iWave iW-RainboW-G37M Installation manual

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i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
iW-RainboW-G34M/G37M
i.MX 8M Mini & i.MX 8M Nano SODIMM
System On Module
Hardware User Guide

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iWave Systems Technologies Pvt. Ltd.
Document Revision History
Document Number
iW-PRFYZ_PRGJZ-UM-01-R1.0-REL0.1-Hardware
Revision
Date
Description
0.1
04th Feb 2021
Initial Release
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others is
strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are hereby
notified that any disclosure, copying distribution or use of any of the information contained within this document is
STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

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Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave
Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
CPU and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : [e-mail]
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bengaluru, Karnataka,
India –560076

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Table of Contents
1. INTRODUCTION ............................................................................................................................................7
1.1 Purpose .............................................................................................................................................................7
1.2 SODIMM SOM Overview...................................................................................................................................7
1.3 List of Acronyms................................................................................................................................................7
1.4 Terminology Description...................................................................................................................................9
1.5 References ........................................................................................................................................................9
2. ARCHITECTURE AND DESIGN....................................................................................................................... 11
2.1 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Block Diagram .....................................................................11
2.2 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Features...............................................................................12
2.3 i.MX 8M Mini or i.MX 8M Nano .....................................................................................................................14
2.4 BD71847AMWV PMIC.....................................................................................................................................16
2.5 Memory...........................................................................................................................................................16
2.5.1 LPDDR4 RAM...............................................................................................................................................16
2.5.2 eMMC Flash ................................................................................................................................................16
2.5.3 Micro SD Connector (Optional) ...................................................................................................................16
2.5.4 QSPI Flash (Optional) ..................................................................................................................................17
2.6 RTC Controller.................................................................................................................................................17
2.7 Wi-Fi and Bluetooth Interface.........................................................................................................................18
2.8 SODIMM PCB Edge Connector........................................................................................................................19
2.8.1 Gigabit Ethernet..........................................................................................................................................23
2.8.2 PCIe Interface (Not available in Nano)........................................................................................................25
2.8.3 SD Interface.................................................................................................................................................26
2.8.4 USB Interface...............................................................................................................................................27
2.8.5 MIPI CSI Camera..........................................................................................................................................28
2.8.6 MIPI DSI Display Interface...........................................................................................................................29
2.8.7 Audio Interface............................................................................................................................................30
2.8.8 UART Interface ............................................................................................................................................31
2.8.9 SPI Interface ................................................................................................................................................32
2.8.10 I2C Interface................................................................................................................................................33
2.8.11 JTAG Interface .............................................................................................................................................33
2.8.12 GPIO Interface.............................................................................................................................................34
2.8.13 SPDIF Interface............................................................................................................................................34
2.8.14 Boot Setting.................................................................................................................................................35
2.8.15 Management Pins .......................................................................................................................................37
2.8.16 Miscellaneous Signals .................................................................................................................................38
2.8.17 Power and GND...........................................................................................................................................40
2.9 i.MX 8M Mini or i.MX 8M Nano Pin Multiplexing on SODIMM Edge .............................................................41
3. TECHNICAL SPECIFICATION.......................................................................................................................... 50
3.1 Electrical Characteristics .................................................................................................................................50
3.1.1 Power Input Sequencing..............................................................................................................................50

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3.2 Power Consumption........................................................................................................................................51
3.3 Environmental Characteristics........................................................................................................................53
3.3.1 Environmental Specification........................................................................................................................53
3.3.2 Heat Sink/ Heat Spreader............................................................................................................................53
3.3.3 RoHS Compliance ........................................................................................................................................55
3.3.4 Electrostatic Discharge................................................................................................................................55
3.4 Mechanical Characteristics .............................................................................................................................56
3.4.1 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Mechanical Dimensions...................................................56
4. ORDERING INFORMATION .......................................................................................................................... 57
5. APPENDIX I................................................................................................................................................. 60
5.1 Guidelines to insert the SOIDMM SOM into carrier board.............................................................................60
5.2 Guidelines to remove the SOIDMM SOM from carrier board ........................................................................60
6. APPENDIX II................................................................................................................................................ 61
6.1 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Development Platform........................................................61

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List of Figures
Figure 1: i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Block Diagram ......................................................................11
Figure 2: i.MX 8M Mini Block Diagram ...........................................................................................................................14
Figure 3: i.MX 8M Nano Block Diagram..........................................................................................................................15
Figure 4: Micro SD Connector.........................................................................................................................................17
Figure 5: Wi-Fi and Bluetooth Antenna Connector.........................................................................................................18
Figure 6: SODIMM Edge Connector................................................................................................................................19
Figure 7: Power Input Sequencing..................................................................................................................................50
Figure 8: Mechanical dimension Heat Sink.....................................................................................................................54
Figure 9: Mechanical dimension Heat Spreader.............................................................................................................55
Figure 10: Mechanical dimension of i.MX 8M Mini or i.MX 8M Nano SODIMM SOM...................................................56
Figure 11: Module Insertion Procedure..........................................................................................................................60
Figure 12: Module Removal Procedure ..........................................................................................................................60
Figure 13: i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Development Platform.......................................................61
List of Tables
Table 1: Acronyms & Abbreviations..................................................................................................................................7
Table 2: Terminology ........................................................................................................................................................9
Table 3: SODIMM Edge Connector Pinouts ....................................................................................................................20
Table 4: i.MX 8M Mini Boot Mode Pin Settings Truth Table ..........................................................................................35
Table 5: i.MX 8M Nano Boot Mode Pin Settings Truth Table.........................................................................................36
Table 6: i.MX 8M Mini IOMUX for SODIMM Edge Connector interfaces ......................................................................41
Table 7: i.MX 8M Nano IOMUX for SODIMM Edge Connector interfaces .....................................................................45
Table 8: Power Input Requirement.................................................................................................................................50
Table 9: Power Sequence Timing....................................................................................................................................50
Table 10: i.MX 8M Mini SODIMM SOM Power Consumption ........................................................................................51
Table 11: i.MX 8M Nano SODIMM SOM Power Consumption.......................................................................................52
Table 12: Environmental Specification ...........................................................................................................................53
Table 13: i.MX 8M Mini SODIMM SOM Orderable Product Part Numbers....................................................................57
Table 14:i.MX 8M Nano SODIMM SOM Orderable Product Part Numbers....................................................................58

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1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the SODIMM SOM based on the NXP’s i.MX 8M Mini or i.MX 8M Nano
Application processor. This board is fully supported by iWave Systems Technologies Pvt. Ltd. This Guide provides
detailed information on the overall design and usage of the i.MX 8M Mini or i.MX 8M Nano SODIMM SOM from a
Hardware Systems perspective.
1.2 SODIMM SOM Overview
The SODIMM (“Small outline dual in line memory module”) is a versatile small form factor computer Module definition
targeting application that require low power, low costs, and high performance. The Modules are used as building
blocks for portable and stationary embedded systems. The core SoC and support circuits, including DRAM, boot flash,
power sequencing, SoC power supplies, GBE and single channel MIPI display transmitter are concentrated on the
Module. The Modules are used with application specific Carrier Boards that implement other features such as audio
CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and
upgradability while still maintaining low costs, low power and small physical size.
NXP’s i.MX 8M Mini or i.MX 8M Nano SoC based SODIMM System on Module is rich with i.MX 8M Mini or i.MX 8M
Nano features along with On SOM LPDDR4, eMMC, Ethernet PHY and comes in compact 67.6mm x 37mm form factor.
The Module PCB has 200 edge fingers that mate with a low profile 200 pin 0.5mm pitch right angle connector.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
ARM
Advanced RISC Machine
BT
Bluetooth
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
CTS
Clear to Send
CSI
Camera Serial Interface
DSI
Display Serial Interface
eMMC
Enhanced Multi Media Card
GB
Giga Byte
Gbps
Gigabits per sec
GPIO
General Purpose Input Output
GPU
Graphics Processing Unit

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Acronyms
Abbreviations
I2C
Inter-Integrated Circuit
I2S
Inter-Integrated Sound
IC
Integrated Circuit
JTAG
Joint Test Action Group
LPDDR4
Low Power Double Data Rate4
MHz
Mega Hertz
MIPI
Mobile Industry Processor Interface
OTG
On-The-Go
PCB
Printed Circuit Sheet
PCIe
Peripheral Component Interconnect express
PMIC
Power management integrated circuits
RAM
Random Access Memory
RGMII
Reduced gigabit media-independent interface
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
RTS
Request to Send
SAI
Serial Audio Interface
SD
Secure Digital
SODIMM
Small outline dual in line memory module
SOM
System On Module
TBD
To Be Defined
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
USB OTG
USB On The Go
Wi-Fi
Wireless Fidelity

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1.4 Terminology Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
GBE
Gigabit Ethernet Signal
LVDS
Low Voltage Differential Signal
MIPI
Mobile Industry Processor Interface Signal
OD
Open Drain Signal
OC
Open Collector Signal
PCIe
Peripheral Component Interconnect Express Signal
USB
Universal Serial Bus Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On-SODIMM SOM.
1.5 References
•IMX8MMIEC_Revx.x.pdf
•IMX_8M_Mini_RM_Revx.x.pdf
•IMX8MNIEC_Revx.x.pdf
•IMX_8M_Nano_RM_Revx.x.pdf

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1.6 Important Note
In this document, wherever i.MX 8M Mini or i.MX 8M Nano SoC signal name is mentioned, it is followed as per below
format for easy understanding.
•If SoC pin doesn’t have multiplexing option or used for dedicated functionality then the signal name is
mentioned as functionality name.
“Functionality Name”
Example: ENET_TXC
In this signal, ENET_TXC pad is used for same functionality.
•If SoC pin selected as GPIO function, then the signal name is mentioned as
“Functionality Description (GPIO Number)”
Example: BCONFIG_0(GPIO1_9)
In this signal, BCONFIG_0 is the GPIO functionality which we are using and GPIO1_9 is the GPIO number.
Note: The above naming is not applicable for other signals which are not connected to SoC.

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2. ARCHITECTURE AND DESIGN
This section provides detailed information about i.MX 8M Mini or i.MX 8M Nano SODIMM SOM features and Hardware
architecture with high level block diagram.
2.1 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Block Diagram
iWave Systems Technologies Pvt. Ltd.
[e-mail]
iW-RainboW-G34M/G37M
i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Block Diagram
Note:
1. UART1 is shared between SODIMM Edge connector and Bluetooth Module, by default it will be connected to Bluetooth Module
2. uSDHC1 is shared between Wi-Fi module and micro SD connector, by default it will be connected to Wi-Fi Module.
3. SAI5 is shared between SODIMM Edge connector and Bluetooth Audio, by default it will be connected to SODIMM Edge.
* Not supported in i.MX 8M Nano
i.MX 8M Mini
or
i.MX 8M Nano
SODIMM Edge
Connector
(200Pin)
Ethernet PHY Gigabit Ethernet
RGMII
ENET
PCIe*
USB2.0 OTG x 1
Gigabit Ethernet
PCIe
PCIe x 1
PCIe to GBE
PHY (Optional)
USB1
USB2*USB2.0 OTG x 1
SD x 1
uSDHC2
eCSPI x 3
eCSPI1, eCSPI2,
eCSPI3
JTAG
JTAG
I2S x 1
SAI53
I2C x 2
I2C2, I2C3
PWM x 2
PWM1, PWM2
UART x 4
UART11, UART2,
UART3, UART4
MIPI DSI[3:0]
MIPI DSI
MIPI CSI[3:0]
MIPI CSI
SPDIF x 1
SPDIF
SAI x 1
SAI1*
GPIOs
GPIOs
LPDDR4 (32bit/16bit)
LPDDR4-1GB
(Upgradable)
Micro SD
(Optional)
DDRC
MMC (8bit)
eMMC –8GB
(Upgradable) uSDHC3
QSPI
QSPI Flash
(Optional) QSPIA
I2C
RTC Controller
WiFi-BT
Module
uSDHC12
UART11
PMIC
UART
SD1 (4bit)
I2C1
I2S/ PCM SAI53
Figure 1: i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Block Diagram

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2.2 i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Features
i.MX 8M Mini or i.MX 8M Nano SODIMM SOM supports the following features.
SoC
•i.MX 8M Mini Q/QL/D/DL/S/SL Processor1:
oi.MX 8M Mini Quad : 4 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Quad Lite : 4 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
oi.MX 8M Mini Dual : 2 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Dual Lite : 2 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
oi.MX 8M Mini Solo : 1 x Cortex- A53, 1 x Cortex-M4
oi.MX 8M Mini Solo Lite : 1 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
•i.MX 8M Nano Q/QL/D/DL/S/SL Processor1:
oi.MX 8M Nano Quad : 4 x Cortex- A53, 1 x Cortex-M7
o7i.MX 8M Nano Quad Lite : 4 x Cortex- A53, 1 x Cortex-M7 (GPU not supported)
oi.MX 8M Nano Dual : 2 x Cortex- A53, 1 x Cortex-M7
oi.MX 8M Nano Dual Lite : 2 x Cortex- A53, 1 x Cortex-M7 (GPU not supported)
oi.MX 8M Nano Solo : 1 x Cortex- A53, 1 x Cortex-M7
oi.MX 8M Nano Solo Lite : 1 x Cortex- A53, 1 x Cortex-M7 (GPU not supported)
Power
•BD71847AMWV PMIC
Memory
•LPDDR4 - 1GB (Expandable up to 4GB)2,3
•eMMC Flash - 8GB (Expandable)3
•Micro SD slot (Optional)4
•QSPI Flash (Optional)
Other On-SOM Features
•WiFi 802.11a/b/g/n/ac + Bluetooth 5.0 Module4,5
•Gigabit Ethernet PHY Transceiver
•PCIe to Ethernet PHY (Optional)6
•RTC Controller
SODIMM PCB Edge Interfaces
•Gigabit Ethernet x 1 Port (Mini optionally support x 2)6
•PCIe x 1 Port (Not supported in Nano)6

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•SD (4bit) x 1 Port
•USB 2.0 OTG x 1 Port
•USB 2.0 Host x 1 Port (Not available in Nano)
•MIPI CSI x 1 Channel
•MIPI DSI x 1 Channel
•SAI/I2S (Audio Interface) x 1 Port
•Data UART (with CTS & RTS) x 2 Port (One is optional)
•Data UART (without CTS & RTS) x 2 Port (One port is used as Debug Port)
•SAI x 1 (Not available in Nano)
•eCSPI x 3 Port
•I2C x 2 Port
•SPDIF x 1
•JTAG x 1
•PWM x 2 Port
•Power & Management Signals
General Specification
•Power Supply : 3V3, 4A
•Form Factor : 67.6mm X 37mm
1. There are six configurations of i.MX 8M Mini or i.MX 8M Nano Processor supported by NXP, hence in this document
i.MX 8M Mini or i.MX 8M Nano Q/QL/D/DL/S/SL is used to represent either of one based on SOM Part Number.
2. The i.MX 8M Mini SoC can support up to 8GB RAM but considering the available LPDDR4 Chips, SOM can support
up to 4GB (32Gb) RAM. The i.MX 8M Nano SoC can support up to 2GB (32Gb) RAM.
3. Memory Size will differ based on iWave’s SOM Product Part Number.
4. uSDHC1 is shared between Wi-Fi module and micro SD connector, by default it will be connected to Wi-Fi Module.
So, on SOM microSD will be an optional feature.
5. UART1 interface of i.MX 8M Mini or i.MX 8M Nano is connected to On SOM Bluetooth module in the default
configuration. One more UART can be supported with CTS and RTS in SODIMM Edge if Bluetooth is not supported.
6. In i.MX 8M Mini SODIMM SOM, PCIe interface signals are connected to both SODIMM PCB Edge Connector and
PCIe to Ethernet controller to support 2nd Gigabit Ethernet Port, by default PCIe is connected to SODIMM Edge.

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2.3 i.MX 8M Mini or i.MX 8M Nano SoC
iW-RainboW-G34M i.MX 8M Mini SODIMM SOM can support different i.MX 8M Mini SoCs from NXP. The i.MX 8M
Mini Family consists of six processors: i.MX 8M Mini Quad, Quad Lite, Dual, Dual Lite, Solo, Solo Lite. The Major
difference between i.MX 8M Mini SoCs are:
•i.MX 8M Mini Quad : 4 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Quad Lite : 4 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
•i.MX 8M Mini Dual : 2 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Dual Lite : 2 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
•i.MX 8M Mini Solo : 1 x Cortex- A53, 1 x Cortex-M4
•i.MX 8M Mini Solo Lite : 1 x Cortex- A53, 1 x Cortex-M4 (VPU not supported)
The i.MX 8M Mini Family supports ARM Cortex-A53 Core @ 1.6 GHz, ARM Cortex-M4F Core @ 400 MHz, 1080p, VPU,
and dual fail over-ready display controllers, 1× 1080p display, including MIPI-DSI. Memory interfaces supporting
LPDDR4, DDR4, DDR3L, Quad SPI/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD, and a wide range of peripheral
I/Os such as PCIe 2.0 provide wide flexibility.
Figure 2: i.MX 8M Mini Block Diagram

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Similarly, the iW-RainboW-G37M i.MX 8M Nano SODIMM SOM can support different i.MX 8M Nano SoCs from NXP.
The i.MX 8M Nano Family also consists of six processors: i.MX 8M Nano Quad, Quad Lite, Dual, Dual Lite, Solo, Solo
Lite. The Major difference between i.MX 8M Nano SoCs are:
•i.MX 8M Nano Quad : 4 x Cortex- A53, 1 x Cortex-M7 (VPU not supported)
•i.MX 8M Nano Quad Lite : 4 x Cortex- A53, 1 x Cortex-M7 (GPU & VPU not supported)
•i.MX 8M Nano Dual : 2 x Cortex- A53, 1 x Cortex-M7(VPU not supported)
•i.MX 8M Nano Dual Lite : 2 x Cortex- A53, 1 x Cortex-M7 (GPU & VPU not supported)
•i.MX 8M Nano Solo : 1 x Cortex- A53, 1 x Cortex-M7(VPU not supported)
•i.MX 8M Nano Solo Lite : 1 x Cortex- A53, 1 x Cortex-M7 (GPU & VPU not supported)
The i.MX 8M Nano Family supports ARM Cortex-A53 Core @ 1.4 GHz, ARM Cortex-M7 Core @ 600 MHz, 1080p, and
dual fail over-ready display controllers, 1× 1080p display, including MIPI-DSI. Memory interfaces supporting LPDDR4,
DDR4, DDR3L, Quad SPI/Octal SPI (FlexSPI), eMMC 5.1, RAW NAND and SD, and a wide range of peripheral I/Os.
Figure 3: i.MX 8M Nano Block Diagram
Note: The i.MX 8M Mini or i.MX 8M Nano processors offers numerous advanced features, please refer the latest i.MX
8M Mini or i.MX 8M Nano Datasheet & Reference Manual for Electrical characteristics and other information, which
may be revised from time to time.

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2.4 BD71847AMWV PMIC
i.MX 8M Mini or i.MX 8M Nano SODIMM SOM uses Rohm’s BD71847AMWV PMIC for on-SOM Power management.
The BD71847AMWV is a Power Management Integrated Circuit (PMIC) designed specifically for powering single-core,
dual-core, and quad-core SoC’s such as NXP-i.MX 8M Mini or i.MX 8M Nano.
The BD71847AMWV is a power management integrated circuit (PMIC) features six high efficiency buck converters and
six linear regulators (LDOs) for powering the processor, memory and miscellaneous peripherals. Built-in one-time
programmable memory stores key start up configurations, drastically reducing external components typically used to
set output voltage and sequence of external regulators. Regulator parameters are adjustable through high-speed
1MHz I2C after start up offering flexibility for different system states. The BD71847AMWV (U10) comes in 56pin 7x7
QFN Package and placed on Top side of SOM.
2.5 Memory
2.5.1 LPDDR4 RAM
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM supports 1GB RAM using 32bit LPDDR4 IC in Mini and 16bit LPDDR4
IC in Nano connected to DDR controller of SoC to support LPDDR4 clock up to 1.5 GHz in Mini and up to 1.6GHz in
Nano. The LPDDR4 IC (U6) placed on Top side of the SOM. The RAM size can be expandable up to maximum of 4GB in
Mini and up to 2GB in Nano. To customize the LPDDR4 memory size, contact iWave.
2.5.2 eMMC Flash
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM supports 8GB eMMC as default boot device and storage device.
This is connected to eMMC0 version 5.1v controller of the i.MX 8M Mini or i.MX 8M Nano SoC and operates at 1.8V
(I/O supply) and 3.3V (NAND core supply) Voltage levels.
The eMMC flash (U16) memory is physically located on bottom side of the SODIMM SOM. The memory size of the
eMMC Flash can be customised based on the requirement by contacting iWave Support Team.
2.5.3 Micro SD Connector (Optional)
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM optionally supports Micro SD slot which can be used to connect
Micro SD card as optional boot device as well as Mass storage device. Micro SD card connector (J2) is directly
connected to the USDHC1 controller of the i.MX 8M Mini or i.MX 8M Nano SoC. The main power to Micro SD Card
Connector is 3.3 Voltage. The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM supports configurable I/O voltage levels
(3.3V/1.8V) for USDHC1 lines through gpio GPIO1_3. If GPIO1_3 is set to low, then 3.3V IO level is selected for uSDHC1
lines. If GPIO4_3 is set to high, then 1.8V IO level is selected for uSDHC1 lines. The micro SD Connector is physically
located on Top side of the i.MX 8M Mini or i.MX 8M Nano SODIMM SOM as shown below.

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Note: In default configuration USDHC1 is used for on board Wi-Fi module. Contact iWave Support team if microSD
feature is required.
Figure 4: Micro SD Connector
2.5.4 QSPI Flash (Optional)
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM optionally supports 2MB QSPI Flash and can be used as optional
boot device in Mini. This is connected to QSPI_A controller of the i.MX 8M Mini or i.MX 8M Nano processor and
operates at 1.8V Voltage levels. The QSPI flash (U14) is physically located on Bottom side of the SODIMM SOM. The
QSPI Flash size can be expandable. For customised QSPI Flash support, contact iWave
2.6 RTC Controller
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM supports external RTC Controller “PCF85263” On-SOM for Real
time clock support. This external RTC Controller IC (U1) is connected to i.MX 8M Mini or i.MX 8M Nano SoC through
I2C1 Interface and operates at 3.3V voltage level. In SOM power off condition, this device will take power from
SODIMM PCB Edge- Pin No. 183 (VRTC_3V0) coin cell power input and continues to keep the current time.

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2.7 Wi-Fi and Bluetooth Interface
The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM is integrated with Murata’s “LBEE5HY1MW” based Wi-Fi &
Bluetooth module. The LBEE5HY1MW module is a very high-performance module based on Cypress CYW43455 combo
chipset which supports WiFi IEEE 802.11a/b/g/n/ac + Bluetooth 5.0 BR/EDR/LE standard.
The LBEE5HY1MW module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols and supports single
stream 1x1 IEEE 802.11 a/b/g/n/ac mode providing up to 390Mbps. The LBEE5HY1MW module features small form
factor when integrating Power Amplifier (PA), Low Noise Amplifier (LNA), Transmit/Receive switch, Power
Management. The LBEE5HY1MW module need external Antenna but it requires a 32.768 kHz clock for sleep operation.
The LBEE5HY1MW module (U3) provides Secure Digital Input Output (SDIO) for interfacing with the host controller for
Wi-Fi and UART interface for Bluetooth. The i.MX 8M Mini or i.MX 8M Nano SODIMM SOM uses processor’s UART1
interface for Bluetooth and USDHC1 interface for Wi-Fi in default configuration. In i.MX 8M Mini or i.MX 8M Nano
SODIMM SOM, antenna pin of Wi-Fi & Bluetooth module is connected to J1 Connector.
Figure 5: Wi-Fi and Bluetooth Antenna Connector
Connector Part Number - : MM4829-2702RA4 from Murata Electronics.
Antenna Part Number - : 2042811100 from Molex/ FXP830.24.0100B from Taoglas Limited

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Note: The LBEE5HY1MW module supports operating temperature -30°C to 85°C with the default module’s firmware.
To set the module temperature to industrial grade in firmware, please contact iWave.
2.8 SODIMM PCB Edge Connector
i.MX 8M Mini or i.MX 8M Nano SODIMM SOM Supports JEDEC Physical Standard 200pin SODIMM PCB edge
connector for interfaces expansion. The interfaces which are available at SODIMM Edge connector are explained in
the following sections.
Figure 6: SODIMM Edge Connector
Number of Pins - : 200
Connector Part - : Not Applicable (On Board PCB Edge connector)
Mating Connector - : 1473005-1 from TE Connectivity

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Table 3: SODIMM Edge Connector Pinouts
Signal
SODIMM Pin
(Top)
SODIMM Pin
(Bottom)
Signal
GND
1
2
GPHY1_ATXRXM
VDVDH_GPHY1*
3
4
GPHY1_ATXRXP
GND
5
6
GPHY1_BTXRXM
UART3_RXD
7
8
GPHY1_BTXRXP
UART3_TXD
9
10
NC
GPHY1_LINK_LED2
11
12
GPHY1_ACTIVITY_LED1
GND
13
14
GPHY1_CTXRXM
GPHY1_DTXRXM
15
16
GPHY1_CTXRXP
GPHY1_DTXRXP
17
18
I2C3_SCL*
I2C3_SDA*
19
20
VIN_3V3
NC
21
22
NC
NC
23
24
NC
NC
25
26
NC
GND
27
28
NC
NC
29
30
GPHY2_ACTIVITY_LED1 (NC in
Nano)*
NC
31
32
VIN_3V3
GPHY2_LINK_LED2 (NC in Nano)*
33
34
GPHY2_ATXRXM (NC in Nano)*
GPHY2_BTXRXM (NC in Nano)*
35
36
GPHY2_ATXRXP (NC in Nano)*
GPHY2_BTXRXP (NC in Nano)*
37
38
UART2_CTS_B(SAI3_RXC)
USB2_OTG_OC(GPIO1_15)
39
40
GND
Key
Key
GND
41
42
GPHY2_CTXRXM (NC in Nano)*
GPHY2_DTXRXM (NC in Nano)*
43
44
GPHY2_CTXRXP (NC in Nano)*
GPHY2_DTXRXP (NC in Nano)*
45
46
VIN_3V3
SAI1_RXD0 (NC in Nano)
47
48
MIPI_DSI_DATA0_N
VDVDH_GPHY2 (NC in Nano)*
49
50
MIPI_DSI_DATA0_P
GND
51
52
MIPI_DSI_DATA1_N
MIPI_DSI_DATA2_N
53
54
MIPI_DSI_DATA1_P
MIPI_DSI_DATA2_P
55
56
MIPI_DSI_DATA3_N
MIPI_DSI_CLK_N
57
58
MIPI_DSI_DATA3_P
MIPI_DSI_CLK_P
59
60
VIN_3V3
SAI5_RX_DATA0(SAI5_RXD0)
61
62
ECSPI2_SS0
ECSPI2_MISO
63
64
GPIO_CLK(SAI5_MCLK)
GND
65
66
ECSPI2_SCLK
SAI5_TX_DATA0(SAI5_RXD3)
67
68
SAI1_RXD2 (NC in Nano)
NC
69
70
ECSPI2_MOSI
GPIO1_6
71
72
VIN_3V3
GPIO1_7
73
74
SAI1_RXC (NC in Nano)
UART2_RTS_B(SAI3_RXD)
75
76
USB1_OTG_OC(GPIO1_13)