ADLINK Technology COM Express Express-ID7 User manual

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 1 Copyright © 2022 ADLINK Technology, Inc.
Express-ID7
Revision: Rev. 1.0
Date: 2022-06-14
Part Number: 50M-00051-1000
User’s Guide

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 2 Copyright © 2022 ADLINK Technology, Inc.
Revision History
Revision
Description
Date
Author
1.0
Initial release
2022-06-14
CC

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 3 Copyright © 2022 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2022 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 4 Copyright © 2022 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 5 Copyright © 2022 ADLINK Technology, Inc.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 6 Copyright © 2022 ADLINK Technology, Inc.
Getting Service
Ask an Expert: http://askanexpert.adlinktech.com
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [email protected]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [email protected]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [email protected]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

Express-ID7 User’s Guide PICMG COM.0 R3.1
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Table of Contents
Preface .................................................................................................................................................................................................................................................................................................................................. 2
List of Figures..................................................................................................................................................................................................................................................................................................................... 9
1. Introduction ...............................................................................................................................................................................................................................................................................................................10
2. Specifications.............................................................................................................................................................................................................................................................................................................11
2.1. Core System............................................................................................................................................................................................................................................................................................................................................. 11
2.2. Expansion Busses................................................................................................................................................................................................................................................................................................................................... 12
2.3. 10G-KR Ethernet .................................................................................................................................................................................................................................................................................................................................... 13
2.4. GbE Ethernet............................................................................................................................................................................................................................................................................................................................................ 13
2.5. Multi I/O and Storage.......................................................................................................................................................................................................................................................................................................................... 14
2.6. Trusted Platform Module (TPM)...................................................................................................................................................................................................................................................................................................... 15
2.7. SEMA Board Controller ....................................................................................................................................................................................................................................................................................................................... 15
2.8. Debug......................................................................................................................................................................................................................................................................................................................................................... 15
2.9. Power.......................................................................................................................................................................................................................................................................................................................................................... 15
2.10. Mechanical and Environmental ....................................................................................................................................................................................................................................................................................................... 16
3. Block Diagram ...........................................................................................................................................................................................................................................................................................................17
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................18
4.1. Pin Summary ........................................................................................................................................................................................................................................................................................................................................... 18
4.2. Signal Terminology Descriptions.................................................................................................................................................................................................................................................................................................... 23
4.3. AB Connector Signal Descriptions ................................................................................................................................................................................................................................................................................................. 24
4.3.1 Network Controller Sideband Interface (NC-SI) .......................................................................................................................................................................................................................................................... 24
4.3.2 Gigabit Ethernet......................................................................................................................................................................................................................................................................................................................... 25
4.3.3 SATA ............................................................................................................................................................................................................................................................................................................................................... 26
4.3.4 PCI Express................................................................................................................................................................................................................................................................................................................................... 27
4.3.5 LPC Bus.......................................................................................................................................................................................................................................................................................................................................... 31
4.3.6 USB.................................................................................................................................................................................................................................................................................................................................................. 32
4.3.7 SPI Bus (BIOS only)................................................................................................................................................................................................................................................................................................................... 33
4.3.8 Miscellaneous............................................................................................................................................................................................................................................................................................................................. 34
4.3.9 SMBus ............................................................................................................................................................................................................................................................................................................................................ 35
4.3.10 I2C Bus........................................................................................................................................................................................................................................................................................................................................... 35
4.3.11 General Purpose I/O (GPIO) ................................................................................................................................................................................................................................................................................................. 36

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4.3.12 Serial Interface Signals............................................................................................................................................................................................................................................................................................................ 36
4.3.13 Power and System Management ....................................................................................................................................................................................................................................................................................... 37
4.3.14 Power and Ground ................................................................................................................................................................................................................................................................................................................... 38
4.4. CD Connector Signal Descriptions................................................................................................................................................................................................................................................................................................. 39
4.4.1 USB 3.0 Extensions ................................................................................................................................................................................................................................................................................................................... 39
4.4.2 PCI Express................................................................................................................................................................................................................................................................................................................................... 40
4.4.3 10G-KR Ethernet........................................................................................................................................................................................................................................................................................................................ 41
4.4.4 PCI Express................................................................................................................................................................................................................................................................................................................................... 44
4.4.5 Module Type Definition ......................................................................................................................................................................................................................................................................................................... 46
4.4.6 Power and Ground ................................................................................................................................................................................................................................................................................................................... 47
5. Additional Features .................................................................................................................................................................................................................................................................................................48
5.1. Debug Connector.................................................................................................................................................................................................................................................................................................................................. 49
5.2. Status LEDs............................................................................................................................................................................................................................................................................................................................................... 50
5.3. Exception Codes..................................................................................................................................................................................................................................................................................................................................... 51
5.4. Fan Connector......................................................................................................................................................................................................................................................................................................................................... 52
5.5. BIOS Default Reset Button................................................................................................................................................................................................................................................................................................................. 53
5.6. BIOS Boot Select.................................................................................................................................................................................................................................................................................................................................... 54
6. BIOS Checkpoints, Beep Codes..........................................................................................................................................................................................................................................................................55
7. Software Support.....................................................................................................................................................................................................................................................................................................56
7.1.1 Windows Server, Windows 10 IOT Enterprise LTSC ................................................................................................................................................................................................................................................... 56
7.1.2 Yocto Linux .................................................................................................................................................................................................................................................................................................................................. 56
7.1.3 Ubuntu........................................................................................................................................................................................................................................................................................................................................... 56
7.1.4 VxWorks........................................................................................................................................................................................................................................................................................................................................ 56
8. Mechanical and Thermal.......................................................................................................................................................................................................................................................................................57
8.1. Module Dimensions ............................................................................................................................................................................................................................................................................................................................. 57
8.2. Thermal Solutions ................................................................................................................................................................................................................................................................................................................................. 58
8.2.1 Heatspreader: HTS.................................................................................................................................................................................................................................................................................................................... 58
8.2.2 Heatsink with Fan: THSF......................................................................................................................................................................................................................................................................................................... 59

Express-ID7 User’s Guide PICMG COM.0 R3.1
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List of Figures
Figure 1 – Module functional block diagram......................................................................................................................................................................................................................................................17
Figure 2 - Module rear side row and pin numbering ......................................................................................................................................................................................................................................18
Figure 3 – Module feature locations.......................................................................................................................................................................................................................................................................48
Figure 4 – Express-ID7 and Debug Module.........................................................................................................................................................................................................................................................49
Figure 5 – Module mechanical dimensions .........................................................................................................................................................................................................................................................57
Figure 6 – Heatspreader HTS.....................................................................................................................................................................................................................................................................................58
Figure 9 – Heatsink with Fan: THSF .........................................................................................................................................................................................................................................................................59

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 10 Copyright © 2022 ADLINK Technology, Inc.
1. Introduction
The Express-ID7 is the first COM Express® COM.0 R3.1 Basic Size Type 7 module based on the new generation and longevity, future-focused Intel®
Xeon-D processors (formerly “Ice Lake D-1700”) supporting up to 10 cores, extended operating temperature range for selected SKUs, and integrated
10G Ethernet connectivity, making it highly suited for mission-critical applications. Its 10 cores at 70 watts TDP combined with Intel® AVX-512 Vector
Neural Network Instructions (VNNI) can optimize AI inferencing performance at the edge. Industries in need of such high performance, low power
consumption, and high bandwidth connectivity include industrial automation and control, intelligent surveillance, video storage analytics, 5G
infrastructure at the edge, and more.
The Express-ID7 features Intel® Virtualization Technology (including VT-x, VT-d), Intel® Hyper-Threading Technology, Intel® Trusted Execution
Technology, Intel® AES-NI Technology, and up to 4 SO-DIMMs supporting a maximum of 128GB DDR4 ECC (or non-ECC) memory capacity with triple-
channel memory design at up to 2933 MT/s (dependent on processor SKU) to provide excellent overall performance.
An integrated Intel® 10G Ethernet controller supports four 10GBASE-KR interfaces, with relevant sideband signals effectively reducing hardware and
firmware complexity for system integration. The Express-ID7 is designed to serve customers requiring optimized computing capability per watt and high
speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.
Input/output features include 16 PCIe Gen4 lanes, 16 PCIe Gen3 lanes, a single onboard Gigabit Ethernet port with NC-SI, 4x USB 3.0/2.0 ports, and 2x
SATA 6 Gb/s ports. Support for SMBus and I2C is also provided. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting
embedded features such as remote console, hardware monitor, and watchdog timer.

Express-ID7 User’s Guide PICMG COM.0 R3.1
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2. Specifications
2.1. Core System
CPU
Intel® Xeon® D-1700 Processor (formerly “Ice Lake D”)
• Intel® Xeon® D-1746TER 2.0/3.1GHz, 15MB, 67W (10C/20T, eTEMP) (up to 2667 MT/s)
• Intel® Xeon® D-1735TR 2.2/3.4GHz, 15MB, 59W (8C/16T) (up to 2933 MT/s)
• Intel® Xeon® D-1732TE 1.9/3.0GHz, 15MB, 52W (8C/16T, eTEMP) (up to 2667 MT/s)
• Intel® Xeon® D-1715TER 2.4/3.5GHz, 10MB, 50W (4C/8T, eTEMP) (up to 2667 MT/s)
• Intel® Xeon® D-1712TR 2.0/3.1GHz, 10MB, 40W (4C/8T) (up to 2400 MT/s)
Note: Other non-IOTG SKUs (D-1748TE, D-1718T) and non-IOTG SKUs with Intel® QAT feature (D-1749NT, D-1747NTE, D-1736NT, D-1733NT,
D-1734NT, D-1713NTE, D-1713NT) may be available by project basis.
Supporting: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel®
Turbo Boost Technology 2.0, Intel® AVX512-VNNI, Intel® TSX-NI, Intel® Platform Protection Technology with Intel® TXT and Execute Disable Bit,
Intel® Data Protection Technology with Intel® Secure Key and Intel® AES-NI (availability of features may vary between processor SKUs)
Memory
Up to 128GB DDR4, three memory channel in total four SODIMM sockets, maximum 32GB per socket, ECC or non-ECC
Up to 2933 MT/s memory speed (dependent on SKUs and 1DPC/2DPC usage)
Four SODIMM sockets supported by build option and project basis

Express-ID7 User’s Guide PICMG COM.0 R3.1
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Cache
15MB: D-1746TER, D-1735TR, D-1732TE
10MB: D-1715TER, D-1712TR
Embedded BIOS
AMI Aptio V UEFI with CMOS backup in 32 MB SPI BIOS, dual BIOS by build option
2.2. Expansion Busses
16 PCI Express Gen4: Lane 16-31 (four controllers, configurable to 1 x16, 2 x8, or 4 x4)
Refer to Ch. 4 Pinout and Signal Descriptions for details on Gen4 clock, PCIE_CK_REF1 (pin B29/B30)
8 PCI Express Gen3:Lanes 0-7 (four controllers, configurable to 1 x8, 2 x4, 4 x2/x1)
8 PCI Express Gen3: Lane 8-15 (four controllers, configurable to 1 x8, 2 x4, 4 x2/x1)
Note: Additional PCIe x1 at Lane 1 and Lane 5 are supported by build option and project basis.
PCIE_CK_REF (A88/A89) for Lane 16-31 (with up to Gen3 speed) is supported by build option and project basis.
Combined HSIO has a bandwidth up to the equivalent of 16 PCIe Gen3 lanes; PCIe lane 0-15, SATA, GbE and USB SSTX/RX are sourced
from HSIO.
Other: SMBus (system), I2C (user), LPC bus

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2.3. 10G-KR Ethernet
Intel® Ethernet Controller integrated on SoC
Four 10GBASE-KR and sideband signals
PHY on carrier and ID EEPROM and PHY firmware are required for 10G SFP+ and/or Copper 10GBASE-T applications
The recommended PHY for SFP+ is C827, for 10GBASE-T is X557-AT4. The enablement of other PHY may require platform supplier support.
10G Ethernet Controller firmware is combined with BIOS code and stored on the same SPI ROM
10G Ethernet Controller firmware for 10K-KR backplane usage is different than that for 10G SFP+/10GBASE-T usage.
10G SFP+/10GBASE-T use the same firmware and are supported by default while 10G-KR backplane firmware is supported by build option and project
basis.
Note: For detailed information about circuit design between the Ethernet controller, Optical Fiber/Copper PHY and firmware, please contact your
local ADLINK representative
40GBASE-KR4 support requires the use of 4 KR lanes, which is supported by project basis (TBC).
2.4. GbE Ethernet
Intel® Ethernet Controller I210 Series
1000/100/10 Mbit/s connections
NC-SI and GBE0_SDP are supported on select SKU

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2.5. Multi I/O and Storage
USB
4x USB 3.0/2.0/1.1 (USB 0, 1, 2, 3)
SuperSpeed, High-Speed, Full-Speed and Low-Speed USB signaling
USB_OC pins share the same source, from SOC
SATA
2x SATA 6Gb/s (SATA 0,1)
Note: Combined HSIO has a bandwidth up to the equivalent of 16 PCIe Gen3 lanes; PCIe lane 0-15, SATA, GbE and USB SSTX/RX are sourced
from HSIO.
UART
Two UART interfaces SER0 and SER1 RX/TX on module
Console Redirection COM 1 or COM 2 selectable in BIOS
Up to 4 serial ports supported by standard BIOS, including Super I/O on carrier board
COM Port Description IRQ Address Console Redirection Support
COM 1 Supported by module (SER0, A98/A99), via embedded controller 4 0x3F8 Yes
COM 2 Supported by module (SER1, A101/A102), via embedded controller 3 0x2F8 Yes
COM 3 Supported by Super I/O (W83627DHG) on carrier board 5 0x240 Yes
COM 4 Supported by Super I/O (W83627DHG) on carrier board 7 0x248 Yes
SER0, SER1 from SoC HSUART are supported by BOM option and project basis
GPIO or SD
4 GPO and 4 GPI (GPI with interrupt, TBC)

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2.6. Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (SPI bus based)
2.7. SEMA Board Controller
Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control
2.8. Debug
30-pin flat cable connector for use with DB30 x86 debug module
Supports embedded controller access, SPI BIOS flashing, internal power rail test points, debug LEDs, and BIOS POST code LED
2.9. Power
Power Modes: AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input: AT: 12V±5% or ATX: 12V±5% / 5Vsb ±5%
Power Management: ACPI 5.0 compliant
Power States: C0-C3, S0, S5, S5 ECO mode (WoL S5)
ECO Mode support for deep S5 for 5Vsb power saving
Note: For ATX power source, a minimum interval of 10ms is required from SUS_S3# fall to VCC_12V fall.

Express-ID7 User’s Guide PICMG COM.0 R3.1
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Power Consumption
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.
2.10. Mechanical and Environmental
Form Factor and specification
PICMG COM Express Rev 3.1 (COM.0 R3.1), Type 7, Basic size 125 x 95 mm
Operating Temperature
Standard 0°C to 60°C Storage: -20°C to 80°C
Extreme Rugged -40°C to 85°C Storage: -40°C to 85°C (build option by project basis, selected SoC SKUs, TBC)
Humidity
5-90% RH operating, non-condensing, 5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

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3. Block Diagram
Figure 1 – Module functional block diagram

Express-ID7 User’s Guide PICMG COM.0 R3.1
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4. Pinout and Signal Descriptions
4.1. Pin Summary
The table below is a comprehensible list of all signal pins supported on the dual 220-pin COM Express connectors as defined for Type 7 in the PICMG
COM.0 R3.1 specification. Signals described in the specification but not supported on the Express-ID7 are strikethrough STRIKETHROUGH
CD
AB
A1
B1
C1
D1
A110
Figure 2 - Module rear side row and pin numbering
Note: The 4th SO-DIMM (grey color) is supported by build option.

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Row A
Row B
Row C
Row D
A1
GND (fixed)
B1
GND (fixed)
C1
GND (fixed)
D1
GND (fixed)
A2
GBE0_MDI3-
B2
GBE0_ACT#
C2
GND
D2
GND
A3
GBE0_MDI3+
B3
LPC_FRAME#
C3
USB_SSRX0-
D3
USB_SSTX0-
A4
GBE0_LINK100#
B4
LPC_AD0
C4
USB_SSRX0+
D4
USB_SSTX0+
A5
GBE0_LINK1000#
B5
LPC_AD1
C5
GND
D5
GND
A6
GBE0_MDI2-
B6
LPC_AD2
C6
USB_SSRX1-
D6
USB_SSTX1-
A7
GBE0_MDI2+
B7
LPC_AD3
C7
USB_SSRX1+
D7
USB_SSTX1+
A8
GBE0_LINK#
B8
LPC_DRQ0#
C8
GND
D8
GND
A9
GBE0_MDI1-
B9
LPC_DRQ1#
C9
USB_SSRX2-
D9
USB_SSTX2-
A10
GBE0_MDI1+
B10
LPC_CLK
C10
USB_SSRX2+
D10
USB_SSTX2+
A11
GND (fixed)
B11
GND (fixed)
C11
GND (fixed)
D11
GND (fixed)
A12
GBE0_MDI0-
B12
PWRBTN#
C12
USB_SSRX3-
D12
USB_SSTX3-
A13
GBE0_MDI0+
B13
SMB_CK
C13
USB_SSRX3+
D13
USB_SSTX3+
A14
GBE0_CTREF
B14
SMB_DAT
C14
GND
D14
GND
A15
SUS_S3#
B15
SMB_ALERT#
C15
10G_PHY_MDC_SCL3
D15
10G_PHY_MDIO_SDA3
A16
SATA0_TX+
B16
SATA1_TX+
C16
10G_PHY_MDC_SCL2
D16
10G_PHY_MDIO_SDA2
A17
SATA0_TX-
B17
SATA1_TX-
C17
10G_SDP2
D17
10G_SDP3
A18
SUS_S4#
B18
SUS_STAT#
C18
GND
D18
GND
A19
SATA0_RX+
B19
SATA1_RX+
C19
PCIE_RX6+
D19
PCIE_TX6+
A20
SATA0_RX-
B20
SATA1_RX-
C20
PCIE_RX6-
D20
PCIE_TX6-
A21
GND (fixed)
B21
GND (fixed)
C21
GND (fixed)
D21
GND (fixed)
A22
PCIE_TX15+
B22
PCIE_RX15+
C22
PCIE_RX7+
D22
PCIE_TX7+
A23
PCIE_TX15-
B23
PCIE_RX15-
C23
PCIE_RX7-
D23
PCIE_TX7-
A24
SUS_S5#
B24
PWR_OK
C24
10G_INT2
D24
10G_INT3
A25
PCIE_TX14+
B25
PCIE_RX14+
C25
GND
D25
GND
A26
PCIE_TX14-
B26
PCIE_RX14-
C26
10G_KR_RX3+
D26
10G_KR_TX3+
A27
BATLOW#
B27
WDT
C27
10G_KR_RX3-
D27
10G_KR_TX3-
A28
(S)ATA_ACT#
B28
GND
C28
GND
D28
GND
A29
RSVD
B29
PCIE_CK_REF1+
C29
10G_KR_RX2+
D29
10G_KR_TX2+
A30
RSVD
B30
PCIE_CK_REF1-
C30
10G_KR_RX2-
D30
10G_KR_TX2-
A31
GND (fixed)
B31
GND (fixed)
C31
GND (fixed)
D31
GND (fixed)
A32
RSVD
B32
SPKR
C32
10G_SFP_SDA3
D32
10G_SFP_SCL3
A33
RSVD
B33
I2C_CK
C33
10G_SFP_SDA2
D33
10G_SFP_SCL2
A34
BIOS_DIS0#
B34
I2C_DAT
C34
10G_PHY_RST_23
D34
10G_PHY_CAP_23
A35
THRMTRIP#
B35
THRM#
C35
10G_PHY_RST_01 / CEI_RST#
D35
10G_PHY_CAP_01 / CEI_PRSNT#

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Row A
Row B
Row C
Row D
A36
PCIE_TX13+
B36
PCIE_RX13+
C36
10G_LED_SDA *
D36
RSVD
A37
PCIE_TX13-
B37
PCIE_RX13-
C37
10G_LED_SCL *
D37
RSVD
A38
GND
B38
GND
C38
10G_SFP_SDA1
D38
10G_SFP_SCL1
A39
PCIE_TX12+
B39
PCIE_RX12+
C39
10G_SFP_SDA0 / CEI_SDA
D39
10G_SFP_SCL0 / CEI_SCL
A40
PCIE_TX12-
B40
PCIE_RX12-
C40
10G_SDP0
D40
10G_SDP1
A41
GND (fixed)
B41
GND (fixed)
C41
GND (fixed)
D41
GND (fixed)
A42
USB2-
B42
USB3-
C42
10G_KR_RX1+
D42
10G_KR_TX1+
A43
USB2+
B43
USB3+
C43
10G_KR_RX1-
D43
10G_KR_TX1-
A44
USB_2_3_OC#
B44
USB_0_1_OC#
C44
GND
D44
GND
A45
USB0-
B45
USB1-
C45
10G_PHY_MDC_SCL1
D45
10G_PHY_MDIO_SDA1
A46
USB0+
B46
USB1+
C46
10G_PHY_MDC_SCL0 / CEI_MDC
D46
10G_PHY_MDIO_SDA0 / CEI_MDIO
A47
VCC_RTC
B47
ESPI_EN#
C47
10G_INT0 / CEI_INT#
D47
10G_INT1 / ETH0-3_PHY_INT#
A48
RSVD
B48
USB0_HOST_PRSNT
C48
GND
D48
GND
A49
GBE0_SDP
B49
SYS_RESET#
C49
10G_KR_RX0+
D49
10G_KR_TX0+
A50
LPC_SERIRQ
B50
CB_RESET#
C50
10G_KR_RX0-
D50
10G_KR_TX0-
A51
GND (fixed)
B51
GND (fixed)
C51
GND (fixed)
D51
GND (fixed)
A52
PCIE_TX5+
B52
PCIE_RX5+
C52
PCIE_RX16+
D52
PCIE_TX16+
A53
PCIE_TX5-
B53
PCIE_RX5-
C53
PCIE_RX16-
D53
PCIE_TX16-
A54
GPI0
B54
GPO1
C54
TYPE0#
D54
RSVD
A55
PCIE_TX4+
B55
PCIE_RX4+
C55
PCIE_RX17+
D55
PCIE_TX17+
A56
PCIE_TX4-
B56
PCIE_RX4-
C56
PCIE_RX17-
D56
PCIE_TX17-
A57
GND
B57
GPO2
C57
TYPE1#
D57
TYPE2#
A58
PCIE_TX3+
B58
PCIE_RX3+
C58
PCIE_RX18+
D58
PCIE_TX18+
A59
PCIE_TX3-
B59
PCIE_RX3-
C59
PCIE_RX18-
D59
PCIE_TX18-
A60
GND (fixed)
B60
GND (fixed)
C60
GND (fixed)
D60
GND (fixed)
A61
PCIE_TX2+
B61
PCIE_RX2+
C61
PCIE_RX19+
D61
PCIE_TX19+
A62
PCIE_TX2-
B62
PCIE_RX2-
C62
PCIE_RX19-
D62
PCIE_TX19-
A63
GPI1
B63
GPO3
C63
RSVD
D63
RSVD
A64
PCIE_TX1+
B64
PCIE_RX1+
C64
RSVD
D64
RSVD
A65
PCIE_TX1-
B65
PCIE_RX1-
C65
PCIE_RX20+
D65
PCIE_TX20+
A66
GND
B66
WAKE0#
C66
PCIE_RX20-
D66
PCIE_TX20-
A67
GPI2
B67
WAKE1#
C67
RAPID_SHUTDOWN
D67
GND
A68
PCIE_TX0+
B68
PCIE_RX0+
C68
PCIE_RX21+
D68
PCIE_TX21+
A69
PCIE_TX0-
B69
PCIE_RX0-
C69
PCIE_RX21-
D69
PCIE_TX21-
A70
GND (fixed)
B70
GND (fixed)
C70
GND (fixed)
D70
GND (fixed)