Huawei U8815 User manual

U8815

Maintenance Manual

Issue

1.0

Date

2012-02-13

HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

No part of this document may be reproduced or transmitted in any form or by any means without prior

written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and

the customer. All or part of the products, services and features described in this document may not be

within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,

information, and recommendations in this document are provided "AS IS" without warranties, guarantees or

representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address:

Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website:

http://www.huawei.com

Email:

[email protected]

U8815

Maintenance Manual

About This Document

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

About This Document

Purpose

Prepared by

R&D personnel

Date

2012-02-20

Reviewed by

Maintenance support team

Date

2012-02-23

Approved by

Service representative

Date

2012-02-23

Change History

Date

Version

Change Reason

Section

Description

Author

2012-02-23

V1.0

Released the first draft.

R&D personnel

U8815

Maintenance Manual

Contents

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

iii

Contents

1 Product Introduction ....................................................................................................................1

1.1 Appearance.......................................................................................................................................................1

1.2 Features............................................................................................................................................................1

2 Maintenance Instructions............................................................................................................3

2.1 Applicable Scope..............................................................................................................................................3

2.2 Precautions.......................................................................................................................................................3

2.3 Obtaining Product and Maintenance Information ............................................................................................3

3 Exploded View...............................................................................................................................4

4 PCBA Components .......................................................................................................................6

5 Software Upgrade .........................................................................................................................9

5.1 Upgrade Preparation.........................................................................................................................................9

5.2 Upgrade Process...............................................................................................................................................9

6 Maintenance Tools......................................................................................................................11

7 Disassembly Procedure..............................................................................................................13

8 Assembly Procedure...................................................................................................................17

9 Principles and Failure Analysis ...............................................................................................20

9.1 Block Diagram and Handset Introduction......................................................................................................20

9.2 Baseband Unit................................................................................................................................................21

9.2.1 Power-on Management Circuits............................................................................................................21

9.2.2 Charging Management Circuits ............................................................................................................26

9.2.3 Clock Circuit.........................................................................................................................................30

9.2.4 Flash Memory Circuit...........................................................................................................................32

9.3 RF Unit...........................................................................................................................................................37

9.3.2 Power Amplifier....................................................................................................................................38

9.3.3 Troubleshooting ....................................................................................................................................40

9.4 Peripheral Circuits..........................................................................................................................................44

9.4.1 Display Screen ......................................................................................................................................44

9.4.2 Vibration ...............................................................................................................................................48

9.4.3 Call Reception.......................................................................................................................................49

9.4.4 Call Transmission..................................................................................................................................53

U8815

Maintenance Manual

Contents

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

9.4.5 Headset..................................................................................................................................................57

9.4.6 SIM Card...............................................................................................................................................59

9.4.7 I/O Connector........................................................................................................................................60

9.4.8 microSD Card Connector......................................................................................................................61

9.4.9 FM.........................................................................................................................................................63

10 Solder Points on the PCB and BGA Chip.............................................................................66

11 Performance Test.......................................................................................................................69

11.1 Keys..............................................................................................................................................................69

11.2 MMI Test......................................................................................................................................................70

11.3 Voice Call Test..............................................................................................................................................71

U8815

Maintenance Manual

Figures

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Figures

Figure 1-1 Appearance of the U8815 handset .......................................................................................................1

Figure 3-1 Exploded view diagram.......................................................................................................................4

Figure 4-1 PCBA components diagram 1..............................................................................................................6

Figure 4-2 PCBA components diagram 2..............................................................................................................7

Figure 4-3 PCBA components diagram 3..............................................................................................................8

Figure 4-4 PCBA components diagram 4..............................................................................................................8

Figure 5-1 Upgrade process diagram...................................................................................................................10

The following figures show the procedures. ........................................................................................................13

Figure 9-1 Block diagram....................................................................................................................................20

Figure 9-2 Power-on management circuit diagram .............................................................................................21

Figure 9-3 Troubleshooting process for no current .............................................................................................24

Figure 9-4 Troubleshooting process for weak current.........................................................................................25

Figure 9-5 Troubleshooting process for high current ..........................................................................................26

Figure 9-6 Charging management circuit diagram 1...........................................................................................27

Figure 9-7 Charging management circuit diagram 2...........................................................................................27

Figure 9-8 Charging management circuit diagram 3...........................................................................................27

Figure 9-9 Charging management circuit diagram 4...........................................................................................28

Figure 9-10 Troubleshooting process for charging failures.................................................................................29

Figure 9-11 19.2 MHz circuit block diagram 1 ...................................................................................................30

Figure 9-12 19.2 MHz circuit block diagram 2 ...................................................................................................31

Figure 9-13 32.768 kHz circuit block diagram 1.................................................................................................31

Figure 9-14 Analysis of clock circuit ..................................................................................................................31

Figure 9-15 Flash memory circuit diagram 1 ......................................................................................................33

Figure 9-16 Flash memory circuit diagram 2 ......................................................................................................33

Figure 9-17 Flash memory circuit diagram 3 ......................................................................................................34

Figure 9-18 Flash memory circuit diagram 4 ......................................................................................................35

U8815

Maintenance Manual

Figures

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Figure 9-19 Analysis of the U8815 memory interface ........................................................................................36

Figure 9-20 Transmitting and receiving circuit block diagram ...........................................................................37

Figure 9-21 WCDMA IMT PAdiagram..............................................................................................................38

Figure 9-22 WCDMA 850 PA diagram ...............................................................................................................39

Figure 9-23 WCDMA PCS PA diagram ..............................................................................................................39

Figure 9-24 GSM Quad_band_PAdiagram.........................................................................................................39

Figure 9-25 UMTS IMT RX INTERSTAGE CHAIN diagram...........................................................................40

Figure 9-26 Diagram of dualband RF transmitting and receiving by using RTR6285A chip .............................40

Figure 9-27 Troubleshooting process for receiving failure .................................................................................41

Figure 9-28 Troubleshooting process for transmission failure ............................................................................43

Figure 9-29 Display screen circuit diagram 1......................................................................................................45

Figure 9-30 Display screen circuit diagram 2......................................................................................................45

Figure 9-31 Display screen circuit diagram 3......................................................................................................46

Figure 9-32 Troubleshooting process for no LCD display ..................................................................................47

Figure 9-33 Motor circuit diagram......................................................................................................................48

Figure 9-34 Vibration maintenance process ........................................................................................................49

Figure 9-35 Call reception circuit diagram 1.......................................................................................................50

Figure 9-36 Call reception circuit diagram 2.......................................................................................................50

Figure 9-37 Call reception circuit diagram 3.......................................................................................................50

Figure 9-38 Call reception circuit diagram 4.......................................................................................................51

Figure 9-39 7227A audio processing diagram.....................................................................................................51

Figure 9-40 Troubleshooting process for sound failure.......................................................................................53

Figure 9-41 Primary handset microphone circuit diagram ..................................................................................54

Figure 9-42 Secondary handset microphone circuit diagram ..............................................................................55

Figure 9-43 Troubleshooting process for sound failure.......................................................................................56

Figure 9-44 Headset circuit block diagram .........................................................................................................57

Figure 9-45 Troubleshooting process for no sound from the headset failure ......................................................58

Figure 9-46 SIM card circuit diagram.................................................................................................................59

Figure 9-47 Troubleshooting process for the UIM card detection failure ...........................................................60

Figure 9-48 I/O connector circuit diagram..........................................................................................................61

Figure 9-49 microSD card connector circuit diagram .........................................................................................62

Figure 9-50 Troubleshooting process for micorSD card read failure ..................................................................63

Figure 9-51 FM circuit diagram 1 .......................................................................................................................63

U8815

Maintenance Manual

Figures

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

vii

Figure 9-52 FM circuit diagram 2 .......................................................................................................................64

Figure 9-53 FM circuit diagram 3 .......................................................................................................................64

Figure 9-54 Troubleshooting process for FM radio failure .................................................................................65

Figure 10-1 Diagram 1 of the solder points on the PCB and BGA chip .............................................................66

Figure 10-2 Diagram 2 of the solder points on the PCB and BGA chip .............................................................67

Figure 10-3 Diagram 3 of the solder points on the PCB and BGA chip .............................................................67

Figure 10-4 Diagram 4 of the solder points on the PCB and BGA chip .............................................................68

Figure 11-1 U8815 handset key...........................................................................................................................69

U8815

Maintenance Manual

Tables

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

viii

Tables

Table 1-1 Description of the features.....................................................................................................................1

Table 3-1 List of components in the exploded view ..............................................................................................4

Table 5-1 Upgrade preparation ..............................................................................................................................9

Table 6-1 List of maintenance tools..................................................................................................................... 11

Table 9-1 List of voltages converted from VHP_PWR by PM8029 power management chip............................23

Table 9-2 Description of the signals in the circuit diagram in this section ..........................................................30

Table 9-3 Description of the signals in the circuit diagram in this section ..........................................................32

Table 9-4 Description of the signals in the circuit diagram in this section ..........................................................36

Table 9-5 Logic table of the RF switch................................................................................................................38

Table 9-6 Truths for control signals.....................................................................................................................42

Table 9-7 Description of the signals in the circuit diagram in this section ..........................................................43

Table 9-8 Description of the signals in the circuit diagram in this section ..........................................................47

Table 9-9 Description of the signals in the circuit diagram in this section ..........................................................49

Table 9-10 Audio output......................................................................................................................................52

Table 9-11 Description of the signals in the circuit diagram in this section ........................................................56

Table 9-12 Description of the signals in the circuit diagram in this section ........................................................58

Table 9-13 Description of the signals in the circuit diagram in this section ........................................................60

Table 9-14 Description of the signals in the circuit diagram in this section ........................................................61

Table 9-15 Description of the signals in the circuit diagram in this section ........................................................65

U8815

Maintenance Manual

1 Product Introduction

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

1 Product Introduction

1.1 Appearance

Figure 1-1 shows the appearance of the U8815 handset.

Figure 1-1 Appearance of the U8815 handset

1.2 Features

Table 1-1 describes the features of the U8815 handset.

Table 1-1 Description of the features

Item

Description

Dimensions (W x D x H)

122.5 mm x 63 mm x 10.5 mm

Technical standard

Wideband Code Division Multiple Access

U8815

Maintenance Manual

1 Product Introduction

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Item

Description

(WCDMA)

Band

Global System for Mobile Communications

(GSM)/General Packet Radio Service (GPRS)

/Enhanced Data Rate for GSM Evolution (EDGE)

850/1800/900/1900

WCDMA 2100/900

Weight

About 140 g (including battery)

Appearance

QWERTY bar-type

Antenna

Built-in

Charger

5 V, 1 A

Flash

4 GB embedded multimediacard (EMMC), 4 GB

Low Power Double Data Rate (LPDDR)

Camera

5 MP AF Camera

Bluetooth

BCM4330, supporting BT2.1 and enhanced data

rate (EDR)

Wi-Fi

BCM4330, supporting 802.11b/g/n

Battery

Li-ion battery

1,350 mA/h

Display

Resolution

800 x 480 pixels

Type

ThinFilmTransistor (TFT)

Color

16.7 M

Size

4.0 inch

Connector

Charger port

Micro-USB connector

USB port

Micro-USB connector

microSD card port

Headset jack

3.5 mm headset jack

Temperature

Operating temperature: –10°C to +55°C

Storage temperature: –40°C to +70°C

Humidity

Operating humidity: 5% to 95% RH

U8815

Maintenance Manual

2 Maintenance Instructions

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

2 Maintenance Instructions

2.1 Applicable Scope

This document provides maintenance instructions for the technicians at service sites

authorized by Huawei. This document is Huawei proprietary and is accessible only for

authorized service centers and companies.Although every effort was made to ensure the

accuracy of the document, errors may still exist. If you find any mistake or have any

suggestion, contact Huawei's customer service.

2.2 Precautions

Maintenance and calibration operations are performed only by qualified technicians.

All repair and maintenance operations are performed in antistatic rooms with ESD wrist

straps correctly worn.

Ensure that all components, nuts, and insulators are installed after maintenance or

calibration. In addition, ensure that all cables and wires are properly installed.

Soldering is lead-free and compliant with environmental protection requirements.

2.3 Obtaining Product and Maintenance Information

For relevant product and repair information, please refer to the Huawei website.

Website: http://www.huaweidevice.com/cn/technicaIndex.do

U8815

Maintenance Manual

3 Exploded View

Issue 1.0 (2012-02-13)

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3 Exploded View

Figure 3-1 shows the exploded view.

Figure 3-1 Exploded view diagram

The components listed in the following table are structural parts of the phone, and cannot be used as

reference when requesting spare parts.

Table 3-1 lists components in the exploded view.

Table 3-1 List of components in the exploded view

No.

Description

Quantity

Touch panel

Front housing (housing A)

Liquid crystal display (LCD) display

Steel holder

Printed circuit board +assembly (PCBA)

Rear housing (housing B)

U8815

Maintenance Manual

3 Exploded View

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

No.

Description

Quantity

Decorating parts of housing B

Battery

Battery cover

Shielding frame for PA

Shielding frame for central processing unit

(CPU)

Main board printed circuit board (PCB)

Shielding frame for radio transceiver (RTR)

Shielding frame for power management (PM)

U8815

Maintenance Manual

4 PCBA Components

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

4 PCBA Components

The following figures show the PCBA components.

Figure 4-1 PCBAcomponents diagram 1

Failure caused by damage to

the J1001 headset connector:

handset function failure

Failure caused by

damage to the

U3202 RF switch:

signal failure

Failure caused by

damage to the

U3401 RF gain

module 824–849

MHz: signal failure

Failures caused by

damage to the U6011

BCM4330: FM, BT,

and Wi-Fi functions

cannot be used.

Failure caused by

damage to the

U3101 19.2 MHz

crystal oscillators:

power-on failure

Failures caused by

damage to the U1700

Flash: power-on failure

and software failure

Failures caused by damage to

the U401 baseband chip and

CPU: power-on failure,

breakdown, and RF failure

Failure caused by

damage to the U3501

power module: GSM

transmission failure

Failures caused by

damage to the

U4202RF power

module 1850–1910

MHz: no signal,

weak signal, and

registration failure

Failure caused by

damage to the

U3302 RF gain

module 1920–1980

MHz: signal failure

Failure caused by

damage to the

springs of the

J1026, J1205,

and J1204

volume keys:

volume key failure

Failure caused by

damage to the

U1402 compass:

direction

orientation failure

Failure caused by

damage to the

U1401 acceleration

meter: gravity

induction failure

U8815

Maintenance Manual

4 PCBA Components

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Figure 4-2 PCBAcomponents diagram 2

Failure caused by

damage to the

spring of the J4101

GPS antenna: GPS

function failure

Failures caused by

damage to the

U4101RF low noise

amplifier GPS

function failure

Failures caused by

damage to the J1102

BTB connector–

FEMALE–24: failures of

proximity light, speaker,

and power key

Failure caused by

damage to the J1201

BTB connector–

FEMALE –10: touch

panel failure

Failure caused by

damage to the J1902

BTB connector–24

(J1902): camera

failure

Failure caused by

damage to the J1201

BTB connector–

FEMALE–24 (J1201):

LCD display failure

Failures caused by

damage to the

antenna springs of the

J4101BT and WIFI:

failures of BT and Wi-

Fi functions

Failure caused by

damage to the J1302

holder connector

Micro SD Receptacle:

failure to identify a

MicroSD card

Failures caused by

damage to the U3901

dual-channel RF

transmission and

receiving RTR6285A: no

signal, weak signal,

registration failure, and

GPS failure

Failures caused by GPS failure

and damage to the J3201 RF

connector: no signal, weak

signal, and registration failure

Failures caused by

damage to the J1501

holder connector–the

battery connector:

power-on and

charging failures

Failure caused by damage

to the U201power

management chip PM8029:

power failure that prevents

the components from

working properly

Failure caused by

damage to the J1601

card holder connector–

UIM card holder:

failure to identify a

UIM card

Failures caused by

damage to the J1101

BTB connector–

FEMALE-24: charging,

USB data

communication, and

call transmission

failures

Failure caused by

damage to the U4301

RF low-noise

amplifier: UMTS signal

failure

Failure caused by

damage to the U1001

charging chip:

charging failure

Failure caused by

damage to the motor:

vibration failure

Failure caused by

damage to the X301

32.768 kHz crystal

resonator: power-on

failure

Failure caused by

damage to the spring

of the J4302 UMTS

diversity antenna:

UMTS signal failure

U8815

Maintenance Manual

4 PCBA Components

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Figure 4-3 PCBAcomponents diagram 3

Failures caused by

damage to the J103 IO

connector-Micro USB

socket: charging and data

communication failures

Failure caused by

damage to the

MIC101 MIC : call

transmission failure

Figure 4-4 PCBAcomponents diagram 4

Failures caused damage to

the J102 RF connector: no

signal, weak signal, and

registration failure

Failures caused by damage

to the J107 antenna spring:

no signal, weak signal, and

registration failure

U8815

Maintenance Manual

5 Software Upgrade

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

5 Software Upgrade

5.1 Upgrade Preparation

Table 5-1 describes the upgrade preparation.

Table 5-1 Upgrade preparation

Item

Description

Remarks

Upgrade tools

Computer

To copy upgrade software

microSD card

More than 512 MB

Battery

With at least 30% power remaining.

Upgrade file

Main upgrade pack

dload/UPDATE.APP

Vendor upgrade pack

vendor_XXX_XXX/UPDATE.APP

Upgrade

method

Upgrade using

microSD cards

Normal upgrade

Forcible upgrade

5.2 Upgrade Process

1. Format the microSD card.

2. Create a folder named dload in the root directory of the microSD card.

3. Copy the upgrade file to the dload folder.

4. Install the microSD card to the handset. Power the handset on, and enter

*#*#2846579#*#* in the idle screen.

Select SD card upgrade then press Confirm to start the upgrade.

5. Before the upgrade, NV items backup is performed (if the handset has not been backed

up before). Then the handset restarts and the upgrade starts.

6. The upgrade progress is displayed on the LCD.

Figure 5-1 shows the upgrade process diagram.

U8815

Maintenance Manual

5 Software Upgrade

Issue 1.0 (2012-02-13)

Huawei Proprietary and Confidential

Figure 5-1 Upgrade process diagram

7. After the upgrade is completed, the handset restarts and the NV items are restored.

8. After the main upgrade pack is upgraded, upgrade the vendor upgrade pack using the

same method.

If the handset cannot be properly powered on, follow the following two methods to forcibly

upgrade the handset:

1. Install the battery to the handset (if the screen is splashing, remove the battery and wait

for five seconds before installing the battery again). Press Volume + and Volume –, and

press the Power key, the handset will start SD forcible download. The specific download

process is similar to the project menu download.

2. When the handset has not a battery installed, press Volume + and Volume –, and

connect the handset to a charger, the handset can also start the SD forcible upgrade. It is

recommended that you use a charger to perform forcible upgrade. If the download still

fails, replace the SD card and try forcible upgrade again.

U8815

Maintenance Manual

6 Maintenance Tools

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6 Maintenance Tools

Table 6-1 lists maintenance tools.

Table 6-1 List of maintenance tools

Name: constant-temperature heat gun

Usage: to heat components

Name: constant-temperature heat gun

Usage: to heat components

Name: soldering iron

Usage: to maintain and solder components

Name: direct current (DC) power supply

Usage: to supply DC current

Name: soldering table

Usage: to fix the PCBA

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