Aaeon COM-KB User manual

COM-KB
COM Express Module
User’s Manual 2nd Ed
Last Updated: July 26, 2016

COM Express Module COM-KB
Copyright Notice
This document is copyrighted, 2016. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original manufacturer.
Information provided in this manual is intended to be accurate and reliable. However,
the original manufacturer assumes no responsibility for its use, or for any infringements
upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.
Preface
II

COM Express Module COM-KB
Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
Microsoft Windows is a registered trademark of Microsoft Corp.
Intel, Pentium, Celeron, and Xeon are registered trademarks of Intel Corporation
Core, Atom are trademarks of Intel Corporation
ITE is a trademark of Integrated Technology Express, Inc.
IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.
Preface
III

COM Express Module COM-KB
Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
COM-KB 1
M2.5 screws 5
Product DVD with User’s Manual (in pdf) and drivers 1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.
Preface
IV

COM Express Module COM-KB
About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the AAEON.com for the latest version of this document.
Preface
V

COM Express Module COM-KB
Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.
Preface
VI

COM Express Module COM-KB
17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICE’S PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.
Preface
VII

COM Express Module COM-KB
FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with
the same or equivalent type recommended by the manufacturer. Dispose of used
batteries according to the manufacturer’s instructions and your local government’s
recycling or disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le
constructeur. Recycler les batteries usées en accord avec les instructions du fabricant et
les directives gouvernementales de recyclage.
Preface
VIII

COM Express Module COM-KB
China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON Main Board/ Daughter Board/ Backplane
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
○
○
○
○
○
○
外部信号
连接器及线材
○
○
○
○
○
○
O:表示该有毒有害物质在该部件所有均质材料中的含量均在
SJ/T 11363-2006 标准规定的限量要求以下。
X:表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
备注:此产品所标示之环保使用期限,系指在一般正常使用状况下。
Preface
IX

COM Express Module COM-KB
China RoHS Requirement (EN)
Poisonous or Hazardous Substances or Elements in Products
AAEON Main Board/ Daughter Board/ Backplane
Component
Poisonous or Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
PCB & Other
Components
OO O O O ○
Wires &
Connectors
for External
Connections
OO O O O O
O
:
The quantity of poisonous or hazardous substances or elements found in each of the
component's parts is below the SJ/T 11363-2006-stipulated requirement.
X: The quantity of poisonous or hazardous substances or elements found in at least one of the
component's parts is beyond the SJ/T 11363-2006-stipulated requirement.
Note: The Environment Friendly Use Period as labeled on this product is applicable under normal
usage only
Preface
X

COM Express Module COM-KB
Table of Contents
Chapter 1 - Product Specifications........................................................................................ 1
1.1 Specifications............................................................................................................ 2
Chapter 2 – Hardware Information ....................................................................................... 4
2.1 Dimensions, Jumpers and Connectors ............................................................... 5
2.2 List of Jumpers ......................................................................................................... 7
2.2.1 DP0 (DDI1) Selection/DP1 (DDI2) Selection (SW1)................................... 7
2.2.2 Power Type Selection/RTC Clear/DDR3 Voltage Selection/LVDS
Backlight Selection (SW2)...............................................................................8
2.3 List of Connectors....................................................................................................9
2.3.1 AMD Debug Connector (CN1)...................................................................... 9
2.3.2 FAN connector (CN2) ...................................................................................... 9
2.3.3 SPI BIOS Program connector (CN3)...........................................................10
2.3.4 Battery Connector (CN4)..............................................................................10
2.3.5 EDP/18BIT LVDS Connector (CN5).............................................................10
2.3.6 18BIT LVDS Connector (CN6)......................................................................11
2.3.7 LPC Connector (CN7)....................................................................................12
2.3.8 SPI EC Program connector (CN8)...............................................................12
2.3.9 ROW_AB connector (CN9)...........................................................................13
2.3.10 ROW_CD connector (CN10) ........................................................................17
2.3.11 DDR3 SODIMM Connector (DIMM1).........................................................21
Chapter 3 - AMI BIOS Setup ................................................................................................ 22
3.1 System Test and Initialization ..............................................................................23
3.2 AMI BIOS Setup .....................................................................................................24
3.3 Setup submenu: Main ..........................................................................................25
3.4 Setup submenu: Advanced .................................................................................26
3.4.1 ACPI Setting ....................................................................................................27
3.4.2 Advanced: CPU Configuration ....................................................................28
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XI

COM Express Module COM-KB
3.4.3 Advanced: IDE Configuration ......................................................................29
3.4.4 Advanced: USB Configuration.....................................................................30
3.4.5 Advanced: Dynamic Digital IO ....................................................................32
3.4.6 Advanced: Power Management..................................................................33
3.4.6.1 Power Management: S5 RTC Wake Settings (Fixed Time)..........34
3.4.6.2 Power Management: S5 RTC Wake Settings (Dynamic Time) ...35
3.4.7 Advanced: On-Module IO Configuration .................................................36
3.4.7.1 On-Module IO Configuration: Serial Port 9 Configuration........37
3.4.7.2 On-Module IO Configuration: Serial Port 10 Configuration......38
3.4.8 Advanced: On-Module H/W Monitor .......................................................39
3.4.8.1 On-Module H/W Monitor: CPU Smart Fan Mode Configuration
(Full Mode) ...........................................................................................40
3.4.8.2 On-Module H/W Monitor: CPU Smart Fan Mode Configuration
(Manual Mode by PWM)...................................................................41
3.4.8.3 On-Module H/W Monitor: CPU Smart Fan Mode Configuration
(Auto Mode by PWM)........................................................................42
3.5 Setup submenu: Chipset......................................................................................43
3.5.1 Chipset: North Bridge ...................................................................................44
3.5.1.1 North Bridge: GFX Configuration....................................................45
3.5.2 Chipset: South Bridge....................................................................................48
3.6 Setup submenu: Boot...........................................................................................49
3.6.1 Setup submenu: BBS Priorities ....................................................................51
3.7 Setup submenu: Security .....................................................................................52
3.8 Setup submenu: Save & Exit ...............................................................................54
Chapter 4 – Drivers Installation............................................................................................ 55
4.1 Product CD/DVD ...................................................................................................56
Appendix A - Watchdog Timer Programming................................................................... 60
A.1 Watchdog Timer Initial Program ........................................................................61
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COM Express Module COM-KB
Appendix B - I/O Information .............................................................................................. 66
B.1 I/O Address Map ...................................................................................................67
B.2 Memory Address Map .........................................................................................69
B.3 IRQ Mapping Chart...............................................................................................70
Appendix C – Programming Digital I/O.............................................................................. 72
C.1 Digital I/O Register................................................................................................73
C.2 Digital I/O Sample Program................................................................................74
Preface
XIII

COM Express Module COM-KB
Chapter 1
Chapter 1 - Product Specifications

COM Express Module COM-KB
1.1 Specifications
System
Form Factor
COM Express Basic module, Pin-out Type 6,
COM. 0 Rev. 2.1
CPU
AMD Embedded G-series SoC APU
CPU Frequency
Quad (2 GHz), Dual (1.6 GHz)
Chipset
AMD® Embedded G-Series SoC
AMD GX-420CA SoC with AMD Radeon™HD
8400E Graphics(Quad)
GX-217GA SoC with AMD Radeon™HD
8280E Graphics (Dual)
Memory Type
DDR3/DDR3L 1333/1600, SODIMM x 1
Max Memory Capacity
8 GB
BIOS
AMI BIOS
Wake On LAN
Yes
Watchdog Timer
255 Levels
Power Requirement
Nominal: +12V,
Optional: +8.5V ~ +19V
Power Supply Type
AT/ATX
Power Consumption (Typical)
AMD GX-420CA 2.0GHz, 8GB memory, 100%
load, 1.2A@12V
Dimensions (L x W)
95 x 95 mm (3.74 x 3.74”)
Operating Temperature
0 ~ 60°C (32 ~ 140°F)
Chapter 1 – Product Specifications
2

COM Express Module COM-KB
Storage Temperature
-40 ~ 80°C (-40 ~ 176°F)
Operation Humidity
0 ~ 90% relative humidity, non-condensing
MTBF
80,000
Certification
CE/FCC Class A
Display
VGA/LCD Controller
AMD® eKabini integrated
Video Output
CRT, 24-bit dual channel LVDS (24 x 2),
eDP/LVDS (18 x 1), DDI x 2
I/O
Ethernet
Realtek® 8111E, Gigabit Ethernet
Audio
HD audio
USB
USB 3.0 x 2, USB 2.0 x 8
Serial Port
2-wire UART (Tx/Rx) x 2
HDD Interface
SATA x 2
Onboard SSD
-
Expansion Slot
PCI-Express [x1] x 5
LPC bus x 1
SMBus x 2
PCI-Express[x4] x 1 (PEG)
DI/O
GPIO 8-bit
TPM
-
Chapter 1 – Product Specifications
3

COM Express Module COM-KB
Chapter 2
Chapter 2 – Hardware Information

COM Express Module COM-KB
2.1 Dimensions, Jumpers and Connectors
Component Side
Chapter 2 – Hardware Information
5

COM Express Module COM-KB
Solder Side
Chapter 2 – Hardware Information
6

COM Express Module COM-KB
2.2 List of Jumpers
Please refer to the table below for all of the board’s jumpers that you can configure for
your application
Label
Function
SW1 DP0 selection/DP1 selection
SW2 Power type selection/RTC Clear/DDR3 Voltage
2.2.1 DP0 (DDI1) Selection/DP1 (DDI2) Selection (SW1)
DP0
Function
1
2
DP Off Off
HDMI/DVI Off On
eDP On Off
18 bit Single CH LVDS On On
DP1
Function
3
4
CH7511B (24 bit dual CH LVDS) Off Off
DP On Off
HDMI/DVI On On
Chapter 2 – Hardware Information
7
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