LSIS XGT Series User manual

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Programmable Logic Controller
RAPIEnet I/F Module
User’s Manual
 Read this manual carefully before
installing, wiring, operating, servicing
or inspecting this equipment.
Keep this manual within easy reach
for quick reference.
XGL-EIMT
XGL-EIMF
XGL-EIMH
XOL-EIMT
XOL-EIMF
XBL-EIMT
XGT Series
http://eng.lsis.biz

Safety Instructions
Before using the product …
For your safety and effective operation, please read the safety instructions
thoroughly before using the product.
►Safety Instructions should always be observed in order to prevent accident
or risk with the safe and proper use the product.
►Instructions are divided into “Warning”and “Caution”, and the meaning of
the terms is as follows.
This symbol indicates the possibility of serious injury
or death if some applicable instruction is violated
This symbol indicates the possibility of severe or
slight injury, and property damages if some
applicable instruction is violated
Moreover, even classified events under its caution category may develop into
serious accidents relying on situations. Therefore we strongly advise users to
observe all precautions properly just like warnings.
►The marks displayed on the product and in the user’s manual have the
following meanings.
Be careful! Danger may be expected.
Be careful! Electric shock may occur.
►The user’s manual even after read shall be kept available and accessible to
any user of the product.
Warning
Caution

Safety Instructions
Safety Instructions for design process
Please install a protection circuit on the exterior of PLC so that the
whole system may operate safely regardless of failures from
external power or PLC. Any abnormal output or operation from PLC
may cause serious problems to safety in whole system.
- Install protection units on the exterior of PLC like an interlock circuit
that deals with opposite operations such as emergency stop,
protection circuit, and forward/reverse rotation or install an interlock
circuit that deals with high/low limit under its position controls.
- If any system error (watch-dog timer error, module installation error,
etc.) is detected during CPU operation in PLC, all output signals are
designed to be turned off and stopped for safety. However, there
are cases when output signals remain active due to device failures
in Relay and TR which can’t be detected. Thus, you are
recommended to install an addition circuit to monitor the output
status for those critical outputs which may cause significant
problems.
Never overload more than rated current of output module nor
allow to have a short circuit. Over current for a long period time may
cause a fire .
Never let the external power of the output circuit to be on earlier
than PLC power, which may cause accidents from abnormal output or
operation.
Please install interlock circuits in the sequence program for safe
operations in the system when exchange data with PLC or modify
operation modes using a computer or other external equipments
Read specific instructions thoroughly when conducting control
operations with PLC.
Warning

Safety Instructions
Safety Instructions for design process
Safety Instructions on installation process
I/O signal or communication line shall be wired at least 100mm
away from a high-voltage cable or power line. Fail to follow this
instruction may cause malfunctions from noise
Caution
Use PLC only in the environment specified in PLC manual or
general standard of data sheet. If not, electric shock, fire, abnormal
operation of the product may be caused.
Before install or remove the module, be sure PLC power is off. If
not, electric shock or damage on the product may be caused.
Be sure that every module is securely attached after adding a
module or an extension connector. If the product is installed
loosely or incorrectly, abnormal operation, error or dropping may be
caused. In addition, contact failures under poor cable installation will
be causing malfunctions as well.
Be sure that screws get tighten securely under vibrating
environments. Fail to do so will put the product under direct
vibrations which will cause electric shock, fire and abnormal
operation.
Do not come in contact with conducting parts in each module,
which may cause electric shock, malfunctions or abnormal operation.
Caution

Safety Instructions
Safety Instructions for wiring process
Prior to wiring works, make sure that every power is turned off. If
not, electric shock or damage on the product may be caused.
After wiring process is done, make sure that terminal covers are
installed properly before its use. Fail to install the cover may cause
electric shocks.
Warning
Check rated voltages and terminal arrangements in each product
prior to its wiring process. Applying incorrect voltages other than
rated voltages and misarrangement among terminals may cause fire
or malfunctions.
Secure terminal screws tightly applying with specified torque. If
the screws get loose, short circuit, fire or abnormal operation may be
caused. Securing screws too tightly will cause damages to the module
or malfunctions, short circuit, and dropping.
*
Be sure to earth to the ground using Class 3 wires for FG
terminals which is exclusively used for PLC. If the terminals not
grounded correctly, abnormal operation or electric shock may be
caused.
Don’t let any foreign materials such as wiring waste inside the
module while wiring, which may cause fire, damage on the product
or abnormal operation.
Make sure that pressed terminals get tighten following the
specified torque. External connector type shall be pressed or
soldered using proper equipments.
Caution

Safety Instructions
Safety Instructions for test-operation and
maintenance
Don’t touch the terminal when powered. Electric shock or abnormal
operation may occur.
Prior to cleaning or tightening the terminal screws, let all the
external power off including PLC power. If not, electric shock or
abnormal operation may occur.
Don’t let the battery recharged, disassembled, heated, short or
soldered. Heat, explosion or ignition may cause injuries or fire.
Warning
Do not make modifications or disassemble each module. Fire,
electric shock or abnormal operation may occur.
Prior to installing or disassembling the module, let all the
external power off including PLC power. If not, electric shock or
abnormal operation may occur.
Keep any wireless equipment such as walkie-talkie or cell phones
at least 30cm away from PLC. If not, abnormal operation may be
caused.
When making a modification on programs or using run to modify
functions under PLC operations, read and comprehend all
contents in the manual fully. Mismanagement will cause damages to
products and accidents.
Avoid any physical impact to the battery and prevent it from
dropping as well. Damages to battery may cause leakage from its
fluid. When battery was dropped or exposed under strong impact,
never reuse the battery again. Moreover skilled workers are needed
when exchanging batteries.
Caution

Safety Instructions
Safety Instructions for waste disposal
Product or battery waste shall be processed as industrial waste.
The waste may discharge toxic materials or explode itself.
Caution

Revision History
Revision History
Version
Date
Details
Page
V1.0
’08.01
FirstEdition
-
V1.1
’10.03
1.NumberofmodulesavailablebyCPU types
(newmodeladded)
2. Specificationadded
Ch1.3.2
Ch2.2
V1.2
’10.09
XGBRAPIEnetadded
-
V1.3
’11.05
How toenablelinkthroughflagadded
Ch5.5.2
※ The number of User’s manual is indicated right part of the back cover.
Copyright ⓒ2005LSIS Co.,Ltd AllRightsReserved.

About User’s Manual
1
Thankyoufor purchasingPLC ofLSISCo.,Ltd.
Before use, make sure to carefully read and understand the User’s Manual about the functions, performances, installation and
programming of the product you purchased in order for correct use and importantly, let the end user and maintenance
administratortobeprovidedwith theUser’sManual.
The User’s Manual describes the product. If necessary, you may refer to the following description and order accordingly. In
addition,youmayconnectourwebsite(http://eng.lsis.biz/)anddownloadtheinformationasaPDFfile.
RelevantUser’sManuals
Title
Description
XG5000User’s Manual
XG5000 softwareusermanualdescribingonlinefunction suchas
programming, print, monitoring, debugging by using XGK, XGB
CPU
XG5000 User’s Manual
(forXGI,XGR)
XG5000 software user manual describing online function such
as programming, print, monitoring, debugging by using XGI,
XGRCPU
XGK/XGBInstructions&Programming
User’s Manual
User’s manual for programming to explain how to use
instructionsthatareusedPLCsystemwithXGK,XGBCPU.
XGI/XGRInstructions&Programming
User’s Manual
User’s manual for programming to explain how to use
instructionsthatareusedPLCsystemwithXGI,XGRCPU.
XGK CPU User’s Manual
(XGK-CPUA/CPUE/CPUH/CPUS/CPUU)
XGK-CPUA/CPUE/CPUH/CPUS/CPUU user manual describing
about XGK CPU module, power module, base, IO module,
specification of extension cable and system configuration, EMC
standard
XGI CPU User’s Manual
(XGI-CPUU)
XGI-CPUU user manual describing about XGK CPU module,
power module, base, IO module, specification of extension cable
andsystemconfiguration,EMCstandard
XGR redundant series User’s
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XGR-CPUU user manual describing about XGR CPU module,
power module, extension drive, base, IO module, specification of
extensioncableandsystemconfiguration,EMCstandard

Contents
1
◎Contents ◎
Chapter 1 Introduction
1.1Introduction-----------------------------------------------------------------------------------------------------------------------------------------------1-1
1.2Features---------------------------------------------------------------------------------------------------------------------------------------------------1-2
1.3ProductConfiguration --------------------------------------------------------------------------------------------------------------------------------1-3
1.3.1Type -------------------------------------------------------------------------------------------------------------------------------------------1-3
1.3.2NumberofmodulesavailablebyCPUtypes --------------------------------------------------------------------------------------1-3
1.4SoftwareforProduct ----------------------------------------------------------------------------------------------------------------------------------1-4
1.4.1CheckpointforSoftware ----------------------------------------------------------------------------------------------------------------1-4
1.4.2XG-PD ----------------------------------------------------------------------------------------------------------------------------------------1-4
1.4.3Versioninformation -----------------------------------------------------------------------------------------------------------------------1-5
Chapter 2 Product Specifications
2.1GeneralSpecifications--------------------------------------------------------------------------------------------------------------------------------2-1
2.2PerformanceSpecifications-------------------------------------------------------------------------------------------------------------------------2-3
2.2.1ExpectationofCommunicationLoad------------------------------------------------------------------------------------------------2-5
2.3StructureandCharacteristics-----------------------------------------------------------------------------------------------------------------------2-7
2.4CableSpecifications-----------------------------------------------------------------------------------------------------------------------------------2-9
2.4.1ExpectationofCommunicationLoad------------------------------------------------------------------------------------------------2-9
2.4.2Opticalcable-------------------------------------------------------------------------------------------------------------------------------2-11
Chapter 3 Installation and Test Operation
3.1InstallationEnvironment------------------------------------------------------------------------------------------------------------------------------3-1
3.2PrecautionforHandling------------------------------------------------------------------------------------------------------------------------------3-6
3.3 Sequence from installation to operation ---------------------------------------------------------------------------------------------------------3-7
3.3.1RAPIEnetI/FModuleforPLC-----------------------------------------------------------------------------------------------------------3-7
3.3.2RAPIEnetI/FmoduleforPC-------------------------------------------------------------------------------------------------------------3-8
3.4ParametersettingintheXG-PD-------------------------------------------------------------------------------------------------------------------3-9
3.4.1Parametersetting---------------------------------------------------------------------------------------------------------------------------3-9
3.5I/OAllocationandDeviceInformation---------------------------------------------------------------------------------------------------------- 3-10
3.5.1I/Oallocation-------------------------------------------------------------------------------------------------------------------------------- 3-10
3.6Installation---------------------------------------------------------------------------------------------------------------------------------------------- 3-15
3.6.1InstallationofXGL-EIMTandXOL-EIMT ------------------------------------------------------------------------------------------ 3-15
3.6.2InstallationofXGL-EIMFandXOL-EIMF ----------------------------------------------------------------------------------------- 3-17
3.6.3InstallationofXGL-EIMH -------------------------------------------------------------------------------------------------------------- 3-18
3.7TestOperation---------------------------------------------------------------------------------------------------------------------------------------- 3-19
3.7.1Precautionsforsystemconfiguration------------------------------------------------------------------------------------------------ 3-19
Chapter 4 System Configuration
4.1AvailableSystemConfiguration--------------------------------------------------------------------------------------------------------------------4-1
4.1.1Ringtypesystemwithelectricmodule------------------------------------------------------------------------------------------------4-1
4.1.2Ringtypesystemwithopticalmodule------------------------------------------------------------------------------------------------4-3
4.1.3Ringtypesystemwithcombinedmodule--------------------------------------------------------------------------------------------4-4
4.1.4Linetypesystemwithopticalmodule-------------------------------------------------------------------------------------------------4-5

Contents
2
Chapter 5 Communication Parameters
5.1Introduction---------------------------------------------------------------------------------------------------------------------------------------------5-1
5.1.1High-speedlinksettingparameters-----------------------------------------------------------------------------------------------------5-1
5.1.2P2PSettingParameters -----------------------------------------------------------------------------------------------------------------5-2
5.1.3ComparisonbetweenhighspeedlinkandP2P-------------------------------------------------------------------------------------5-3
5.2InstallationandExecutionofSoftware --------------------------------------------------------------------------------------------------------5-4
5.2.1InstallationofXG5000 --------------------------------------------------------------------------------------------------------------------5-4
5.2.2InstallationofUSBdevicedriver -------------------------------------------------------------------------------------------------------5-7
5.2.3ConfirmationofinstalledUSBdevicedrive------------------------------------------------------------------------------------------5-11
5.3RegistrationofCommunicationModule------------------------------------------------------------------------------------------------------ 5-18
5.3.1Off-lineregistration ------------------------------------------------------------------------------------------------------------------------ 5-18
5.3.2On-lineregistration------------------------------------------------------------------------------------------------------------------------ 5-19
5.3.3HowtoreadtheparametersavedinthePLC------------------------------------------------------------------------------------- 5-20
5.3.4Modulesettingmethod------------------------------------------------------------------------------------------------------------------- 5-21
5.3.5MenubarandshortcutofXG-PD----------------------------------------------------------------------------------------------------- 5-22
5.4Howtosettheparameteraccordingtoservice-------------------------------------------------------------------------------------------- 5-23
5.4.1High-speedlinkservice------------------------------------------------------------------------------------------------------------------ 5-23
5.4.2P2PService ------------------------------------------------------------------------------------------------------------------------------- 5-26
5.5OperationStart-up---------------------------------------------------------------------------------------------------------------------------------- 5-27
5.5.1 XG-PDsetting------------------------------------------------------------------------------------------------------------------------------ 5-27
5.5.2Whenoperatinginhighspeedlinkservice----------------------------------------------------------------------------------------- 5-28
5.5.3OperatinginP2Pservice---------------------------------------------------------------------------------------------------------------- 5-34
Chapter 6 High-speed Link
6.1Introduction---------------------------------------------------------------------------------------------------------------------------------------------6-1
6.2HSlinkTx/RxDataProcessing-------------------------------------------------------------------------------------------------------------------6-2
6.3OperationSequencethroughHigh-speedLink----------------------------------------------------------------------------------------------6-3
6.4 HSlinkparameterssetting-------------------------------------------------------------------------------------------------------------------------6-4
6.4.1HSlinkparameterssettingofXG-PD--------------------------------------------------------------------------------------------------6-4
6.5High-speedlinkinformation------------------------------------------------------------------------------------------------------------------------6-9
6.5.1High-speedlinkflag-------------------------------------------------------------------------------------------------------------------------6-9
6.5.2MonitorofHigh-speedlinkinformation------------------------------------------------------------------------------------------------6-11
Chapter 7 P2PService
7.1Introduction---------------------------------------------------------------------------------------------------------------------------------------------7-1
7.2 P2PInstruction----------------------------------------------------------------------------------------------------------------------------------------7-1
7.3P2PApplication---------------------------------------------------------------------------------------------------------------------------------------7-2
7.3.1FunctionsandsettingofP2P-----------------------------------------------------------------------------------------------------------7-4
7.4OperationSequenceofP2PService-----------------------------------------------------------------------------------------------------------7-6
7.5P2PServiceInformation----------------------------------------------------------------------------------------------------------------------------7-7
7.5.1P2PservicefromtheXG-PDsystemdiagnosis-----------------------------------------------------------------------------------7-7

Contents
3
Chapter 8 Remote Connection Service
8.1Introduction-------------------------------------------------------------------------------------------------------------------------------------------8-1
8.2SettingandConnection---------------------------------------------------------------------------------------------------------------------------8-2
8.2.1Remote1connection---------------------------------------------------------------------------------------------------------------------8-2
8.2.2Remote2connection---------------------------------------------------------------------------------------------------------------------8-5
Chapter 9 Example Program
9.1HighSpeedLinkProgram ----------------------------------------------------------------------------------------------------------------------9-1
9.1.1HighSpeedLinkparametersetting ------------------------------------------------------------------------------------------------9-1
9.1.2HowtosetHSlinkspeed ------------------------------------------------------------------------------------------------------------9-4
9.1.3HighSpeedLinkDiagnosisservice -----------------------------------------------------------------------------------------------9-5
9.2P2PProgram --------------------------------------------------------------------------------------------------------------------------------------9-6
9.2.1P2Pparametersetting ----------------------------------------------------------------------------------------------------------------9-6
9.2.2P2PDiagnosis ------------------------------------------------------------------------------------------------------------------------ 9-10
Chapter 10 Diagnostic Function
10.1Systemdiagnosis------------------------------------------------------------------------------------------------------------------------------ 10-1
10.2 Communication module information ----------------------------------------------------------------------------------------------------- 10-2
10.3 AutoScan---------------------------------------------------------------------------------------------------------------------------------------- 10-3
10.3.1Autoscan------------------------------------------------------------------------------------------------------------------------------ 10-3
10.3.2Cabledistancemeasurement ------------------------------------------------------------------------------------------------- 10-4
10.3.3Diagnosisonthestatusinformationofremotemodules----------------------------------------------------------------- 10-4
10.4Mediainformationdiagnosis---------------------------------------------------------------------------------------------------------------- 10-8
10.4.1Mediainformation------------------------------------------------------------------------------------------------------------------- 10-8
10.4.2Viewerrordetails-------------------------------------------------------------------------------------------------------------------- 10-9
10.5Troubleshooting-------------------------------------------------------------------------------------------------------------------------------10-10
10.5.1DiagnosisthroughcommunicationModuleLED--------------------------------------------------------------------------10-10
10.5.2DiagnosisofCommunicationModulethroughXG5000 ---------------------------------------------------------------10-11
10.5.3Checkingmodulehealthinesswithsystemlog----------------------------------------------------------------------------10-11
Appendix
A.1Terminology----------------------------------------------------------------------------------------------------------------------------------------A-1
A.2ListofFlags --------------------------------------------------------------------------------------------------------------------------------------A-3
A.2.1ListofSpecialRelays(F) -----------------------------------------------------------------------------------------------------------A-3
A.2.2ListofCommunicationRelays(L) --------------------------------------------------------------------------------------------- A-11
A.2.3ListofLinkdevice(N) -------------------------------------------------------------------------------------------------------------A-14
A.3Dimension----------------------------------------------------------------------------------------------------------------------------------------A-17
A.4Troubleshooting --------------------------------------------------------------------------------------------------------------------------------A-20
A.4.1Hardwarefailure---------------------------------------------------------------------------------------------------------------------A-20
A.4.2Interfacefailure-----------------------------------------------------------------------------------------------------------------------A-21
A.4.3CPUandinterfacefailureduringoperation ---------------------------------------------------------------------------------A-22
A.4.4High-speedlinkparametererror-------------------------------------------------------------------------------------------------A-23
A.4.5High-speedlinkoperationfailure------------------------------------------------------------------------------------------------A-24
A.5PerformanceTable ---------------------------------------------------------------------------------------------------------------------------A-25
A.5.1High-speedlinkperformancetable----------------------------------------------------------------------------------------------A-25
A.6ErrorCode---------------------------------------------------------------------------------------------------------------------------------------A-26
A.6.1P2Pclienterrorcode----------------------------------------------------------------------------------------------------------------A-26

Chapter 1 Introduction
1-1
Chapter 1 Introduction
1.1 Introduction
This User Manual describes the Ethernet RAPIEnet I/F module (hereinafter, RAPIEnet I/F Module) for the exclusive use on
dual port in the XGT PLC system network. The RAPIEnet I/F Module carries out the communication between the PLCs in the
XGT series on the basis of Ethernet communication, and provides two Ethernet ports which can be configured in line (daisy
chain) and ringstructure, enablingconstructionofnetworkwhich is moreflexible thanconventional star-type PLCcommunication
module.The RAPIEnet I/FModulecan be classified into2electrical ports (10/100BASE-TX),2optical ports(100BASE-FX), and
hybrid (10/100BASE-TX, 100BASE-FX) according to the media type. The Module is an interface module for data transmission
betweenPLCsusingtheseports.
Tocreatea program, refer to the followingmanuals together.
XG5000usermanual
XGKinstruction
XGKusermanual
XGI/XGRinstruction
XGI/XGRusermanual
Whenconfiguringcommunicationmodulesystem,payattention toeachprogramandmodule version.
1)Whenconfiguringa XGT RAPIEnet I/Fmodule system
XGTPLCXG5000(ProgrammingTool):V2.0orabove
XG-PD:V2.0orabove
XGKCPUseries:V2.0orabove
XGICPUseries:V2.0orabove
XGRCPU series: V1.0orabove
2)Whenconfiguringa XGBRAPIEnetI/Fmodulesystem
XGTPLCXG5000(ProgrammingTool):V3.3orabove
XG-PD:V3.3orabove
XBChigh-end typeCPUseries:V2.0or above

Chapter 1 Introduction
1-2
1.2 Features
The XGTRAPIEnet I/FNodulehasfollowingfeatures.
(1) SupportsIEEE802.3 Standard.
(2) Supportshighspeed linkbetweenRAPIEnetmodules forhighspeeddata communication.
(Max.64blocksfor transmission, max.128blocksforreception, min.5msofhighspeedlinkcycle)
(3)Provides100BASE-TX and 100BASE-FXmedia, andsupportsfullduplexof100Mbps.
(4) SupportsDynamicConnection/Disconnectionusing P2Pservice.
(5)Suitableforlargevolumedataexchange. (Max.highspeedlinkcommunicationrate:25,600*12 =307,200words)
(6)Max.24modulescanbeinstalledperCPUmodule, available for bothprincipal andextendedbases.However,in
theXGRsystem,themodulecanbeinstalledontheprincipalbaseonly.TheI/FcardforPCcanbeinstalled1per
1PC.
(7)Supportsringandline(daisychain)topologytoenableconstructionofnetworksmostsuitableforon-siteuse.Ring
topologystructuresupportsredundancyfunction.
(8)Optical,electrical,andhybridmodulesareprovidedfor variouscontrolnetworks,overcomingthe limitationin
distance.
(Built-inswitchingfunctionenablesconstructionofringandlinetopologywithoutadditionalswitchorhub,withreduced
wiringandimprovedflexibilityininstallation.)
(9) Providesalarm functionforstation number conflict.
(10)Auto Cross-Over function is provided forconvenientcablework.
(11)Cabledistancemeasuringfunctionisprovidedfortheuseofelectricalcable
(12)Network-basedsimultaneousOSupgrade
(13)Variousdiagnoses functions are provided.The status informationof modulesand networkis provided.
(a) CPUmodulestatus
(b) Communicationmodule status
(c) Communicationservice(high-speedlink, exclusiveservice, P2P)status
(d)Auto Scanfunctionprovides theinformationonthemodules belong to thecompanyconnected in the network
(e) Provides information on the type and data volume of packet received through communication module, which
enablesnetwork loadprediction.
(f)Diagnosisofcommunicationmodulesthroughnetwork
(14)Modulecanbesetupsimplywithstationnumber,withoutIP

Chapter 1 Introduction
1-3
1.3 Product Configuration
1.3.1 Type
Itdescribesproductspec.ofXGTRAPIEnetI/Fmodule.
Type
Description
Remarks
XGK/I/R
XGL-EIMT
Electric2ports
Category5orabove
XGL-EIMF
Optical2ports
XGL-EIMH
Electric1port, optical1port
XGB
XBL-EIMT
Electric2ports
Option
XOL-EIMT
Electric2ports
Multi-modeoptical cable of twowires
XOL-EIMF
Optical2ports
1.3.2 Number of modules available by CPU types
RAPIEnetI/FModulescanbeinstalledupto24setsregardlessofmainorextensionbases.Itisrecommendedto
installthemodulesonthemainbaseformaximumusability. The tablebelowshowsthetypesofservicesavailable
for eachCPU.Youcanusethistableforsystemconstruction consideringthenumberof communicationmodules.
Classification
XGK
XGI
XGRnote1)
XGB
PCI/F
Card
CPUH
CPUH
CPUA
CPUS
CPUE
CPUU
CPUH
CPUS
CPUE
CPUH/F
CPUH/T
XBC
Max. number of
modules using high
speedlink
12 note2)
2
1
Max. number of
modulesusingP2P
8note2)
2
-
Max. number of
module (including
the modules using
exclusiveservices)
24 note2)
2
1
Note1)TheRAPIEnetI/FModulecanbeinstalledonthemainbaseonlywhenusingXGRCPU.
Note
Note1)Installation positionofRAPIEnetI/Fmodule according toCPUtype
-When usingXGK/XGICPU,you caninstall the RAPIEnet I/Fmodule atmainbothbaseand expansion base.
-When usingXGR CPU, youcan installthe RPIEnet I/Fmodule at mainbaseonly.
Note2)ThenumberofXGR’s moduleusingP2P
-ForRAPIEnet,itcanbeinstalledatmainbasesothenumberofmoduleusingHighspeedlinkandP2Pisupto6.

Chapter 1 Introduction
1-4
1.4 Software for Product
It describes major programming tool and other developer’s software for using XGT RAPIEnet I/F module. For
moreaccurateapplicationofprogramandcommunication,itisusefultorefertothefollowsbeforeapplyingtothe
system.
1.4.1 Check point for Software
Category
Item
Communicationsetting
XGL-EIMT
Comm.Module forXGT
XG-PD
XGL-EIMF
XGL-EIMH
XBL-EIMT
XOL-EIMT
PCI interface hardware
Devicedriver(*.DLL)
Userapplication
(Visualbasic, VisualCetc.)
XOL-EIMF
Note
1)Theaboveprogramisdownloadableformthewebsitebelow.IfInternetisnotavailable,itisalsopossibleto
useitfromInstallationCD-ROMby visitingthecloseagency.
InternetWebsite:http://www.lsis.biz
2)XG5000andXG-PDareprogrammablethroughRS-232CportofCPUmoduleandUSB.Forthecabletype,
referto XGTCatalogProductExhibit(USB-301A, K1C-050A).
1.4.2 XG-PD
XG-PDisthededicatedcommunicationsoftwaresupportingbasicparametersetting,framecreationanddiagnosticsof
module andnetwork fortheoperation of allcommunication modules including RAPIEnet I/Fmodule.
The followingfigureshowstheinitialwindowwhenstartingXG-PD.
[Fig.1.4.1]XG-PDInitialWindow

Chapter 1 Introduction
1-5
1.4.3 Version information
BeforeusingRAPIEI/Fmodule,checktheversionofmodule.
(1)Check byXG-PD
Itdirectlyconnectscommunicationmoduleonlinetoreadtheinfoofcommunicationmodule.Duringnormalinterfacewith
CPU,itcanshowthe following information.
(a) RunXG-PD.
(b) Withonline connection,connect to CPU.
(c) IfconnectedtoCPU,itexecutes SystemDiagnosisofXG-PD.
(d) In the system diagnosis window from the online menu, place the mouse pointer on the pertinent communication
module.
(e) Double-click the communication module, or right-click the mouse button. Select detail information of the
communicationmodule.
[Fig.1.4.2]Checking module’s version by XG-PD
(2)Check by product’s case label
Each communication module is with module’s product info on its external case.
Ifonlinecheckisnotpossibleduetoabsenceof any externaldeviceinterfacingwitha PC,itcanbecheckedafterdetaching
amodule.
The rear side has product label showing the product’s type and version.

Chapter 2 Product Specifications
2-1
Chapter 2 Product Specifications
2.1 General Specifications
General specifications of XGT series are as shown below.
No.
Items
Specifications
Related standards
1
Operating
temperature
0 ~ 55 C
2
Storage
temperature
25 ~ 70 C
3
Operating
humidity
5 ~ 95%RH (Non-condensing)
4
Storage
humidity
5 ~ 95%RH (Non-condensing)
5
Vibration
resistance
Occasional vibration
-
Frequency
Acceleration
Amplitude
times
IEC61131-2
10 f 57Hz

0.075mm
10 times each
directions
(X, Y and Z)
57 f 150Hz
9.8m/s2(1G)

Continuous vibration
Frequency
Acceleration
Amplitude
10 f 57Hz

0.035mm
57 f 150Hz
4.9m/s2(0.5G)

6
Shock
resistance
Peak acceleration: 147 m/s2(15G)
Duration: 11ms
Half-sine, 3 times each direction per each axis
IEC61131-2
7
Noise
resistance
Square wave
Impulsenoise
1,500 V
LSIS standard
Electrostatic
discharge
4kV (Contact discharge)
IEC61131-2
IEC61000-4-2
Radiated
electromagnetic
field noise
80 ~ 1,000 MHz, 10V/m
IEC61131-2,
IEC61000-4-3
Fast
transient/bust
noise
Segm
ent
Power supply
module
Digital/analoginput/output
communication interface
IEC61131-2
IEC61000-4-4
Voltage
2kV
1kV
8
Environment
Free from corrosive gasses and excessive dust
9
Altitude
Upto2,000ms
10
Pollution
degree
2 or less
11
Cooling
Air-cooling
[Table 2.1.1] General specification for PLC
N0ote
1) IEC (International Electrotechnical Commission):
An international nongovernmental organization which promotes internationally cooperated standardization in
electric/electronic field, publishes international standards and manages applicable estimation system related with.
2) Pollution degree:
An index indicating pollution degree of the operating environment which decides insulation performance of the devices. For
instance, Pollution degree 2 indicates the state generally that only non-conductive pollution occurs. However, this state contains
temporary conduction due to dew produced.

Chapter 2 Product Specifications
2-2
General specifications of PC I.F card are as shown below.
No.
Items
Specification
Reference
1
Ambient Temp.
0℃∼+55℃
2
Storage Temp.
-25℃∼+70℃
3
Ambient humidity
5∼95%RH, (Non-condensing)
4
Storage humidity
5∼95%RH, (Non-condensing)
5
Noise Immunity
Square wave impulsenoise
±1,500V
LSIS internal test spec.
Electrostatic discharge
Voltage : 4kV
(Contact discharge)
IEC 61131-2,
IEC 61000-4-2
Radiated electromagnetic field noise
27 ~ 500MHz, 10 V/m
IEC 61131-2,
IEC 61000-4-3
6
Operation ambience
Free from corrosive gases and excessive dust
7
Altitude
Less than 2,000m
8
Pollution degree
Less than 2
9
Cooling method
Air-cooling
[Table2.1.2]General specification for PC I/F card
N0ote
1) IEC (International Electrotechnical Commission):
An international nongovernmental organization which promotes internationally cooperated standardization in
electric/electronic field, publishes international standards and manages applicable estimation system related with.
2) Pollution degree:
An index indicating pollution degree of the operating environment which decides insulation performance of the devices. For
instance, Pollution degree 2 indicates the state generally that only non-conductive pollution occurs. However, this state contains
temporary conduction due to dew produced.

Chapter 2 Product Specifications
2-3
2.2 Performance Specifications
Specifications for system configuration are as described below according to media of RAPIEnet I/F module. Refer to the
table below for system configuration.
Item
XGK/I/R
XGB
100BASE-FX
100BASE-TX
100BASE-TX
Transmission
Specification
Baud rate
100Mbps
100Mbps
100Mbps
Transmission Type
Base band
Max. extended length between nodes
2km
100m
100m
Max. number of nodes
64
Max. protocol size
1,516 byte
Access method to service zone
CSMA/CD
Frame error check
CRC 32 = X32 + X26 + X23+ ,,,,,+ X2 + X+ 1
Max.
equipment no.
note1)
PLC
12
2
PC
1
-
Equip-able
location
PLC
XGK-CPUU/H,
XGI-CPUU
Main base ~ extension step 7
-
-
XGK-CPUE
Main base ~ extension step 1
-
XGK-CPUA/S,
XGI-CPUH/S
Main base ~ extension step 3
-
XGR-CPUH/F,
XGR-CPUH/T
Main base
-
XBC
-
Main base
extension
PC
Empty PCI slot
-
Normal communication
guarantee
Max. 3,600(packet/sec)note2)
Max. 1,200
(packet/sec)note3)
Basic
Specification
Dimension (mm)
PLC
98(H) X 27(W) X 90(D)
PC
18(H) X 120(W) X 174(D)
-
Consumption
current (mA)
PLC
Electric: 330, Optical: 670, Combined:
510
Electric: 290
PC
Electric: 630, Optical: 630
-
Weight (g)
PLC
Electric: 102, Optical: 109, Combined:
105
Electric: 102
PC
Electric: 104, Optical: 128,