ADLINK Technology cExpress-EL User manual

User’s Guide
cExpress-EL
Revision: Rev. 1.1
Date: 2021-08-11
Part Number: 50M-00026-1010

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 1 Copyright © 2021 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2021 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 2 Copyright © 2021 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 3 Copyright © 2021 ADLINK Technology, Inc.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 4 Copyright © 2021 ADLINK Technology, Inc.
Revision History
Revision Description Date Author
1.0 Initial release 2021-06-03
1.1 Update specs, mechanical drawings 2021-08-11

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 5 Copyright © 2021 ADLINK Technology, Inc.
Table of Contents
Preface .................................................................................................................................................................................................................................................................................................................................. 1
List of Figures..................................................................................................................................................................................................................................................................................................................... 7
1. Introduction ................................................................................................................................................................................................................................................................................................................. 8
2. Specifications............................................................................................................................................................................................................................................................................................................... 9
2.1 Core System..................................................................................................................................................................................................................................................................................................................................... 9
2.2 Video ................................................................................................................................................................................................................................................................................................................................................10
2.2.1 Display Interface Support .............................................................................................................................................................................................................................................................................................11
2.3 Audio................................................................................................................................................................................................................................................................................................................................................11
2.4 Expansion Busses .........................................................................................................................................................................................................................................................................................................................12
2.5 Ethernet ...........................................................................................................................................................................................................................................................................................................................................12
2.6 Multi I/O and Storage ................................................................................................................................................................................................................................................................................................................12
2.7 Trusted Platform Module (TPM).............................................................................................................................................................................................................................................................................................14
2.8 SEMA Board controller...............................................................................................................................................................................................................................................................................................................14
2.9 Debug...............................................................................................................................................................................................................................................................................................................................................14
2.10 Power................................................................................................................................................................................................................................................................................................................................................14
2.11 Mechanical and Environmental...............................................................................................................................................................................................................................................................................................15
3. Block Diagram...........................................................................................................................................................................................................................................................................................................16
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................17
4.1 Pin Summary..................................................................................................................................................................................................................................................................................................................................17
4.2 Signal Terminology Descriptions ...........................................................................................................................................................................................................................................................................................22
4.3 AB Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................23
4.3.1 Audio....................................................................................................................................................................................................................................................................................................................................23
4.3.2 Analog VGA........................................................................................................................................................................................................................................................................................................................24
4.3.3 LVDS or eDP.......................................................................................................................................................................................................................................................................................................................25
4.3.4 Gigabit Ethernet ...............................................................................................................................................................................................................................................................................................................28
4.3.5 SATA .....................................................................................................................................................................................................................................................................................................................................29
4.3.6 PCIe.......................................................................................................................................................................................................................................................................................................................................30
4.3.7 LPC Bus................................................................................................................................................................................................................................................................................................................................32
4.3.8 USB........................................................................................................................................................................................................................................................................................................................................33
4.3.9 SPI Bus (BIOS only)..........................................................................................................................................................................................................................................................................................................34

cExpress-EL User’s Guide PICMG COM.0 R3.0
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4.3.10 Miscellaneous....................................................................................................................................................................................................................................................................................................................35
4.3.11 SMBus ..................................................................................................................................................................................................................................................................................................................................36
4.3.12 I2C bus.................................................................................................................................................................................................................................................................................................................................36
4.3.13 General Purpose I/O (GPIO).........................................................................................................................................................................................................................................................................................37
4.3.14 Serial Interface Signals...................................................................................................................................................................................................................................................................................................38
4.3.15 Power and System Management...............................................................................................................................................................................................................................................................................39
4.3.16 Power and Ground ..........................................................................................................................................................................................................................................................................................................40
4.4 CD Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................41
4.4.1 USB 3.0 Extensions ..........................................................................................................................................................................................................................................................................................................41
4.4.2 PCI Express .........................................................................................................................................................................................................................................................................................................................43
4.4.3 DDI1 Port ............................................................................................................................................................................................................................................................................................................................44
4.4.4 DDI2 port ............................................................................................................................................................................................................................................................................................................................47
4.4.5 DDI3 Port ............................................................................................................................................................................................................................................................................................................................50
4.4.6 PCIe Graphics Port (PEG)...............................................................................................................................................................................................................................................................................................50
4.4.7 Module Type Definition.................................................................................................................................................................................................................................................................................................51
4.4.8 Power and Ground ..........................................................................................................................................................................................................................................................................................................52
5. Additional Features.................................................................................................................................................................................................................................................................................................53
5.1 Debug Connector ........................................................................................................................................................................................................................................................................................................................54
5.2 Status LEDs.....................................................................................................................................................................................................................................................................................................................................55
5.3 Fan Connector...............................................................................................................................................................................................................................................................................................................................57
5.4 BIOS Default Reset ......................................................................................................................................................................................................................................................................................................................58
5.5 BIOS Boot Select...........................................................................................................................................................................................................................................................................................................................59
6. BIOS Checkpoints, Beep Codes..........................................................................................................................................................................................................................................................................60
6.1 Status Code Ranges ....................................................................................................................................................................................................................................................................................................................62
7. Software Support.....................................................................................................................................................................................................................................................................................................63
7.1.1 Windows 10 IOT Enterprise 64-bit.............................................................................................................................................................................................................................................................................63
7.1.2 Yocto Linux 64-bit ...........................................................................................................................................................................................................................................................................................................63
7.1.3 Ubuntu.................................................................................................................................................................................................................................................................................................................................63
7.1.4 VxWorks 64-bit.................................................................................................................................................................................................................................................................................................................63
8. Mechanical and Thermal.......................................................................................................................................................................................................................................................................................64
8.1 Module Dimensions....................................................................................................................................................................................................................................................................................................................64
8.2 Thermal Solutions........................................................................................................................................................................................................................................................................................................................65
8.2.1 Heatspreader: HTS...........................................................................................................................................................................................................................................................................................................65
8.2.2 Heatsink: THS ....................................................................................................................................................................................................................................................................................................................66
8.2.3 Heatsink: THSH.................................................................................................................................................................................................................................................................................................................67
8.2.4 Active Cooling: THSF ......................................................................................................................................................................................................................................................................................................68

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 7 Copyright © 2021 ADLINK Technology, Inc.
List of Figures
Figure 1 – Module Function Block Diagram ........................................................................................................................................................................................................................................................16
Figure 2 – Module Rear Side Row and Pin Numbering ..................................................................................................................................................................................................................................17
Figure 3 –Module feature locations........................................................................................................................................................................................................................................................................53
Figure 4 –COM Express® Compact Size Module and Debug Module.....................................................................................................................................................................................................54
Figure 5 – Module Dimensions.................................................................................................................................................................................................................................................................................64
Figure 6 – Heatspreader HTS-cEL-I .........................................................................................................................................................................................................................................................................65
Figure 7 – Heatsink THS-cEL-B-I...............................................................................................................................................................................................................................................................................66
Figure 8 – Heatsink THSH-cEL-B-I ...........................................................................................................................................................................................................................................................................67
Figure 9 – Heatsink THSH-cEL-B-I ...........................................................................................................................................................................................................................................................................68

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 8 Copyright © 2021 ADLINK Technology, Inc.
1. Introduction
Warning: This is an EA (early available) engineering manual. The contents may not accurately reflect the actual or final version of this product.
The cExpress-EL is the first COM Express® COM.0 R3.0 Compact Size Type 6 module featuring the IT/OT convergence 6th Generation Intel Atom®
x6000E processors and Pentium®/Celeron® processors (formerly “Elkhart Lake”). The processors support up to quad-core x86 as well as an impressive
turbo boost of up to 3.0GHz. An ARM Cortex M7 core is integrated to manage the low speed interface (optional, by project basis), for real-time
applications. In addition, the module is also equipped with Intel® Time Coordinated Computing (Intel® TCC) that allows several controllers to process
in a synchronized manner and communicate in real-time. These combined features make the cExpress-EL well suited to customers who need to manage
both IT and OT in a simplified design.
The cExpress-EL supports BIOS configurable in-band ECC (IBECC) with up to two SODIMM sockets and a maximum 32GB DDR4 3200 MT/s memory
capacity to support mission critical applications.
Integrated Intel Gen 11 LP Graphics includes features such as OpenGL 4.5, OpenGL ES 3.1/3.0/2.0/1.1, DirectX 12.1, OpenCL 1.2, Vulkan 1.1 APIs, Intel®
Clear Video HD Technology, and support for full H.265/HEVC 10-bit, H.264, VP9, JPEG/MJPEG hardware codecs. Graphics outputs include LVDS and two
DDI ports supporting HDMI/DVI/DisplayPort with eDP/VGA as a BOM option. A maximum of three 4K displays are supported.
Input/output features include six PCIe Gen3 lanes that can be used for NVMe SSD, allowing applications to utilize the highest speed storage solutions,
as well as an optional 2.5GbE port supporting Time Sensitive Network (TSN), up to four USB 3.2 Gen2 ports with a USB hub, four USB 2.0 ports, two
SATA 6 Gb/s ports and an optional onboard eMMC (16/32/64GB). Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI
BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 9 Copyright © 2021 ADLINK Technology, Inc.
2. Specifications
2.1 Core System
CPU
6th Gen Intel Atom® x6000E processors and Intel® Celeron® and Pentium® N & J processors (formerly “Elkhart Lake”)
• Intel Atom® x6425E, 2.0(3.0) GHz, 12W, 4C/32EU (IBECC/non-ECC)
• Intel Atom® x6413E, 1.5(3.0) GHz, 9W, 4C/16EU (IBECC/non-ECC)
• Intel Atom® x6211E, 1.3(3.0) GHz, 6W, 2C/16EU (IBECC/non-ECC)
• Intel Atom® x6425RE, 1.9 GHz, 12W, 4C/32EU (IBECC/non-ECC, Intel TCC)
• Intel Atom® x6414RE, 1.5 GHz, 9W, 4C/16EU (IBECC/non-ECC, Intel TCC)
• Intel Atom® x6212RE, 1.2 GHz, 6W, 2C/16EU (IBECC/non-ECC, Intel TCC)
• Intel Atom® x6200FE, 1.0 GHz, 4.5W, 2C/No GPU (IBECC/non-ECC, Intel TCC)
• Intel® Pentium® J6426, 2.0(3.0) GHz, 10W, 4C/32EU (non-ECC)
• Intel® Celeron® J6413, 1.8(3.0) GHz, 10W, 4C/16EU (non-ECC)
• Intel® Pentium® N6415, 1.2(3.0) GHz, 6.5W, 4C/16EU (non-ECC)
• Intel® Celeron® N6211, 1.2(3.0) GHz, 6.5W, 2C/16EU (non-ECC)
Supporting: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, Execute Disable Bit, Intel® AVX2, Intel® AES-NI, PCLMULQDQ
Instruction, Intel® Device Protection Technology with Intel® Secure Key (availability of features may vary between processor SKUs)
Note: SKUs supporting Intel® TCC paired with specific LAN solutions can also support TSN (TBC).
Pentium, Celeron and some of Atom SKUs supported by project basis only. Please contact your local ADLINK presentative.

cExpress-EL User’s Guide PICMG COM.0 R3.0
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Memory
Up to 32GB 3200 MT/s DDR4 in two SODIMM sockets, Maximum 32GB per socket
In-band ECC (IBECC) dependent on SKU and IBECC work with normal type SO-DIMM memory
Note: 64GB (2x 32GB) memory is TBC.
Cache
1.5MB
Embedded BIOS
AMI Aptio V UEFI with CMOS backup in 16 (or 32) MB SPI BIOS
2.2 Video
GPU
Intel® Gen 11 LP Graphics core architecture
GPU Feature Support
3 independent and simultaneous combinations of DisplayPort/HDMI/LVDS graphics outputs
(eDP optional in place of LVDS, VGA optional in place of DDI 2)
Encode/transcode HD content
Playback of high definition content, including Blu-ray Disc and Blu-ray Disc 3D, using HDMI (1.4a spec compliant with 3D)
Intel® QuickSync and Intel® Clear Video HD

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HEVC/H.265 10-bit/8-bit, H.264, M/JPEG, MPEG2, VC1/WMV9, VP9, VP8 HW decode
HEVC/H.265 10-bit/8-bit, H.264, M/JPEG, VP9 HW encode
DirectX up to 12.1
OpenGL up to 4.5, OpenGL ES up to 3.1
OpenCL 1.2, Vulkan 1.1 APIs
Note: Availability of features dependent on operating system (Windows 10 64-bit, Linux 64-bit).
2.2.1 Display Interface Support
LVDS: Single/dual channel 18/24-bit LVDS through eDP to LVDS, supports DE mode and Hsync/Vsync mode. Max. resolution is 1920x1200@60Hz in
dual mode. Pixel clock frequency up to 112 MHz. VESA and JEIDA panel data formats supported.
eDP: eDP 1.3 up to 4 lane support, in place of LVDS (BOM option), max. resolution is 4096x2160@60Hz, 24bpp
DDI x 2: Digital Display Ports (DDI) support DisplayPort 1.4, HDMI 1.4b or DVI
VGA: VGA support, in place of DDI 2, max. resolution is 1920x1200@60Hz
2.3 Audio
Intel® HD Audio integrated
Located on carrier Express-BASE6 (ALC886 standard support)

cExpress-EL User’s Guide PICMG COM.0 R3.0
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2.4 Expansion Busses
6 PCI Express x1 Gen3: Lanes 0,1,2,3,4,5
PCIe lanes 0-4 can be configured to x1, x2, x4 (for example, 1 x4 or 2 x2 or 1 x2 + 2 x1)
PCIe lanes 4,5 can only be x1 configuration
Other: SMBus (system), I2C (user)
2.5 Ethernet
Integrated MAC with MaxLinear® 2.5Gigabit Ethernet PHY, GPY211 or GPY215
Supports 2.5Gbit/s or 1000/100/10 Mbit/s connection
Supports TSN on Yocto Linux (dependent on GPY215 and CPU SKU with Intel® TCC feature, TSN supported by project basis)
2.6 Multi I/O and Storage
USB
Up to 4x USB 3.2 Gen1 (USB 0,1,2,3; via USB hub, project basis), 4x USB 2.0 (USB 4,5,6,7)
Default support is 2x USB 3.2 Gen2 (USB 0,1), 6x USB 2.0 (USB 2,3,4,5,6,7)
SuperSpeedPlus, SuperSpeed, High-Speed, Full-Speed and Low-Speed USB signalling
Note: Carrier board must be designed for Gen2 operation.
UART/CAN
Two UART interfaces SER0 and SER1 RX/TX on Module
Console Redirection COM 1 or COM 2 selectable in BIOS

cExpress-EL User’s Guide PICMG COM.0 R3.0
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Up to 4 serial ports are supported in standard BIOS including Super I/O on the carrier
COMPortDescription IRQAddressConsoleRedirectionSupport
COM 1 Supported by module (SER0, A98/A99), via EC 4 0x3F8 Yes
COM 2 Supported by module (SER1, A101/A102), via EC 3 0x2F8 Yes
COM 3 Supported by Super I/O (W83627DHG) on carrier board 5 0x240 Yes
COM 4 Supported by Super I/O (W83627DHG) on carrier board 7 0x248 Yes
SER0, SER1 from SoC HSUART is a BOM option supported by project basis
LPC Bus
Low Pin Count bus extends from an eSPI to LPC bridge IC.
GPIO or SD
4 GPO and 4 GPI (GPI with interrupt), SD/GPIO muxed design, switched by BIOS setting
SD functions as storage device on Windows 10 Enterprise (support on Yocto Linux is TBC)
eMMC
16/32/64GB, build option by project basis
eMMC functions as boot-up device on Windows 10 Enterprise and Yocto Linux
SATA
2x SATA 6Gb/s (SATA 0,1)
Real-time I/O (under planning, TBC)
8x GPIO, I2C, 2x UART are BIOS configurable and managed by ARM Cortex M7 core for real-time applications
Note: The above interfaces are BOM options and supported by project basis

cExpress-EL User’s Guide PICMG COM.0 R3.0
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2.7 Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (SPI bus based)
TPM chip is a BOM option
2.8 SEMA Board controller
Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control
2.9 Debug
30-pin flat cable connector to be used with DB-30 x86 debug module
Supports BIOS POST code LED, BMC access, SPI BIOS flashing, internal power rail test points, debug LEDs
2.10 Power
Power Modes: AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input: ATX 12V±5% / 5Vsb ±5% or AT 12V±5%
Wide Voltage Input: ATX 8.5-20V, 5Vsb ±5% or AT 8.5-20V
Power Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)
ECO Mode support for deep S5 for 5Vsb power saving
Power Consumption
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.

cExpress-EL User’s Guide PICMG COM.0 R3.0
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2.11 Mechanical and Environmental
Form Factor and Specification
PICMG COM.0 Rev 3.0 Type 6, Compact size 95 x 95 mm
Operating Temperature
Standard 0°C to +60°C (Wide Voltage Input) Storage: -20°C to +80°C
Extreme Rugged -40°C to +85°C (Standard Voltage Input) Storage: -40°C to +85°C
(selected processor SKUs)
Humidity
5-90% RH operating, non-condensing, 5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

cExpress-EL User’s Guide PICMG COM.0 R3.0
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3. Block Diagram
C
AB
DDI 3
DDI 2
DDI 1
USB 3.2 Lane 0
USB 3.2 Lane 1
USB 3.2 Lane 2
USB 3.2 Lane 3
PCIe Lane 6
PCIe Lane 7
PEG Port
PEG 0-15
6th Generation
Intel Atom® x6000E
(formerly “Elkhart Lake”)
DP to VGA
eDP to LVDS
eDP
build option
build option, eDP 4lanes
SATA 6Gbps
(HSIO 10-11)
DDR4 SODIMM (bottom side)
3200 MT/s, non-ECC/IBECC
DDR4 SODIMM (top side)
3200 MT/s, non-ECC/IBECC
LAN PHY
(MaxLinear GPY Series)
VGA
eDP/LVDS
USB 2.0 Lane 0-7
SATA Port 0-1
Max. 2.5GbE
PCIe Lane 0-3
PCIe Lane 4-5
HDA
SPI
SMBus
I2C
GPIO/SDIO
UART 0-1
LPC
(HSIO 0) USB 3.2 Gen2 x1
USB 3 Hub
build option
4 PCIe Gen3
(HSIO 2-5)
2 PCIe Gen3
(HSIO 8, 6)
x4, x2, x1 config.
2 x1 config. only
eSPI
TPM 2.0
build option
build option
eSPI to LPC
I2C
SDIO 3.0
HSUART
Thermal
sensor
(SoC)
Thermal
sensor
(board)
MUX
Embedded Controller
SMBus
BIOS
BIOS
eMMC 5.1
16GB-64GB
(HSIO 1) USB 3.2 Gen2 x1
Figure 1 – Module Function Block Diagram

cExpress-EL User’s Guide PICMG COM.0 R3.0
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4. Pinout and Signal Descriptions
4.1 Pin Summary
The below table is a comprehensive list of all signal pins supported on the dual 220-pin COM Express connectors as defined for Type 6 in the PICMG
COM.0 Rev 3.0 specification. Signals described in the specification but not supported on the cExpress-EL are marked by strikethrough STRIKETHROUGH
CD
AB
A1
B1
C1
D1
A110
Figure 2 – Module Rear Side Row and Pin Numbering

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Row A Row B Row C Row D
A1 GND (FIXED) B1 GND (FIXED) C1 GND FIXED) D1 GND FIXED)
A2 GBE0_MDI3- B2 GBE0_ACT# C2 GND D2 GND
A3 GBE0_MDI3+ B3 LPC_FRAME#/ESPI_CS0#* C3 USB_SSRX0- D3 USB_SSTX0-
A4 GBE0_LINK100# B4 LPC_AD0/ESPI_IO_0* C4 USB_SSRX0+ D4 USB_SSTX0+
A5 GBE0_LINK1000# B5 LPC_AD1/ESPI_IO_1* C5 GND D5 GND
A6 GBE0_MDI2- B6 LPC_AD2/ESPI_IO_2* C6 USB_SSRX1- D6 USB_SSTX1-
A7 GBE0_MDI2+ B7 LPC_AD3/ESPI_IO_3* C7 USB_SSRX1+ D7 USB_SSTX1+
A8 GBE0_LINK# B8 LPC_DRQ0#/ESPI_ALERT0#* C8 GND D8 GND
A9 GBE0_MDI1- B9 LPC_DRQ1#/ESPI_ALERT1#* C9 USB_SSRX2-* D9 USB_SSTX2-*
A10 GBE0_MDI1+ B10 LPC_DRQ1#/ESPI_CK* C10 USB_SSRX2+* D10 USB_SSTX2+*
A11 GND (FIXED) B11 GND (FIXED) C11 GND (FIXED) D11 GND (FIXED)
A12 GBE0_MDI0- B12 PWRBTN# C12 USB_SSRX3-* D12 USB_SSTX3-*
A13 GBE0_MDI0+ B13 SMB_CK C13 USB_SSRX3+* D13 USB_SSTX3+*
A14 GBE0_CTREF B14 SMB_DAT C14 GND D14 GND
A15 SUS_S3# B15 SMB_ALERT# C15 DDI1_PAIR6+ D15 DDI1_CTRLCLK_AUX+
A16 SATA0_TX+ B16 SATA1_TX+ C16 DDI1_PAIR6-D16 DDI1_CTRLDATA_AUX-
A17 SATA0_TX- B17 SATA1_TX- C17 RSVD D17 RSVD
A18 SUS_S4# B18 SUS_STAT#/ESPI_RESET#* C18 RSVD D18 RSVD
A19 SATA0_RX+ B19 SATA1_RX+ C19 PCIE_RX6+ D19 PCIE_TX6+
A20 SATA0_RX- B20 SATA1_RX- C20 PCIE_RX6-D20 PCIE_TX6-
A21 GND (FIXED) B21 GND (FIXED) C21 GND (FIXED) D21 GND (FIXED)
A22 SATA2_TX+ B22 SATA3_TX+ C22 PCIE_RX7+ D22 PCIE_TX7+
A23 SATA2_TX-B23 SATA3_TX-C23 PCIE_RX7-D23 PCIE_TX7-
A24 SUS_S5# B24 PWR_OK C24 DDI1_HPD D24 RSVD
A25 SATA2_RX+ B25 SATA3_RX+ C25 DDI1_PAIR4+ D25 RSVD
A26 SATA2_RX-B26 SATA3_RX-C26 DDI1_PAIR4-D26 DDI1_PAIR0+
A27 BATLOW# B27 WDT C27 RSVD D27 DDI1_PAIR0-
A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 C28 RSVD D28 RSVD
A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 C29 DDI1_PAIR5+ D29 DDI1_PAIR1+
A30 AC/HDA_RST# B30 AC/HDA_SDIN0 C30 DDI1_PAIR5-D30 DDI1_PAIR1-
A31 GND (FIXED) B31 GND (FIXED) C31 GND (FIXED) D31 GND (FIXED)
A32 AC/HDA_BITCLK B32 SPKR C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+
A33 AC/HDA_SDOUT B33 I2C_CK C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2-
A34 BIOS_DIS0#/ESPI_SAFS* B34 I2C_DAT C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL
A35 THRMTRIP# B35 THRM# C35 RSVD D35 RSVD

cExpress-EL User’s Guide PICMG COM.0 R3.0
Page 19 Copyright © 2021 ADLINK Technology, Inc.
Row A Row B Row C Row D
A36 USB6- B36 USB7- C36 DDI3_CTRLCLK_AUX+ D36 DDI1_PAIR3+
A37 USB6+ B37 USB7+ C37 DDI3_CTRLDATA_AUX-D37 DDI1_PAIR3-
A38 USB_6_7_OC# B38 USB_4_5_OC# C38 DDI3_DDC_AUX_SEL D38 RSVD
A39 USB4- B39 USB5- C39 DDI3_PAIR0+ D39 DDI2_PAIR0+
A40 USB4+ B40 USB5+ C40 DDI3_PAIR0-D40 DDI2_PAIR0-
A41 GND (FIXED) B41 GND (FIXED) C41 GND (FIXED) D41 GND (FIXED)
A42 USB2- B42 USB3- C42 DDI3_PAIR1+ D42 DDI2_PAIR1+
A43 USB2+ B43 USB3+ C43 DDI3_PAIR1-D43 DDI2_PAIR1-
A44 USB_2_3_OC# B44 USB_0_1_OC# C44 DDI3_HPD D44 DDI2_HPD
A45 USB0- B45 USB1- C45 RSVD D45 RSVD
A46 USB0+ B46 USB1+ C46 DDI3_PAIR2+ D46 DDI2_PAIR2+
A47 VCC_RTC B47 ESPI_EN#* C47 DDI3_PAIR2-D47 DDI2_PAIR2-
A48 RSVD B48 USB0_HOST_PRSNT C48 RSVD D48 RSVD
A49 GBE0_SDP B49 SYS_RESET# C49 DDI3_PAIR3+ D49 DDI2_PAIR3+
A50 LPC_SERIRQ/ESPI_CS1#* B50 CB_RESET# C50 DDI3_PAIR3-D50 DDI2_PAIR3-
A51 GND (FIXED) B51 GND (FIXED) C51 GND (FIXED) D51 GND (FIXED)
A52 PCIE_TX5+ B52 PCIE_RX5+ C52 PEG_RX0+ D52 PEG_TX0+
A53 PCIE_TX5- B53 PCIE_RX5- C53 PEG_RX0-D53 PEG_TX0-
A54 GPI0 B54 GPO1 C54 TYPE0# D54 PEG_LANE_RV#
A55 PCIE_TX4+ B55 PCIE_RX4+ C55 PEG_RX1+ D55 PEG_TX1+
A56 PCIE_TX4- B56 PCIE_RX4- C56 PEG_RX1-D56 PEG_TX1-
A57 GND B57 GPO2 C57 TYPE1# D57 TYPE2#
A58 PCIE_TX3+ B58 PCIE_RX3+ C58 PEG_RX2+ D58 PEG_TX2+
A59 PCIE_TX3- B59 PCIE_RX3- C59 PEG_RX2-D59 PEG_TX2-
A60 GND (FIXED) B60 GND (FIXED) C60 GND (FIXED) D60 GND (FIXED)
A61 PCIE_TX2+ B61 PCIE_RX2+ C61 PEG_RX3+ D61 PEG_TX3+
A62 PCIE_TX2- B62 PCIE_RX2- C62 PEG_RX3-D62 PEG_TX3-
A63 GPI1 B63 GPO3 C63 RSVD D63 RSVD
A64 PCIE_TX1+ B64 PCIE_RX1+ C64 RSVD D64 RSVD
A65 PCIE_TX1- B65 PCIE_RX1- C65 PEG_RX4+ D65 PEG_TX4+
A66 GND B66 WAKE0# C66 PEG_RX4-D66 PEG_TX4-
A67 GPI2 B67 WAKE1# C67 RAPID_SHUTDOWN D67 GND
A68 PCIE_TX0+ B68 PCIE_RX0+ C68 PEG_RX5+ D68 PEG_TX5+
A69 PCIE_TX0- B69 PCIE_RX0- C69 PEG_RX5-D69 PEG_TX5-
A70 GND (FIXED) B70 GND (FIXED) C70 GND (FIXED) D70 GND (FIXED)