
Contents
59 38 399 D3352
D3352.076.01.26.02 09.2016 V
1General information ..................................................................... 1-5
1.1 Safety .................................................................................. 1-5
1.2 Device classes XGPlus / 3Dready and XG 5 / 3 / 3 PPE ....... 1-6
1.3 Operation notes ................................................................... 1-8
1.4 Demo mode – Operation without radiation release ........... 1-11
1.5 Demo mode – Repacking andtransport ............................ 1-13
1.6 List of software versions .................................................... 1-14
1.7 Software update ................................................................ 1-27
1.8 Opening the "Details" ........................................................ 1-37
1.9 Configuring X-ray components via the SIDEXIS Manager 1-39
1.10 The most important modules and components ................. 1-45
1.11 Cabling overview ............................................................... 1-50
1.12 Illustrations of boards ........................................................ 1-54
1.13 Remove covers ................................................................. 1-66
2Messages .................................................................................... 2-3
2.1 Help messages ................................................................... 2-4
2.2 System messages ............................................................... 2-6
2.3 Status displays .................................................................... 2-6
2.4 Error messages ................................................................... 2-6
2.5 List of error messages ......................................................... 2-9
2.6 List of available service routines ....................................... 2-59
3Troubleshooting .......................................................................... 3-3
3.1 Error logging memory .......................................................... 3-4
3.2 Check the CAN bus ............................................................. 3-6
3.3 Checking the boards ......................................................... 3-12
3.4 Checking the motors ......................................................... 3-15
3.5 Checking the light barriers ................................................ 3-16
3.6 Device leakage current too high ........................................ 3-17
3.7 Checking the cables .......................................................... 3-18
3.8 Error analysis of X-RAY control signal path:
up to unit hardware version AG
(with board DX41) ............................................................. 3-19
3.9 Error analysis of X-RAY control signal path:
unit HW version BA or higher
(without board DX41) ........................................................ 3-23
3.10 Checking data paths / Generating test images ................. 3-26