Advantech MIO-2375 User manual

User Manual
MIO-2375
11th Gen Intel® Core™ i7/i5/i3/
Celeron® U-Series 2.5" Pico-ITX
SBC

MIO-2375 User Manual ii
Copyright
The documentation and software included with this product are copyrighted 2021 by
Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right to
make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. Information provided in this manual is intended to be accurate and reliable. How-
ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-
ments of the rights of third parties, which may result from its use.
Acknowledgments
Intel® is a trademark of Intel® Corporation.
AMI is a trademark of American Megatrends, Inc.
IBM, PC, PS/2, and VGA are trademarks of International Business Machines Corpo-
ration.
Microsoft Windows®, DirectX® is a registered trademark of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
For more information on this and other Advantech products, please visit our websites
at:
http://www.advantech.com
http://www.advantech.com/eplatform
For technical support and service, please visit our support website at:
http://support.advantech.com/
This manual is for the MIO-2375.
Part No. 2006237500 Edition 1
May 2021

iii MIO-2375 User Manual
Product Warranty (2 years)
Advantech warrants to you, the original purchaser, that each of its products will be
free from defects in materials and workmanship for two years from the date of pur-
chase.
This warranty does not apply to any products which have been repaired or altered by
persons other than repair personnel authorized by Advantech, or which have been
subject to misuse, abuse, accident or improper installation. Advantech assumes no
liability under the terms of this warranty as a consequence of such events.
Because of Advantech’s high quality-control standards and rigorous testing, most of
our customers never need to use our repair service. If an Advantech product is defec-
tive, it will be repaired or replaced at no charge during the warranty period. For out-
of-warranty repairs, you will be billed according to the cost of replacement materials,
service time, and freight. Please consult your dealer for more details.
If you think you have a defective product, follow these steps:
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages you get when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a fully-completed Repair and Replacement
Order Card and a photocopy proof of purchase date (such as your sales receipt)
in a shippable container. A product returned without proof of the purchase date
is not eligible for warranty service.
5. Write the RMA number visibly on the outside of the package and ship it prepaid
to your dealer.

MIO-2375 User Manual iv
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications. Test conditions
for passing included the equipment being operated within an industrial enclosure. In
order to protect the product from being damaged by ESD (Electrostatic Discharge)
and EMI leakage, we strongly recommend the use of CE-compliant industrial enclo-
sure products.
FCC Class B
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installa-
tion. This equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instructions, may cause harmful inter-
ference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interfer-
ence to radio or television reception, which can be determined by turning the equip-
ment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Technical Support and Assistance
1. Visit the Advantech website at http://support.advantech.com where you can find
the latest information about this product.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before you call:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages
Caution! There is a danger of a new battery exploding if it is incorrectly installed.
Do not attempt to recharge, force open, or heat the battery. Replace the
battery only with the same or equivalent type recommended by the man-
ual. Discard used batteries according to the manufacturer's instructions.

v MIO-2375 User Manual
Packing List
Before you begin installing your card, please make sure that the following materials
have been shipped:
If any of these items are missing or damaged, contact your distributor or sales repre-
sentative immediately.
Optional Accessories
Part number Description
1970004968N001 Heat spreader of MIO-2375
1 x MIO-2375 SBC
1 x SATA Cable 30 cm (11.8 in) (p/n: 1700006291)
1 x SATA Power Cable 35 cm (13.7 in) (p/n: 1700031583-01)
2 x USB 2.0 Cable 20 cm (7.87 in) (p/n: 1700030406-01)
1 x Audio Cable 20 cm (7.87 in) (p/n: 1700019584-01)
2 x COM RS-232/422/485 Cable 20 cm (7.87 in) (p/n: 1700030404-01)
1 x AT power cable 12 cm (4.72 in) (p/n: 1700019705-01)
1 x Cooler (Heatsink) (p/n: 1970004956T001)
1 x Startup manual (p/n: 2046237500)
4 x Stand-off (p/n: 1930000058)
1 x DeviceOn Package

MIO-2375 User Manual vi

vii MIO-2375 User Manual
Contents
Chapter 1 General Information ............................1
1.1 Introduction ............................................................................................... 2
1.2 Specifications............................................................................................ 2
1.3 Block Diagram........................................................................................... 4
Chapter 2 Mechanical Specifications..................5
2.1 Introduction ............................................................................................... 6
2.2 Board Layout: Dimensions........................................................................ 6
Figure 2.1 MIO-2375 Mechanical Diagram (Top Side) ................ 6
Figure 2.2 MIO-2375 Mechanical Diagram (Bottom Side)........... 7
Figure 2.3 MIO-2375 Mechanical Diagram (Coastline) ............... 7
Figure 2.4 MIO-2375 Mechanical Diagram (with Cooler) ............ 7
Figure 2.5 MIO-2375 Mechanical Diagram (with Heat Spreader) 7
2.3 Quick Installation Guide ............................................................................ 8
2.3.1 Cooler ........................................................................................... 8
2.3.2 Heatspreader (Optional) ............................................................... 8
Chapter 3 Installation............................................9
3.1 Jumpers and Switches ............................................................................ 10
Table 3.1: Jumpers and Switches ............................................. 10
3.2 Connectors.............................................................................................. 10
Table 3.2: Connectors ............................................................... 10
3.3 Locating Connectors ............................................................................... 11
Figure 3.1 MIO-2375 Connector Locations (Top Side).............. 11
Figure 3.2 MIO-2375 Connector Locations (Bottom Side)......... 11
3.4 Setting Jumpers ...................................................................................... 12
3.4.1 Auto Power On Setting (SW1) .................................................... 12
Table 3.3: Auto Power On Setting (SW1).................................. 12
3.4.2 LCD Power Setting (VDD1) ........................................................ 13
3.4.3 Front Panel (CN1)....................................................................... 13
Table 3.4: Front Panel (CN1) .................................................... 13
3.4.4 GPIO (CN2) ................................................................................ 14
Table 3.5: GPIO (CN2) .............................................................. 14
3.4.5 I2C (CN3).................................................................................... 14
Table 3.6: I2C (CN3) ................................................................. 14
3.4.6 FAN (CN4) .................................................................................. 15
Table 3.7: FAN (CN4)................................................................ 15
3.4.7 DC Power in (CN5) ..................................................................... 15
Table 3.8: DC Power in (CN5)................................................... 15
3.4.8 RTC Battery (Battery1) ............................................................... 16
Table 3.9: RTC Battery (Battery1) ............................................. 16
3.4.9 eDP (EDP1) ................................................................................ 16
Table 3.10:eDP (EDP1).............................................................. 17
3.4.10 Inverter Power Output (BL1)....................................................... 18
Table 3.11:Inverter Power Output (BL1)..................................... 18
3.4.11 DP++ (DP1) ................................................................................ 18
Table 3.12:DP++ (DP1) .............................................................. 18
3.4.12 USB3.2_13H (USB1) .................................................................. 19
Table 3.13:USB3.2_13H (USB1)................................................ 19
3.4.13 Internal USB (USB 3).................................................................. 19
Table 3.14:Internal USB (USB3) ................................................ 19

MIO-2375 User Manual viii
3.4.14 M.2 E key (M2_1) ....................................................................... 20
Table 3.15:M.2 E key (M2_1) ..................................................... 20
3.4.15 M.2 B/M key (M2_2) ................................................................... 21
Table 3.16:M.2 B/M key (M2_2) ................................................. 21
3.4.16 NANO SIM(SIM1) ....................................................................... 23
Table 3.17:NANO SIM(SIM1)..................................................... 23
3.4.17 RJ45_2x1_W/XFMR&LED (LAN1) ............................................. 23
Table 3.18:RJ45_2x1_W/XFMR&LED (LAN1)........................... 23
3.4.18 SATA_7V (SATA1) ..................................................................... 24
Table 3.19:SATA_7V (SATA1)................................................... 24
3.4.19 Audio (Audio1)............................................................................ 24
Table 3.20:Audio (Audio1).......................................................... 24
3.4.20 COM1 (COM1)............................................................................ 25
Table 3.21:COM1 (COM1) ......................................................... 25
3.4.21 COM2 (COM2)............................................................................ 25
Table 3.22:COM2 (COM2) ......................................................... 25
Chapter 4 AMI BIOS Setup................................. 27
4.1 Entering the Setup .................................................................................. 29
4.1.1 Main Setup.................................................................................. 29
4.1.2 Advanced BIOS Features Setup................................................. 30
4.1.3 Chipset Configuration ................................................................. 55
4.1.4 Security....................................................................................... 67
4.1.5 Boot ............................................................................................ 68
4.1.6 Save & Exit ................................................................................. 69
Appendix A System Assignments........................ 71
A.1 System I/O Ports..................................................................................... 72
Table A.1: System I/O Ports ...................................................... 72
A.2 DMA Channel Assignments .................................................................... 73
Table A.2: DMA Channel Assignments ..................................... 73
A.3 1st MB Memory Map............................................................................... 73
Table A.3: 1st MB Memory Map ................................................ 73
A.4 Interrupt Assignments ............................................................................. 73
Table A.4: Interrupt Assignments .............................................. 73

Chapter 1
1General Information
This chapter details background
information on the MIO-2375.
Sections include:
Introduction
Specifications
Block diagrams

MIO-2375 User Manual 2
1.1 Introduction
Advantech’s MIO-2375 is powered by 11th Gen Intel® Core™ U series processors,
and features a 2.5” Pico-ITX SBC form factor (compact series, 100 x 72 mm/3.93 x
2.83 in). MIO-2375 is capable of using embedded iManager 3.0, SUSI 4.0, and
WISE-DeviceOn to remotely monitor and control system operations.
MIO-2375 adopts the latest 64-bit, multi-core processors built on 10nm process tech-
nology to improve CPU processing, graphics, security, and I/O flexibility.
1.2 Specifications
Platform
Processor i7-1185G7E i7-1185GRE i5-1145G7E i3-1115G4E
Max. Frequency 4.40 GHz 4.40 GHz 4.10 GHz 3.90 GHz
Base Frequency 1.8 GHz 1.80 GHz 1.50 GHz 2.20 GHz
Core/Tread 4/8 4/8 4/8 2/4
LLC 12MB 12MB 8MB 6MB
CPU TDP 15W 15W 15W 15W
Chipset Intel® 300 Series Chipset (SoC Integrated)
BIOS AMI EFI 256Mbit
Memory
Technology LPDDR4x-4267
Max. Capacity Up to 32GB
Channel/Socket Single or Dual Channels/Onboard
ECC Support No Yes No No
Graphics
Controller Integrated Intel® Iris® Xe Graphics
Max. Frequency 1.35 GHz 1.35 GHz 1.30 GHz 1.25 GHz
Graphics Memory TBU TBU TBU TBU
3D/HW Accelera-
tion
DX12, OGL4.0, OCL1.2, HW Encode: H.265/HEVC, H.264,
MPEG2, HW Decode: H.264
Display I/F
LCD
eDP1.4 HBR3, up to 4096x2304x36bpp@60Hz; with DSC
7680x4320x30bpp@60 Hz
Optional MIPI-DSI 2.5GHz, up to 3200x2000x24bpp@60Hz; with
DSC 5120x3200x24bpp@60 Hz
HDMI/DP 1 x DP1.4 (DP++), up to 4096x2304x36bpp@60Hz; with DSC
7680x4320x30bpp@60 Hz
Multiple Display Dual simultaneous displays by eDP/MIPI-DSI + DP
External I/O
Ethernet 2 x RJ-45, LAN1: Intel 219LM, LAN2: Intel 210AT/IT
VGA/HDMI/DP -/-/1
USB 3.2/USB 2.0 2/-
Power DC-Jack Optional

3 MIO-2375 User Manual
Chapter 1 General Information
*Note: Supported by request
Internal I/O
SATA 1 x SATA GenIII 6.0 Gbps
USB 2.0 2 x
Serial Bus I2C (support 400Kbit/s), *SMBus (optional)
COM Port 1 x RS-232/422/485 (support 1Mbps), 1 x RS-232 (115.2kbps)
GPIO 4-bit general purpose input output I/O
Audio Realtek ALC888s, Line-in/Line-out/MIC
Inverter 12V
Fan 4-wire smart fan
Front Panel Control Power-on, Reset, Buzzer, SATA LED, CaseOpen
Board Feature
Watchdog Timer 65536 level, 0~65535 sec
TPM TPM 2.0, Infineon SLB9670
iManager 3.0 SW API for Hardware Monitor, Smart Fan Control, Brightness
Control, I2C, GPIO, WDT
Expansion
M.2 E-Key 1 x E-Key 2230 (PCIe x1, USB2.0)
M.2 B-Key/M.2 M-
Key
1 x B-Key 3042/2242 (1 x SATA , 1 x USB 2.0) w/ Nano-SIM
Optional 1 x M-Key 2242 (PCIe x2 NVMe)
Power
Supply Voltage Vin: DC 12V +/- 10%; RTC Battery: Lithium 3V/210mAH
Connector ATX 2pin 180D, optional DC-Jack
Power Management AT, ATX
Max. Consumption 23.388 W
Idle Consumption 9.029 W
Environment
Temperature
Operating: Standard: 0 ~ 60 °C (32 ~ 140 °F),
Extend: -40 ~ 85 °C (-40 ~ 185 °F)
Storage: -40 ~ 85 °C (-40 ~ 185 °F)
Humidity
Operating: 40 °C (104 °F) @ 95% relative humidity, non-condens-
ing
Storage: 60 °C (140 °F) @ 95% relative humidity, non-condensing
Vibration Resis-
tance 3.5 Grms
Software OS Windows10, Linux 20.04, Yocto BSP
Software & API WISE-DeviceOn, Edge AI Suite, iManager 3.0
Certification EMC CE, FCC Class B
Mechanical Dimensions 100 x 72 mm (3.93 x 2.83 in)
Net Weight 80g (.17 lb)

MIO-2375 User Manual 4
1.3 Block Diagram
Intel
Tiger Lake-UP3 SoC
I7/i5/i3/Celeron
(28W/15W)
DC 12V only
AT/ATX
External I/O
Internal I/O
Opt. Func.
CH-0 CH-1
LPDDR4x-4267
Dual Channel
Up to 32GB
*IBECC
eDP 4-Lane/
MIPI-DSI
DDI A
i219
GbE (vPro)
GbE
DP 1.4
2x USB 3.2 USB3.2 x2
TPM2.0
AES-256
COM1
RS-232/422/485
COM2
RS-232
GPIO 4-bit
I2C (SMBus)
Audio
Line-in/out/MIC
SPI
eSPI
PCIex1
PCIex1
M.2 M-Key
2242
M.2 E-Key
2230
M.2 B Key
3042/2242
PCIex2, USB2.0
PCIex2
CODEC
ALC-888s
I210
256M BIOS
SPI
Nano
SIM
EIO-211
(TCP2)Type-C
USB2.0 SATA III
*PCIex2
2x USB 2.0 USB 2.0 x2
Smart Fan
1x SATA SATA

Chapter 2
2Mechanical
Specifications
This chapter details background
information on the MIO-2375.
Sections include:
Mechanical Diagrams
Assembly Diagrams

MIO-2375 User Manual 6
2.1 Introduction
This MI/O compact form factor, next-generation SBC features a variety of mechanical
improvements. The following is a quick installation guide for Advantech’s thermal
solution.
This chapter comprises assembly instructions for standard and optional thermal solu-
tions as well as board dimension diagrams.
2.2 Board Layout: Dimensions
Figure 2.1 MIO-2375 Mechanical Diagram (Top Side)
0
3.25
50
96.75
100
0
3.25
36
68.75
72

7 MIO-2375 User Manual
Chapter 2 Mechanical Specifications
Figure 2.2 MIO-2375 Mechanical Diagram (Bottom Side)
Figure 2.3 MIO-2375 Mechanical Diagram (Coastline)
Figure 2.4 MIO-2375 Mechanical Diagram (with Cooler)
Figure 2.5 MIO-2375 Mechanical Diagram (with Heat Spreader)
0
3.25
18
78.03 96.75
100
0
3.25
25.21
25.72
68.75
72
0
1.60
17.94
3.88
0
13.45 30.15 48.87 62.84 82.51
100
0
1.60
17.94
20
0
1.6
17.94
11
20.60

MIO-2375 User Manual 8
2.3 Quick Installation Guide
There is a Heatsink/Cooler (or optional heatspreader) in the white box inside the
package. Use the following exploded diagram to assemble it.
2.3.1 Cooler
2.3.2 Heatspreader (Optional)
Remove release paper
Remove release paper
Remove release paper

Chapter 3
3Installation
This chapter details setup proce-
dures for MIO-2375 hardware —
including instructions on setting
jumpers and connecting peripher-
als, as well as switches and indi-
cators. Be sure to read all the
safety precautions before installa-
tion.

MIO-2375 User Manual 10
3.1 Jumpers and Switches
The MIO-2375 has a number of jumpers that allow you to configure your system to
suit your application. The table below lists the functions of the various jumpers.
3.2 Connectors
Onboard connectors link MIO-2375 to external devices such as hard disk drives or
keyboards. The table below lists the function of each of the board's connectors.
Table 3.1: Jumpers and Switches
SW1 Auto Power on Setting
VDD1 LCD Power
Table 3.2: Connectors
Label Function
CN1 Front Panel
CN2 GPIO
CN3 I2C
CN4 FAN
CN5 DC Power in
Battery1 RTC Battery
EDP1 eDP
BL1 Inverter Power Output
DP1 DP++
USB1 USB 2.0+3.2
USB3 Internal USB
M2_1 M.2 E-key
M2_2 M.2 B/M-key
SIM1 NANO SIM
LAN1 RJ45_2x1_W/XFMR&LED
SATA1 SATA_7V
Audio1 Audio
COM1 COM1
COM2 COM2

11 MIO-2375 User Manual
Chapter 3 Installation
3.3 Locating Connectors
Figure 3.1 MIO-2375 Connector Locations (Top Side)
Figure 3.2 MIO-2375 Connector Locations (Bottom Side)
DC IN
RJ45 USB3.2
DP
M.2 B-Key
(co-lay M-Key)
M.2 E-Key
RTC BaƩery
SATA
USB 2.0
Audio
COM1
Inverter &
SATA Power
GPIO
SIM Card
I2C/SMBus
COM2
LPDDR4x
eDP conn.
(*opƟonal)
Smart Fan

MIO-2375 User Manual 12
3.4 Setting Jumpers
You may configure your card to match the needs of your application by setting jump-
ers. A jumper is a metal bridge used to close an electric circuit. It consists of two
metal pins and a small metal clip (often protected by a plastic cover) that slides over
the pins to connect them. To “close” a jumper, you connect the pins with the clip. To
“open” a jumper, you remove the clip. Sometimes a jumper will have three pins,
labeled 1, 2, and 3. In this case you would connect either pins 1 and 2, or 2 and 3.
The jumper settings are schematically depicted in this manual as follows:
A pair of needle-nose pliers may be helpful when working with jumpers. If you have
any doubts about the best hardware configuration for your application, contact your
local distributor or sales representative before you make any changes. Generally, you
simply need a standard cable to make most connections.
3.4.1 Auto Power On Setting (SW1)
Load BIOS Default
Step 1: Power OFF
Step 2: Dip switch to position 3 to 6, then power on
Step 3: BIOS load default (do not clear time & clear CMOS)ŁAPop out to remind the
user to shut down and switch the DIP switch from 6 to 3
Step 4: Power on
closed 2-3closedopen
Table 3.3: Auto Power On Setting (SW1)
Part Number 1600000084
Footprint SW_4x2P_50_260x220
Description SLIDE SW CHS-04TA(29) SMD 8P 6.6x5.4x2.4mm
Setting Function
(1-8)* on AT mode
(1-8) off ATX mode
(3-6) on Clear CMOS
(3-6)*off Normal (Keep CMOS)
(2-7)(4-5) Test Only