Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core... User manual

Document Number: 318726-010
Intel®Core™2 Extreme Processor
QX9000ΔSeries, Intel®Core™2 Quad
Processor Q9000Δ, Q9000SΔ, Q8000Δ,
and Q8000SΔSeries
Datasheet
— on 45 nm process in the 775 land package
August 2009

2Datasheet
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BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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Intel may make changes to specifications and product descriptions at any time, without notice.
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rights.
The Intel®Core™2 Extreme processor QX9000 series and Intel®Core™2 Quad processor Q9000, Q9000S, Q8000, and Q8000S
series may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel®64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled
for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including
details on which processors support Intel 64, or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting
operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
±Intel®Virtualization Technology requires a computer system with an enabled Intel®processor, BIOS, virtual machine monitor
(VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary
depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible
with all operating systems. Please check with your application vendor.
No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires
a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code
Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor,
an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing
Group and specific software for some uses. For more information, see http://www.intel.com/technology/security/
‡ Not all specified units of this processor support Enhanced Intel SpeedStep®Technology. See the Processor Spec Finder at http:/
/processorfinder.intel.com or contact your Intel representative for more information.
Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep®
Technology. See the Processor Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more
information.
Intel, Pentium, Intel Core, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007–2009, Intel Corporation. All Rights Reserved.

Datasheet 3
Contents
1Introduction............................................................................................................ 11
1.1 Terminology ..................................................................................................... 12
1.1.1 Processor Terminology Definitions ............................................................ 12
1.2 References ....................................................................................................... 14
2 Electrical Specifications ........................................................................................... 15
2.1 Power and Ground Lands.................................................................................... 15
2.2 Decoupling Guidelines........................................................................................ 15
2.2.1 VCC Decoupling ..................................................................................... 15
2.2.2 Vtt Decoupling ....................................................................................... 15
2.2.3 FSB Decoupling...................................................................................... 16
2.3 Voltage Identification ......................................................................................... 16
2.4 Reserved, Unused, and TESTHI Signals ................................................................ 18
2.5 Power Segment Identifier (PSID)......................................................................... 18
2.6 Voltage and Current Specification ........................................................................ 19
2.6.1 Absolute Maximum and Minimum Ratings .................................................. 19
2.6.2 DC Voltage and Current Specification ........................................................ 20
2.6.3 VCC Overshoot ...................................................................................... 25
2.6.4 Die Voltage Validation ............................................................................. 25
2.7 Signaling Specifications...................................................................................... 26
2.7.1 FSB Signal Groups.................................................................................. 26
2.7.2 CMOS and Open Drain Signals ................................................................. 28
2.7.3 Processor DC Specifications ..................................................................... 28
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 29
2.7.3.2 GTL+ Front Side Bus Specifications ............................................. 30
2.8 Clock Specifications ........................................................................................... 31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 32
2.8.3 Phase Lock Loop (PLL) and Filter .............................................................. 32
2.8.4 BCLK[1:0] Specifications ......................................................................... 32
3 Package Mechanical Specifications .......................................................................... 35
3.1 Package Mechanical Drawing............................................................................... 35
3.2 Processor Component Keep-Out Zones ................................................................. 39
3.3 Package Loading Specifications ........................................................................... 39
3.4 Package Handling Guidelines............................................................................... 39
3.5 Package Insertion Specifications.......................................................................... 40
3.6 Processor Mass Specification ............................................................................... 40
3.7 Processor Materials............................................................................................ 40
3.8 Processor Markings............................................................................................ 40
4 Land Listing and Signal Descriptions ....................................................................... 43
4.1 Processor Land Assignments ............................................................................... 43
4.2 Alphabetical Signals Reference ............................................................................ 64
5 Thermal Specifications and Design Considerations .................................................. 75
5.1 Processor Thermal Specifications ......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 82
5.2 Processor Thermal Features................................................................................ 82
5.2.1 Thermal Monitor..................................................................................... 82
5.2.2 Thermal Monitor 2 .................................................................................. 83

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5.2.3 On-Demand Mode...................................................................................84
5.2.4 PROCHOT# Signal ..................................................................................85
5.2.5 THERMTRIP# Signal ................................................................................85
5.3 Platform Environment Control Interface (PECI) ......................................................86
5.3.1 Introduction...........................................................................................86
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems ..................86
5.3.2 PECI Specifications .................................................................................87
5.3.2.1 PECI Device Address..................................................................87
5.3.2.2 PECI Command Support .............................................................87
5.3.2.3 PECI Fault Handling Requirements ...............................................87
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................87
6Features..................................................................................................................89
6.1 Power-On Configuration Options ..........................................................................89
6.2 Clock Control and Low Power States .....................................................................89
6.2.1 Normal State .........................................................................................90
6.2.2 HALT and Extended HALT Powerdown States ..............................................90
6.2.2.1 HALT Powerdown State ..............................................................90
6.2.2.2 Extended HALT Powerdown State ................................................91
6.2.3 Stop Grant and Extended Stop Grant States ...............................................91
6.2.3.1 Stop-Grant State.......................................................................91
6.2.3.2 Extended Stop Grant State .........................................................92
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended
Stop Grant Snoop State, and Stop Grant Snoop State..................................92
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................92
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......92
6.2.5 Sleep State ............................................................................................92
6.2.6 Deep Sleep State....................................................................................93
6.2.7 Deeper Sleep State .................................................................................93
6.2.8 Enhanced Intel SpeedStep®Technology ....................................................94
6.3 Processor Power Status Indicator (PSI) Signal .......................................................94
7 Boxed Processor Specifications................................................................................95
7.1 Introduction......................................................................................................95
7.2 Mechanical Specifications ....................................................................................96
7.2.1 Boxed Processor Cooling Solution Dimensions.............................................96
7.2.2 Boxed Processor Fan Heatsink Weight .......................................................97
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....97
7.3 Electrical Requirements ......................................................................................97
7.3.1 Fan Heatsink Power Supply ......................................................................97
7.4 Thermal Specifications........................................................................................99
7.4.1 Boxed Processor Cooling Requirements......................................................99
7.4.2 Variable Speed Fan ............................................................................... 100
7.5 Boxed Intel®Core™2 Extreme Processor QX9650 Specifications ............................ 101
7.5.1 Boxed Intel®Core™2 Extreme Processor QX9650 Fan Heatsink Weight........ 102
8 Debug Tools Specifications .................................................................................... 105
8.1 Logic Analyzer Interface (LAI) ........................................................................... 105
8.1.1 Mechanical Considerations ..................................................................... 105
8.1.2 Electrical Considerations ........................................................................ 105

Datasheet 5
Figures
2-1 VCC Static and Transient Tolerance......................................................................... 24
2-2 VCC Overshoot Example Waveform ......................................................................... 25
2-3 Differential Clock Waveform .................................................................................. 34
2-4 Measurement Points for Differential Clock Waveforms ............................................... 34
3-1 Processor Package Assembly Sketch....................................................................... 35
3-2 Processor Package Drawing (Sheet 1 of 3) .............................................................. 36
3-3 Processor Package Drawing (Sheet 2 of 3) .............................................................. 37
3-4 Processor Package Drawing (Sheet 3 of 3) .............................................................. 38
3-5 Processor Top-Side Markings Example (Intel®Core™2 Extreme Processor QX9650)...... 40
3-6 Processor Top-Side Markings Example (Intel®Core™2 Quad Processor Q9000 Series) .. 41
3-7 Processor Land Coordinates and Quadrants, Top View............................................... 42
4-1 land-out Diagram (Top View – Left Side)................................................................. 44
4-2 land-out Diagram (Top View – Right Side)............................................................... 45
5-1 Intel®Core™2 Extreme Processor QX9770 Thermal Profile........................................ 78
5-2 Intel®Core™2 Extreme Processor QX9650 Thermal Profile........................................ 79
5-3 Intel®Core™2 Quad Processor Q9000 and Q8000 Series Thermal Profile .................... 80
5-4 Intel®Core™2 Quad Processor Q9000S and Q8000S Series Thermal Profile................. 81
5-5 Case Temperature (TC) Measurement Location ........................................................ 82
5-6 Thermal Monitor 2 Frequency and Voltage Ordering.................................................. 84
5-7 Conceptual Fan Control Diagram on PECI-Based Platforms ........................................ 86
6-1 Processor Low Power State Machine ....................................................................... 90
7-1 Mechanical Representation of the Boxed Processor ................................................... 95
7-2 Space Requirements for the Boxed Processor (side view) .......................................... 96
7-3 Space Requirements for the Boxed Processor (top view) ........................................... 96
7-4 Space Requirements for the Boxed Processor (overall view) ...................................... 97
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description.............................. 98
7-6 Baseboard Power Header Placement Relative to Processor Socket............................... 98
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............... 99
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............... 99
7-9 Boxed Processor Fan Heatsink Set Points .............................................................. 100
7-10 Space Requirements for the Boxed Processor (side view) ........................................ 102
7-11 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............. 102
7-12 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............. 103

6Datasheet
Tables
1-1 References ..........................................................................................................14
2-1 Voltage Identification Definition..............................................................................17
2-2 Absolute Maximum and Minimum Ratings ................................................................19
2-3 Voltage and Current Specifications .........................................................................20
2-4 VCC Static and Transient Tolerance .........................................................................23
2-5 VCC Overshoot Specifications .................................................................................25
2-6 FSB Signal Groups................................................................................................26
2-7 Signal Characteristics ...........................................................................................27
2-8 Signal Reference Voltages .....................................................................................27
2-9 GTL+ Signal Group DC Specifications ......................................................................28
2-10 Open Drain and TAP Output Signal Group DC Specifications .......................................28
2-11 CMOS Signal Group DC Specifications .....................................................................29
2-12 PECI DC Electrical Limits .......................................................................................30
2-13 GTL+ Bus Resistance Definitions ............................................................................30
2-14 Core Frequency to FSB Multiplier Configuration ........................................................31
2-15 BSEL[2:0] Frequency Table for BCLK[1:0] ...............................................................32
2-16 Front Side Bus Differential BCLK Specifications.........................................................32
2-17 FSB Differential Clock Specifications (1600 MHz FSB) ................................................33
2-18 FSB Differential Clock Specifications (1333 MHz FSB) ................................................33
3-1 Processor Loading Specifications ............................................................................39
3-2 Package Handling Guidelines..................................................................................39
3-3 Processor Materials...............................................................................................40
4-1 Alphabetical Land Assignments ..............................................................................46
4-2 Numerical Land Assignment...................................................................................55
4-3 Signal Description ................................................................................................64
5-1 Processor Thermal Specifications............................................................................76
5-2 Intel®Core™2 Extreme Processor QX9770 Thermal Profile ........................................78
5-3 Intel®Core™2 Extreme Processor QX9650 Thermal Profile ........................................79
5-4 Intel®Core™2 Quad Processor Q9000 and Q8000 Series Thermal Profile.....................80
5-5 Intel®Core™2 Quad Processor Q9000S and Q8000S Series Thermal Profile .................81
5-6 GetTemp0() Error Codes .......................................................................................87
6-1 Power-On Configuration Option Signals ...................................................................89
7-1 Fan Heatsink Power and Signal Specifications...........................................................98
7-2 Fan Heatsink Power and Signal Specifications......................................................... 100

Datasheet 7
Revision History
§
Revision
Number Description Revision Date
-001 • Initial release November 2007
-002 • Added Intel®Core™2 Quad processors Q9550, Q9450, and Q9300 January 2008
-003 • Added 1600 MHz FSB
• Added Intel®Core™2 Extreme processor QX9770 March 2008
-004
• Added Intel®Core™2 Quad processors Q9650 and Q9400
• Added PSI# signal
• Updated Sections 6.2.3, 6.2.4, 6.2.5, 6.2.6, 6.2.7, and 6.3
• Updated FSB termination voltage in Table 2-3
August 2008
-005 • Added Intel®Core™2 Quad processor Q8200 August 2008
-006 • Added Intel®Core™2 Quad processor Q8300 December 2008
-007 • Added Intel®Core™2 Quad processor Q9000S and Q8000S series – Q9550S,
Q9400S, and Q8200S. January 2009
-008 • Added Intel®Core™2 Quad processors Q8400 and Q8400S April 2009
-009 • Corrected list of Intel®VT supported processors: Intel®Core™2 Quad
processors Q8400 and Q8400S May 2009
-010 • Added Intel®Core™2 Quad processors Q9505 and Q9505S August 2009

8Datasheet

Datasheet 9
Intel®Core™2 Extreme Processor QX9000 Series and
Intel®Core™2 Quad Processor Q9000, Q9000S, Q8000,
Q8000S Series Features
The Intel Core™2 Extreme processor QX9000 series and Intel®Core™2 Quad processor Q9000,
Q9000S, Q8000, and Q8000S series deliver Intel's advanced, powerful processors for desktop PCs.
The processor is designed to deliver performance across applications and usages where end-users can
truly appreciate and experience the performance. These applications include Internet audio and
streaming video, image processing, video content creation, speech, 3D, CAD, games, multimedia, and
multitasking user environments.
Intel®64Φarchitecture enables the processor to execute operating systems and applications written
to take advantage of the Intel 64 architecture. The processor, supporting Enhanced Intel Speedstep®
technology, allows tradeoffs to be made between performance and power consumption.
The Intel Core™2 Extreme processor QX9000 series, Intel®Core™2 Quad processor Q9000, Q9000S,
Q8000, and Q8000S series also includes the Execute Disable Bit capability. This feature, combined
with a supported operating system, allows memory to be marked as executable or non-executable.
• Available at 3.20 GHz and 3.00 GHz (Intel®
Core™2 Extreme processor QX9000 series)
• Available at 3.0 GHz, 2.83 GHz, 2.66 GHz,
and 2.50 GHz (Intel®Core™2 Quad
processor Q9650, Q9550, Q9505, Q9450,
Q9400, and Q9300)
• Available at 2,66 GHz, 2.50 GHz and
2.33 GHz (Intel®Core™2 Quad processor
Q8400, Q8300, and Q8200)
• Available at 2.83 GHz and 2.66 GHz (Intel®
Core™2 Quad processor Q9550S, Q9505S,
and Q9400S)
• Available at 2.66 GHz and 2.33 GHz (Intel®
Core™2 Quad processor Q8400S and
Q8200S)
• FSB frequency at 1333 MHz (Intel®Core™2
Extreme processor QX9650, Intel®Core™2
Quad Q9000, Q9000S, Q8000, and Q8000S
series only)
• FSB frequency at 1600 MHz (Intel®Core™2
Extreme processor QX9770 only)
• Enhanced Intel SpeedStep®Technology
•SupportsIntel
®64Φarchitecture
•SupportsIntel
® Virtualization Technology
(Intel®Core™2 Extreme processor QX9650,
Intel®Core™2 Quad processor Q9000 and
Q9000S series, Intel®Core™2 Quad
processors Q8400 and Q8400S only)
•SupportsIntel
®Trusted Execution
Techn ol og y (Intel®Core™2 Quad processor
Q9000 and Q9000S series only)
• Low power processor (Intel®Core™2 Quad
processor Q9000S and Q8000S series only)
• Binary compatible with applications running
on previous members of the Intel
microprocessor line
• Supports Execute Disable Bit capability
•Intel
®Wide Dynamic Execution
•Intel
®Advanced Smart Cache
•Intel
®Smart Memory Access
•Intel
®Intelligent Power Capability
•Intel
®Advanced Digital Media Boost
• Optimized for 32-bit applications running on
advanced 32-bit operating systems
• Two 6 MB Level 2 caches (Intel®Core™2
Extreme processor QX9000 series, Intel®
Core™2 Quad processor Q9650, Q9550,
Q9550S, and Q9450)
• Two 4 MB Level 2 caches (Intel®Core™2
Quad processor Q9505, Q9505S, Q8400,
and Q8400S)
• Two 3 MB Level 2 caches (Intel®Core™2
Quad processor Q9400, Q9400S, and
Q9300)
• Two 2 MB Level 2 caches (Intel®Core™2
Quad processor Q8200, Q8200S, and
Q8300)
•Intel
®HD Boost utilizing new SSE4
instructions for improved multimedia
performance, especially for video encoding
and photo processing
• System Management mode
• 12-way cache associativity provides
improved cache hit rate on load/store
operations
• 775-land Package

10 Datasheet
The Intel Core™2 Extreme processor QX9000 series, Intel®Core™2 Quad processor Q9000 and
Q9000S series, and Intel®Core™2 Quad processors Q8400 and Q8400S support Intel®Virtualization
Technology. Virtualization Technology provides silicon-based functionality that works together with
compatible Virtual Machine Monitor (VMM) software to improve on software-only solutions.
The Intel®Core™2 Quad processor Q9000 and Q9000S series support Intel®Trusted Execution
Technology (Intel®TXT). Intel®TXT is a key element in Intel's safer computing initiative that defines
a set of hardware enhancements that operate with an Intel TXT enabled operating system to help
protect against software-based attacks. It creates a hardware foundation that builds on Intel's
Virtualization Technology to help protect the confidentiality and integrity of data stored/created on the
client PC.
§ §