Zeiss GeminiSEM Series User manual

Instruction Manual
ZEISS GeminiSEM Series
Field Emission Scanning Electron Microscopy
Analytical Power for the Sub-Nanometer World

2
ZEISS GeminiSEM Series
Field Emission Scanning Electron Microscope
Original Instructions
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena
Germany
[email protected]
www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Straße 22
73447 Oberkochen
Germany
Document name: Instruction Manual ZEISS GeminiSEM Series
Revision: en(ko)02
Effective from: August 2018
© Jena 2018 by Carl Zeiss Microscopy GmbH - all rights reserved
349500-8038-000
This document or any part of it must not be translated, reproduced, or transmitted in any form or by any means, electronic or mechanical, including
photocopying, recording, or by any information or retrieval system. Violations will be prosecuted.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply, even in the absence of a specific
statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. Software programs will
fully remain the property of ZEISS. No program, documentation, or subsequent upgrade thereof may be disclosed to any third party, unless prior
written consent of ZEISS has been procured to do so, nor may be copied or otherwise duplicated, even for the customer’s internal needs apart from
a single back-up copy for safety purposes.
ZEISS reserves the right to make modifications to this document without notice.

Table of Contents
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 3
Glossary 8
1 About this Document 10
1.1 Text Conventions and Link Types 11
1.2 Safety Instructions and Additional Information 12
1.3 Related Documents 13
2 Safety 14
2.1 Intended Use 14
2.2 Safety Procedures 15
2.2.1 Safe Operation Conditions 15
2.2.2 Requirements for Personnel 16
2.2.3 Preventive Maintenance 16
2.2.4 Safe Handling of Spare Parts 16
2.3 Prevention of Hazards 17
2.3.1 Biological Hazards 17
2.3.2 Burn Hazards 17
2.3.3 Chemical Hazards 18
2.3.4 Electrical Hazards 19
2.3.5 Hazards Due to Accidental Misuse 19
2.3.6 High Pressure Hazards 20
2.3.7 Radiation Hazards 20
2.3.8 Suffocation Hazards 21
2.4 Safety Equipment 22
2.4.1 Protective Cover Panels 22
2.4.2 MAIN Switch 23
2.4.3 Emergency Off (EMO) Option 23
2.4.4 Locking Devices 24
2.4.4.1 Chamber Door Locking Device 24
2.4.4.2 Vacuum Locking Device 24
2.4.4.3 Interlock System of Optional Airlock 25
2.4.5 Lockout/Tagout Equipment 25
2.4.6 Safety Labels 26
3 Technical Data and Conformity 31
3.1 Product Specification | GeminiSEM 300 31
3.2 Product Specification | GeminiSEM 450 35
3.3 Product Specification | GeminiSEM 500 40
3.4 Installation Requirements 44
3.4.1 Layout and Connections 48
3.4.2 System Layout 49

Table of Contents
4Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
3.5 Declaration of Conformity 51
4 Device Description 52
4.1 System Overview 52
4.2 Main Components 54
4.2.1 Vacuum System 54
4.2.2 Vacuum System with Variable Pressure 56
4.2.2.1 Operating Principle of the Vacuum Modes 59
4.2.2.2 Beam Gas Path Length (BGPL) 60
4.2.3 Electron Optical Column | Gemini I Column (GeminiSEM 300
and GeminiSEM 500) 61
4.2.4 Electron Optical Column | Gemini II Column (GeminiSEM 450) 63
4.2.5 Gun Modes 65
4.2.6 Detectors 66
4.2.6.1 Principle of Signal Detection 66
4.2.6.2 Detectors Overview 67
4.2.6.3 InLens SE Detector 68
4.2.6.4 SE2 Detector 70
4.2.6.5 VPSE Detector 71
4.2.6.6 Chamber CCD Camera 72
4.2.7 Specimen Stage 73
4.2.8 Dual Joystick 74
4.3 Optional Components and Accessories 75
4.3.1 Optional Detectors 75
4.3.1.1 EsB Detector 75
4.3.1.2 CL Detector 76
4.3.1.3 AsB Detector 77
4.3.1.4 BSD Detector 78
4.3.1.5 BSD Detector 79
4.3.1.6 aBSD Detector 81
4.3.2 Control Panel 85
5 Software Description 87
5.1 User Interface 87
5.2 Graphical Control Elements 88
5.3 User Access Levels and User Privileges 89
5.4 SmartSEM Program Suite 91
6 Transport and Storage 93
7 Installation 96

Table of Contents
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 5
8 Operation 97
8.1 Starting the System 97
8.1.1 Energizing the Microscope 97
8.1.2 Starting the Microscope 98
8.1.3 Starting SmartSEM 98
8.1.3.1 Calling up the Help 99
8.2 Obtaining a First Image 100
8.2.1 Preparing the Specimen Holder 100
8.2.2 Loading the Specimen Chamber 102
8.2.3 Locating the Specimen 104
8.2.4 Switching on the Gun 106
8.2.5 Switching on the EHT 106
8.2.6 Acquiring an Image 107
8.2.7 Optimizing the Image 109
8.2.8 Saving the Image 111
8.3 Modifying Gun Parameters 112
8.3.1 Selecting the Gun Mode 112
8.3.2 Measuring the Probe Current 112
8.3.3 Changing the Extractor Voltage 114
8.4 Working with Different Apertures Configurations and Column
Modes 115
8.4.1 Determining the Installed Aperture Configuration | Gemini I
Column 115
8.4.2 Determining the Installed Aperture Configuration | Gemini II
Column 116
8.4.3 Selecting the Beam Mode | Gemini I Column 116
8.4.4 Selecting the Beam Mode | Gemini II Column 117
8.4.5 Controlling the Probe Current with Different Apertures 118
8.5 Setting Detection Parameters 119
8.5.1 Setting up the InLens SE Detector 119
8.5.2 Setting up the SE2 Detector 120
8.5.3 Setting up the VPSE Detector 121
8.5.4 Setting up the HE-SE2 Detector 122
8.5.5 Setting up the AsB Detector 123
8.5.6 Setting up the AsB4 Detector 124
8.5.7 Setting up the aBSD/BSD Detector 126
8.5.8 Setting up the CL Detector 129
8.5.9 Setting up the EsB Detector 130

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6Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
8.6 Working with Variable Pressure 131
8.6.1 Using VP Mode 131
8.6.1.1 Changing to VP Mode 131
8.6.2 Using Nano VP/XVP Mode 132
8.6.2.1 Preparing the System for Nano VP/XVP Operation 132
8.6.2.2 Aligning the Beamsleeve Aperture 133
8.6.2.3 Ideal Working Conditions in Nano VP/XVP Mode 134
8.6.2.4 Changing to Nano VP or XVP Mode 136
8.6.3 Returning to HV Mode 137
8.7 Shutting Down the System 138
8.7.1 Finishing the Work Session 138
8.7.2 De-energizing the Microscope 139
8.7.3 Performing a Lockout/Tagout 139
8.8 Performing an Emergency Shutdown 140
9 Maintenance and Repair 141
9.1 Maintenance Work 141
9.2 Maintenance Intervals 141
9.3 Change of Consumables and Chemicals 142
10 Troubleshooting 143
10.1 Overview 143
10.2 Chamber 146
10.2.1 Initializing the Stage 146
10.2.2 Replacing the Chamber Door Seal 146
10.3 Column 148
10.3.1 Baking out the Gun Head 148
10.3.2 Calibrating the Probe Current | Gemini II Column 149
10.4 Power Circuit 150
10.4.1 Checking the Position of the Circuit Breakers 150
10.5 Detectors 151
10.5.1 Lubricating the Rod 151
10.6 Apertures 152
10.6.1 Cleaning the Beamsleeve Apertures 152
11 Shutdown and Disposal 154
11.1 Putting the Microscope Out of Operation 154
11.2 Disposal 154
11.2.1 Disposing of Solid Waste (Consumables) 154
11.2.2 Disposing of the Microscope 154

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Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 7
12 Parts and Tools 155
12.1 Consumables 155
12.2 Spare Parts 155
12.3 Tools and Accessories 155
Index 157

Glossary
8Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
Glossary
A
Aperture Small opening in the beam path that forms and limits the electron or ion beam.
Astigmatism Lens aberration that distorts the shape of the electron beam, compensated by the
stigmator.
B
Backscattered Electrons High-energy electrons that are liberated from the specimen surface when the
specimen is hit by the primary electron beam.
Bakeout Degassing of surfaces of a vacuum system by heating during the pumping process.
Beam Booster Anode and liner tube of the Gemini column are connected mechanically and
electrically forming the beam booster. A booster voltage (UB, liner voltage) of
+8kV is applied to the beam booster, so that a high beam energy is maintained
throughout the entire column. The beam booster technique has two main
advantages: It minimizes beam widening, that may occur due to stochastic
electron-electron interactions. Consequently there is almost no loss in beam
brightness, even at low acceleration voltages. Secondly, the beam booster
technique enhances protection against external stray fields.
C
Condenser Device that collects and focuses the electron beam onto the specimen.
E
EM Server A server that implements the internal communication between control software
and microscope hardware.
Eucentric Type of stage, the rotation axes of which intersect in the same point. The specimen
surface is located in the eucentric point, where the tilt axis meets the beam axis.
This guarantees that the focus is maintained when the specimen is tilted at a
certain working distance.
Extractor Positive electrode that attracts electrons from the filament.
F
Faraday Cup Small insulated metal container, equipped with an aperture where electrons can
enter but not escape. Used to measure the probe current in the microscope.
Focus Wobble Function that sweeps the focus of the objective lens backwards and forward
through the focus on the specimen plane. When the aperture is misaligned a lateral
shift is observed.

Glossary
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 9
P
Penning Gauge Device for measuring high vacuum in the vacuum system.
Pre-vacuum Pump A pump for generating a pre-vacuum.
Primary Electrons Narrowly bundled beam of accelerated electrons that hit the specimen surface.
S
Schottky Field Emitter Type of electron source in which emission occurs at or near the work function
barrier.
Scintillator Substance that absorbs electrons and in response, fluoresces photons while
releasing the previously absorbed energy.
Secondary Electrons Low-energy electrons that are emitted from the specimen surface when the
specimen is hit by the primary electron beam. Secondary electrons are generated by
inelastic scattering.
Stigmator Compensates astigmatism (lens aberration), so that the electron beam becomes
rotationally symmetrical.
Suppressor Electrode (anode) that suppresses unwanted thermionic emission from the shank of
the Schottky field emitter.
X
X-ray Type of high energy electromagnetic radiation, that is generated during the
operation of electron microscopes.

1 About this Document 
10 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
1 About this Document
Welcome to the GeminiSEM Instruction Manual.
This manual is part of the FESEM workstation, hereinafter referred to as the
“microscope”. Read the instructions carefully. Keep the manual nearby the
microscope and hand it over to future owners of the microscope.
The manual is designed for operators who have been trained to operate the
microscope by a ZEISS service representative. Basic operator training and safety
instructions will be provided within the scope of initial start-up by ZEISS. Operators
of the microscope must not deviate from the instructions provided in this manual.
It is assumed that the operator is familiar with Windows based programs.
This manual contains the following chapters:
Chapter Content
Glossary Lists important technical terms.
About this Document Explains the function and structure of this manual.
Safety Summarizes important safety details.
Technical Data and
Conformity
Lists hardware specifications as well as the manufacturer’s declaration that the
equipment is in conformity with all applicable European Directives.
Device Description Describes the microscope and its main hardware components.
Software Description Provides an overview of the user interface.
Transport and Storage Provides details on transport and storage.
Installation Refers to the ZEISS service representatives.
Operation Contains information about starting the microscope and the software, obtaining a
first image, adjusting important parameters, and powering down the microscope,
also in emergency.
Maintenance and Repair Informs you about preventive maintenance work and intervals and the change of
consumables.
Troubleshooting Describes common issues and how to resolve them.
Shutdown and Disposal Summarizes notes on shutdown and disposal.
Parts and Tools Lists consumables, spare parts, tools, and accessories.
Index Lists keywords to help you find relevant information quickly.

1 About this Document|1.1 Text Conventions and Link Types
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 11
1.1 Text Conventions and Link Types
|
1.1
Text Conventions and Link Types
The following conventions are used in this manual:
Text Conventions
Convention Meaning
¢Click Start
¢Push the STANDBY button
¢Press Enter on the keyboard
The name of a control element is
written in bold letters.
Press <Ctrl+Alt+Del> Press multiple buttons on the
keyboard at the same time.
Select Tools > Goto Control Panel >
Airlock
Follow a path in the software.
Input text The font Courier highlights text to
be entered by the user.
Link Types
Link Type Meaning
See Safety Instructions and Additional
Information [}12].
Leads to the chapter Safety
Instructions and Additional
Information.

1 About this Document|1.2 Safety Instructions and Additional Information
12 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
1.2 Safety Instructions and Additional Information
|
1.2
Safety Instructions and Additional Information
The safety instructions in this manual follow a system of risk levels that are defined
as follows:
DANGER
Risk of injury
DANGER indicates an imminently hazardous situation which, if not avoided, will
result in death or serious injury.
WARNING
Risk of injury
WARNING indicates a potentially hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION
Risk of injury
CAUTION indicates a potentially hazardous situation which, if not avoided, may
result in minor or moderate injury.
NOTICE
Risk of property damage
NOTICE indicates a property damage message.
INFO
INFO indicates useful additional information and tips that can help you to make
your daily work easier. There is no risk for health or property involved.

1 About this Document|1.3 Related Documents
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 13
1.3 Related Documents
|
1.3
Related Documents
Software Manual SmartSEM
For detailed information on how to use the SmartSEM software for imaging and
hardware control, refer to the software manual SmartSEM.
For detailed information regarding the SmartSEM software refer to the SmartSEM
software manual.
Electronic Manual of the Microscope
All information contained in this instruction manual as well as the information
contained in the SmartSEM software manual is integrated in the Electronic Manual.
Instruction Manual for Options
For detailed information regarding optional accessories, refer to the respective
instruction manual in your document folder.
Product Specification and Installation Requirements
For details on technical data, refer to the documents Product Specification and
Installation Requirements.
Material Safety Data Sheets
Material safety data sheets (MSDS) of chemicals used in combination with the
microscope are contained in the document folder delivered with the microscope.

2 Safety|2.1 Intended Use
14 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
2 Safety
2.1 Intended Use
|
2.1
Intended Use
The microscope has been designed to generate an image or to analyze appropriate
specimens, which is achieved by scanning a focused electron beam across the
specimen. In addition to microscopic examination, the microscope also allows for
the modification of appropriate specimens. For these purposes, the specimen is
placed in the evacuated specimen chamber.
The microscope has been designed for the following applications:
Imaging
¢Image generation and specimen analysis can be performed by means of a
focused electron beam that is scanned across the specimen.
¢This application allows for the analysis of surface structures and near-surface
structures of appropriate specimens.
Analytics
¢Elemental analysis with optional EDS spectroscopy at the focused electron
beam position.
¢Crystal structure and orientation with optional EBSD detectors.
In combination with a gas injection system option, the microscope has been
designed for the following applications:
Gas-assisted deposition with the electron beam
¢A process gas in combination with a focused electron beam can be used to
deposit material onto the specimen surface.
Gas-assisted etching with the electron beam
¢This application enables an accelerated material removal by a focused electron
beam in combination with process gas.
INFO
Not for therapeutic, treatment or medical diagnostic evidence. Not all products
are available in every country. Contact your local ZEISS representative for more
information.

2 Safety|2.2 Safety Procedures
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 15
SmartSEM Software
The SmartSEM software is intended for the operation of ZEISS scanning electron
microscopes.
The SmartSEM software has to be run exclusively on a personal computer delivered
by ZEISS. Any other applications are not allowed.
Regarding the operation of the microscope, the following regulations must be met:
¢Only operate the microscope according to the operating conditions after
correct installation by a ZEISS service representative.
¢The microscope is only to be used by operators who have been trained by a
ZEISS service representative. Basic operator training and safety instructions will
be provided within the scope of initial start-up by ZEISS. Make sure that
everyone working with the microscope only performs the tasks for which he/
she is trained.
¢Operators of the microscope must not deviate from the instructions provided
in this manual.
¢Only perform preventive maintenance tasks described in this manual. All tasks
of maintenance, service, and repair not described in this manual have to be
performed by an authorized ZEISS service representative.
¢The microscope is to be used in a laboratory environment for commercial and
scientific purpose only.
Using the microscope for any other purpose is not allowed and can be hazardous.
2.2 Safety Procedures
|
2.2
Safety Procedures
2.2.1 Safe Operation Conditions
If the product safety labels are covered or worn or if any of the safety devices are
not in proper working condition, operation of the microscope can be hazardous.
¢Periodically check the function of safety equipment and that all protective
cover panels are installed.
¢Always follow the instructions given on the safety labels.
¢Inspect and clean the product safety labels to maintain good legibility.

2 Safety|2.2 Safety Procedures
16 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
2.2.2 Requirements for Personnel
Deviating from the instructions given in this manual and on the safety labels can be
hazardous or can lead to property damage.
¢Do not operate the microscope until you have completely read and understood
the entire user documentation delivered with the microscope.
¢Observe all safety labels on the microscope and within this manual.
¢Only operate the microscope according to the operating conditions after
correct installation by a ZEISS service representative.
¢Only ZEISS service representatives, who have specialized knowledge of
radiation protection, are permitted to service the microscope.
Operator Training
Within the scope of initial start-up, the ZEISS service representative will perform a
basic operator training. The basic operator training consists of fundamental
operation procedures including safety instructions. Besides, an introduction to basic
maintenance tasks will be given for an advanced operator, who has to be an
electrically skilled person. The training performed must be documented
appropriately.
Special application training is offered on request.
2.2.3 Preventive Maintenance
Deviating from the maintenance and repair tasks described in this manual can be
hazardous or can lead to property damage:
¢Only perform preventive maintenance and repair tasks described in this
manual.
¢All tasks of maintenance, service, and repair not described in this manual have
to be performed by an authorized ZEISS service representative.
¢To maintain best performance of the microscope, it is essential to perform
preventive maintenance on a regular basis. Moreover, it is recommended that
you conclude a service contract with your local ZEISS service representative or
organization.
2.2.4 Safe Handling of Spare Parts
Using spare parts that are not provided by ZEISS can be hazardous or can lead to
property damage:
¢Only genuine parts supplied by ZEISS are to be used in servicing the
microscope.
¢Contact your ZEISS service representative for information regarding how to
order spare parts.

2 Safety|2.3 Prevention of Hazards
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 17
¢Unless authorized by ZEISS, all spare parts should be installed by a ZEISS service
representative.
2.3 Prevention of Hazards
|
2.3
Prevention of Hazards
This section summarizes possible hazards and recommended safety procedures.
2.3.1 Biological Hazards
WARNING
Biological hazards
Biological substances may pose a threat to the health of humans and other
living organisms.
uKeep a logbook of the biological substances loaded into the microscope
and show it to the ZEISS service representatives before they perform any
work on the microscope.
2.3.2 Burn Hazards
NOTICE
Risk of property damage
Parts of the enclosure in the upper range of the column may become hot during
bakeout, particularly after a long bakeout cycle.
uDo not place any objects on the grids of the electron column during
bakeout.
uAfter the bakeout procedure, let surfaces cool down before working around
the column.
uOnly trained operators are allowed to perform the bakeout procedure.

2 Safety|2.3 Prevention of Hazards
18 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
2.3.3 Chemical Hazards
WARNING
Risk of injury: Aggressive or toxic chemicals
Aggressive or toxic chemicals can cause chemical burns.
uWhen handling aggressive or toxic chemicals, wear suitable protective
clothing, gloves, and eye/face protection.
uDo not eat, drink, or smoke while handling toxic chemicals.
uRefer to local safety regulations.
uRead and follow the instructions in the material safety data sheet of the
chemical. The material safety data sheet can be obtained from the supplier
of the chemicals.
WARNING
Risk of injury: Reaction products
Dangerous reaction products can be present in the specimen chamber during or
after operation.
uEnsure that there is an appropriate exhaust gas line to remove the waste
gas of the pre-vacuum pump and to transmit it to the outside.
uWear lint-free gloves when touching the inner parts of the specimen
chamber or the specimen.
CAUTION
Environmental risk: Disposal of aggressive or toxic chemicals
When disposing of aggressive or toxic chemicals, there is a threat of damage to
the environment.
uWhen disposing of waste that has been generated during a service
operation (e.g. used rotary pump oil), comply with all national and local
safety and environmental protection regulations.

2 Safety|2.3 Prevention of Hazards
Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000 19
2.3.4 Electrical Hazards
WARNING
Hazardous voltage inside the microscope
Contact may cause burn or electrical shock.
uDo not remove any parts.
uOnly authorized ZEISS service representatives are allowed to service the
microscope.
uDo not try to service the microscope yourself.
uDisconnect power before opening.
WARNING
High leakage current
Risk of electrical shock.
uEnsure proper grounding.
uDo not operate the microscope without the separate ground connection.
2.3.5 Hazards Due to Accidental Misuse
CAUTION
Risk of injury: Moving the specimen stage
Fingers can be trapped by the moving specimen stage.
uAlways close the chamber door before moving the specimen stage.
uTo remove parts fallen into or near to the stage use a tool (e.g. tweezers)
instead of your fingers.
CAUTION
Risk of injury: Closing the chamber door
Fingers can be pinched when closing the chamber door.
uUse the door handle to close the chamber door.
uEnsure not to get your fingers caught in the chamber door gap.

2 Safety|2.3 Prevention of Hazards
20 Instruction Manual ZEISS GeminiSEM Series|en02|349500-8038-000
NOTICE
Risk of property damage: Short working distance
When opening the specimen door, the microscope or specimen can be
damaged if the specimen stage is at a short working distance. If a BSD detector
is inserted, it can be damaged as well.
uAlways move the specimen stage to a long working distance before
opening the chamber door.
2.3.6 High Pressure Hazards
WARNING
Risk of injury or property damage: High pressure in gas cylinders
Gas cylinders containing for example nitrogen or compressed air have a high
internal pressure of approximately 200bar. If not properly handled, the
contained gas can abruptly escape and cause the gas cylinder to move in an
uncontrollable manner.
uObserve all safety labels on the gas cylinders and all safety instructions given
by the gas cylinder manufacturer.
uAlways operate gas cylinders in an upright position and secure them so they
will not tip over.
uBefore transporting gas cylinders, place protective caps on them.
2.3.7 Radiation Hazards
WARNING
Radiation hazard: X-rays
X-rays are generated inside the microscope during operation. This is unavoidable
because electrons are accelerated by voltages up to 30kV.
uDo not remove any parts around the column and chamber that are essential
for radiation protection.
uUse genuine ZEISS parts exclusively.
uEnsure that all local safety and X-ray protection regulations are met.
uOnly authorized ZEISS service representatives are allowed to service the
microscope.