Infortrend EonStor U16U-G4010 User manual

EonStor U16U-G4010
320MB/sec SCSI-to-SCSI RAID Subsystem
Installation and Hardware Reference Manual
Revision: 1.1
®

EonStor U16U Installation and Hardware Reference Manual
- ii - EonStor U16U-G4010
Contact Information
Asia Pacific
(International headquarter)
Infortrend Technology, Inc.
8F, No. 102 Chung-Shan Rd., Sec. 3
Chung-Ho City, Taipei Hsien, Taiwan
Tel: [phone]
Fax: [phone]
[email protected]
[e-mail]
www.infortrend.com.tw
Americas
Infortrend Corporation
3150 Coronado Drive, Unit C
Santa Clara, CA 95054, USA
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
www.infortrend.com
China
Infortrend Technology, Limited
Room 1210, West Wing, Tower One, Junefield Plaza, No.
6 Xuanwumen Street, Xuanwu District, Beijing, China.
Post code: 100052
Tel: [phone]
Fax: [phone]
[email protected]
[email protected].cn
www.infortrend.com.cn
Europe (EMEA)
Infortrend Europe Limited
5 Elmwood, Crockford Lane
Chineham Business Park
Basingstoke, Hampshire
RG24 8WG, UK
Tel: [phone]
Fax:[phone]
[e-mail]
[e-mail]
www.infortrend-europe.com

EonStor U16U Installation and Hardware Reference Manual
EonStor U16U-G4010 - iii -
Copyright © 2004
This Edition First Published 2004
All rights reserved. This publication may not be reproduced, transmitted, transcribed,
stored in a retrieval system, or translated into any language or computer language, in any
form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or
otherwise, without the prior written consent of Infortrend Technology, Inc.
Disclaimer
Infortrend Technology makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of merchantability or
fitness for any particular purpose. Furthermore, Infortrend Technology reserves the right
to revise this publication and to make changes from time to time in the content hereof
without obligation to notify any person of such revisions or changes. Product
specifications are also subject to change without prior notice.
Trademarks
Infortrend and the Infortrend logo are registered trademarks of
Infortrend Technology, Inc.. EonStor and other names prefixed with “IFT” and “ES” are
trademarks of Infortrend Technology, Inc.
PowerPC®is a trademark of International Business Machines Corporation and Motorola
Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered trademarks of
its respective owners.
Printed in Taiwan

EonStor U16U Installation and Hardware Reference Manual
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Warnings and Certifications
FCC (applies in the U.S. and Canada)
This device complies with Part 15 of FCC Rules. Operation of this device is subject to
the following two conditions: 1) this device may not cause harmful interference, and 2)
this device must accept any interference received, including interference that may cause
undesired operation.
Warning:
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly approved by the party
responsible for compliance could void your authority to operate the equipment.
This device is in conformity with the EMC

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Table of Contents
Chapter 1: Introduction ...............................................................................................1-1
1.1. Chapter Overview........................................................................................................................1-1
1.2. Product Overview........................................................................................................................1-2
1.2.1 Product Introduction.......................................................................................................1-2
1.2.2 Model Variations ............................................................................................................1-2
1.2.3 Enclosure Chassis...........................................................................................................1-3
1.2.4 SCSI-320 Channels.........................................................................................................1-3
1.3. ES Subsystem Components.........................................................................................................1-5
1.3.1 Front Panel Overview.....................................................................................................1-5
1.3.2 Rear Panel Overview......................................................................................................1-6
1.4. Front Panel Components .............................................................................................................1-7
1.4.1 LCD Panel......................................................................................................................1-7
1.4.2 Enclosure Bay ID Allocation ..........................................................................................1-7
1.5. Rear Panel Components...............................................................................................................1-8
1.5.1 The RAID Controller Module .........................................................................................1-8
1.5.2 I2C Enclosure Monitoring:........................................................................................... 1-11
1.5.3 Power Supply Units ......................................................................................................1-11
1.5.4 Cooling fan modules..................................................................................................... 1-13
1.6. ES Subsystem Monitoring.........................................................................................................1-13
1.6.1 I2C bus.......................................................................................................................... 1-13
1.6.2 LED Indicators .............................................................................................................1-13
1.6.3 Firmware (FW) and RAIDWatch GUI..........................................................................1-14
1.6.4 Audible Alarms .............................................................................................................1-14
1.7. Hot-Swappable Components.....................................................................................................1-14
1.7.1 Hot-Swap Capabilities.................................................................................................. 1-14
1.7.2 Components ..................................................................................................................1-14
1.7.3 Normalized Airflow.......................................................................................................1-15
1.8. Connector Type, Supported Connections and Other Information .............................................1-15
Chapter 2: Installation .................................................................................................2-1
2.1. Chapter Overview........................................................................................................................2-1
2.2. Installation Pre-requisites ............................................................................................................2-2
2.3. Safety Precautions .......................................................................................................................2-2
2.3.1 General Considerations..................................................................................................2-2
2.3.2 Precautions Handling Other Modules:...........................................................................2-3

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2.3.3 Static-Free Installation...................................................................................................2-4
2.4. Hardware Installation Preparation...............................................................................................2-4
2.4.1 Tools or Equipment Needed for Installing the Subsystem............................................... 2-4
2.4.2 Planning Before Installation........................................................................................... 2-4
2.4.3 General Installation Procedure...................................................................................... 2-5
2.5. Unpacking the Subsystem............................................................................................................2-6
2.6. Memory Module Installation/Upgrade ........................................................................................ 2-7
2.6.1 Selecting the DIMMs ......................................................................................................2-7
2.6.2 DIMM Module Upgrade Procedure ...............................................................................2-8
2.7. BBU Installation........................................................................................................................2-12
2.7.1 About the BBU Installation........................................................................................... 2-12
2.7.2 BBU Installation Procedure ......................................................................................... 2-12
2.8. Installing the RAID Controller Module.....................................................................................2-15
2.9. Mounting the Enclosure.............................................................................................................2-15
2.9.1 Enclosure Mounting Considerations ............................................................................2-15
2.9.2 Slide Rail Availability................................................................................................... 2-16
2.10.Hard Drive and Drive Tray Installation...................................................................................2-16
2.10.1 Hard Drive Installation Pre-requisites........................................................................ 2-16
2.10.2 Hard Drive Installation...............................................................................................2-17
2.10.3 Drive Tray Installation................................................................................................ 2-17
Chapter 3: Subsystem Monitoring..............................................................................3-1
3.1. Chapter Overview........................................................................................................................3-1
3.2. Subsystem Monitoring Overview................................................................................................ 3-2
3.3. Status Indicating LEDs................................................................................................................ 3-3
3.3.1 Brief Overview of the LEDs............................................................................................3-3
3.3.2 Controller Module LEDs ................................................................................................3-3
3.3.3 LAN Port LEDs...............................................................................................................3-4
3.3.4 PSU Module LED ........................................................................................................... 3-4
3.3.5 Cooling FAN Module LED .............................................................................................3-5
3.3.6 LCD Panel......................................................................................................................3-6
3.3.7 Drive Tray LEDs.............................................................................................................3-7
3.4. RAIDWatch Manager..................................................................................................................3-8
3.5. Notification Processing Center (NPC)......................................................................................... 3-8
3.6. Audible Alarm.............................................................................................................................3-8
3.6.1 Default Threshold Values ...............................................................................................3-8
3.6.2 Failed Devices ................................................................................................................3-9

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3.7. I2C Port (Enclosure Monitoring)................................................................................................. 3-9
Chapter 4: Subsystem Connection and Operation...................................................4-1
4.1 Chapter Overview........................................................................................................................4-1
4.2 EonStor U16U Subsystem Host Connection ............................................................................... 4-2
4.2.1 SCSI Cables.....................................................................................................................4-2
4.2.2 Connecting the four channel ES U16U ...........................................................................4-2
4.2.3 Operation Considerations ............................................................................................... 4-3
4.2.4 Expansion........................................................................................................................4-3
4.3 Power On.....................................................................................................................................4-5
4.3.1 Check List........................................................................................................................4-5
4.3.2 Power On Sequence.........................................................................................................4-5
4.3.3 EonStor Power On-Procedure.........................................................................................4-6
4.3.4 Power On Status Check...................................................................................................4-6
4.3.5 LCD Screen .....................................................................................................................4-7
4.4 Power Off Procedure...................................................................................................................4-8
Chapter 5: Subsystem Maintenance ..........................................................................5-1
5.1. Chapter Overview........................................................................................................................5-1
5.2. Overview .....................................................................................................................................5-2
5.2.1 About Subsystem Maintenance .......................................................................................5-2
5.2.2 General Notes on Component Replacement ...................................................................5-2
5.3. Controller Module Maintenance..................................................................................................5-3
5.3.1 Overview.........................................................................................................................5-3
5.3.2 Notes on Controller Module Maintenance......................................................................5-3
5.3.3 Replacing a Failed Controller Module...........................................................................5-4
5.3.4 BBU and BBU Charger Board Replacement.................................................................. 5-6
5.3.5 DIMM Module Replacement...........................................................................................5-8
5.3.6 Controller Board and Host IO Board Maintenance .......................................................5-8
5.4. Replacing a Failed PSU Module..................................................................................................5-9
5.4.1 Notes on PSU Module Maintenance............................................................................... 5-9
5.4.2 Replacing the PSU Module.............................................................................................5-9
5.5. Cooling FAN Module Maintenance .......................................................................................... 5-11
5.5.1 Notes on Cooling FAN Module Maintenance............................................................... 5-11
5.5.2 Replacing a Cooling FAN Module................................................................................5-12
5.6. Drive Tray Maintenance............................................................................................................ 5-13
5.6.1 Notes on Hard Drive Maintenance...............................................................................5-13

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5.6.2 HDD Replacement........................................................................................................5-14
Appendix A: EonStor U16U Features........................................................................A-1
A.1.Appendix Overview.................................................................................................................... A-1
A.2.Overview .................................................................................................................................... A-2
A.3.Subsystem Features .................................................................................................................... A-2
A.3.1 Model Variations ............................................................................................................A-2
A.3.2 SCSI-320 Host.................................................................................................................A-2
A.3.3 Sixteen SCSI-320 Drives.................................................................................................A-2
A.3.4 Expansion channels ........................................................................................................A-2
A.3.5 Cableless Design.............................................................................................................A-2
A.4.Fault Tolerance........................................................................................................................... A-3
A.4.1 Intelligent Drive Handling..............................................................................................A-3
A.4.2 Auto Switch Cache Policy and Auto Shutdown...............................................................A-3
A.4.3 Global and Local Spares ................................................................................................A-3
A.4.4 Hot-Swapping of Drives..................................................................................................A-3
A.4.5 S.M.A.R.T. Support .........................................................................................................A-3
A.4.6 Other Fault Tolerant Features........................................................................................A-4
Appendix B: Specifications........................................................................................B-1
B.1.Appendix Overview.....................................................................................................................B-1
B.2.Technical Specifications..............................................................................................................B-2
B.3.RAID Operation Specifications...................................................................................................B-4
B.4.Drive Tray Specifications............................................................................................................B-4
B.5.Power Supply Specifications.......................................................................................................B-4
B.6.RAID Management......................................................................................................................B-4
B.7.Fault Tolerance Management......................................................................................................B-4
Appendix C: Packaging..............................................................................................C-1
C.1.Appendix Overview.....................................................................................................................C-1
C.2. Overview .....................................................................................................................................C-2
C.3.Container Contents......................................................................................................................C-3
C.3.1 Accessory Box.................................................................................................................C-3
C.3.2 HDD Tray Box................................................................................................................C-3
C.3.3 Controller Box ................................................................................................................C-3
C.3.4 Enclosure Box.................................................................................................................C-4

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Appendix D: Spare Parts and Accessories ..............................................................D-1
D.1.Appendix Overview.................................................................................................................... D-1
D.2.Spare Parts.................................................................................................................................. D-2
D.2.1Controller Modules........................................................................................................ D-2
D.2.2General Spare Parts ...................................................................................................... D-3
D.3.Accessories................................................................................................................................. D-4
Appendix E: Pin-outs.................................................................................................. E-1
E.1. Appendix Overview.....................................................................................................................E-1
E.2. SCSI Port Pin-outs.......................................................................................................................E-2
E.3. Controller Interfaces....................................................................................................................E-3
E.3.1 DB-9 Serial Port Pinouts................................................................................................E-3
E.3.2 Ethernet Port Pin-outs....................................................................................................E-3
E.4. Mains Power................................................................................................................................E-4
E.5. I2C Port........................................................................................................................................E-4

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Safety Precautions
Precautions and instructions
♦Prior to powering on the subsystem, ensure that the correct power range is being
used.
♦The EonStor U16U subsystem comes with 16 drive bays (slots). Leaving any of
these slots empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can cause
irreparable damage.
♦If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
♦Airflow Consideration: The subsystem requires an airflow clearance especially at
the front and at the rear.
♦To handle subsystem modules, use the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards or connector pins.
♦To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
♦Be sure that the rack cabinet into which the subsystem chassis is to be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
♦Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
♦If it is necessary to transport the subsystem, repackage all drives and replaceable
modules separately.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of
grounded wrist-strap and an anti-static work pad are recommended. Avoid dust or debris
in your work area.

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About This Manual
Chapter Descriptions
This Hardware and User’s Installation Guide for the EonStor U16U RAID subsystem is
divided into 5 chapters and 5 appendices.
♦Chapter 1: EonStor U16U Introduction
This chapter introduces the EonStor U16U along with all it’s major components.
The location of active components is described and the brief descriptions of each
component are also given. After reading this chapter a user should be familiar with
the different active components and their location on the subsystem. A brief
introduction to subsystem monitoring and hot-swappable components is also given.
♦Chapter 2: Installation
This chapter shows users how to correctly install the EonStor U16U (ES U16U)
RAID subsystem. Installation pre-requisites, precautions and unpacking
instructions are also given. Components that need to be installed include the
optional battery backup unit and the battery charger board, the hard drives and the
drive trays. A description of DIMM module upgrading is also given.
♦Chapter 3: Subsystem Monitoring
This chapter teaches the user how to use LEDs to monitor the status of ES U16U
active components. The RAIDWatch GUI and Firmware is briefly introduced and
audible alarms, with activation thresholds are also described.
♦Chapter 4: Subsystem Connection and Operation
This chapter teaches users how to connect the ES U16U to a host computer. Two
different configurations are shown with brief descriptions of each. This chapter also
describes both the power on and power off procedure of the ES U16U.
♦Chapter 5: System Maintenance
This chapter instructs users on how to maintain their subsystem. The replacement
and maintenance of a number of active components including the controller
module, the power supply units and the cooling FAN modules are discussed.
Replacement of failed battery modules and DIMM modules are also described.
♦Appendix A: EonStor U16U Features
This appendix describes a few of the many features of the ES U16U.
♦Appendix B: EonStor U16U Specifications

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This appendix lists all the technical specifications of the ES U16U RAID
subsystem.
♦Appendix C: EonStor U16U Packaging
This appendix completely describes the ES U16U package that a user will receive.
♦Appendix D: Accessories and Spare Parts
This appendix lists all the part numbers for the different accessories and spare parts
that are available for the ES U16U
♦Appendix E: Pin Outs
This appendix shows the different pin outs of the ES U16U subsystem. Pin outs for
the SCSI host ports, RS-232C Audio Jack and the RJ-45 Ethernet connector are
among those specified.
Who should read this manual?
This manual assumes that its readers are experienced with computer hardware installation
and are familiar with storage enclosures.
Related Documentation
♦Generic Operation Manual
♦RAIDWatch User’s Manual
Conventions
Naming
From this point on and throughout the rest of this manual the EonStor series is referred to
as simply the “subsystem” or the “system” and EonStor is frequently abbreviated as ES.
Warnings
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING”, both capitalized and bold and is
followed by text in italics. The italicized text is the warning message.

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EonStor U16U-G4010 - xiii -
Cautions
Cautionary messages should also be heeded for the messages can help you reduce the
chance of losing data or damaging the system. Cautions are easy to recognize. The word
“caution” is written as “CAUTION”, both capitalized and bold and is followed by text in
italics. The italicized text is the cautionary message.
Notes
These are messages that are used to inform the reader of essential but non-critical
information. These messages should be read carefully and any directions or instructions
contained herein can help you avoid making mistakes. Notes are easy to recognize. The
word “note” is written as “NOTE”, it is both capitalized and bold and is followed by text
in italics. The italicized text is the cautionary message.
Lists
Bulleted Lists: - Bulleted lists are statements of non-sequential facts. They can be read in
any order. Each statement is preceded by a round black dot “∙”.
Numbered Lists: - Numbered lists are used to describe sequential steps a user should
follow in order.
Software and Firmware Updates
Please contact your system vendor or visit Infortrend’s FTP site (ftp.infortrend.com.tw)
for the latest software or firmware updates. NOTE that the firmware version installed on
your system should provide the complete functionality listed in the specification
sheet/user’s manual. We provide special revisions for various application purposes.
Therefore, DO NOT upgrade your firmware unless you fully understand what a firmware
revision will do.
Problems that occur during the updating process may cause unrecoverable errors and
system down time. Always consult technical personnel before proceeding with any
firmware upgrade.

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Chapter 1: Introduction
Chapter Overview 1-1
Chapter 1: Introduction
1.1. Chapter Overview
This chapter:-
1. Introduces the 3U, 16 Bay, SCSI-to-SCSI EonStor (ES) subsystems (ES U16U).
2. Introduces the model variations.
3. Introduces the different active components on the subsystem.
4. Introduces the different monitoring techniques.
After reading this chapter a user should:-
1. Have a good overview the ES U16U subsystem series.
2. Be well acquainted with the different active components and their location in the
subsystem.
3. Have an idea of the different subsystem status monitoring techniques that can be
used.

EonStor U16U Installation and Hardware Reference Manual
1-2 Product Overview
1.2. Product Overview
1.2.1 Product Introduction
This hardware manual briefly introduces the EonStor (ES) U16U-G4010 (ES U16U)
SCSI-to-SCSI storage subsystems shown in Figure 1-1.
Figure 1-1: ES U16U storage subsystem
The ES U16U subsystem series comes in four models (see Table 1-1). All the models
come with two 320MB/sec SCSI (SCSI-320) host channels and are able to support up to
16, hot-swappable, SCSI-320 hard drives. Two hot-swappable cooling fan modules
protects the subsystem from over heating and two, hot-swappable power supply unit
(PSU) modules provide a constant power supply to the subsystem. The modular nature of
the subsystem and the easy accessibility to all major subsystem components ensures that
the ES U16U can be easily maintained.
1.2.2 Model Variations
The SCSI-320 ES U16U subsystems come in four different models. Two models come
with four SCSI-320 (two host and two drive) channels and two models come with six
SCSI-320 (two host, two expansion and two drive) channels. The host IO board (see
Section 1.5.1.3) on the six channel models comes with an additional two pre-set, SCSI-
320 drive channels that are connected to external expansion connectors. These additional
expansion channels are facilitated by the presence of an additional chip on the host IO
board itself.
One four channel model and one six channel model comes with a 256MB pre-installed
DIMM module whereas the other two models (one four channel and one six channel)
come with a 512MB DIMM module. (See Section 1.5.1.2)
Model variations are shown in Table 1-1 below:

Chapter 1: Introduction
Product Overview 1-3
ES U16UG4010 -42-0030 -45-0030 -62-0030 -65-0030
Host Channels
(CH0 and CH1) 2 x SCSI-320 2 x SCSI-320 2 x SCSI-320 2 x SCSI-320
Drive Channel
(CH2 and CH3) 2 x SCSI-320 2 x SCSI-320 2 x SCSI-320 2 x SCSI-320
Expansion Channels
(CH4 and CH5) 0 0 2 x SCSI-320 2 x SCSI-320
DIMM Module 256MB 512MB 256MB 512MB
Table 1-1: ES U16U-G4010 Subsystem Model Variations
1.2.3 Enclosure Chassis
The ES subsystem enclosure is divided into a front and rear section.
NOTE:
Components accessed through the front panel are referred to as “Front Panel
Components” and Components accessed through the rear panel are referred to as
“Rear Panel Components.”
1.2.3.1 Front Section
The front section of the ES subsystem features a 4 x 4 layout for sixteen 3.5”
SCSI-320 drives and houses a foldable LCD panel.
1.2.3.2 Rear Section
The rear section of the ES subsystem is accessed through the rear panel and is
reserved for the RAID controller module(s), power supply units (PSU),
cooling fan modules and power switches.
1.2.3.3 Midplane and Driveplane Boards
Integrated driveplane and midplane boards separate the front and rear
sections of the ES subsystem. These PCB boards provide logic level signals
and low voltage power paths. They contain no user-serviceable components.
1.2.4 SCSI-320 Channels
Two of the ES U16U models have four SCSI-320 channels. The other two models have
six SCSI-320 channels. The channels are configured as shown in Table 1-2:

EonStor U16U Installation and Hardware Reference Manual
1-4 Product Overview
Channel Type Channel Assignment
Host CH0 and CH1
Drive CH2 and CH3
Expansion (Configured as drive channels) CH4 and CH5
Table 1-2: Channel Pre-configurations
The following two diagrams show the data paths for the six channel and four channel
models.
1.2.4.1 6 Channel Bus Diagram
Figure 1-2 below shows a 6-channel (ES U16U-G40106) RAID subsystem
cascaded to a JBOD. Channels 0 and 1 are connected to host computers.
Channels 2 and 3 connect to the disk drives housed in the RAID subsystem.
Channels 4 and 5 connect to an expansion module (JBOD).
Figure 1-2: Data Path Diagram – Cascaded Enclosures
1.2.4.2 4 Channel Bus Diagram
Figure 1-3 below shows a 4-channel (ES U16U-G40104) RAID subsystem.
Channels 0 and 1 are connected to host computers. Channels 2 and 3 connect
to the disk drives housed in the RAID subsystem. There are no SCSI ports
on the controller box.

Chapter 1: Introduction
ES Subsystem Components 1-5
Figure 1-3: Data Path Diagram – RAID Array Enclosure
1.3. ES Subsystem Components
All the active components on the ES subsystems can be accessed through either the front
or rear panel. The modular design of the active components facilitates their easy
installation and removal. Hot-swap mechanisms are incorporated to eliminate power
surges and signal glitches that might happen while removing or installing these modules.
1.3.1 Front Panel Overview
The front panel of the ES RAID subsystem described in this manual is shown Figure 1-4.
A description of each front panel component is given below.
Figure 1-4: Front View – RAID Appliance Models
The front panel shown in Figure 1-4 is designed to accommodate the following
components:
♦LCD Panel:- The LCD Panel shows system information and can be used to
configure and monitor the ES subsystem.
♦Drive bays with drive tray canisters:- The drive bays are used to house the ES
subsystem hard drives.

EonStor U16U Installation and Hardware Reference Manual
1-6 ES Subsystem Components
1.3.2 Rear Panel Overview
The rear panel of the RAID subsystems described in this manual is shown in Figure 1-5.
A description of each rear panel component is given below.
Figure 1-5: ES U16U Subsystem Rear View
The rear panel shown in Figure 1-5 is designed to accommodate the following
components:
♦Controller Box:- The controller box contain both the RAID controllers and the
optional battery back up units (BBU).
♦PSU:- The PSUs are used to provide power to the subsystem.
♦Cooling fan modules:- The redundant cooling FAN modules are used to ventilate
the subsystem and to reduce the temperature within the subsystem.
♦Power Switches:- The power switches are used to turn the system on and off.