Kontron cPCI-MXP64GX Product manual

cPCI-MXP64GX
6U CompactPCI®64-bit Peripheral Processor
Technical Reference Manual
Version 1.2, February 2003
Note: The latest releases of the Technical Reference Manuals are available at:
ftp://ftp.kontron.ca/Support/Product_Manuals/
www.kontron.com

FOREWORD
The information in this document is provided for reference purposes only. Kontron does
not assume any liability for the application of information or the use of products described
herein.
This document may contain information or refer to products protected by the copyrights or
patents of others and does not convey any license under the patent rights of Kontron, nor
the rights of others.
Printed in Canada.
Copyright 2003 by Kontron inc., Boisbriand, Qc J7G 2A7.

DOCUMENTATION SURVEY
cPCI-MXP64GX – Technical Reference Manual
Your comments are valuable for us and will contribute to improve the quality of this product by
complementing and returning this form.
1. Overall rating of the Technical Reference Manual: ❑Excellent ❑Satisfactory ❑Fair ❑Poor
Did you find easily the information you were seeking for? ❑Yes ❑No
If no, can you comment? _________________________________________________________
2. What section of this manual do you refer to the most? __________________________________
3. How can you rate this manual?
In terms of clarity of information: ❑Excellent ❑Satisfactory ❑Fair ❑Poor
Comments: ________________________________________________________________________
________________________________________________________________________________
In terms of complexity: ❑Too technical ❑Just OK ❑Not technical enough
Comments: ________________________________________________________________________
________________________________________________________________________________
In terms of classification of information: ❑Excellent ❑Satisfactory ❑Fair ❑Poor
Comments: ________________________________________________________________________
_______________________________________________________________________
5. Is some information missing in this book? ❑Yes ❑No
If yes, what information is missing?____________________________________________________
________________________________________________________________________________
6. Is some information not properly or clearly explained? ❑Yes ❑No
If yes, can you comment?_____________________________________________________________
________________________________________________________________________________
7. Additional comments (suggestions, errors found, etc.):_____________________________________
________________________________________________________________________________
________________________________________________________________________________
Please send your comments to:
Kontron Canada inc
Technical Writing dept.
616 Curé Boivin, Boisbriand
(Québec) CANADA J7G 2A7
Name ________________________________
Company _____________________________
Address ______________________________
_____________________________________
_____________________________________
Optional

ADDITIONAL COMMENTS

FCC Compliance Statement
Warning
Changes or modifications to this unit not expressly approved by the party
responsible for the compliance could void the user's authority to operate this
equipment.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference, in which case the
user will be required to correct the interference at his or her own expense.
European Statement
Warning
This is a class B product. If not installed in a properly shielded enclosure,
and used in accordance with the instruction manual, this product may cause
radio interference in which case the user may be required to take adequate
measures at his or her own expense.
Safety Standard
UL Recognized Component, File # E186339 vol. 1 section 2
Care and handling precautions for Lithium batteries
•Do not short circuit
•Do not heat or incinerate
•Do not charge
•Do not deform or disassemble
•Do not apply solder directly
•Do not mix different types or partially used batteries together
•Always observe proper polarities

READ ME FIRST
Your computer board has a standard non-rechargeable lithium battery. To preserve the
battery lifetime, the battery enable jumper is removed when you receive the
board.
EXERCISE CAUTION WHILE REPLACING LITHIUM BATTERY
 WARNING
Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of
used batteries according to the manufacturer's instructions.
 ATTENTION
Il y a danger d’explosion s’il y a remplacement incorrect de la batterie.
Remplacer uniquement avec une batterie du même type ou d’un type
équivalent recommandé par le constructeur. Mettre au rebut les batteries
usagées conformément aux instructions du fabriquant.
ACHTUNG
Explosionsgefahr bei falschem Batteriewechsel. Verwenden Sie nur die
empfohlenen Batterietypen des Herstellers. Entsorgen Sie die verbrauchten
Batterien laut Gebrauchsanweisung des Herstellers.
 ATENCION
Puede explotar si la pila no este bien reemplazada.
Solo reemplazca la pila con tipas equivalentes segun las instrucciones del
manifacturo. Vote las pilas usadas segun las instrucciones del manifacturo.

 IMPORTANT
J1 and J2 pinout is as per PICMG standard.
J3 and J5 pinout is user-defined and varies between various
manufacturers. Contact our Technical Support to verify pinout
compatibility with other chassis backplane vendors.
 POWERING-UP THE BOARD
If you should encounter a problem, verify the following items:
Make sure that all connectors are properly connected.
Check your boot diskette.
If the board still does not start up properly, you should try booting your
system with the cPCI- MXP64GX installed in the system, a monitor and a
keyboard connected to the board. This is the minimum required to verify
the board’s operation.
If you still are not able to verify your board, please refer to the
emergency Procedure in the Appendix Section.
If you still are not able to get your board up and running, contact our
technical Support department for assistance.
PREVENTING VIRUSES
Kontron Inc. takes every precaution against computer viruses.
To safeguard against computer viruses in general, do not freely lend your
diskettes and regularly perform virus scans on all your computer
systems.
 ADAPTER CABLES
While adapter cables are provided from various sources, the pinout is often
different. The direct crimp design offered by Kontron allows the simplest
cable assembly. All cables are available from Kontron Sales Department.

UNPACKING AND SAFETY PRECAUTIONS
STATIC ELECTRICITY
Since static electricity can cause damage to electronic devices, the following precautions
should be taken:
1. Keep the board in its anti-static package, until you are ready to install it.
2. Always touch a grounded surface or wear a grounding wrist strap before removing the
board from its package; this will discharge any static electricity that may have built up
in your body.
3. Handle the board by the edges.
Storage Environment
Electronic boards are sensitive devices. Do not handle or store devices near strong
electrostatic, electromagnetic, magnetic or radioactive fields.
Power Supply
Before any installation or setup, ensure that the board is unplugged from power sources or
subsystems.
Unpacking
Follow these recommendations while unpacking:
1. After opening the box, save it and the packing material for possible future shipment.
2. Remove the board from its anti-static wrapping and place it on a grounded surface.
3. Inspect the board for damage. If there is any damage or missing items, notify Kontron
immediately.
When unpacking you will find:
1. One cPCI- MXP64GX, 6U CompactPCI® Peripheral Processor.
2. One Quick Reference sheet
3. One CDROM containing drivers.

i
TABLE OF CONTENTS
1PRODUCT DESCRIPTION.........................................................5
1.1 PRODUCT SPECIFICATIONS ...................................................................................1-1
1.2 CPCI- MXP64GX TECHNICAL SPECIFICATIONS SHEET...........................................1-2
1.2.1 Power requirements............................................................................................1-5
1.3 HOT SWAP CAPABILITY .........................................................................................1-6
1.4 INTERFACING WITH THE ENVIRONMENT ...................................................................1-8
1.4.1 CPCI...................................................................................................................1-8
1.4.2 Mezzanines.........................................................................................................1-8
1.5 COMPATIBILITY WITH KONTRON PRODUCTS.............................................................1-9
1.6 MEZZANINE CARD CONCEPT ...............................................................................1-10
1.6.1 Kontron’s cMC Mezzanine Concept...................................................................1-11
1.6.2 PMC Concept....................................................................................................1-11
1.6.3 CompactFlash Feature......................................................................................1-11
2ONBOARD FEATURES..........................................................2-1
2.1 COMPACTFLASH INTERFACE..................................................................................2-1
2.2 ENHANCED IDE INTERFACES.................................................................................2-2
2.3 ETHERNET INTERFACE..........................................................................................2-3
2.3.1 Front I/O Configuration........................................................................................2-3
2.3.2 Rear I/O Configuration.........................................................................................2-3
2.3.3 Boot from LAN.....................................................................................................2-4
2.3.4 Drivers.................................................................................................................2-4
2.4 FLOPPY DISK INTERFACE ......................................................................................2-4
2.5 PS/2 KEYBOARD / PS/2 MOUSE INTERFACE ..........................................................2-5
2.6 PARALLEL PORT...................................................................................................2-5
2.6.1 Standard Mode....................................................................................................2-6

ii
2.6.2 EPP Mode...........................................................................................................2-7
2.6.3 ECP Mode...........................................................................................................2-7
2.7 POWER MANAGEMENT..........................................................................................2-8
2.8 SERIAL PORTS.....................................................................................................2-8
2.8.1 Serial Port 1 ........................................................................................................2-8
2.8.2 Remote Reset.....................................................................................................2-9
2.8.3 Serial Port 2 ......................................................................................................2-10
2.9 THERMAL MANAGEMENT.....................................................................................2-12
2.10 USB INTERFACES..............................................................................................2-13
2.11 VIDEO INTERFACE ..............................................................................................2-13
2.11.1 Front I/O Configuration......................................................................................2-14
2.11.2 Rear I/O Configuration.......................................................................................2-14
2.11.3 Supported Resolutions......................................................................................2-14
2.11.4 Major Features Description................................................................................2-15
3INSTALLING THE BOARD......................................................17
3.1 SETTING JUMPERS ...............................................................................................3-1
3.1.1 Jumper Description for the CPCI- MXP64GX......................................................3-1
3.1.2 CPCI- MXP64GX Connector and Jumper Location .............................................3-2
3.2 REGISTER’S DESCRIPTION ....................................................................................3-4
3.2.1 Serial Port 2 Configuration...................................................................................3-4
3.2.2 History and monitor status...................................................................................3-4
3.2.3 History status ......................................................................................................3-5
3.2.4 Monitoring status and I/O access.........................................................................3-5
3.2.5 Digital watchdog..................................................................................................3-5
3.2.6 NMI Control.........................................................................................................3-6
3.3 ONBOARD INTERCONNECTIVITY..............................................................................3-8
3.3.1 cPCI- MXP64GX Block Diagram..........................................................................3-8
3.3.2 Mobile Pentium®III processor..............................................................................3-9
3.3.3 North Bridge Chipset...........................................................................................3-9
3.3.4 21554 PCI-to-PCI Bridge...................................................................................3-10
3.3.5 82371AB PCI-to-ISA Bridge / IDE Xcelerator (PIIX4).........................................3-10
3.3.6 Onboard Connectors and Headers....................................................................3-11

iii
3.3.7 Front Plate Connectors and Indicators...............................................................3-12
3.3.8 CompactPCI Connectors...................................................................................3-15
3.4 CUSTOMIZING THE BOARD...................................................................................3-16
3.4.1 Processor..........................................................................................................3-16
3.4.2 Backup Battery..................................................................................................3-16
3.4.3 Installing the Memory........................................................................................3-18
3.4.4 Supervision Features.........................................................................................3-20
3.5 PUTTING A KONTRON CPCI SYSTEM TOGETHER ...................................................3-24
3.5.1 Backplane.........................................................................................................3-25
3.5.2 Rear-Panel I/O..................................................................................................3-26
Storage Devices.............................................................................................................3-27
3.5.3 Power Supply....................................................................................................3-27
3.5.4 Fan Tray............................................................................................................3-27
3.5.5 Installing the Board into a Bay...........................................................................3-27
3.5.6 Connector Keying..............................................................................................3-27
3.5.7 Connection........................................................................................................3-28
3.6 CPCI I/O SIGNALS ............................................................................................3-29
3.6.1 J3 Signal Specification ......................................................................................3-29
3.6.2 J5 Signal Specification ......................................................................................3-30
4SOFTWARE SETUPS.............................................................4-1
4.1 BIOS SETUP PROGRAM .......................................................................................4-1
4.1.1 Accessing the BIOS setup program.....................................................................4-2
4.1.2 Main Menu ..........................................................................................................4-4
4.1.3 Setups.................................................................................................................4-5
4.1.4 Standard CMOS Setups......................................................................................4-6
4.1.5 BIOS Features Setup..........................................................................................4-7
4.1.6 Chipset Features Setup.......................................................................................4-9
4.1.7 Power Management Setup................................................................................4-11
4.1.8 PnP/PCI Configuration ......................................................................................4-13
4.1.9 CPU/Board Features Setup...............................................................................4-14
4.1.10 Integrated Peripherals.......................................................................................4-15
4.2 UPDATING OR RESTORING THE BIOS IN FLASH.....................................................4-17
4.2.1 UBIOS.EXE 4.0 - BIOS update and copy utility..................................................4-17

iv
4.2.2 How to do a successful update..........................................................................4-17
4.2.3 How to do a successful copy.............................................................................4-18
4.2.4 Advanced functionality.......................................................................................4-18
4.2.5 VT-100 mode ....................................................................................................4-18
4.2.6 UBIOS - Interactive Mode..................................................................................4-19
4.2.7 UBIOS – Batch Mode........................................................................................4-26
4.3 VT100 MODE....................................................................................................4-27
4.3.1 Requirements....................................................................................................4-27
4.3.2 Setup & Configuration .......................................................................................4-27
4.3.3 Running Without a Terminal..............................................................................4-28

1 PRODUCT DESCRIPTION
1. PRODUCT SPECIFICATIONS
2. HOT SWAP CAPABILITY
3. INTERFACING WITH THE ENVIRONMENT
4. COMPATIBILITY WITH KONTRON PRODUCTS
5. MEZZANINE CARD CONCEPT
1
PART

1-1
1.1 PRODUCT SPECIFICATIONS
Kontron’s 6U CompactPCI®peripheral processor, featuring scalable multiprocessing and
the highest level of hot-swap capability, is the ideal peripheral processor for
data/telecommunication, CTI, and industrial control/monitoring markets.
The cPCI- MXP64GX 6U CompactPCI peripheral processor brings scalable multi-
processing capability to the telecom and industrial automation markets. It is designed to
operate as a “slave” processor and can be installed in any CompactPCI peripheral slot
where a standard system processor, such as Kontron’s cPCI-MXS64 or cPCI-CXS, drives
the system slot. The cPCI- MXP64GX is also stand-alone operation capable, i.e., it is
capable of operation in systems were no system processor is installed.
Fully hot-swappable, the cPCI- MXP64GX communicates with other processor boards
using the CompactPCI backplane as the physical layer of a 1 Gb/s Ethernet.
To provide the necessary interconnect, Kontron developed IPTalky, a series of IP-Stacks
that currently support local versions of the following OSs: Microsoft Windows NT,
Microsoft Windows 2000, Linux, VxWorks and pSOS. Using the cPCI- MXP64GX’s
scalability, up to 15 loosely coupled x86 processors can be operated simultaneously in a
single 19” CompactPCI system.
Multi-level PCI-to-PCI bridging is fully supported. Based on Intel’s 21554 PCI-to–PCI
non-transparent bridge, the feature set of the cPCI- MXP64GX includes a rich selection of
standard peripherals.
The cPCI- MXP64GX offers a natural growth path to high performance, high availability
as well as hot swap and scalable multiprocessing technology.
The cPCI- MXP64GX can be ordered in either front I/O interfacing (video, serial port,
2xEthernet, all available on the face plate) or rear I/O interfacing through CPCI I/O
connectors J3 and J5 (no interconnection capability on the face plate).
CompactPCI Connectors
Rear I/O CPCI connectors are PICMG 2.0 Rev 3.0 compliant. CompactPCI connectors are
located at the rear edge of the processor board. The complete CPCI connector configuration
of the cPCI- MXP64GX is composed of four connectors referred to as J1, J2, J3, and J5.
Their function is described below:
J1 32 bit PCI signaling, power
J2 64 bit extension, arbitration, clocks, reset and. power
J3/J5 handle I/O signals.
CompactPCI

connectors are also known as 2mm Hard Metric connectors.

cPCI- MXP64GX Technical Reference manual
1-2
1.2 CPCI- MXP64GX TECHNICAL SPECIFICATIONS SHEET
Features Description
CPU •Pentium III processor Low Power at 500MHz to 700MHz
Cache •16K/16K Instruction / Data CPU-internal Level 1
•256KB 64-bit wide on-die Level 2 pipelined burst
Chipset •Intel 440GX AGP set
Bus Interfaces
•Front side bus 100MHz
•CompactPCI®Bus, 32-bit (33MHz) J1 and J2
•PCI-to-PCI 64-bit non-transparent bridge; Intel’s 21554
•PCI Mezzanine Card (PMC)
•cMC series mezzanines with PCI bus, Floppy and EIDE HD
support
•SMBus, IPMI compliant (for system management of CPU
temperature monitoring, DRAM control, Clock buffers and power
control)
Memory
•Three 168-pin latching DIMM sockets, 64/72-bit
(in 4HP configuration, uses Kontron’s memory module)
•Up to 1.5GB of SDRAM with parity or ECC (for single bit error
correction and double bit error detection)
Data Path •64-bit on CPU and video memory; 32-bit on local PCI and 32/64-
bits on CompactPCI bus
Interrupts •11 edge/level sensitive and configurable
•4 PCI level sensitive, configurable to any interrupt vector for PnP
compatibility
Flash Memory •512KB for BIOS field upgrade
•Silicon Serial ID TAG for unique board identification accessible via
software
I/O
•SMC FDC37C672
•USB Ports : Two
•Serial Ports: Two (one RS-232, COM1, COM2 configurable as RS-
232/422/485
•Parallel Port : One bi-directional with all IEEE 1284 protocols
supported with BIOS selectable IRQs and addressing
•Floppy Disk: Support for two drives (360KB to 1.44MB)
•EIDE: One channel Bus Master PCI EIDE; support for two IDE
drives (type 1 to 4, master/slave configuration); LBA, PIO Mode 0-
4 and Ultra DMA/33

Product Description
1-3
cPCI- MXP64GX Technical Specifications Sheet (cont’d)
Features Description
I/O (cont’d)
•CompactFlash™ Module: Optional bootable CompactFlash™ disk
interfaces to primary EIDE channel, user upgradeable,
master/slave
•Ethernet: Two Ethernet, PCI 10/100Base-TX ports Intel 82559
controller)
•HD/FD Mezzanine Card: Optionally onboard using Kontron’s cMC
series mezzanine cards
Video
•64-bit AGP video controller (Intel 69000) with 2MB on die video
memory
•CRT resolutions up to 1024x768x64K colors or 1280x1024x256
colors
Clock/Calendar •Real-time clock with (replaceable) battery backup
•CMOS RAM
Connectors in “Front”
configuration •CRT (15-pin D-sub); serial COM1 (9-pin D-sub); two Ethernet
ports (RJ-45 with link/activity indicators); PS/2 mouse/keyboard (6-
pin mini-Din)
Rear I/O on J3 and J5 •CRT; 2x serial; 2 x USB; 1 x parallel; SMBus; I2C; speaker I/F;
Reset; IR; 2 x Ethernet; PS/2 mouse; keyboard; 1 x EIDE; floppy
disk interface; fan fail monitoring
BIOS Features
•Award Elite BIOS in Boot Block Flash with emergency recovery
code; save CMOS in Flash option, and boot from LAN capability
•Auto configuration, extended setup;
•CC000-E0000 address blocking; PnP tables
•Setup console redirection to serial port (VT100 mode) with CMOS
setup access
•Software enable/disable of onboard Ethernet; hardware
enable/disable of onboard video
•Diskless, keyboardless, and videoless operation extensions
•System, video, and LAN BIOS shadowing system, video, LAN and
option BIOS shadowing
•Programmable bus and I/0 speeds and memory wait states
•Advanced Configuration and Power Interface (ACPI 1.0),
Advanced Power Management (APM 1.2), advanced thermal
management (resume, overheat alarm and auto slow down), and
Green support
Supervisory
•Two-stage software programmable Watchdog timer drives NMI on
first stage and system reset on second stage
•Programmable CPU temperature monitor alarm
•Power failure/low battery detector
•Front Panel LEDs: IDE activity, Ethernet activity and link and hot
swap status.

cPCI- MXP64GX Technical Reference manual
1-4
cPCI- MXP64GX Technical Specifications Sheet (cont’d)
Features Description
OS Compatibility •MS-DOS™, Windows®95/98, Windows®NT, Windows2000,
VxWorks™, pSOS™, QNX™, Linux, and Solaris
PICMG compliance •Mechanical : compliant to IEEE 1101.10; compliant to PICMG 2.0
R3.0 and PICMG 2.1
Form Factor
•233 x 160 x 41 mm / 9.2 x 6.3 , 1.6 in; 6U x 8HP (dual slot)
Mechanically
•233 x 160 x 20.5 mm / 9.2 x 6.3 , 0.8 in; 6U x 4HP (single slot)
Mechanically
Power Requirements
•Supply Voltages: +3.3V ±5% +5V±5% +12V±5%
•Supply Current * : 3.3V: 4.5 Amps max.
5V: 3 Amps max.
12V: 0.01 Amps max.
-12V: 0.01 Amps max.
•Power Dissipation: 40W max.
* Pentium III processor Low Power 500MHz with 1.5GB SDRAM.
Environmental
Operating Storage and Transit
Temp.: 0-60°/32-140°F (w/ 150LFM airflow) -40°to +70°/ -40°to 158°F
Humidity 5% to 95% @ 40°C/104°F 5% to 95% @ 40°C/104°F
non-condensing non-condensing
Altitude 4,572m / 15,000ft
Shock Designed to meet IEC 68-2-27
Vibration Designed to meet IEC 68-2-6
Reliability
•MTBF:> 100,000 hours 55°C/131°F (MIL-HDBK-217F)
•Board serial number in EEPROM
•USB, keyboard, mouse voltage protected by self-resetting fuses
•2 year limited warranty
Safety •Designed to meet or exceed UL 1950; CSA C22.2 No 950; EN
60950; IEC950
EMI/EMC •FCC 47 CFR Part 15/CISPR22, Class B; CE Mark to
EN55022/EN50082

Product Description
1-5
1.2.1 Power requirements
The power requirements for the cPCI- MXP64GX are specified as follows:
CPU VCORE
Frequency
(in MHz)
Int. / Ext.
Power MAX
(in Watts)
3.3V/5V/12V
Power TYP
(in Watts)
3.3V/5V/12V
Power SUS
(in Watts)
3.3V/5V/12V
Ambient
temp.
MAX
PIII, 500MHz 1.35 V 500 / 100 16.2 / 10.3 8.8 / 7.1 6.6 / 1.2 60°C
PIII, 700MHz 1.60 V 700 / 100 16.5 / 15.9 8.8 / 9.5 6.7 / 1.3 60°C
Where :
Power MAX Running memory benchmark in Windows NT for 3.3Volts
Running Hiwpwr30 in Windows NT for 5Volts
Power TYP At DOS prompt
Power SUS At DOS prompt
Test condition 256MB SDRAM, mezzanine with hard disk drive

cPCI- MXP64GX Technical Reference manual
1-6
1.3 HOT SWAP CAPABILITY
The cPCI- MXP64GX is Hot Swappable, which means it can be installed and removed
under power.
Hot Swap consists of two (2) distinct elements:
1- Hardware Connection Layer,
2- Hot-Swap Services.
Upon insertion of the board the hardware connection layer will power-up and initialize
the board, the Hot-Swap Services provide the means for reconfiguring the system.
High Availability: Under PICMG 2.1 Hot Swap specifications 3 levels of hot swap
have been defined:
Level 1 Basic hot swap;
Level 2 Full hot swap;
Level 3 High availability.
The cPCI- MXP64GX is compliant to level 3, PICMG’s highest hot swap level.
Hardware Connection Layer: Electrically, 3 pins are dedicated to hot swap
functionality. They are BD_SEL#, HEALTHY# and PCI_RST#.
BD_SEL# It is the shortest pins. This pin is the last to mate and the first to
break contact. This ensures that the sensing of its connection
takes place at a time when all other pins are reliably connected.
It has two functions:
1- It is used to indicate to the CompactPCI® system that a
board is properly inserted in a particular slot;
2- It allows the CompactPCI® system to power up/down a
particular board.
HEALTHY# Once a CompactPCI® board is properly inserted and powered,
this signal is used to indicate its readiness for operation. In cases
of failure, this pin can be used to indicate such an instance to the
rest of the CompactPCI® system.
PCI_RST# As defined by the CompactPCI® Specification, this is a signal
on the backplane, driven by the system host. Platforms may
implement this signal as a radial signal from the Hot Swap
Controller to further control the electrical connection process.
Platforms that do this must OR the system host’s reset signal
with the slot specific signal to maintain the bussed signal’s
function.

Product Description
1-7
The Hot Swap Services interface with the rest of the system via the ENUM# signal, a
switch located in the CompactPCI® insertion/extraction handle as well as a Blue LED.
Hot Swap Level 3 compliant boards use the ENUM# signal to indicate a service
request to the CompactPCI® system processor. This signal is provided among other
things, to notify the system processor that either a board has been newly inserted or is
about to be extracted. This signal informs the system processor that the configuration
of the system has changed or is about to change. The system processor is then free to
perform any necessary maintenance such as installing/removing device drivers. The
application that is using the resources of the particular board can also be notified of the
change.
The Hot Swap Switch implemented in the CompactPCI® handle allows the operator to
start the extraction sequence. A blue LED, located on the faceplate, is illuminated
when it is safe to extract the board. This LED indicates that the system software has
been placed in a state for orderly extraction of the board. The hardware connection
layer provides protection only for the hardware during insertions and extractions.
All actions are initiated by the operator, and must be performed in the correct
sequence for proper system operation.
Hot Swap level 3 complaint boards present the following resources to software
executing on the system host (nominally implementing the Hot-Swap Services and
Hot-Swap System Driver)
 An ENUM# signal, which is an open collector (open drain) bussed signal, to
signal a change in status for the board.
 A switch actuated with the lower ejector handle, indicating the beginning of
the extraction process or end of the insertion process.
 A blue LED located on the faceplate of the compliant board is used to
indicate the status of the software connection process.
 A set of four control and status bits (located in the I21554 bridge chip) on
each compliant board allows the system host’s software to determine the
source of the ENUM# signal and control the LED.
High Availability compliant boards support the full range of system capabilities.