AXIOMTEK CEM860 User manual

4 9418D860000E
©Copyright 2011 Axiomtek Co., Ltd.
Version A1 November 2011
Printed in Taiwan
Quick Start
The basic procedures required to power on CEM860:
(1). Require DC +12V power at minimum 4.5A. Make sure the power is
OFF before connecting the CEM860.
(2). Check to ensure the onboard switch SW1 is set to default (OFF
position).
(3). Firmly install DDR3 memory module(s) into connector(s) SDIMM1(and
SDIMM2) until fully seated.
(4). Attach heatspreader to the CEM860, refer to section Installing
Heatspreader.
(5). Install the CEM860 onto COM ExpressTM baseboard, for example,
CEB94006 baseboard.
(6). Properly install all necessary peripheral devices such as hard disk,
monitor, keyboard and etc. to the baseboard.
(7). Firmly attach power supply to the baseboard’s power connector.
(8). Turn on the system power.
CEM860 Quick Installation Guide
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©Copyright 2011 Axiomtek Co., Ltd.
Version A1 November 2011
Printed in Taiwan
Checklist
9CEM860 Board x1 9Product Information CD x1
9Quick Installation Guide x1
Note: Please contact your local vendors if any damaged or missing items. DO
NOT apply power to the board if there is any damaged component.
Please refer to the product information CD for the complete user’s
manual, drivers and utilities. User’s manual and related documents are
in Acrobat PDF format.
Board Layout
Top Side
CEM860 2nd Generation Intel®CoreTM Processor COM ExpressTM Type 6 Basic Module

2 9418D860000E
©Copyright 2011 Axiomtek Co., Ltd.
Version A1 November 2011
Printed in Taiwan
Bottom Side
Connectors
Switch Setting
SW1
Connector Description
SDIMM1 DDR3 SO-DIMM
Connector
SDIMM2 DDR3 SO-DIMM
Connector
SS3 COM ExpressTM Connector
SS4 COM ExpressTM Connector
Description Setting
Disable auto power on
(Default) OFF position
Enable auto power on ON position
SS3
SS4
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©Copyright 2011 Axiomtek Co., Ltd.
Version A1 November 2011
Printed in Taiwan
Installing Heatspreader
1. There is a protective plastic covering on the thermal pads. This must be
removed before the heatspreader can be mounted.
2. Each heatspreader is designed for a specific CEM module. The thermal
pads on the heatspreader are designed to make contact with the
necessary components on the CEM module. When mounting the
heatspreader you must make sure that the thermal pads on the
heatspreader make complete contact (no space between thermal pad
and component) with the corresponding components on the CEM
module. This is especially critical for CEM modules that have higher
CPU speeds (for example 1.0GHz or more) to ensure that the
heatspreader acts as a proper thermal interface for cooling solutions.
3. This CPU module has five assembly holes for installing heat spreader
plate. Use the five screws (M2.5x15L) to secure the heat spreader plate
to the CEM860. Be careful not to over-tighten the screws.
4. If you need additional information for thermal solution, please refer to
below image to design your system’s cooling.