Infortrend EonStor S12S-G1033 User manual

Installation and Hardware
Reference Manual
EonStor®S12S-G1033
S12S-G1033P
2U Profile
SAS-to-SAS/SATA RAID Subsystem
Version 1.4 (November, 2011)

EonStor S12S-G1033/P Installation and Hardware Reference Manual
ii
Contact Information
Customer Support Contact your system vendor or visit the following support
sites.
EonStor DS Support
ESVA Support
EonNAS Support
Headquarters
(Taiwan)
Infortrend Technology, Inc.
8F, No. 102, Sec. 3, Jhongshan Rd., Jhonghe Dist., New Taipei City 235,
Taiwan
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
Japan Infortrend Japan, Inc.
6F Okayasu Bldg., 1-7-14 Shibaura, Minato-Ku, Tokyo, 105-0023 Japan
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
Americas Infortrend Corporation
2200 Zanker Road, Suite 130, San Jose, CA. 95131, USA
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
US East Coast Office
4 Northeastern Blvd. Suite 21B, Nashua, NH, 03062, USA
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
China Infortrend Technology, Ltd.
Room 1210, West Wing, Tower One, Junefield Plaza No.6 Xuanwumen
Street, Xuanwu District, Beijing, China
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
Europe (EMEA) Infortrend Europe LTD.
1 Cherrywood, Stag Oak Lane Chineham Business Park Basingstoke,
Hampshire RG24 8WF, UK
Tel: [phone] Fax: [phone] Email, Technical Support,
Website
Germany/ Infortrend Deutschland GmbH
Wappenhalle Business Center Konrad-Zuse-Platz 8, 81829 Munich,
Germany
Tel: [phone] Fax: [phone] Email, Technical
Support, Website

EonStor S12S-G1033/P Installation and Hardware Reference Manual
iii
Copyright
All rights reserved. This publication may not be reproduced,
transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any
form or by any means, electronic, mechanical, magnetic,
optical, chemical, manual or otherwise, without the prior
written consent of Infortrend Technology, Inc.
Disclaimer Infortrend Technology makes no representations or
warranties with respect to the contents hereof and
specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose.
Furthermore, Infortrend Technology reserves the right to
revise this publication and to make changes from time to
time in the content hereof without obligation to notify any
person of such revisions or changes. Product specifications
are also subject to change without prior notice.
Trademarks Infortrend, the Infortrend logo, SANWatch, ESVA, EonStor,
EonStor DS, EonNAS, and EonPath are registered
trademarks of Infortrend Technology, Inc. Other names
prefixed with “IFT” and “ES” are trademarks of Infortrend
Technology, Inc.
Windows is a registered trademark of Microsoft
Corporation.
Mac OS X is a registered trademark of Apple Computer,
Inc.
Linux is a trademark of Linus Torvalds.
All other names, brands, products or services are
trademarks or registered trademarks of their respective
owners.

EonStor S12S-G1033/P Installation and Hardware Reference Manual
iv
Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED
ACCESS LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and
service personnel who have been instructed of and fully understand
the possible hazardous conditions and the consequences of
accessing non-field-serviceable units, e.g., system backplane.
FCC (applies in the U.S. and Canada)
FCC Class B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to Part 15 of the FCC Rules (47
CFR, Part 2, Part 15 and CISPR PUB. 22 Class B). These limits are
designed to provide reasonable protection against harmful
interference when the equipment is operated in a residential
installation. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with
this user’s guide, may cause harmful interference to radio
communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, you are encouraged
to try to correct the interference by one or more of the following
measures:
˙ Reorient or relocate the receiving antenna.
˙ Increase the separation between the equipment and receiver.
˙ Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
˙ Consult the dealer or an experienced radio/TV technician for
help.
This device complies with Part 15 of FCC Rules. Operation is subject
to the following two conditions: 1) this device may not cause harmful

EonStor S12S-G1033/P Installation and Hardware Reference Manual
interference, and 2) this device must accept any interference
received, including interference that may cause undesired operation.
Warning!
A shielded power cord is required in order to meet FCC emission
limits and also to prevent interference with nearby radio and
television reception.
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly
approved by the party responsible for compliance could void your
authority to operate the equipment.
This device is in conformity with the EMC.
China RoHS In Compliance with AeA China RoHS Regulations (SJ/T 11364-
2006)
CB (Certified Worldwide)
This device meets the requirements of the CB standard for
electrical equipment with regard to establishing a satisfactory
level of safety for persons using the device and for the area
surrounding the apparatus. This standard covers only safety
aspects of the above apparatus; it does not cover other matters,
such as style or performance.
CCC
For Power Supplies’ compatibility to China Compulsory
Certification.
ITE BSMI Class A, CNS 13438 (for Taiwan)
v

EonStor S12S-G1033/P Installation and Hardware Reference Manual
vi
This device is in conformity with UL standards for safety.
This device is in conformity with Russia GOST-R standards for
safety.
Инструкция по безопасности
Модель:
FC to SAS/SATA 2U/12Bay RAID Subsystem, Models ESS12F-
R1432xxxxxx, ESS12F-G1433xxxx, where “x” can be “0-9”, “A-
Z“, blank, or dash “x” for marketing purpose and no impact
safety related critical components and constructions.
1. Перед использованием оборудования внимательно
прочтите инструкцию.
2. Сохраняйте инструкцию для дальнейшего
использования вработе.
3. Не допускайте попадания влаги на изделие.
4. Устанавливайте оборудование на устойчивую
поверхность. Падение может нанести ущерб
оборудованию.
5. Соблюдайте климатические требования, использование
оборудование при температуре окружающей среды
выше 50 С, может привести квыходу оборудования из
строя.
6. Размещайте шнур питания внедоступном для
пользователя месте. Запрещается ставить на шнур
питания какие-либо предметы.
7. При работе соборудованием необходимо учитывать все
предупреждения изамечания.
8. Если оборудование не используется втечении
длительного времени, отключите его от сети питания.
9. Запрещается вскрывать оборудование. Оборудование
может вскрываться только квалифицированным
персоналом.
10. При возникновении одного из повреждений
оборудования вызовите обслуживающий персонал:
a. Повреждение шнура питания или вилки.
b. Оборудование не работает или его работа не
соответствует инструкции пользователя .
e. Оборудование повреEждено.
f. Оборудование имеет очевидный признак поломки.
11. Источник питания должен быть установлен в
соответствии синструкцией. Ток нагрузки ивыходная
мощность не должны превышать указанных в

EonStor S12S-G1033/P Installation and Hardware Reference Manual
спецификации.
Infortrend is committed to being properly prepared and taking all
the necessary steps that will result in our compliance with the
new European directive, RoHS (2002/95/EC), on or before the
specific dates set forth in those applicable laws and regulations.
Infortrend is applying its own internal efforts and expertise and is
working closely with customers and suppliers to achieve
compliance while maintaining an uninterrupted supply of quality
products. Infortrend is currently investigating, evaluating, and
qualifying our materials and components to ensure that products
sold on or after 1 July 2006, in such territory, are in compliance
with the above regulations.
Disposal of Old Electrical & Electronic Equipment (Applicable in
the European Union and other European countries with separate
collection systems)
This symbol on the product or on its packaging indicates that
this product shall not be treated as household waste. Instead it
shall be handed over to the applicable collection point for the
recycling of electrical and electronic equipment. By proper waste
handling of this product you ensure that it has no negative
consequences for the environment and human health, which
could otherwise be caused if this product is thrown into the
garbage bin. The recycling of materials will help to conserve
natural resources.
For more details about recycling of this product, please contact
your local city office, your household waste disposal service or
the dealer from whom you purchased the product.
This product utilizes STA standards compliant interfaces.
vii

EonStor S12S-G1033/P Installation and Hardware Reference Manual
viii
Table of Contents
CONTACT INFORMATION...............................................................................................II
CPOYRIGHT ................................................................................................................III
WARNINGS AND CERTIFICATIONS ............................................................................... IV
SAFETY PRECAUTIONS ............................................................................................... X
Precautions and Instructions...............................................................................................x
ESD Precautions.................................................................................................................x
ABOUT THIS MANUAL ................................................................................................ XI
Revision History .................................................................................................................xi
Who should read this manual?...........................................................................................xi
Related Documentation .....................................................................................................xi
CONVENTIONS .......................................................................................................... XII
Naming ............................................................................................................................. xii
Lists .................................................................................................................................. xii
Important Information........................................................................................................ xii
SOFTWARE AND FIRMWARE UPDATES ...................................................................... XIII
CHAPTER 1
1.1 PRODUCT OVERVIEW .................................................................................... 1-1
1.2 CHASSIS OVERVIEW ..................................................................................... 1-2
1.2.1 Front Panel Overview ................................................................................. 1-2
1.2.2 Rear Panel Overview.................................................................................. 1-3
1.2.3 Internal Backplane ...................................................................................... 1-3
1.2.4 Physical Dimensions................................................................................... 1-4
1.3 MAJOR COMPONENTS................................................................................... 1-4
1.3.1 LCD keypad Panel...................................................................................... 1-4
1.3.2 Drive Tray ................................................................................................... 1-5
1.3.3 RAID Controller Module.............................................................................. 1-6
1.3.3.1 Controller Module Interfaces........................................................................1-7
1.3.3.2 DIMM Module ..............................................................................................1-9
1.3.4 BBU ............................................................................................................ 1-9
1.3.5 PSUs ........................................................................................................ 1-10
1.3.6 Cooling Modules ....................................................................................... 1-10
1.4 ENCLOSURE MONITORING ........................................................................... 1-11
1.4.1 I2C bus ..................................................................................................... 1-11
1.4.2 LED Indicators .......................................................................................... 1-12
1.4.3 Firmware (FW) and SANWatch Management Suite ................................. 1-12
1.4.4 Audible Alarms ......................................................................................... 1-12
1.5 HOT-SWAPPABLE COMPONENTS ................................................................. 1-13
1.5.1 Hot-swap Capabilities ............................................................................... 1-13
1.5.2 Components ............................................................................................. 1-13
CHAPTER 2
2.1 INTRODUCTION ............................................................................................. 2-1
2.2 INSTALLATION PREREQUISITES...................................................................... 2-1
2.3 SAFETY PRECAUTIONS.................................................................................. 2-2
2.3.1 Precautions and Instructions ...................................................................... 2-2
2.3.2 Static-free Installation ................................................................................. 2-4
2.3.3 Preparation ................................................................................................. 2-4
2.4 GENERAL INSTALLATION PROCEDURE ........................................................... 2-5
2.5 UNPACKING THE SUBSYSTEM ........................................................................ 2-6
2.5.1 Preinstalled Components............................................................................ 2-7
2.5.2 Modules to be Installed ............................................................................. 2-7
2.6 RACKMOUNTING ........................................................................................... 2-7
2.7 HARD DRIVE INSTALLATION......................................................................... 2-12
2.7.1 Hard Drive Installation Prerequisites......................................................... 2-12
2.7.2 Drive Installation ....................................................................................... 2-13
2.8 DRIVE TRAY INSTALLATION ......................................................................... 2-13
2.9 OPTIONAL BATTERY MODULE INSTALLATION ............................................... 2-16
2.9.1 BBU Warnings and Precautions ............................................................... 2-16
2.9.2 Installation Procedure............................................................................... 2-17
CHAPTER 3
3.1 HOST CONNECTION PREREQUISITES.............................................................. 3-1

EonStor S12S-G1033/P Installation and Hardware Reference Manual
ix
3.1.1 Host Link Cables....................................................................................... 3-1
3.1.2 Other Concerns......................................................................................... 3-2
3.2 SAMPLE TOPOLOGY...................................................................................... 3-4
3.3 EXPANSION LINKS ........................................................................................ 3-5
CHAPTER 4
4.1 POWER ON................................................................................................... 4-1
4.1.1 Check List................................................................................................... 4-1
4.1.2 Power On Procedure .................................................................................. 4-1
4.1.3 Power On Status Check ............................................................................. 4-2
4.1.4 LCD Screen ................................................................................................ 4-3
4.2 POWER OFF PROCEDURE ............................................................................. 4-4
4.3 SYSTEM MONITORING OVERVIEW .................................................................. 4-5
4.4 STATUS-INDICATING LEDS............................................................................ 4-6
4.4.1 LED Overview............................................................................................. 4-6
4.4.2 LCD Keypad Panel ..................................................................................... 4-6
4.4.3 Drive Tray LEDs ......................................................................................... 4-7
4.4.4 Controller Module LEDs.............................................................................. 4-8
4.4.4.1 System Status LEDs....................................................................................4-8
4.4.4.2 SAS Port LEDs ............................................................................................4-9
4.4.4.3 Restore Default LED....................................................................................4-9
4.4.4.4 LAN Port LEDs ..........................................................................................4-10
4.4.5 BBU LED .................................................................................................. 4-10
4.4.6 PSU LEDs ................................................................................................ 4-11
4.4.7 Cooling Module LEDs ............................................................................... 4-11
4.5 AUDIBLE ALARM......................................................................................... 4-12
4.5.1 Overview ................................................................................................. 4-12
4.5.2 Failed Devices .......................................................................................... 4-13
CHAPTER 5
5.1 OVERVIEW.................................................................................................... 5-1
5.1.1 About Subsystem Maintenance .................................................................. 5-1
5.1.2 General Notes on Component Replacement .............................................. 5-1
5.2 REPLACING A CONTROLLER MODULE ............................................................ 5-2
5.2.1 Considerations............................................................................................ 5-2
5.2.2 Controller Module Replacement Procedure................................................ 5-3
5.3 REPLACING A DIMM MODULE ....................................................................... 5-4
5.3.1 DIMM Module Considerations .................................................................... 5-4
5.3.2 DIMM Module Upgrade/Replacement Procedure ....................................... 5-5
5.4 REPLACING A FAULTY BBU .......................................................................... 5-6
5.4.1 Notes on BBU Maintenance ....................................................................... 5-6
5.4.2 BBU Replacement Procedure..................................................................... 5-8
5.5 REPLACING A FAULTY PSU .......................................................................... 5-9
5.5.1 PSU Overview ............................................................................................ 5-9
5.5.2 PSU Replacement Procedure................................................................... 5-10
5.6 REPLACING A COOLING MODULE................................................................. 5-12
5.6.1 Notes on Cooling Module Maintenance .................................................... 5-12
5.6.2 Cooling Module Replacement Procedure ................................................. 5-13
5.7 REPLACING A FAILED HARD DRIVE.............................................................. 5-13
5.7.1 Hard Drive Maintenance Overview ........................................................... 5-13
5.7.2 Hard Drive Replacement Procedure ......................................................... 5-14
APPENDIX A
A.1 TECHNICAL SPECIFICATIONS .........................................................................A-1
A.2 FUNCTIONAL SPECIFICATIONS .......................................................................A-2
A.3 POWER SUPPLY SPECIFICATIONS ..................................................................A-3
A.4 COOLING MODULE SPECIFICATIONS ..............................................................A-4
A.5 RAID MANAGEMENT.....................................................................................A-4
A.6 FAULT TOLERANCE MANAGEMENT ................................................................A-4
APPENDIX B
B.1 SAS CONNECTOR PINOUTS ..........................................................................B-1
B.2 COM1 SERIAL PORT CABLE .........................................................................B-2
B.3 COM2 SERIAL PORT CABLE TO UPS............................................................B-2
B.4 IFT-9011 NULL MODEM................................................................................B-4
B.5 ETHERNET PORT PINOUTS ............................................................................B-5
B.6 POWER CONNECTORS ..................................................................................B-5

EonStor S12S-G1033/P Installation and Hardware Reference Manual
x
Safety Precautions
Precautions and Instructions
Provide a soft, clean surface to place your subsystem on before
working on it. Servicing on a rough surface may damage the
exterior of the chassis.
The EonStor subsystem comes with twelve (12) drive bays.
Leaving any of these drive bays empty will greatly affect the
efficiency of the airflow within the enclosure, and will
consequently lead to the system overheating, which can cause
irreparable damage.
Prior to powering on the subsystem, ensure that the correct
power range is being used.
All modules must be properly installed before powering on the
subsystem.
If a module fails, leave it in place until you have a replacement
unit and you are ready to replace it.
Handle subsystem modules using their retention screws, ejection
levers, and the metal frames/faceplates. Avoid touching PCB
boards and connector pins.
Airflow Consideration: the subsystem requires an airflow
clearance, especially at the front and the rear. An 18 to 20cm
clearance is required on the rear side of the enclosure.
Make sure data and console cables within a rackmount cabinet
are carefully routed, without causing interference with the airflow
circulation.
Ventilation airflow around the chassis is necessary whether
rackmounted or placed on a table top.
Be sure that the rack cabinet into which the subsystem chassis
will be installed provides sufficient ventilation channels and
airflow circulation around the chassis.
To comply with safety, emission, or thermal requirements, none
of the covers or replaceable modules should be removed. Make
sure that all enclosure modules and covers are securely in place
during operation.
If it is necessary to transport the subsystem, repackage all drives
in its drive trays separately using the original foam blocks in the
shipping box.

EonStor S12S-G1033/P Installation and Hardware Reference Manual
xi
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work
pad are recommended. Avoid dust and debris in your work area.
About This Manual
This manual:
Introduces the EonStor S12S-G1033 subsystem.
Describes all the active components in the system.
Provides recommendations and details about the hardware
installation process of the subsystem.
Briefly describes how to monitor the subsystem.
Describes how to maintain the subsystem.
This manual does not:
Describe components that are not user-serviceable.
Describe the configuration options of firmware, using terminal
emulation programs, or the SANWatch GUI that came with your
subsystem.
Give a detailed description of the RAID controllers embedded
within the subsystem.
Revision History
Rev. 1.0: Initial release
Rev. 1.1: Added Russia GOST-R conformity statement and
removed Appendix B; for detailed spare part and accessory
information, please visit Infortrend website http://www.infortrend.com/
or consult your sales representatives.
Rev. 1.2: Added the P model name. P model is one shipped with
bundled disk drives. Use and installation details are the same as
S12S-G1033.
Rev. 1.3: Added EonStor DS Series JBOD to the list of
compatible JBOD models.
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.

EonStor S12S-G1033/P Installation and Hardware Reference Manual
xii
Related Documentation
SAS to SAS/SATA Series Firmware Operation Manual
SANWatch User’s Manual
Firmware Operation Manual can be found in the Product Utility CD,
while SANWatch User’s Manual can be found in the SANWatch CD.
Both CDs came with your subsystem.
Conventions
Naming
From this point on and throughout the rest of this manual, the
EonStor series may frequently be referred to as simply the
“subsystem” or the “system.” The EonStor S12S-G1033 subsystem
name is abbreviated as S12S-G1033.
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts.
They can be read in any order. Each statement is preceded by a
round black dot “.”
Numbered Lists: Numbered lists are used to describe sequential
steps you should follow in order.
Important Information
Important information that users should be aware of is indicated with
the following icons:
IMPORTANT!
The Important messages pertain to using the EonStor subsystem
introduced in this manual.
WARNING!
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION!
Cautionary messages should also be heeded to help you reduce the
chance of losing data or damaging the system.

EonStor S12S-G1033/P Installation and Hardware Reference Manual
NOTE:
These messages inform readers of essential but non-critical
information. They should be read carefully as any directions or
instructions contained therein can help you avoid making mistakes.
Software and Firmware Updates
Please contact your system vendor, visit Infortrend’s FTP site
(ftp.infortrend.com), or the VIP Room on our website
(http://viproom.infortrend.com.tw/) for the latest software or firmware
updates.
Problems that occur during the updating process may cause
unrecoverable errors and system down time. Always consult
technical personnel before proceeding with any firmware upgrade.
NOTE:
The firmware version installed on your system should provide the
complete functionality listed in the specification sheet/user’s
manual. We provide special revisions for various application
purposes. Therefore, DO NOT upgrade your firmware unless you
fully understand what a firmware revision will do.
xiii

Chapter 1
Introduction
1.1 Product Overview
This hardware manual briefly introduces the EonStor S12S-G1033
SAS to Serial Attached SCSI (SAS) RAID subsystem. The 12-bay
model comes with two (2) SAS host channels and supports twelve
(12) hot-swappable SAS or SATA II hard drives in an 2U chassis. The
core of the subsystem is the RAID controller module boosted by the
ASIC400 RAID engine.
By default, each RAID
controller comes with a
pre-installed 512MB
DDR RAM DIMM module.
Each SAS channel is
capable of a 1200MB/s bandwidth; therefore a total of 2400MB/s
bandwidth is available for the subsystem. With a passive backplane,
redundant hot-swappable component design, and the sophisticated
firmware, the subsystem is ideal for high availability applications.
The enclosure is designed to contain twelve (12) 3.5-inch disk drives.
Drive capacity can be expanded by attaching the maximum of four (4)
2U-profile drive enclosures with the addition of 48 more disk drives.
Three (3) cooling modules protect the subsystem from overheating,
and two (2) hot-swappable power supply unit (PSU) modules provide
constant power to the subsystem. The modular nature of the
subsystem and the easy accessibility to all major components ensure
the ease of maintenance.
Figure 1-1: EonStor S12S-G1033

EonStor S12S -G1033/P Installation and Hardware Reference Manual
NOTE:
On receiving and unpacking your subsystem, please check the
package contents against the included Unpacking List. If any
module is missing, please contact your subsystem vendor
immediately.
1.2 Chassis Overview
The subsystem chassis is an enhanced 2U storage chassis divided
into front and rear sections, which are respectively accessed through
front and rear panels. The enclosure is designed to be installed into a
rack or cabinet. Read the following sections for the components’
descriptions and locations in the subsystem.
NOTE:
Components accessed through the front panel are referred to as
“Front Panel Components” and components accessed through
the rear panel are referred to as “Rear Panel Components.”
1.2.1 Front Panel Overview
The front section of the subsystem features a 4 x 3 layout for housing
twelve (12) 3.5-inch drives. Two (2) forearm handles on the sides of
the chassis help with retrieving the chassis from a rack cabinet. A
comprehensive LCD keypad panel provides access to all embedded
firmware functionalities.
The front view of the subsystem is shown below:
Figure 1-2: S12S-G1033 Enclosure Front View
˙ Drive bays with drive tray canisters: The subsystem comes
with twelve (12) drive bays in the front section of the chassis.
1-2

Chapter 1: Introduction
˙ LCD keypad panel: The LCD panel is mounted on the left-side
forearm handle. The panel comes with status LEDs, function
keys, and a mute button. (See Section 1.3.1)
1.2.2 Rear Panel Overview
The enclosure rear view is shown below. The rear panel provides
access to all enclosure components. A description of each rear panel
component is given below:
Figure 1-3: S12S-G1033 Enclosure Rear View
˙ RAID controller module: One (1) controller module is installed
in the subsystem. It contains a main circuit board, which
processes I/O requests and RAID parity computation for data
protection and provides high data throughput for application
servers. (See Section 1.3.3.)
˙ PSUs: Two (2) hot-swappable PSUs supply power to the
subsystem. Power on/off is controlled by the individual power
switches on the power supplies. (See Section 1.3.5.)
˙ Cooling Modules: Three (3) redundant cooling modules
ventilate the system with an airflow direction from the front to the
rear. (See Section 1.3.6)
1.2.3 Internal Backplane
An integrated backplane board separates the front and rear sections
of the chassis. This circuit board provides logic level signals and low
voltage power paths. Thermal sensors and I2C serial paths are
implemented in order to receive temperature/voltage readings and
module presence signals. This board contains no user-serviceable
components.
1-3

EonStor S12S -G1033/P Installation and Hardware Reference Manual
WARNING!
Accessing the backplane board may lead to fatal damage of the RAID
subsystem. Also, a physical contact with the backplane may cause
electrical hazards. For example, short-circuiting may occur if you
accidentally touch the backplane with a screwdriver.
1.2.4 Physical Dimensions
The subsystem comes in an enhanced 2U chassis with the following
dimensions:
˙ With forearm handles: 446mm x 88mm x 490mm (width x height
x depth)
˙ Without forearm handles: 482mm x 88mm x 505mm (width x
height x depth)
1.3 Major Components
The subsystem houses many active components and most of them
can be accessed either through the front or the rear panel. The
modular design of these components facilitates their easy installation
and removal. Hot-swap mechanisms are incorporated to eliminate
power surges and signal glitches that might occur when you remove
or installing these modules. Each component is further described
below:
1.3.1 LCD keypad Panel
Figure 1-4: LCD Keypad Panel
The LCD panel (as shown above) consists of a 16 characters x 2
rows LCD screen with push buttons, a mute button, and LED status
indicators. The LCD front panel provides full access to all
1-4

Chapter 1: Introduction
configuration and monitoring options. After the subsystem is powered
up, the initial screen displays the subsystem model name. A different
name can be manually assigned to the subsystem or to different
RAID arrays. This enables easier identification in a topology
consisting of numerous arrays.
Figure 1- 5: Forearm Handle Retention Latches
To access drive bays in the left- or right-hand side column, first
release the retention latches by pushing them outwards (as shown in
the figure above), and then swing the forearm handles to the sides.
To close the handles (see the figure below), swing the forearm
handles towards the center; gently press the handles until a click
sound is heard. The latches will lock the handles in place.
Figure 1- 6: Closing the Front Handles
1.3.2 Drive Tray
Figure 1-7: Drive Tray Front View
The enclosure comes with drive trays (see the figure above) designed
to accommodate separately purchased, standard 1-inch pitch, 3.5-
inch SAS or SATA-II disk drives. Two (2) LEDs on the tray bezel
indicate operating statuses. A rotary bezel lock prevents accidental
removal, while a convenient release button ensures fast and efficient
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EonStor S12S -G1033/P Installation and Hardware Reference Manual
drive swapping. There are screw holes on the sides of the drive tray
for securing hard drives to the drive tray.
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way
(e.g., by dropping it or resting heavy objects on it). The drive tray
has been customized to fit into the drive bays in the subsystem. If
the drive bay superstructure is deformed or altered, the drive trays
may not fit properly into the drive bay.
The diagram below shows drive bays that are numbered from Slot 1
to Slot 12 (see the figure below), from left to right, and then from top
to bottom. This numbering sequence is important when you try to
identify and replace a disk drive. Replacing a wrong drive can fatally
fail a RAID3 or RAID5 logical array.
Figure 1-8: Drive Bay Numbering Sequence
1.3.3 RAID Controller Module
Figure 1-9: RAID Controller Module
The RAID controller contains a main circuit board, a BBU module bay,
an interface faceplate, and a pre-installed 512 MB DDR RAM DIMM
module.
WARNING!
Although the RAID controller can be removed, the only time you
should touch the controller itself is to install/replace the memory
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Chapter 1: Introduction
modules. The RAID controller is built of sensitive components and
unnecessary tampering can damage the controller.
1.3.3.1 Controller Module Interfaces
The controller interfaces are accessed through the controller
faceplate as shown in the figure below.
Figure 1-10: Controller Faceplate
˙ SAS Host Ports: The RAID controller features two (2) SAS host
ports labeled HOST-CH0 and HOST-CH1. Each quad port is
comprised of the connectivity of 4 PHYs with Gigabits of link
bandwidth and assigned with an LED which indicates the link
condition of the PHYs on the port. Each subsystem comes with
one (1) host link cable.
˙ SAS Expansion Port: The SAS Exp. port is meant to connect to
expansion enclosures, i.e., Infortrend’s S12S-J1000-G. The
subsystem can connect to the maximum of four (4) expansion
enclosures. For the expansion connection, you have to
separately purchase SFF-8088 to SFF-8470 SAS cable. As to
the connection between expansion enclosures, you have to
purchase SFF-8470 to SFF-8470 SAS cables.
˙ RJ-45 Fast Ethernet port: The controller module comes with a
10/100BaseT Ethernet port for local/remote management over
the network. Shielded cables must be used to protect against
emissions. Connect the other end of the Ethernet cable to a LAN
hub port of the local network.
˙ Status LEDs: Each controller board rear panel comes with six (6)
status LED indicators. Please refer to Chapter 4 for information
on how to monitor your subsystem using these LED indicators.
˙ Restore Default (non-latch button & LED):
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