AMD OPTERON 30925 User manual

Builder’s Guide for
AMD Opteron™
Processor-Based
Servers and Workstations
Publication # 30925 Revision: 3.04
Issue Date: February 2004

© 2003, 2004 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced
Micro Devices, Inc. (“AMD”) products. AMD makes no representations or
warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. No license, whether express,
implied, arising by estoppel, or otherwise, to any intellectual property rights are
granted by this publication. Except as set forth in AMD’s Standard Terms and
Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to its products including, but not limited
to, the implied warranty of merchantability, fitness for a particular purpose, or
infringement of any intellectual property right.
AMD’s products are not designed, intended, authorized or warranted for use as
components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or in any other application in
which the failure of AMD’s product could create a situation where personal
injury, death, or severe property or environmental damage may occur. AMD
reserves the right to discontinue or make changes to its products at any time
without notice.
Trademarks
AMD, the AMD Arrow logo, AMD Athlon, AMD Opteron, and combinations thereof, AMD-8000, AMD-8111,
AMD-8131, and AMD-8151 are trademarks of Advanced Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
Microsoft and Windows are registered trademarks of Microsoft Corporation.
PCI-X is a registered trademark of the PCI-Special Interest Group (PCI-SIG).
Other product names used in this publication are for identification purposes only and may be trademarks of their
respective companies.

30925 Rev. 3.04 February 2004 Builder’s Guide for AMD Opteron™ Processor-
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Contents 3
Contents
Revision History...............................................................................................................................7
Chapter 1 AMD Opteron™ Processor Key Architectural Features.....................................9
1.1 The AMD64 Architecture..................................................................................................9
Chapter 2 Validated Server Program (VSP) .........................................................................11
2.1 Value Proposition ............................................................................................................11
2.2 Design Methodology for the VSP Platform.....................................................................11
2.3 Platform Description........................................................................................................12
2.3.1 Model A2210 1U/2P—Based on the AMD Opteron™ 200-Series Processor ........12
2.3.2 4U/4P Model A8440—Based on the AMD Opteron 800-Series Processor ............13
2.4 Not Yet a Member of VSP?.............................................................................................15
Chapter 3 AMD Opteron™ Processor-In-a-Box ..................................................................17
Chapter 4 Heatsink Installation..............................................................................................19
4.1 Heatsink Installation Procedure .......................................................................................19
Chapter 5 Hardware Considerations .....................................................................................29
5.1 System Enclosures and Chassis Selection .......................................................................29
5.1.1 Basic System Enclosure Selection Guidelines.........................................................29
5.1.2 Basic Chassis Selection Guidelines .........................................................................29
5.1.3 Power Supply Considerations..................................................................................30
5.2 Power Supply Guidelines.................................................................................................31
5.2.1 Server and Workstation Platform Power Supplies...................................................31
5.2.2 Calculating System Power Consumption.................................................................32
5.3 Thermal Solution .............................................................................................................34
5.3.1 AMD Opteron™ Processor Thermal Solution Guidelines ......................................34
5.3.2 Thermally Tested Populated Chassis Server Solutions for AMD Opteron
Processor..................................................................................................................34
5.4 Memory Guidelines for AMD Opteron Processor-Based Systems .................................35
5.5 AMD Opteron Processor Information .............................................................................35
5.6 AMD Chipset Information...............................................................................................37

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4 Contents
5.6.1 AMD-8000™ Series Chipset .................................................................................. 37
5.6.2 Graphics and Storage .............................................................................................. 38
5.7 AMD Opteron Processor Utilities and Updates .............................................................. 39
5.8 AMD-8000 Series Chipset Drivers ................................................................................. 39
Chapter 6 EMI Reduction Techniques.................................................................................. 43
6.1 EMI Emission Standards................................................................................................. 43
6.2 AMD Opteron Processor-Based System Builder EMI Reduction Techniques............... 43
Appendix A AMD Opteron™ Processor-Based System Build Procedure ........................... 47
Appendix B FAQs....................................................................................................................... 51
B.1 AMD Opteron™ Processor FAQs .................................................................................. 51
B.2 Validated Server Program FAQs..................................................................................... 53

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List of Figures 5
List of Figures
Figure 1. AMD Opteron™ Processor Architecture ...........................................................................9
Figure 2. Model A2210 1U/2P Rack Server....................................................................................13
Figure 3. Model A8440 4U/4P Rack Server....................................................................................14
Figure 4. AMD64 Processor-in-a-Box.............................................................................................17
Figure 5. Retention Frame and Backplate for the AMD Opteron Processor Heatsink....................19
Figure 6. Backplate Release Liner ...................................................................................................20
Figure 7. Motherboard Placed Over Backplate................................................................................20
Figure 8. Ensure Proper Contact Between Backplate and Motherboard .........................................21
Figure 9. Retention Frame Screw Holes Aligned with Backplate Standoffs...................................21
Figure 10. Tightening Down the Retention Frame ..........................................................................22
Figure 11. Alignment Markers on Processor and Motherboard ......................................................22
Figure 12. Pushing Gently Down on the Processor .........................................................................23
Figure 13. Plastic Cover Over Thermal Interface Material .............................................................23
Figure 14. Heatsink Centered Over Processor.................................................................................24
Figure 15. Heatsink Spring Clip ......................................................................................................24
Figure 16. Pushing Straight Down on the Clip................................................................................25
Figure 17. Correctly Installed Spring Clip.......................................................................................25
Figure 18. Turning the Cam Lever ..................................................................................................26
Figure 19. Cam Lever Locked into Retention Frame ......................................................................26
Figure 20. Installed Heatsink ...........................................................................................................27
Figure 21. Desirable Airflow—Power Supply with Bottom Inlet ...................................................30
Figure 22. Undesirable Airflow—Power Supply with Front Inlet Only .........................................31

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30925 Rev. 3.04 February 2004
6 List of Tables
List of Tables
Table 1. Power Worksheet 1—Component Power ......................................................................... 32
Table 2. Power Worksheet 2—Total Watts..................................................................................... 33
Table 3. AMD Opteron™ Processor Series and Model Numbers .................................................. 36
Table 4. Microsoft®Drivers for the AMD-8000™ Series of Chipset Components ....................... 39
Table 5. Linux Drivers for the AMD-8000 Series of Chipset Components ................................... 41

30925 Rev. 3.04 February 2004 Builder’s Guide for AMD Opteron™ Processor-
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Revision History 7
Revision History
Date Revision Description
February 2004 3.04 Revised public release. Added EMEA contact information.
December 2003 3.00 Initial public release.

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30925 Rev. 3.04 February 2004 Builder’s Guide for AMD Opteron™ Processor-
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Chapter 1 AMD Opteron™ Processor Key Architectural Features 9
Chapter 1 AMD Opteron™ Processor Key
Architectural Features
The key architectural features of an AMD Opteron™ processor-based system include AMD64
architecture, integrated DDR DRAM memory controller, HyperTransport™ technology, and many
other features.
Figure 1 shows a block diagram of the AMD Opteron processor architecture.
Figure 1. AMD Opteron™ Processor Architecture
1.1 The AMD64 Architecture
AMD64 architecture allows end users to run existing, installed 32-bit applications and operating
systems at peak performance, while providing a migration path that is 64-bit capable. It is
designed to enable 64-bit computing while remaining compatible with the vast x86 software
infrastructure. AMD64 architecture represents a new class of computing, enabling a single
architecture across 32- and 64-bit environments.

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10 AMD Opteron™ Processor Key Architectural Features Chapter 1
Integrated DDR DRAM Memory Controller
The 128-bit wide integrated DDR DRAM memory controller:
•changes the way the processor accesses main memory, resulting in increased bandwidth,
reduced memory latencies, and increased processor performance.
•allows available memory bandwidth to scale with the number of processors.
•can support up to eight registered DDR DIMMs per processor.
•has available memory bandwidth of up to 5.3 Gbytes/s (with PC2700) per processor.
HyperTransport™ Technology
The HyperTransport technology of the AMD64 architecture offers the following features:
•A scalable bandwidth interconnection between processors, I/O subsystems, and other chipsets
•Support for up to three coherent HyperTransport links, providing up to 19.2 Gbytes/s of peak
bandwidth per processor
•Up to 6.4 Gbytes/s bandwidth per link providing sufficient bandwidth for supporting new
interconnects including PCI-X, DDR, InfiniBand, and 10G Ethernet
•Low power consumption (1.2 W) to help reduce the system thermal budget
Other Features of the AMD Opteron™ Processor
Other features of the AMD Opteron processor include:
•64-bit wide key data and address paths that incorporate a 48-bit virtual address space and a
40-bit physical address space
•ECC (error correcting code) protection for L1 cache data, L2 cache data and tags, and DRAM
with hardware scrubbing of all ECC-protected arrays
•Lower thermal output levels and improved frequency scaling through .13 micron SOI (silicon-
on-insulator) process technology
•Support for all instructions necessary to be fully compatible with SSE2 technology
•Two additional pipeline stages (compared to AMD’s 32-bit architecture) for increased
performance and frequency scalability
•Higher IPC (instructions-per-clock) achieved through additional key features, such as larger
TLBs (translation lookaside buffer), flush filters, and enhanced branch prediction algorithms

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Chapter 2 Validated Server Program (VSP) 11
Chapter 2 Validated Server Program (VSP)
For those System Builders, VARs and Integrators that prefer a pre-built system, the Validated
Server Program (VSP) is designed to enable rapid introduction of AMD Opteron™ processor-
based servers. AMD has joined forces with Celestica, one of the world’s leading electronics
manufacturing services (EMS) providers, to bring you the VSP. Building on tested, stable, and
reliable VSP solutions available from Celestica, your organization can:
•Gain leverage in a highly competitive market
•Streamline the development cycle and simplify your business
•Speed time-to-market
•Build revenue through value-added products and services
•Focus on customer service and other core competencies
•Boost customer satisfaction with Celestica’s end-to-end service and support
2.1 Value Proposition
VSP platforms are designed to take advantage of the performance of AMD Opteron processors,
HyperTransport™ technology links, and the AMD-8000™ series of chipsets. All of Celestica’s
server platforms are defined with reliability, availability, and serviceability as key objectives. This
attention to detail provides servers that can be relied on for mission critical applications.
2.2 Design Methodology for the VSP Platform
The design methodology for the VSP platform includes:
•Hot plug testing with multiple operating systems
•Peripheral compatibility testing with more than 100 cards, drives, and multiple operating
systems
•Worst-case power consumption analysis (including PCI-X®peripherals and drives)
•Thermal analysis of components
•Accelerated life test (used to determine MTBF figures)
•Full Flotherm analysis using the latest software modeling tools to confirm sufficient airflow in
the design
•Signal analysis on all high-speed bus and critical signal traces
•Acoustic testing
•Shock, vibration, and drop testing

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12 Validated Server Program (VSP) Chapter 2
In addition to the rigorous design and test methodologies, Celestica provides an Engineering
Change Notice (ECN) procedure to give advanced warning of any modifications in hardware or
firmware along with an explanation of the severity and cause. These ECNs are designed to allow
you to proactively solve potential issues with your customers and provide orderly transitions to
new revisions of the platforms.
Celestica offers comprehensive phone and web-based support for all VSP platforms. A
knowledgebase is available for common issues while a trained staff of technicians and engineers
handles more difficult situations. All issues are tracked with trouble tickets to help ensure a
prompt response.
2.3 Platform Description
VSP includes two product lines—one for 2-way multiprocessing and one for 4-way
multiprocessing. Both product lines are available in bare-bones and fully-configured options. Both
product lines feature AMD Opteron processors with AMD64 architecture, enabling end-users to
leverage their current base of 32-bit applications and migrate to 64-bit applications when ready. In
addition, each platform offers high-bandwidth I/O for increased flexibility and expandability,
along with an integrated QLogic baseboard management controller (BMC) for streamlined
management, IPMI v1.5-compliance, and remote management capabilities.
2.3.1 Model A2210 1U/2P—Based on the AMD Opteron™ 200-Series
Processor
This rack-optimized 1U platform is ideal for print/file server applications, Internet/network-edge
devices, dedicated web servers, and high performance cluster nodes. Figure 2 on page 13 shows a
1U/2P rack-optimized server based on the AMD Opteron 200-series processor.

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Chapter 2 Validated Server Program (VSP) 13
Figure 2. Model A2210 1U/2P Rack Server
Key features of this platform include:
•Up to two AMD Opteron 200-series processors
•AMD64 architecture
•Up to 16 GBytes of DDR ECC registered memory (4 DIMMs per processor)
•One PCI-X 64-bit/133MHz or two PCI-X 64-bit/100 full length slots
•Up to two fixed IDE or two hot-swappable SCSI Ultra320 hard drives
•Slimline DVD-ROM or optional floppy disk drive
•Dual Broadcom 10/100/1000 Ethernet onboard
•500-W power supply
•Integrated QLogic baseboard management controller (BMC); IPMI v1.5-compliant
2.3.2 4U/4P Model A8440—Based on the AMD Opteron™ 800-Series
Processor
The VSP 4-way multiprocessor solution is designed to deliver incredible performance for
enterprise-level computing including—database, Internet infrastructure, data center environments,
CAD/CAM, high performance cluster nodes, and scientific applications.

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14 Validated Server Program (VSP) Chapter 2
Figure 3 shows a 4U/4P server, based on the AMD Opteron 800-series processor.
Figure 3. Model A8440 4U/4P Rack Server
Key features of this platform include:
•Up to four AMD Opteron 800-series processors
•AMD64 architecture
•Up to 32 Gbytes of DDR memory (4 DIMMs per processor)
•Two PCI-X 64-bit/133-MHz hot-swappable slots
•Three 64-bit/66-MHz slots
•Two LSI Logic SCSI Ultra 320 channels—one internal and one external
•Four 1” hot-swap SCSI drive bays with U320 SCSI-capable SAF-TE backplane
•Slimline DVD-ROM and floppy drive
•Dual Broadcom 10/100/1000 Ethernet onboard
•Up to three hot-swap 500-W power supplies with 2+1 redundancy
•Integrated QLogic BMC management controller; IPMI v1.5-compliant

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Chapter 2 Validated Server Program (VSP) 15
2.4 Not Yet a Member of VSP?
For more information, register as a member, and find out how to order VSP products, please visit
http://www.amd.com/vsp7 or contact us by email at [email protected]. In Europe, the Middle East,
and Africa (EMEA), please visit www.amd.com/vsp.

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Chapter 3 AMD Opteron™ Processor-In-a-Box 17
Chapter 3 AMD Opteron™
Processor-In-a-Box
The best solution for System Builders and Resellers manufacturing pedestal platforms is the
processor-in-a-box (PIB) from AMD. The PIB is available now in a new retail box. The improved
display options allow the product to be either free-standing, stacked, or hung. The boxed processor
package is heat-sealed to alleviate lid tampering and to help ensure the authenticity of the AMD
processor. The AMD PIB is covered by a three-year limited warranty.
Figure 4 shows the new PIB retail box.
Figure 4. AMD64 Processor-in-a-Box
The PIB includes the following items:
•The AMD64 processor of choice
•Heatsink and fan, properly sized for the thermal requirements of the processor
•Assembly and installation instructions
•AMD64 processor case sticker
•Double processor packaging allows higher impact resistance adding more protection
•A three-year limited warranty
•Certificate of Authenticity
Check with your preferred distribution partner for AMD Opteron™ processor in a box or buy
online at: https://aac.avnet.com/AMDstore/index.jsp. In EMEA, please check with your preferred
distribution partner for AMD Opteron™ processor-in-a-box.

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18 AMD Opteron™ Processor-In-a-Box Chapter 3

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Chapter 4 Heatsink Installation 19
Chapter 4 Heatsink Installation
This chapter contains instructions for the installation of the AMD Opteron™ processor heatsink.
The AMD Opteron processor heatsink requires the retention frame and the backplate to be
attached to the motherboard. If the retention frame and backplate are already attached to the
motherboard, proceed to step 10. Figure 5 shows the backplate and retention frame for the
AMD Opteron processor heatsink. The heatsink assembly shown in Figure 5 may not exactly
match the one provided in a PIB.
Figure 5. Retention Frame and Backplate for the AMD Opteron™ Processor Heatsink
4.1 Heatsink Installation Procedure
Follow the instructions to install the AMD Opteron processor heatsink.
CAUTION: As with all computer equipment, the processor and motherboard components may be
damaged by electrostatic discharge (ESD). Please take proper ESD precautions
when handling any board.
Warning: Do not apply voltage until the heatsink is fully installed. If voltage is applied before
the heatsink is fully installed, the processor will overheat and failure will result.
Read through the entire installation instructions completely to make sure you
understand them before you begin.
1. Place the backplate on a flat surface.
2. Peel the release liner off the backplate. (See Figure 6 on page 20.)

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20 Heatsink Installation
Chapter 4
Figure 6. Backplate Release Liner
3. Gently lift the motherboard by the edges over the backplate.
4. Align the two threaded standoffs on the backplate with the two mounting holes near the socket
on the motherboard. (See Figure 7.)
Figure 7. Motherboard Placed Over Backplate
5. Gently lower the motherboard until the standoffs fit through the holes near the socket and the
backplate makes complete contact with the motherboard.
6. Press firmly on the socket to ensure proper contact between the backplate and motherboard.
(See Figure 8 on page 21.)