Infineon TLE4972 User manual

TLE4972 Lateral insertion 45° S-bend on PCB
User guide
About this document
This document describes the evaluation board of TLE4972, Infineon's magnetic current sensor for automotive
applications with external current rail.
Scope and purpose
The evaluation board is meant to be used by the customer solely for the purpose of evaluation and testing. It is
not a commercial product and shall not be used for series production. This board is thus not intend to meet any
industrial specifications and shall be operated at room temperature.
Due to its purpose, the evaluation board is not subject to the same procedures as regular products regarding
Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Withdraw (PWD).
Intended audience
This document is written for customers who intend to use TLE4972 in current sensing applications.
Evaluation Board
This board will be used during design in, for evaluation and measurement of characteristics, and proof of
datasheet specifications.
Note: PCB and auxiliary circuits are NOT optimized for final customer design. Boards do not necessarily
meet safety, EMI, quality standards (for example UL, CE) requirements.
Figure 1 TLE4972 EVAL STD PCB
User guide Please read the sections "Important notice" and "Warnings" at the end of this document Rev. 1.00
www.infineon.com 2022-04-12

Table of contents
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
1 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Safety precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 The board at a glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.1 Delivery content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4 Board parameters and technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 System and functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Description of the functional blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4.3 Sensing Structure Layout & Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 System design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 Bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Connector details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 System performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1 Test points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2 Test results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2.1 Measurement results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2.1.1 Sensitivity dri and oset dri over temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2.1.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2.1.3 Crosstalk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2.1.4 Thermal capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.2 Simulation results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.2.1 Conductor and insertion resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.2.2 Transfer factor error due to sensor displacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7 References and appendices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.1 Abbreviations and definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.2 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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User guide
Table of contents
User guide 2 Rev. 1.00
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1 Important notice
“Evaluation Boards and Reference Boards” shall mean products embedded on a printed circuit board
(PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration,
reference and evaluation boards, kits and design (collectively referred to as “Reference Board”).
Environmental conditions have been considered in the design of the Evaluation Boards and Reference
Boards provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards has
been tested by Infineon Technologies only as described in this document. The design is not qualified in
terms of safety requirements, manufacturing and operation over the entire operating temperature range
or lifetime.
The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional
testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to
the same procedures as regular products regarding returned material analysis (RMA), process change
notification (PCN) and product discontinuation (PD).
Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for
evaluation and testing purposes. In particular, they shall not be used for reliability testing or production.
The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards
(including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other
requirements of the country in which they are operated by the customer. The customer shall ensure that
all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant
requirements and standards of the country in which they are operated.
The Evaluation Boards and Reference Boards as well as the information provided in this document
are addressed only to qualified and skilled technical sta, for laboratory usage, and shall be used
and managed according to the terms and conditions set forth in this document and in other related
documentation supplied with the respective Evaluation Board or Reference Board.
It is the responsibility of the customer’s technical departments to evaluate the suitability of the
Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness
and correctness of the information provided in this document with respect to such application.
The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not
cause any harm to persons or third party property. The Evaluation Boards and Reference Boards and any
information in this document is provided "as is" and Infineon Technologies disclaims any warranties,
express or implied, including but not limited to warranties of non-infringement of third party rights and
implied warranties of fitness for any purpose, or for merchantability.
Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation
Boards and Reference Boards and/or from any information provided in this document. The customer is
obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or
damages arising out of or resulting from any use thereof.
Infineon Technologies reserves the right to modify this document and/or any information provided
herein at any time without further notice.
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1 Important notice
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2 Safety precautions
Note: Please note the following warnings regarding the hazards associated with development systems.
Figure 2 Safety Precautions
•Warning: Remove or disconnect power from the drive before you disconnect or reconnect wires, or
perform maintenance work. Failure to do so may result in personal injury or death.
•Warning: Do not keep the programmer connected to the laptop while the board is in use in an inverter. The
laptop may be damaged during the operation of the system.
•Warning: The evaluation board is intended to be used only in low voltage systems (≤ 50 V).
•Caution: The board and device surfaces of the evaluation board may become hot during testing. Hence,
necessary precautions are required while handling the board. Failure to comply may cause injury. Please
refer to Chapter 6.2.1.4 for an indication of the heating due to the current flow.
•Caution: Only personnel familiar with the drive, power electronics and associated machinery should plan,
install, commission and subsequently service the system. Failure to comply may result in personal injury
and/or equipment damage.
•Caution: The evaluation board contains parts and assemblies sensitive to electrostatic discharge (ESD).
Electrostatic control precautions are required when installing, testing, servicing or repairing the assembly.
Component damage may result if ESD control procedures are not followed. If you are not familiar with
electrostatic control procedures, refer to the applicable ESD protection handbooks and guidelines.
•Caution: A drive that is incorrectly applied or installed can lead to component damage or reduction in
product lifetime. Wiring or application errors such as undersizing the motor, supplying an incorrect or
inadequate AC supply, or excessive ambient temperatures may result in system malfunction.
•Caution: The evaluation board is shipped with packing materials that need to be removed prior to
installation. Failure to remove all packing materials that are unnecessary for system installation may result
in overheating or abnormal operating conditions.
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3 The board at a glance
TLE4972 evaluation board is developed to familiarize the users with TLE4972 current sensor for design in
support and evaluation purposes. The complete evaluation kit consists of this board and the programmer
board, which is explained in [1]. The programmer board supplies the sensors on the evaluation board and
allows a fast and easy interfacing to each sensor. If the programmer board is not used, power supply has to be
provided externally by the user.
3.1 Delivery content
The delivery content consist in TLE4972 evaluation board.
3.2 Block diagram
The evaluation board includes three TLE4972 coreless magnetic current sensors for testing in three-phase
systems. The evaluation board has been designed to operate safely in low voltage systems (≤50 V). It is
recommended to disconnect the USB cable between the programmer and the laptop while the system is in
operation, in order to avoid damages to the laptop.
Figure 3 Block diagram of the evaluation board in use in a three-phase system
3.3 Main features
• Three TLE4972 sensors, for testing in three-phase systems
• On board EEPROM to store board settings [Before calibration initial EEPROM Settings need to be saved in
order if re-calibration will reoccur, see the description of calibration procedure]
• Compatible with Infineon programmer board [1]
3.4 Board parameters and technical data
Table 1 Evaluation Board Overview
Product TLE4972-AE35D5
Package PG-TDSO-16
Evaluation board name TLE4972 EVAL STD PCB
Evaluation board order number SP005632136
Insertion method name 45° S-bend on PCB
Full scale (FS) ± 225.06 A
Typical current rail transfer factor 42.96 μT/A
Typical sensor sensitivity 124 mV/mT (S5)
(table continues...)
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3 The board at a glance
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Table 1 (continued) Evaluation Board Overview
Product TLE4972-AE35D5
Typical evaluation board sensitivity 5.33 mV/A
Output mode Semi-dierential
OCD1 threshold 313.83 A (139% of FS)
OCD2 threshold 185.99 A (82% of FS)
Typical insertion resistance 55 μΩ
Current rail width 14 mm
Current rail thickness 140 μΩ (two layers)
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3 The board at a glance
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4 System and functional description
4.1 Commissioning
If the evaluation board is used in combination with the Infineon programmer board [1], it is suicient to
connect the two boards and follow the instructions on the GUI [1].
If instead the evaluation board is used as stand-alone, then the user has to supply the board with 3.3 V using
pin 24 (positive terminal of the supply) and pin 20 or 22 (ground terminal of the supply) of the evaluation board
connector. Please refer to Chapter 5.4 for the complete pinout of the evaluation board connector.
4.2 Description of the functional blocks
The board consists of three TLE4972 current sensors to accurately sense AC and DC currents, a EEPROM to
store the board settings, a LDO (Low Drop Out) regulator to stabilize the supply voltage of the sensors and a
connector to connect to the Infineon programmer board [1]. For additional information about TLE4972 please
refer to the user manual [2] and datasheet [3].
4.3 Sensing Structure Layout & Guidelines
The three sensors are mounted on a PCB and placed on top of the current rail inside the PCB. The sensors are
twisted 45° in order to reduce the crosstalk between the three phases, without compromising the frequency
response of the sensor and insertion resistance of the conductor. The current rail has a 0.5 mm s-shaped slit.
Figure 4 Sensing structure overview
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5 System design
5.1 Schematics
Figure 5 TLE4972 evaluation board schematic
In order to suppress the high frequency noise and meet the EMC and ESD requirements, the following
capacitors have been implemented:
• A 220 nF bypass capacitor at the VDD pins of the sensors;
• A 6.8 nF bypass capacitor at the AOUT and VREF pins of the sensors;
• A 1 nF bypass capacitor at the OCD1 and OCD2 pins of the sensors.
Additionally, OCD1 and OCD2 pins of the sensors are connected to 1 kΩpull-up resistors, as they are open drain
pins.
A voltage regulator is implemented to supply the sensors with a stable voltage.
5.2 Layout
TLE4972 evaluation board consists of two 35 μm outer metallization layers and two 140 μm inner
metallization layers. The inner layers are intended to carry the high current that is sensed by the sensors.
Details are shown in the figure below.
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Figure 6 Evaluation board layer stack up
The figure below shows the top and bottom layer of the evaluation board. Please contact your local Infineon
sales oice to receive the Gerber files.
Figure 7 Evaluation board PCB layout (top and bottom layer)
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AOUT and VREF tracks of each sensor are traced in parallel on the PCB in order to minimize the common mode
noise on the output signal. Additionally, ground planes are used to protect the signal tracks and reduce the
parasitic couplings. The ground and power planes are cut below the TLE4972 including input and output pins to
avoid the error induced due to the eddy currents. For the same reason, no heat sink or other conductor material
shall be placed on the same position of the sensor.
5.3 Bill of material
Table 2 Bill of Material
Quantity Designator Value Footprint Description
1 U5 - SOIC-8 TLS208D1EJV33
(LDO)
3 U2, U3, U4 - PG-TDSO-16 TLE4972 (current
sensor)
1 U1 - TSSOP8_W M24C02-WDW6TP
(EEPROM)
2 R3, R4 100 Ω±1% R0603 Resistors for
EEPROM
8 R1, R2, R5, R6, R7,
R8, R9, R10
1 kΩ±1% R0603 Pull-up resistors
1 P1 - HDR2X12-Würth WR-
BHD
Header, 24-Pin
(2x12)
6 C5, C6, C10, C11,
C15, C16
6.8 nF, 25V C0603 AOUT and VREF
capacitors
6 C3, C4, C8, C9, C13,
C14
1 nF, 25V C0603 OCD1/OCD2
capacitors
7 C1, C2, C7, C12, C21,
C22, C25
220 nF, 25V C0603 Bypass capacitors
2 C23, C24 22 μF, 10 V C0603 Bypass capacitors
5.4 Connector details
The evaluation board connector establishes the connection between the evaluation board and the programmer
board. Please refer to the programmer user guide [1] for details about the programmer.
Table 3 Evaluation board connector pinout
Pin Number Pin name Pin function
1 AOUT1 Analog output voltage of sensor 1
2 OCD1_1 Over Current Detection channel 1 of
sensor 1 (open drain)
3 VREF1 Reference voltage of sensor 1
4 OCD2_1 Over Current Detection channel 2 of
sensor 1 (open drain)
5 AOUT2 Analog output voltage of sensor 2
(table continues...)
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Table 3 (continued) Evaluation board connector pinout
6 OCD1_2 Over Current Detection channel 1 of
sensor 2 (open drain)
7 VREF2 Reference voltage of sensor 2
8 OCD2_2 Over Current Detection channel 2 of
sensor 2 (open drain)
9 AOUT3 Analog output voltage of sensor 3
10 OCD1_3 Over Current Detection channel 1 of
sensor 3 (open drain)
11 VREF3 Reference voltage of sensor 3
12 OCD2_3 Over Current Detection channel 2 of
sensor 3 (open drain)
13 Reserved Additional ADC input, connected
to µC XMC4700 P14_7 on the
programmer board
14 VSENS Sensor supply voltage, used for
sensor test mode activation
15 Reserved Additional ADC input, connected
to µC XMC4700 P14_9 on the
programmer board
16 V5 5 V supply voltage
17 Reserved External trigger input, connected
to µC XMC4700 P4_0 on the
programmer board
18 Reserved -
19 SCL Clock for communication with
external EEPROM on Infineon's
evaluation boards
20 GND Ground connection
21 SDA Data link for communication with
external EEPROM on Infineon's
evaluation boards
22 GND Ground connection
23 - -
24 V33 3.3 V supply
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6 System performance
6.1 Test points
The output voltage of the three sensors, as well as the OCD signals have been measured from the evaluation
board connector. Please refer to Chapter 5.4 for the complete pinout of the evaluation board connector.
6.2 Test results
6.2.1 Measurement results
This section discusses the results of the measurements performed in the laboratory on the evaluation board.
The following measurements have been performed:
1. Sensitivity dri and oset dri over temperature
2. Frequency response
3. Crosstalk
4. Thermal capability
6.2.1.1 Sensitivity dri and oset dri over temperature
The figures below show the TLE4972 evaluation board measurement results of sensitivity dri and oset over
temperature when the sensor is placed in the nominal position. The results show extremely stable sensitivity
and small oset across the whole temperature range. The absolute value of sensitivity used as target for
calibration is shown in Chapter 3.4.
Figure 8 Sensitivity dri over temperature
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Figure 9 Oset over temperature
6.2.1.2 Frequency response
The figures below show the TLE4972 evaluation board measurement results of frequency response (gain and
phase) when the sensor is placed in the nominal position. Two out of three sensors have been measured.
A comparison with results from Finite Element Method (FEM) simulations is also provided.
Figure 10 Frequency response (gain)
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Figure 11 Frequency response (phase)
6.2.1.3 Crosstalk
The crosstalk is defined as the sensitivity error due to the magnetic stray field generated by the
neighbouring conductive lines. The crosstalk can be compensated with the “Matrix compensation method”
in the programming soware. For further information, please refer to the programming board user guide [1]
and device user manual [2]. The table below shows the sensitivity error due to the crosstalk before
the compensation.
Table 4 Crosstalk
S [%]
Active phase U V W
U 100,00 -1,09 -0,27
V -0,99 100,00 -1,10
W -0,22 -0,89 100,00
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6.2.1.4 Thermal capability
The following figure shows the heating of the board and device when a current flows in the evaluation
board. The temperature is read out by the sensor over time and the measurement is stopped when a
temperature of approximately 80°C is detected. The measurement shows that a cooling of the board is needed,
if high currents are applied.
Figure 12 Thermal capability
6.2.2 Simulation results
This section discusses the results of the simulations performed in ANSYS Maxwell 3D on the evaluation board to
complement the results from measurements. The following simulations have been performed:
1. Conductor and insertion resistance
2. Transfer factor error due to sensor displacement
6.2.2.1 Conductor and insertion resistance
The insertion resistance indicates the additional resistance caused by the sensing structure at 25°C. The
simulations are performed with and without slit in the conductor by applying 1 A of current. Simulation results
are shown in the figure below. Please note that the legend shows a voltage [V], which is equivalent to resistance
[Ω], being the applied current 1 A.
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Figure 13 Conductor resistance, without slit (le) and with slit (right)
The table below shows the simulated resistance of the conductor with and without slit and the calculated
insertion resistance.
Table 5 Evaluation Board Conductor Resistance
Parameter Value
Conductor resistance without slit 353 μΩ
Conductor resistance with slit 408 μΩ
Insertion resistance 55 μΩ
Conductor resistance increase 15.58%
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6.2.2.2 Transfer factor error due to sensor displacement
This following figures show the transfer factor variation due to sensor displacement in the x, y, and z-axis
direction.The transfer factor is defined in μT/A and the typical value is shown in Chapter 3.4.
Figure 14 Reference system for sensor displacement simulations
Figure 15 Transfer factor error due to sensor displacement in x direction
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Figure 16 Transfer factor error due to sensor displacement in y direction
Figure 17 Transfer factor error due to sensor displacement in z direction
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7 References and appendices
7.1 Abbreviations and definitions
Notation Description
AC Alternating Current
CE European Conformity
DC Direct Current
EMC Electro-Magnetic Compatibility
EMI Electro-Magnetic Interference
EEPROM Electrically Erasable Programmable Read-Only
Memory
ESD Electro-Static Discharge
FEM Finite Element Method
GUI Graphical User Interface
LDO Low Drop Out
LV Low Voltage
OCD Over Current Detection
PCB Printed Circuit Board
PCN Process Change Notification
PD Product Discontinuation
PWD Product Withdraw
RMA Returned Material Analysis
SCL Serial Clock
SDA Serial Data
UL Underwriters Laboratories
USB Universal Serial Bus
7.2 References
[1] Infineon-TLE4972-Current_Sensor_Programmer_User_guide-vxx_xx-EN
[2] Infineon-TLE4972-User_manual-vxx_xx-EN
[3] Infineon-TLE4972AE35S5-DS-vxx_xx-EN, Infineon-TLE4972AE35D5-DS-vxx_xx-EN
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7 References and appendices
User guide 19 Rev. 1.00
2022-04-12

8 Revision history
Table 6 Revision History
Document version Date of release Description of changes
1.0 12.04.2022 Initial revision
TLE4972 Lateral insertion 45° S-bend on PCB
User guide
8 Revision history
User guide 20 Rev. 1.00
2022-04-12