ADLINK Technology COM Express cExpress-TL User manual

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 1 Copyright © 2021 ADLINK Technology, Inc.
cExpress-TL
Revision: Rev. 1.0
Date: 2021-08-23
Part Number: 50M-00001-1000
User’s Guide

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 2 Copyright © 2021 ADLINK Technology, Inc.
Revision History
Revision Description Date Author
1.0 Initial release 2021-08-23 JC

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 3 Copyright © 2021 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2021 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 4 Copyright © 2021 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

cExpress-TL User’s Guide PICMG COM.0 R3.0
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Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 6 Copyright © 2021 ADLINK Technology, Inc.
Getting Service
Ask an Expert: http://askanexpert.adlinktech.com
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [email protected]
Ampro ADLINK Technology, Inc.
5215 Hellyer Avenue, #110, San Jose, CA 95138, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [email protected]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [email protected]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

cExpress-TL User’s Guide PICMG COM.0 R3.0
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Table of Contents
Revision History................................................................................................................................................................................................................................................................................................................. 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
List of Figures..................................................................................................................................................................................................................................................................................................................... 9
1. Introduction ...............................................................................................................................................................................................................................................................................................................10
2. Specifications.............................................................................................................................................................................................................................................................................................................11
2.1. Core System...................................................................................................................................................................................................................................................................................................................................11
2.2. Video ................................................................................................................................................................................................................................................................................................................................................12
2.2.1 Display Interface Support .............................................................................................................................................................................................................................................................................................13
2.3. Audio................................................................................................................................................................................................................................................................................................................................................13
2.4. Expansion Busses .........................................................................................................................................................................................................................................................................................................................13
2.5. Ethernet ...........................................................................................................................................................................................................................................................................................................................................14
2.6. Multi I/O and Storage ................................................................................................................................................................................................................................................................................................................14
2.7. Trusted Platform Module (TPM).............................................................................................................................................................................................................................................................................................15
2.8. SEMA Board controller...............................................................................................................................................................................................................................................................................................................15
2.9. Debug...............................................................................................................................................................................................................................................................................................................................................15
2.10. Power................................................................................................................................................................................................................................................................................................................................................16
2.11. Mechanical and Environmental...............................................................................................................................................................................................................................................................................................16
3. Block Diagram...........................................................................................................................................................................................................................................................................................................18
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................19
4.1. Pin Summary..................................................................................................................................................................................................................................................................................................................................19
4.2. Signal Terminology Descriptions ...........................................................................................................................................................................................................................................................................................24
4.3. AB Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................25
4.3.1 Audio....................................................................................................................................................................................................................................................................................................................................25
4.3.2 Analog VGA........................................................................................................................................................................................................................................................................................................................26
4.3.3 LVDS or eDP.......................................................................................................................................................................................................................................................................................................................27
4.3.4 Gigabit Ethernet ...............................................................................................................................................................................................................................................................................................................30
4.3.5 SATA .....................................................................................................................................................................................................................................................................................................................................31
4.3.6 PCI Express .........................................................................................................................................................................................................................................................................................................................32
4.3.7 LPC Bus................................................................................................................................................................................................................................................................................................................................34
4.3.8 USB........................................................................................................................................................................................................................................................................................................................................35
4.3.9 SPI Bus (BIOS only)..........................................................................................................................................................................................................................................................................................................36
4.3.10 Miscellaneous....................................................................................................................................................................................................................................................................................................................37

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4.3.11 SMBus ..................................................................................................................................................................................................................................................................................................................................38
4.3.12 I2C Bus.................................................................................................................................................................................................................................................................................................................................38
4.3.13 General Purpose I/O (GPIO).........................................................................................................................................................................................................................................................................................39
4.3.14 Serial Interface Signals...................................................................................................................................................................................................................................................................................................39
4.3.15 Power and System Management...............................................................................................................................................................................................................................................................................40
4.3.16 Power and Ground ..........................................................................................................................................................................................................................................................................................................41
4.4. CD Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................42
4.4.1 USB 3.0 Extensions ..........................................................................................................................................................................................................................................................................................................42
4.4.2 PCI Express .........................................................................................................................................................................................................................................................................................................................43
4.4.3 DDI1 Port ............................................................................................................................................................................................................................................................................................................................44
4.4.4 DDI2 Port ............................................................................................................................................................................................................................................................................................................................47
4.4.5 DDI3 Port ............................................................................................................................................................................................................................................................................................................................50
4.4.6 PCIe Graphics Port (PEG)...............................................................................................................................................................................................................................................................................................53
4.4.7 Module Type Definition.................................................................................................................................................................................................................................................................................................54
4.4.8 Power and Ground ..........................................................................................................................................................................................................................................................................................................55
5. Additional Features.................................................................................................................................................................................................................................................................................................56
5.1. Debug Connector ........................................................................................................................................................................................................................................................................................................................57
5.2. Status LEDs.....................................................................................................................................................................................................................................................................................................................................58
5.3. Exception Codes...........................................................................................................................................................................................................................................................................................................................59
5.4. Fan Connector...............................................................................................................................................................................................................................................................................................................................60
5.5. BIOS Default Reset Button........................................................................................................................................................................................................................................................................................................61
5.6. BIOS Boot Select...........................................................................................................................................................................................................................................................................................................................62
6. BIOS Checkpoints, Beep Codes..........................................................................................................................................................................................................................................................................63
7. Software Support.....................................................................................................................................................................................................................................................................................................64
7.1. Windows 10 IOT Enterprise 64-bit.........................................................................................................................................................................................................................................................................................64
7.2. Yocto Linux 64-bit........................................................................................................................................................................................................................................................................................................................64
7.3. Ubuntu.............................................................................................................................................................................................................................................................................................................................................64
7.4. VxWorks 64-bit .............................................................................................................................................................................................................................................................................................................................64
8. Mechanical and Thermal.......................................................................................................................................................................................................................................................................................65
8.1. Module Dimensions....................................................................................................................................................................................................................................................................................................................65
8.2. Thermal Solutions........................................................................................................................................................................................................................................................................................................................66
8.2.1 Heatspreader: HTS...........................................................................................................................................................................................................................................................................................................66
8.2.2 Heatsink: THS ....................................................................................................................................................................................................................................................................................................................67
8.2.3 Heatsink High Profile: THSH ........................................................................................................................................................................................................................................................................................68
8.2.4 Heatsink with Fan: THSF................................................................................................................................................................................................................................................................................................69

cExpress-TL User’s Guide PICMG COM.0 R3.0
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List of Figures
Figure 1 – Module function diagram......................................................................................................................................................................................................................................................................18
Figure 2 - Module rear side row and pin numbering ......................................................................................................................................................................................................................................19
Figure 3 – Module feature locations.......................................................................................................................................................................................................................................................................56
Figure 4 – cExpress-TL and Debug Module .........................................................................................................................................................................................................................................................57
Figure 5 – Module mechanical dimensions .........................................................................................................................................................................................................................................................65
Figure 6 – Heatspreader HTS.....................................................................................................................................................................................................................................................................................66
Figure 7 – Heatsink THS...............................................................................................................................................................................................................................................................................................67
Figure 8 – Heatsink High Profile THSH..................................................................................................................................................................................................................................................................68
Figure 9 – Heatsink with Fan THSF..........................................................................................................................................................................................................................................................................69

cExpress-TL User’s Guide PICMG COM.0 R3.0
Page 10 Copyright © 2021 ADLINK Technology, Inc.
1. Introduction
Warning: this is an EA (early available) engineering manual, meaning contents may not properly reflect the actual or final version of this product
The cExpress-TL is the first COM Express® COM.0 R3.0 Compact Size Type 6 module based on the ultra-low-power 11th Generation Intel® Core™
i7/i5/i3, Celeron® processors (formerly “Tiger Lake-UP3”) featuring a brand new Intel® Iris® Xe high performance graphics core and supporting
AVX512-VNNI (Vector Neural Network Instructions) that almost triples AI inferencing performance. A configurable power range of 12 to 28 watts makes
it ideally suited for fan less space-constraint embedded applications. Typical industries in need of such high performance, low power characteristics are
transport, medical, industrial automation and control, edge controllers, robotics and multi camera-based AI.
The cExpress-TL supports BIOS configurable In-band ECC (IBECC) that provides ECC level error correction on standard DDR4 memory. A maximum 64GB
DDR4 3200 MT/s memory capacity, wide operating temperature range, and MIL-STD environmental specifications make it well suited for mission critical
or extreme rugged applications.
The integrated Intel® Iris® Xe Graphics(Gen12) includes features such as OpenGL 4.5, DirectX 12, OpenCL 2.1/2.0/1.2, Intel® Clear Video HD
Technology, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, VP9 hardware codecs. In addition, High Dynamic Range is
supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and
three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option, with a maximum of four 4K displays supported.
Input/output features include up to eight PCIe Gen3 lanes (through a PCIe switch, project basis support) and PCIe x4 Gen4 lanes that can be used for
NVMe SSD, allowing applications access to the highest speed storage solutions, as well as a single onboard 2.5Gigabit Ethernet port (SKU dependent)
with optional Time Sensitive Network (TSN), four USB 3.2 Gen2 ports, four USB 2.0 ports, two SATA 6 Gb/s ports. Support is provided for SMBus and I2C.
The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and
watchdog timer.

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2. Specifications
2.1. Core System
CPU
11th Gen Intel® Core™ and Intel® Celeron® Processor (formerly “Tiger Lake UP3”)
• Intel® Core™ i7-1185G7E, 2.8(4.4) GHz, 12MB, 28W (15W-12W cTDP), 4C/Iris Xe (non-ECC)
• Intel® Core™ i5-1145G7E, 2.6(4.1) GHz, 8MB, 28W (15W-12W cTDP), 4C/Iris Xe (non-ECC)
• Intel® Core™ i3-1115G4E, 3.0(3.9) GHz, 6MB, 28W (15W-12W cTDP), 2C/UHD (non-ECC)
• Intel® Celeron® 6305E, 1.8GHz, 4MB, 15W, 2C/UHD (non-ECC)
• Intel® Core™ i7-1185GRE, 2.8(4.4) GHz, 12MB, 28W (15W-12W cTDP), 4C/Iris Xe (IBECC/non-ECC)
• Intel® Core™ i5-1145GRE, 2.6(4.1) GHz, 8MB, 28W (15W-12W cTDP), 4C/Iris Xe (IBECC/non-ECC)
• Intel® Core™ i3-1115GRE, 3.0(3.9) GHz, 6MB, 28W (15W-12W cTDP), 2C/UHD (IBECC/non-ECC)
Supporting: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost
Technology 2.0, Intel® AVX-512, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key,
Intel® TSX-NI (availability of features may vary between processor SKUs)
Memory
Up to 64GB 3200 MT/s DDR4 in two SODIMM sockets, maximum 32GB per socket
In-band ECC (IBECC) with standard DDR4 memory support on selected SKUs (Core™ i7-1185GRE, Core™ i5-1145GRE, Core™ i3-1115GRE)
Cache
12MB for Core™ i7, 8MB for Core™ i5, 6MB for Core™ i3, 4MB for Celeron®

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Embedded BIOS
AMI Aptio V UEFI with CMOS backup in 32 (or 16, TBC) MB SPI BIOS, dual BIOS by build option
2.2. Video
GPU
Intel® Iris® Xe Graphics (Gen12) core architecture for Core™ i7/ i5
Intel® Iris® UHD Graphics (Gen12) core architecture for Core™ i3, Celeron®
GPU Feature Support
4 independent and simultaneous combinations of DisplayPort/HDMI/LVDS graphics outputs (4x 4K @60Hz)
(eDP optional in place of LVDS, VGA optional in place of DDI 3)
Encode/transcode HD content
Playback of high-definition content including Blu-ray Disc and Blu-ray Disc 3D content using HDMI (1.4a spec compliant with 3D)
DirectX Video Acceleration (DXVA) support for accelerated video processing
HEVC/H.265, H.264, M/JPEG, MPEG2, AV1, WMV9, VP9 HW decode
HEVC/H.265, H.264, JPEG, VP9 HW encode
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX up to 12
OpenGL up to 4.5 and ES 2.0 support
OpenCL up to 2.1 support
Note: Availability of features s dependent on operating system (Windows 10 64-bit, Linux 64-bit).

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2.2.1 Display Interface Support
LVDS: Single/dual channel 18/24-bit LVDS through eDP to LVDS IC, supports DE mode and Hsync/Vsync mode.
Max. resolution 1920x1200@60Hz in dual mode. Pixel clock frequency up to 112 MHz. VESA and JEIDA panel data formats supported.
eDP: eDP 1.4b up to 4 lane support, in place of LVDS (BOM option), up to 4096x2304@60Hz bpp with DSC
DDI x3: Digital Display Ports (DDI) support DisplayPort 1.4a, HDMI 2.0b or DVI
VGA: VGA BOM option support in place of DDI 3; max. resolution 1920x1200@60Hz
2.3. Audio
Intel® HD Audio integrated
Located on carrier Express-BASE6 (ALC886 standard support)
2.4. Expansion Busses
5 PCI Express x1 Gen3: Lanes 0,1,2,3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only)
A PCIe switch is HW BOM option by project basis to offer more x1 lanes via Lanes 5,6,7
1 PCI Express x4 Gen4: Lanes 16, 17, 18, 19 (x4 only), Gen4 support dependent on carrier design
Other: SMBus (system), I2C (user), LPC bus (via eSPI to LPC bridge IC)

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2.5. Ethernet
2.5Gigabit Intel® Ethernet Controller i225 Series (V, IT or LM version)
Supports up to 2.5GbE and 1000/100/10 Mbit/s connections
V version supports up to 2.5GbE (without TSN, selected for Standard Operating Temperature SKU)
IT version supports TSN feature (at Linux OS) at maximum 2.5GbE connection (selected for Extreme Rugged Operating Temperature SKU)
GbE0_SDP available if TSN support enabled
Other combinations supported by project basis
2.6. Multi I/O and Storage
USB
4x USB 3.2 Gen2/2.0/1.1 (USB 0,1,2,3), 4x USB 2.0/1.1 (USB 4,5,6,7)
SuperSpeedPlus, SuperSpeed, High-Speed, Full-Speed and Low-Speed USB signalling
Note: Carrier board must be designed for Gen2 operation.
UART
Two UART interfaces SER0 and SER1 RX/TX on module
Console Redirection COM 1 or COM 2 selectable in BIOS
Up to 4 serial ports supported by standard BIOS, including Super I/O on carrier board
COM Port Description IRQ Address Console Redirection Support
COM 1 Supported by module (SER0, A98/A99), via embedded controller 4 0x3F8 Yes
COM 2 Supported by module (SER1, A101/A102), via embedded controller 3 0x2F8 Yes
COM 3 Supported by Super I/O (W83627DHG) on carrier board 5 0x240 Yes
COM 4 Supported by Super I/O (W83627DHG) on carrier board 7 0x248 Yes
SER0, SER1 from SoC HSUART are BOM option support by project basis

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GPIO or SD
4 GPO and 4 GPI (GPI with interrupt)
SATA
2x SATA 6Gb/s (SATA 0,1)
2.7. Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (SPI bus based)
TPM chip is BOM option
2.8. SEMA Board controller
Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control
2.9. Debug
30-pin flat cable connector for use with DB-30 x86 debug module
Supports BIOS POST code LED, embedded controller access, SPI BIOS flashing, internal power rail test points, debug LEDs

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2.10. Power
Power Modes: AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input: ATX: 12V±5% / 5Vsb ±5% or AT: 12V±5%
Wide Voltage Input: ATX: 8.5-20V, 5Vsb ±5% or AT: 8.5-20V
Power Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)
ECO Mode support for deep S5 for 5Vsb power saving
Power Consumption
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.
2.11. Mechanical and Environmental
Form Factor and specification
PICMG COM Express Rev 3.0 (COM.0 R3.0), Type 6, Compact size 95 x 95 mm
Operating Temperature
Standard 0°C to +60°C (Wide Voltage Input) Storage: -20°C to +80°C
Extreme Rugged -40°C to +85°C (Standard Voltage Input) Storage: -40°C to +85°C
(Selected SoC SKUs)
Humidity
5-90% RH operating, non-condensing, 5-95% RH storage (and operating with conformal coating)

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Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

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3. Block Diagram
C
AB
DDI 1
DDI 2
DDI 3
USB 3.0 Lane 3
USB 3.0 Lane 2
USB 3.0 Lane 1
USB 3.0 Lane 0
PCIe Lane 6-7
PEG Port
PCIe 16 -19
PCIe 20 -31
11th Generation
Intel® Core™, Celeron®ULT
(formerly Tiger Lake-UP3
)
DP to VGA
eDP to LVDS
(build option)
(build option), eDP 4lanes
SATA 6Gb/s
DDR4 SODIMM (top side)
3200 MT/s, non-ECC/IBECC
LAN
Controller
VGA
eDP/LVDS
USB 2.0 Lane 0-7
SATA Port 0-1
SATA Port 2-3
Max. 2.5GbE
PCIe Lane 0-3
PCIe Lane 4
PCIe Lane 5
HDA
SPI
SMBus
I2C
GPIO/SDIO
UART/CAN
LPC/eSPI
4PCIeGen3 (HSIO 4-7)
eSPI
TPM 2.0
(build option)
eSPI to LPC
I2C
HSUART
Thermal
Sensor
(board)
1PCIeGen4x4
DDI B
(DP, HDMI)
Embedded Controller
1 x4, 2 x2, 4 x1
1PCIeGen3
(HSIO 9)
DDI A TCP0 TCP1 DDI B
USB 3.2 Gen2 x1
USB 3.2 Gen2 x1
USB 3.2 Gen2 x1
USB 3.2 Gen2 x1
PCIe Gen3/2
Switch
2x1only
1PCIeGen3
(HSIO 8)
TSN dependent on controller SKU
BIOS
BIOS
DB30 x86
connector
(build option)
DDR4 SODIMM (bottom side)
3200 MT/s, non-ECC/IBECC
SMBus
Figure 1 – Module function diagram

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4. Pinout and Signal Descriptions
4.1. Pin Summary
The table below is a comprehensible list of all signal pins supported on the dual 220-pin COM Express connectors as defined for Type 6 in the PICMG
COM.0 R3.0 specification. Signals described in the specification but not supported on the cExpress-TL are strikethrough STRIKETHROUGH.
CD
AB
A1
B1
C1
D1
A110
Figure 2 - Module rear side row and pin numbering

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Row A Row B Row C Row D
A1 GND (FIXED) B1 GND (FIXED) C1 GND FIXED) D1 GND FIXED)
A2 GBE0_MDI3- B2 GBE0_ACT# C2 GND D2 GND
A3 GBE0_MDI3+ B3 LPC_FRAME#/ESPI_CS0# C3 USB_SSRX0- D3 USB_SSTX0-
A4 GBE0_LINK100# * B4 LPC_AD0/ESPI_IO_0 C4 USB_SSRX0+ D4 USB_SSTX0+
A5 GBE0_LINK1000# * B5 LPC_AD1/ESPI_IO_1 C5 GND D5 GND
A6 GBE0_MDI2- B6 LPC_AD2/ESPI_IO_2 C6 USB_SSRX1- D6 USB_SSTX1-
A7 GBE0_MDI2+ B7 LPC_AD3/ESPI_IO_3 C7 USB_SSRX1+ D7 USB_SSTX1+
A8 GBE0_LINK# B8 LPC_DRQ0#/ESPI_ALERT0# C8 GND D8 GND
A9 GBE0_MDI1- B9 LPC_DRQ1#/ESPI_ALERT1# C9 USB_SSRX2- D9 USB_SSTX2-
A10 GBE0_MDI1+ B10 LPC_CLK/ESPI_CK C10 USB_SSRX2+ D10 USB_SSTX2+
A11 GND (FIXED) B11 GND (FIXED) C11 GND (FIXED) D11 GND (FIXED)
A12 GBE0_MDI0- B12 PWRBTN# C12 USB_SSRX3- D12 USB_SSTX3-
A13 GBE0_MDI0+ B13 SMB_CK C13 USB_SSRX3+ D13 USB_SSTX3+
A14 GBE0_CTREF B14 SMB_DAT C14 GND D14 GND
A15 SUS_S3# B15 SMB_ALERT# C15 DDI1_PAIR6+D15 DDI1_CTRLCLK_AUX+
A16 SATA0_TX+ B16 SATA1_TX+ C16 DDI1_PAIR6-D16 DDI1_CTRLDATA_AUX-
A17 SATA0_TX- B17 SATA1_TX- C17 RSVD D17 RSVD
A18 SUS_S4# B18 SUS_STAT#/ESPI_RESET# C18 RSVD D18 RSVD
A19 SATA0_RX+ B19 SATA1_RX+ C19 PCIE_RX6+ * D19 PCIE_TX6+ *
A20 SATA0_RX- B20 SATA1_RX- C20 PCIE_RX6- * D20 PCIE_TX6- *
A21 GND (FIXED) B21 GND (FIXED) C21 GND (FIXED) D21 GND (FIXED)
A22 SATA2_TX+ B22 SATA3_TX+ C22 PCIE_RX7+ * D22 PCIE_TX7+ *
A23 SATA2_TX-B23 SATA3_TX-C23 PCIE_RX7- * D23 PCIE_TX7- *
A24 SUS_S5# B24 PWR_OK C24 DDI1_HPD D24 RSVD
A25 SATA2_RX+ B25 SATA3_RX+ C25 DDI1_PAIR4+ D25 RSVD
A26 SATA2_RX-B26 SATA3_RX-C26 DDI1_PAIR4-D26 DDI1_PAIR0+
A27 BATLOW# B27 WDT C27 RSVD D27 DDI1_PAIR0-
A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 C28 RSVD D28 RSVD
A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 C29 DDI1_PAIR5+ D29 DDI1_PAIR1+
A30 AC/HDA_RST# B30 AC/HDA_SDIN0 C30 DDI1_PAIR5-D30 DDI1_PAIR1-
A31 GND (FIXED) B31 GND (FIXED) C31 GND (FIXED) D31 GND (FIXED)
A32 AC/HDA_BITCLK B32 SPKR C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+
A33 AC/HDA_SDOUT B33 I2C_CK C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2-
A34 BIOS_DIS0#/ESPI_SAFS B34 I2C_DAT C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL
A35 THRMTRIP# B35 THRM# C35 RSVD D35 RSVD