Advantech MIO-5376 User manual

User Manual
MIO-5376

MIO-5376 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2023
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. The information provided in this manual is intended to be accurate and reliable.
However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any
infringements of the rights of third parties that may result from its use.
Acknowledgments
AMD Ryzen™ Embedded is a trademark of AMD Corporation.
AMI is a trademark of American Megatrends, Inc.
IBM, PC, PS/2, and VGA are trademarks of International Business Machines Corpo-
ration.
Microsoft Windows® and DirectX® are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
For more information on this and other Advantech products, please visit our websites
at:
http://www.advantech.com
http://www.advantech.com/eplatform
For technical support and service, please visit our support website at:
http://support.advantech.com/
This manual is for MIO-5376.
Part No. 2006537600 Edition 1
Published in March 2023

iii MIO-5376 User Manual
Product Warranty (2 years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers will be billed according to the cost of replacement mate-
rials, service time, and freight. Please consult your dealer for more details.
If you believe your product to be defective, follow the steps outlined below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages displayed when the prob-
lem occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card, and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number clearly on the outside of the package and ship the pack-
age prepaid to your dealer.

MIO-5376 User Manual iv
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables. This
type of cable is available from Advantech. Please contact your local supplier for
ordering information.
Test conditions for passing also include the equipment being operated within an
industrial enclosure. In order to protect the product from damage caused by electro-
static discharge (ESD) and EMI leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class B
This equipment has been tested and found to comply with the limits for a Class B dig-
ital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro-
vide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. However, there is no guarantee that interfer-
ence will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for assistance.
Technical Support and Assistance
1. Visit the Advantech website at www.advantech.com/support to obtain the latest
product information.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before calling:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages

v MIO-5376 User Manual
Packing List
Before system installation, check that the items listed below are included and in good
condition. If any item does not accord with the list, contact your dealer immediately.
1 x MIO-5376 SBC
1 x SATA cable, 30 cm (P/N: 1700006291)
1 x SATA power cable, 35 cm (P/N: 1700031583-01)
1 x USB 2.0 cable, 20 cm (P/N: 1700030406-01)
1 x USB 3.2 cable, 35 cm (P/N: 1700032181-01)
1 x Audio cable, 20 cm (P/N: 1700019584-01)
2 x COM RS-232/422/485 cables, 20 cm (P/N: 1700030404-01)
2 x COM RS-232 cables, 20 cm (P/N: 1700031582-01)
1 x Heatsink for CPU cTDP 12W/15W (P/N: 1970005548T001)
1 x Screw kit (2 sets of screws for the M.2 device & 4 sets of screws and stand-
off for the heatsink/cooler)
1 x Startup Manual
1 x DeviceOn package
Optional Accessories
Heat spreader for MIO-5376 (P/N: 1970005615T001)
Active cooler, 25W (P/N: 1970005512T001)*
MIOe-PSE dual-port PSE power module, 15.4W x 2 (P/N: MIOe-PSE-DPA1)
Note:
*Suggested thermal solution: CPU cTDP (default 15W) with heatsink; optional 25W
with cooler

MIO-5376 User Manual vi

vii MIO-5376 User Manual
Contents
Chapter 1 Introduction..........................................1
1.1 Introduction ............................................................................................... 2
1.2 Specifications............................................................................................ 2
1.3 Block Diagram........................................................................................... 4
Chapter 2 Mechanical Specifications..................5
2.1 Introduction ............................................................................................... 6
2.2 Board Layout: Dimensions ........................................................................ 6
Figure 2.1 MIO-5376 Mechanical Diagram (Top Side) ................ 6
Figure 2.2 MIO-5376 Mechanical Diagram (Bottom Side)........... 6
Figure 2.3 MIO-5376 Mechanical Diagram (Coastline) ............... 7
Figure 2.4 MIO-5376 Mechanical Diagram (with Heatsink) ......... 7
Figure 2.5 MIO-5376 Mechanical Diagram (with Optional Cooler)
7
Figure 2.6 MIO-5376 Mechanical Diagram (with Optional Heat
Spreader).................................................................... 8
2.3 Quick Installation Guide ............................................................................ 8
Figure 2.7 Heatsink Assembly Guide .......................................... 8
Figure 2.8 Cooler Assembly Guide (Optional) ............................. 9
Figure 2.9 Heat Spreader Assembly Guide (Optional) ................ 9
Figure 2.10MIO-5376 and MIOe-PSE (Optional PoE Module) As-
sembly ........................................................................ 9
Chapter 3 Jumpers..............................................11
3.1 Jumpers .................................................................................................. 12
3.1.1 Panel Voltage Selection Jumper: VDD1 ..................................... 12
3.1.2 AT Mode/Load BIOS Default: J1................................................. 12
3.2 Connectors.............................................................................................. 13
3.3 Locating Connectors ............................................................................... 14
Figure 3.1 Locating Connectors (Front View) ............................ 14
Figure 3.2 Locating Connectors (Bottom View) ......................... 14
3.4 Setting Jumpers ...................................................................................... 15
3.4.1 I2C Internal Connector: CN2....................................................... 15
3.4.2 Smart FAN Internal Connector: FAN1 ........................................ 16
3.4.3 COM-Port Internal Connector 3: COM3...................................... 16
3.4.4 COM-Port Internal Connector 4: COM4...................................... 17
3.4.5 POE Power Internal Connector: POE_PWR1............................. 17
3.4.6 COM-Port Internal Connector 1: COM1...................................... 18
3.4.7 COM-Port Internal Connector 2: COM2...................................... 18
3.4.8 Front Panel Internal Connector: CN1.......................................... 19
3.4.9 GPIO Internal Connector: GPIO1 ............................................... 20
3.4.10 USB 2.0 Dual-Port Internal Connector: USB3 ............................ 21
3.4.11 Audio Internal Connector: AUDIO1............................................. 21
3.4.12 CANBus Internal Connector: CN3 .............................................. 22
3.4.13 SATA Power Connector: SATA_PWR1...................................... 22
3.4.14 Panel Inverter Connector: BL1.................................................... 23
3.4.15 USB 3.2 Dual-Port Internal Connector: USB2 ............................ 23
3.4.16 LVDS Connector: LVDS1............................................................ 24
3.4.17 RTC Battery Connector: BAT1.................................................... 25
3.4.18 M.2 E-Key Connector: M2_E1 .................................................... 26
3.4.19 M.2 M-Key Connector: M2_M1................................................... 28

MIO-5376 User Manual viii
3.4.20 M.2 B-Key Connector: M2_B1.................................................... 31
Chapter 4 AMI BIOS Setup................................. 35
4.1 Entering Setup ........................................................................................ 36
4.1.1 Main Setup.................................................................................. 36
4.1.2 Advanced BIOS Features Setup................................................. 37
4.1.3 Chipset Configuration ................................................................. 61
4.1.4 Security....................................................................................... 67
4.1.5 Boot ............................................................................................ 68
4.1.6 Save & Exit ................................................................................. 69
4.1.7 AMD PBS Option ........................................................................ 70
Chapter A System I/O Ports ............................... 71
A.1 System I/O Ports..................................................................................... 72
A.2 DMA Channel Assignments .................................................................... 73
A.3 1st MB Memory Map............................................................................... 73
A.4 Interrupt Assignments ............................................................................. 73

Chapter 1
1Introduction

MIO-5376 User Manual 2
1.1 Introduction
Advantech’s MIO-5376 3.5” SBCs – powered by AMD Ryzen™ Embedded R2000
Series processors – is designed for vertical market applications and harsh industrial
environments. MIO-5376 integrated 12V to 24V wide voltage range and multi-I/Os
include three 2.5GbE ports (including two optional PoE ports), CANBus, and high-
speed UARTs. Moreover, MIO-5376 provides network expansion through M.2 E-Key
and B-Key ports and it supports Wi-Fi and 5G/LTE modules.
Advantech’s MIO-5376 SBCs are available in 15W or 25W configurations to meet a
diverse range of power and performance requirements. The 15W version is a fanless
system design optimized for reliability and ruggedness. MIO-5376 can also be
adapted to run at 25W with an efficient slim-line cooler for an additional performance
boost.
MIO-5376 offers the embedded iManager 3.0, SUSI 4.0 and Advantech WISE-PaaS/
DeviceOn to monitor and control system operation effectively and remotely.
1.2 Specifications
Platform
Processor R2314 SoC with AMD
Radeon™ Graphics
R2514 SoC with AMD
Radeon™ Graphics*
Max. Frequency 3.50 GHz 3.70 GHz
Base Frequency 2.1 GHz 2.1 GHz
Core/Thread 4/4 4/8
Chipset AMD Ryzen™ Embedded R2000 processor
BIOS AMI EFI 256 Mbit
Memory
Technology DDR4-2667
Max. Capacity up to 32GB
Channel/Socket dual channels / 2 sockets
Graphics Controller
Integrated AMD Radeon Graphics
R2314: 6 computing units (CUs)
R2514: 8 computing units (CUs)
Display I/F
LCD 1 x LVDS: dual channel 18/24-bit, up to 1920 x 1200
HDMI 1 x HDMI 2.0b, up to 4Kx2Kx24 bpp @60Hz
DP 1 x DP1.4a, up to 4096x2304x36 bpp @60Hz or
5120x3200x24 bpp @60Hz
Multiple Displays 3 simultaneous displays
Ethernet Controller 3 x GbE, Intel® i226
Speed 2.5 GbE/port
External I/O
Ethernet
3 x GbE, Intel® i226
2 x optional PSE compliant to 802.3af (15.4W per
port) with external PSE power module (Model: MIOe-
PSE)
HDMI/DP 1/1
USB 3.2 2 x USB 3.2 Gen2x1 10Gbps
LED power status, SATA R/W
Power Connector 2-pin phoenix connector

3 MIO-5376 User Manual
Chapter 1 Introduction
Internal I/O
SATA 1 x SATA Gen3 6.0Gbps
USB 3.2 2
USB 2.0 2
COM Port 2 x RS-232/422/485, 2 x RS-232 (4-wire)
CANBus 1 x CAN2.0
Serial Bus I2C, SMBus* (optional)
Audio Realtek ALC888s, Line-In/Line-Out/MIC
GPIO 8-bit general purpose input output I/O
Inverter 12V/5V/3.3V selectable
Fan 12V, 1A (4-wire)
Front Panel Control Power-On, Reset, Buzzer, SATA LED, CaseOpen
Board
Features
Watchdog Timer 65536 level, 0~65535 sec
TPM TPM 2.0
iManager 3.0 SW API for Hardware Monitor, Smart Fan Control,
Brightness Control, I2C, GPIO, WDT
Expansion
M.2 E-Key 1 x E-Key 2230 (PCIe x1, USB 2.0)
M.2 B-Key 1 x B-Key 3042/ 3052 (PCIe x1, USB 3.2/2.0) w/
Nano-SIM
M.2 M-Key 1 x M-Key 2280 (PCIe Gen3 x4 SSD, Optional SATA
III)
Power
Supply Voltage Vin: DC 12V~24V +/- 10%; RTC Battery: Lithium 3V/
210mAH
Connector 2-pin phoenix connector
Power Management AT, ATX
Environment
Temperature
Operating: Standard: 0 ~ 60 °C (32 ~ 140 °F), Extend:
-40 ~ 85 °C (-40 ~ 185 °F)
Storage: -40 ~ 85 °C (-40 ~ 185 °F)
Humidity
Operating: 40 °C @ 95% relative humidity, non-con-
densing
Storage: 60 °C @ 95%relative humidity, non-condens-
ing
Vibration Resistance 3.5 Grms
Certification EMC CE, FCC Class B
Mechanical Dimensions 146 x 102 mm (5.7” x 4”)

MIO-5376 User Manual 4
1.3 Block Diagram

Chapter 2
2Mechanical
Specifications

MIO-5376 User Manual 6
2.1 Introduction
The MI/O compact form factor SBC is a new-generation SBC designed with a variety
of mechanical improvements. This chapter includes board dimensions and assembly
instructions for the standard thermal solution.
2.2 Board Layout: Dimensions
Figure 2.1 MIO-5376 Mechanical Diagram (Top Side)
Figure 2.2 MIO-5376 Mechanical Diagram (Bottom Side)

7 MIO-5376 User Manual
Chapter 2 Mechanical Specifications
Figure 2.3 MIO-5376 Mechanical Diagram (Coastline)
Figure 2.4 MIO-5376 Mechanical Diagram (with Heatsink)
Figure 2.5 MIO-5376 Mechanical Diagram (with Optional Cooler)

MIO-5376 User Manual 8
Figure 2.6 MIO-5376 Mechanical Diagram (with Optional Heat Spreader)
2.3 Quick Installation Guide
This section guides the installation of the heatsink and optional cooler, which is con-
tained in the white box inside the package. Please assemble it as in the following dia-
gram. Remember to remove the plastic from the thermal pad before assembling.
Figure 2.7 Heatsink Assembly Guide

9 MIO-5376 User Manual
Chapter 2 Mechanical Specifications
Figure 2.8 Cooler Assembly Guide (Optional)
Figure 2.9 Heat Spreader Assembly Guide (Optional)
Figure 2.10 MIO-5376 and MIOe-PSE (Optional PoE Module) Assembly

MIO-5376 User Manual 10

Chapter 3
3Jumpers

MIO-5376 User Manual 12
3.1 Jumpers
3.1.1 Panel Voltage Selection Jumper: VDD1
3.1.2 AT Mode/Load BIOS Default: J1
Jumper Short Panel Voltage
1-3 +3.3V (Default)
3-5 +5V
3-4 +12V
Jumper Short Panel Functional
1-2 On: AT mode* (default)
Off: ATX mode
3-4 On: Reserved* (default)
Off: Reserved
5-6 On: Load BIOS default
Off: Normal* (default)