-5721 Computer on Module.
Sections include:
Connector Information
Mechanical Drawing

ROM-5721 User Manual
6
2.1 Board Connectors
The board has four connectors that allow you to configure your system to your
appli- cation.
2.2 Pin Out
P-Pin
SMARC 2.0
i.MX8M mini Quad
P1
SMB_ALERT_1V8#
SMB_ALERT_1V8#
P2
GND
P3
CSI1_CK+
MIPI_CSI_CLKP
P4
CSI1_CK-
MIPI_CSI_CLKN
P5
GBE1_SDP
NA
P6
GBE0_SDP
NA
P7
CSI1_RX0+
MIPI_CSI_D0P
P8
CSI1_RX0-
MIPI_CSI_D0N
P9
GND
P10
CSI1_RX1+
MIPI_CSI_D1P
P11
CSI1_RX1-
MIPI_CSI_D1N
P12
GND
P13
CSI1_RX2+
MIPI_CSI_D2P
P14
CSI1_RX2-
MIPI_CSI_D2N
P15
GND
P16
CSI1_RX3+
MIPI_CSI_D3P
P17
CSI1_RX3-
MIPI_CSI_D3N
P18
GND
P19
GBE0_MDI3-
GBE0_MDI3-
P20
GBE0_MDI3+
GBE0_MDI3+
P21
GBE0_LINK100#
GBE0_LINK100#
P22
GBE0_LINK1000#
GBE0_LINK1000#
P23
GBE0_MDI2-
GBE0_MDI2-
P24
GBE0_MDI2+
GBE0_MDI2+
P25
GBE0_LINK_ACT#
GBE0_LINK_ACT#
P26
GBE0_MDI1-
GBE0_MDI1-
P27
GBE0_MDI1+
GBE0_MDI1+
P28
GBE0_CTREF
NA
P29
GBE0_MDI0-
GBE0_MDI0-

P30
GBE0_MDI0+
GBE0_MDI0+
P31
SPI0_CS1#
ECSPI2_SS1#
P32
GND
P33
SDIO_WP
SD2_WP
P34
SDIO_CMD
SD2_CMD
P35
SDIO_CD#
SD2_CD#
P36
SDIO_CK
SD2_CLK
P37
SDIO_PWR_EN
SD2_PWR_EN
P38
GND
P39
SDIO_D0
SD2_DATA0
P40
SDIO_D1
SD2_DATA1
P41
SDIO_D2
SD2_DATA2
P42
SDIO_D3
SD2_DATA3
P43
SPI0_CS0#
ECSPI2_SS0#
P44
SPI0_CK
ECSPI2_SCLK
P45
SPI0_DIN
ECSPI2_MISO
P46
SPI0_DO
ECSPI2_MOSI
P47
GND
P48
SATA_TX+
NA
P49
SATA_TX-
NA
P50
GND
P51
SATA_RX+
NA
P52
SATA_RX-
NA
P53
GND
P54
ESPI_CS0#
ECSPI3_SS0#
P55
ESPI_CS1#
ECSPI3_SS1#
P56
ESPI_CK
ECSPI3_SCLK
P57
ESPI_IO_0
ECSPI3_MOSI
P58
ESPI_IO_1
ECSPI3_MISO
P59
GND
P60
USB0+
USB1_OTG_DP
P61
USB0-
USB1_OTG_DN
P62
USB0_EN_OC#
USB1_OTG_EN_OC#
P63
USB0_VBUS_DET
USB1_OTG_DET
P64
USB0_OTG_ID
USB1_OTG_ID
P65
USB1+
USBDN3_DP
P66
USB1-
USBDN3_DM
P67
USB1_EN_OC#
USB3_EN_OC#
P68
GND
P69
USB2+
USBDN2_DP
P70
USB2-
USBDN2_DM
P71
USB2_EN_OC#
USB2_EN_OC#
P72
RSVD
NA
P73
RSVD
NA
P74
USB3_EN_OC#
USB1_EN_OC#
<Key>
<Key>
P75
PCIE_A_RST#
PCIE_A_RST#
P76
USB4_EN_OC#
USB4_EN_OC#
P77
RSVD
NA
P78
RSVD
NA
P79
GND
P80
PCIE_C_REFCK+
NA
P81
PCIE_C_REFCK-
NA
P82
GND
P83
PCIE_A_REFCK+
PCIE_A_REFCK_P
P84
PCIE_A_REFCK-
PCIE_A_REFCK_N
P85
GND
P86
PCIE_A_RX+
PCIE_RXN_P
P87
PCIE_A_RX-
PCIE_RXN_N
P88
GND
P89
PCIE_A_TX+
PCIE_TXN_P
P90
PCIE_A_TX-
PCIE_TXN_N
P91
GND
P92
HDMI_D2+ / DP1_LANE0+
NA
P93
HDMI_D2- / DP1_LANE0-
NA
P94
GND
P95
HDMI_D1+ / DP1_LANE1+
NA
P96
HDMI_D1- / DP1_LANE1-
NA
P97
GND

ROM-5721 User Manual
8
P98
HDMI_D0+ / DP1_LANE2+
NA
P99
HDMI_D0- / DP1_LANE2-
NA
P100
GND
P101
HDMI_CK+ / DP1_LANE3+
NA
P102
HDMI_CK- / DP1_LANE3-
NA
P103
GND
P104
HDMI_HPD / DP1_HPD
NA
P105
HDMI_CTRL_CK / DP1_AUX+
NA
P106
HDMI_CTRL_DAT / DP1_AUX-
NA
P107
DP1_AUX_SEL
NA
P108
GPIO0 / CAM0_PWR#
GPIO0
P109
GPIO1 / CAM1_PWR#
CAM1_PWR#
P110
GPIO2 / CAM0_RST#
GPIO2
P111
GPIO3 / CAM1_RST#
CAM1_RST#
P112
GPIO4 / HDA_RST#
GPIO4
P113
GPIO5 / PWM_OUT
GPIO5
P114
GPIO6 / TACHIN
GPIO6
P115
GPIO7
GPIO7
P116
GPIO8
GPIO8
P117
GPIO9
GPIO9
P118
GPIO10
GPIO10
P119
GPIO11
GPIO11
P120
GND
P121
I2C_PM_CK
I2C_PM_SCL
P122
I2C_PM_DAT
I2C_PM_SDA
P123
BOOT_SEL0#
BOOT_SEL0#
P124
BOOT_SEL1#
BOOT_SEL1#
P125
BOOT_SEL2#
BOOT_SEL2#
P126
RESET_OUT#
RESET_OUT#
P127
RESET_IN#
RESET_IN#
P128
POWER_BTN#
POWER_BTN#
P129
SER0_TX
UART3_TX
P130
SER0_RX
UART3_RX
P131
SER0_RTS#
UART3_RTS#
P132
SER0_CTS#
UART3_CTS#
P133
GND
P134
SER1_TX
UART4_TX
P135
SER1_RX
UART4_RX
P136
SER2_TX
UART1_TX
P137
SER2_RX
UART1_RX
P138
SER2_RTS#
UART1_RTS#
P139
SER2_CTS#
UART1_CTS#
P140
SER3_TX
UART2_TX
P141
SER3_RX
UART2_RX
P142
GND
P143
CAN0_TX
NA
P144
CAN0_RX
NA
P145
CAN1_TX
NA
P146
CAN1_RX
NA
P147
VDD_IN
+VDD_IN_MXM
P148
VDD_IN
+VDD_IN_MXM
P149
VDD_IN
+VDD_IN_MXM
P150
VDD_IN
+VDD_IN_MXM
P151
VDD_IN
+VDD_IN_MXM
P152
VDD_IN
+VDD_IN_MXM
P153
VDD_IN
+VDD_IN_MXM
P154
VDD_IN
+VDD_IN_MXM
P155
VDD_IN
+VDD_IN_MXM
P156
VDD_IN
+VDD_IN_MXM
S-Pin
SMARC 2.0
i.MX8M mini Quad
S1
CSI1_TX+/I2C_CAM1_CK
I2C_CAM_SCL
S2
CSI1_TX-/I2C_CAM1_DAT
I2C_CAM_SDA
S3
GND
S4
RSVD
NA
S5
CSI0_TX-/I2C_CAM0_CK
NA
S6
CAM_MCK
CAM_MCLK
S7
CSI0_TX+/I2C_CAM0_DAT
NA
S8
CSI0_CK+
NA

S9
CSI0_CK-
NA
S10
GND
S11
CSI0_RX0+
NA
S12
CSI0_RX0-
NA
S13
GND
S14
CSI0_RX1+
NA
S15
CSI0_RX1-
NA
S16
GND
S17
GBE1_MDI0+
NA
S18
GBE1_MDI0-
NA
S19
GBE1_LINK100#
NA
S20
GBE1_MDI1+
NA
S21
GBE1_MDI1-
NA
S22
GBE1_LINK1000#
NA
S23
GBE1_MDI2+
NA
S24
GBE1_MDI2-
NA
S25
GND
S26
GBE1_MDI3+
NA
S27
GBE1_MDI3-
NA
S28
GBE1_CTREF
NA
S29
PCIE_D_TX+
NA
S30
PCIE_D_TX-
NA
S31
GBE1_LINK_ACT#
NA
S32
PCIE_D_RX+
NA
S33
PCIE_D_RX-
NA
S34
GND
S35
USB4+
USBDN4_DP
S36
USB4-
USBDN4_DM
S37
USB3_VBUS_DET
NA
S38
AUDIO_MCK
SAI1_MCLK
S39
I2S0_LRCK
SAI1_LRCK
S40
I2S0_SDOUT
SAI1_SDOUT
S41
I2S0_SDIN
SAI1_SDIN
S42
I2S0_CK
SAI1_CK
S43
ESPI_ALERT0#
NA
S44
ESPI_ALERT1#
NA
S45
RSVD
NA
S46
RSVD
NA
S47
GND
S48
I2C_GP_CK
I2C4_SCL
S49
I2C_GP_DAT
I2C4_SDA
S50
HDA_SYNC / I2S2_LRCK
SAI6_LRCK
S51
HDA_SDO / I2S2_SDOUT
SAI6_SDOUT
S52
HDA_SDI / I2S2_SDIN
SAI6_SDIN
S53
HDA_CK / I2S2_CK
SAI6_CK
S54
SATA_ACT#
NA
S55
USB5_EN_OC#
NA
S56
ESPI_IO_2
NA
S57
ESPI_IO_3
NA
S58
ESPI_RESET#
NA
S59
USB5+
NA
S60
USB5-
NA
S61
GND
S62
USB3_SSTX+
NA
S63
USB3_SSTX-
NA
S64
GND
S65
USB3_SSRX+
NA
S66
USB3_SSRX-
NA
S67
GND
S68
USB3+
USBDN1_DP
S69
USB3-
USBDN1_DM
S70
GND
S71
USB2_SSTX+
NA
S72
USB2_SSTX-
NA
S73
GND
S74
USB2_SSRX+
NA
S75
USB2_SSRX-
NA
<Key>
<Key>
S76
PCIE_B_RST#
NA
S77
PCIE_C_RST#
NA
S78
PCIE_C_RX+
NA
S79
PCIE_C_RX-
NA
S80
GND
S81
PCIE_C_TX+
NA
S82
PCIE_C_TX-
NA
S83
GND

ROM-5721 User Manual
1
0
S84
PCIE_B_REFCK+
NA
S85
PCIE_B_REFCK-
NA
S86
GND
S87
PCIE_B_RX+
NA
S88
PCIE_B_RX-
NA
S89
GND
S90
PCIE_B_TX+
NA
S91
PCIE_B_TX-
NA
S92
GND
S93
DP0_LANE0+
DP0_LANE0P (SELECT)
S94
DP0_LANE0-
DP0_LANE0N (SELECT)
S95
DP0_AUX_SEL
NA
S96
DP0_LANE1+
DP0_LANE1P (SELECT)
S97
DP0_LANE1-
DP0_LANE1N (SELECT)
S98
DP0_HPD
DP0_HPD
S99
DP0_LANE2+
DP0_LANE2P (SELECT)
S100
DP0_LANE2-
DP0_LANE2N (SELECT)
S101
GND
S102
DP0_LANE3+
DP0_LANE3P (SELECT)
S103
DP0_LANE3-
DP0_LANE3N (SELECT)
S104
USB3_OTG_ID
NA
S105
DP0_AUX+
DP0_AUXP (SELECT)
S106
DP0_AUX-
DP0_AUXN (SELECT)
S107
LCD1_BKLT_EN
NA
S108
LVDS1_CK+ / eDP1_AUX+ /
DSI1_CLK+
LVDS1_CLKP ( only dual channel)
S109
LVDS1_CK- / eDP1_AUX- /
DSI1_CLK-
LVDS1_CLKN ( only dual channel)
S110
GND
S111
LVDS1_0+ / eDP1_TX0+ / DSI1_D0+
LVDS1_D0P ( only dual channel)
S112
LVDS1_0- / eDP1_TX0- / DSI1_D0-
LVDS1_D0N ( only dual channel)
S113
eDP1_HPD
NA
S114
LVDS1_1+ / eDP1_TX1+ / DSI1_D1+
LVDS1_D1P ( only dual channel)
S115
LVDS1_1- / eDP1_TX1- / DSI1_D1-
LVDS1_D1N ( only dual channel)
S116
LCD1_VDD_EN
NA
S117
LVDS1_2+ / eDP1_TX2+ / DSI1_D2+
LVDS1_D2P ( only dual channel)
S118
LVDS1_2- / eDP1_TX2- / DSI1_D2-
LVDS1_D2N ( only dual channel)
S119
GND
S120
LVDS1_3+ / eDP1_TX3+ / DSI1_D3+
LVDS1_D3P ( only dual channel)
S121
LVDS1_3- / eDP1_TX3- / DSI1_D3-
LVDS1_D3N ( only dual channel)
S122
LCD1_BKLT_PWM
NA
S123
RSVD
NA
S124
GND
S125
LVDS0_0+ / eDP0_TX0+ / DSI0_D0+
LVDS0_D0P / MIPI_DSI_D0P
S126
LVDS0_0- / eDP0_TX0- / DSI0_D0-
LVDS0_D0N / MIPI_DSI_D0N
S127
LCD0_BKLT_EN
LCD0_BKLT_EN
S128
LVDS0_1+ / eDP0_TX1+ / DSI0_D1+
LVDS0_D1P / MIPI_DSI_D1P
S129
LVDS0_1- / eDP0_TX1- / DSI0_D1-
LVDS0_D1N / MIPI_DSI_D1N
S130
GND
S131
LVDS0_2+ / eDP0_TX2+ / DSI0_D2+
LVDS0_D2P / MIPI_DSI_D2P
S132
LVDS0_2- / eDP0_TX2- / DSI0_D2-
LVDS0_D2N / MIPI_DSI_D2N
S133
LCD0_VDD_EN
LCD0_VDD_EN
S134
LVDS0_CK+ / eDP0_AUX+ /
DSI0_CLK+
LVDS0_CLKP / MIPI_DSI_CLKP
S135
LVDS0_CK- / eDP0_AUX- /
DSI0_CLK-
LVDS0_CLKN / MIPI_DSI_CLKN
S136
GND
S137
LVDS0_3+ / eDP0_TX3+ / DSI0_D3+
LVDS0_D3P / MIPI_DSI_D3P
S138
LVDS0_3- / eDP0_TX3- / DSI0_D3-
LVDS0_D3N / MIPI_DSI_D3N
S139
I2C_LCD_CK
I2C_LCD_SCL
S140
I2C_LCD_DAT
I2C_LCD_SDA
S141
LCD0_BKLT_PWM
LCD0_BKLT_PWM
S142
RSVD
NA
S143
GND
S144
eDP0_HPD
NA
S145
WDT_TIME_OUT#
WDT_TIME_OUT#
S146
PCIE_WAKE#
PCIE_A_WAKE#
S147
VDD_RTC
VDD_RTC
S148
LID#
TBD
S149
SLEEP#
SLEEP#
S150
VIN_PWR_BAD#
VIN_PWR_BAD#
S151
CHARGING#
CHARGING#
S152
CHARGER_PRSNT#
CHARGER_PRSNT#
S153
CARRIER_STBY#
CB_STBY#
S154
CARRIER_PWR_ON
CB_PWR_ON
S155
FORCE_RECOV#
FORCE_RECOV#
S156
BATLOW#
BATLOW#
S157
TEST#
TEST#
S158
GND

Chapter 2
H/W Installation

ROM-5721 User Manual
8
2.2 Board Block Diagram
Below is the block diagram of ROM-5721.
Figure 2.1 ROM-5721 Block Diagram