
L2 Repair Document TCLCommunication Ltd.
5045X/D/A/J/G/T/Y Level 2 Repair Document
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Content
1Level 2 repair process ..............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1 Warranty confirmation of L1..............................................................................................................5
2.2 Visual mechanical check...................................................................................................................6
2.3 Pretest...............................................................................................................................................7
3Software download .................................................................................................13
3.1 Equipments requested when download:......................................................................................13
3.2 Install driver.....................................................................................................................................14
3.3 SW download process....................................................................................................................16
4. Disassembly and assembly 5045...........................................................................24
4.1. ESD Safety......................................................................................................................................24
4.2. Disassembly tool.............................................................................................................................25
4.3. Disassembly process......................................................................................................................25
4.4. Reassembly Process......................................................................................................................34
4.5. Disassembly process evaluation ....................................................................................................35
5. Disassembly Complete...........................................................................................36
6. Level 2 repair...........................................................................................................36
6.1. power on issue.................................................................................................................................37
6.2. Charge issue....................................................................................................................................38
6.3. Display issue....................................................................................................................................39
6.4. Vibrator issue..................................................................................................................................40
6.5. Touch panel issue...........................................................................................................................41
6.6. SIM recognize issue........................................................................................................................42
6.7. TF card recognized issue................................................................................................................43
6.8. Main camera issue..........................................................................................................................44
6.9. Sub camera issue...........................................................................................................................45
6.10.MIC issue........................................................................................................................................46
6.11.Speaker issue..................................................................................................................................47
7. PCBA exchange.......................................................................................................47
8. Other component exchange...................................................................................48
9. Final test ..................................................................................................................48
APPENDIX 1 Packaging Requirements ........................................................................49