RF-Star RF-BM-BG22A1 User manual

RF-BM-BG22A1 Bluetooth5.2 Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Sep.10th, 2020

RF-BM-BG22A1
www.szrfstar.comV1.0 - Sep., 2020
1 Device Overview
1.1 Module Series
There are three modules of RF-BM-BG22Ax. All of them are based on Silicon Labs EFR32BG22 series. Because the
EFR32BG22 chips are pin-2-pin compatible in package, pins and peripherals, those three modules are pin-2-pin
compatible with each other as well.
Table 1. Module Specification of RF-BM-BG22Ax
Model Chip Model Max. CPU
Speed
TX
Power FLASH RAM Protocol
BG22A1 EFR32BG22C112F352GM32-C 38.4 MHz 0 dBm 352 KB 32 KB BT5.2
1.2 Description
RF-BM-BG22A1 is an RF module based on EFR32BG22C112F352GM32-C, one of Gecko family of SoCs from Silicon
Labs,with a 32-bit ARM®Cortex®-M33core with 38.4 MHz maximum operating frequency. It integrates a 38.4 MHz
crystal,a matching, an antenna matching, a low-pass filterand a meander line inverted-F PCB antenna. It supports
Bluetooth 5.2 low energy and Bluetooth 5.0 low energy and can be preprogrammed with a serial interface
communication protocol for simple programming. It also has a range of analog and digital interfaces such as PRS,ADC,
UART, SPI, I2C, PWM, ISO 7816, IrDA, I2S,EUART and PDM.It features low power consumption, compact size, robust
connection distance, and rigid reliability. The module reaches up to 0 dBm TX power. 1.27-mm pitch stamp stick
package for easy assembling and cost-effective PCB design.RF-BM-BG22A1 is pin-2-pin compatible with BG22A2 and
BG22A3.
1.3Key Features
•Protocol
- Bluetooth 5.1Low Energy
- Bluetooth 5.0 Low Energy
- Bluetooth Mesh Node
•Supported Modulation Format
- 2 (G)FSK with fully configurable shaping
•High Performance 32-bit 76.8 MHz ARM
Cortex®-M33 with DSP instruction and
floating-point unit for efficient signal processing
•Memory
- Flash:352KB
- RAM: 32 KB
•TX power: -28 dBm ~ 6 dBm
•Wide Peripherals
- 12-bit 1 Mbps SAR Analog to Digital Converter
(ADC)
- Up to 18GPIOs with output state retention and
asynchronous interrupts
- 8 Channel DMA Controller
- 12 Channel Peripheral Reflex System (PRS)
- 4 ×16-bit Timer / Counter with 3 Compare /
Capture / PWM channels
- 1 ×32-bit Timer / Counter with 3 Compare /
Capture / PWM channels
- 32-bit Real Time Counter
- 24-bit Low Energy Timer for waveform generation
- 1 ×Watchdog Timer
- 2 ×Universal Synchronous / Asynchronous
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Receiver / Transmitter (UART / SPI / SmartCard
(ISO 7816) / IrDA / I2S)
- 1 ×Enhanced Universal Asynchronous
Receiver/Transmitter(EUART)
- 2 ×I2C interface with SMBus support
- Digital microphone interface (PDM)
- Precision Low-Frequency RC Oscillator enabling
single-crystaloperation
- RFSENSE with selective OOK mode
- Die temperature sensor with +/-2 degree C
accuracy acrosstemperature range
•Wide Operation Range
- 1.71 V to 3.8 V single power supply
- Operating temperature: -40 °C to +85 °C
•Security Features
- Secure Boot with Root of Trust and Secure Loader
(RTSL)
- Hardware Cryptographic Acceleration for
AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC
(up to 256-bit), ECDSA, and ECDH
- True Random Number Generator (TRNG)
compliant with NIST SP800-90 and AIS-31
- ARM®TrustZone®
- Secure Debug with lock/unlock
1.4 Applications
•Asset tags and beacons
•Consumer electronics remote controls
•Portable medical
•Bluetooth Mesh Low energy nodes
•Sports, fitness and wellness devices
•Connected home
•Building automation and security
1.5 Functional Block Diagram
Confidential
Figure 1. Functional Block Diagram of RF-BM-BG22A1
1.6 Part Number Conventions
The part numbers are of the form of RF-BM-BG22A1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-BG22A1
RF BM BG22
Company
Name
RF-star
Wireless Type
Bluetooth Module
Chipset
Silicon Labs EFR32BG22 Series
--A1
Module Version
The first version
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FCC Statement
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
Integral antenna with antenna gain 0dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
If theFCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module
is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter
Module FCC ID: 2ABN2-BG22A1 Or Contains FCC ID: 2ABN2-BG22A1”
When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause
undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
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interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes
with the product.
Any company of the host device which install this modular with modular approval should perform the test of radiated & conducted emission and
spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC
part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement，then the host can be sold legally.
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Table of Contents
1 Device Overview..................................................................................................................................... 1
1.1 Module Series........................................................................................................................... 1
1.2 Description....................................................................................................................................1
1.3 Key Features................................................................................................................................1
1.4 Applications.................................................................................................................................. 2
1.5 Functional Block Diagram........................................................................................................... 2
1.6 Part Number Conventions .......................................................................................................... 2
Table of Contents....................................................................................................................................... 5
Table of Figures .........................................................................................................................................6
Table of Tables...........................................................................................................................................6
2 Module Configuration and Functions.................................................................................................... 7
2.1 Module Parameters.....................................................................................................................7
2.2 Module Pin Diagram.................................................................................................................... 8
2.3 Pin Functions ...............................................................................................................................8
3 Specifications........................................................................................................................................ 10
3.1 Recommended Operating Conditions ..................................................................................... 10
3.2 Handling Ratings ....................................................................................................................... 10
3.3 Current Consumption................................................................................................................ 10
4 Application, Implementation, and Layout ........................................................................................... 11
4.1 Module Photos........................................................................................................................... 11
4.2 Recommended PCB Footprint ................................................................................................. 11
4.3 Schematic Diagram and Reference Design............................................................................ 12
4.4 Basic Operation of Hardware Design...................................................................................... 13
4.5 Trouble Shooting........................................................................................................................ 14
4.5.1 Unsatisfactory Transmission Distance.......................................................................... 14
4.5.2 Vulnerable Module.......................................................................................................... 15
4.5.3 High Bit Error Rate.......................................................................................................... 15
4.6 Electrostatics Discharge Warnings.......................................................................................... 15
4.7 Soldering and Reflow Condition............................................................................................... 15
4.8 Optional Packaging................................................................................................................... 17
5 Revision History.................................................................................................................................... 17
6 Contact Us............................................................................................................................................. 18
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Table of Figures
Figure 1. Functional Block Diagram of RF-BM-BG22A1................................................................ 2
Figure 2. Part Number Conventions of RF-BM-BG22A1 ............................................................... 2
Figure 3. Pin Diagram of RF-BM-BG22A1 ......................................................................................8
Figure 4. Photos of RF-BM-BG22A1.............................................................................................. 11
Figure 5. Recommended PCB Footprint of RF-BM-BG22A1 (mm)............................................ 11
Figure 6. Schematic Diagram of RF-BM-BG22A1........................................................................ 12
Figure 7. Reference Design of RF-BM-BG22A1........................................................................... 12
Figure 8. Recommendation of Antenna Layout............................................................................. 14
Figure 9. Antenna Output Mode Change........................................................ 错误！未定义书签。
Figure 10. Recommended Reflow for Lead Free Solder.............................................................. 16
Figure 11. Optional Packaging Mode............................................................................................. 17
Table of Tables
Table 1. Module Specification of RF-BM-BG22Ax.......................................................................... 1
Table 2. Parameters of RF-BM-BG22A1 ......................................................................................... 7
Table 3. Pin Functions of RF-BM-BG22A1......................................................................................8
Table 4. Recommended Operating Conditions of RF-BM-BG22A1............................................ 10
Table 5. Handling Ratings of RF-BM-BG22A1.............................................................................. 10
Table 6. Current Consumption of RF-BM-BG22A1....................................................................... 10
Table 7. Temperature Table of Soldering and Reflow................................................................... 15
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2 Module Configuration and Functions
2.1 Module Parameters
Table 2. Parameters of RF-BM-BG22A1
Chipset EFR32BG22C112F352GM32-C
Supply Power Voltage 1.71 V ~ 3.8 V, recommended to 3.3 V
Frequency 2402 MHz ~ 2480 MHz
Transmit Power -28.0 dBm ~ 0 dBm (typical: 0 dBm)
Receiving Sensitivity -98.9 dBm sensitivity @ 1 Mbit/s GFSK
-96.2 dBm sensitivity @ 2 Mbit/s GFSK
-106.7 dBm sensitivity @ 125 kbps GFSK
Power Consumption 3.6 mA RX current (1 Mbps GFSK)
4.1 mA TX current @ 0 dBm output power
GPIO 18
Crystal 38.4 MHz
RAM 32 KB
Flash 352 KB
Package SMT Packaging
Frequency Error ±20 kHz
Dimension 16.5 mm x 11.6 mm x (2.06 ± 0.1) mm
Type of Antenna PCB antenna
Operating Temperature -40 ℃～ +85℃
Storage Temperature -40 ℃～ +125 ℃
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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-BG22A1
2.3 Pin Functions
Table 3. Pin Functions of RF-BM-BG22A1
Pin Name Chip Pin Pin Type Description
1 EXT_ANT - - External antenna pin.
2 PB02 PB02 I/O GPIO
3 PB01 PB01 I/O GPIO
4 PB00 PB00 I/O GPIO
5 PA00 PA00 - RTS
6 PA03 PA03 I/O GPIO
7 PA04 PA04 I/O GPIO
8 PA05 PA05 I/O GPIO
9 PA06 PA06 I/O GPIO
10 GND GND - Ground
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11 RESET RESET - Reset, active low, internal pull-up.
12 PA01 PA01 I/O GPIO / SWCLK(connect j-link)
13 PA02 PA02 I/O GPIO / SWDDIO(connect j-link)
14 GND GND - Ground
15 VCC VCC VCC 1.71 V ~ 3.8V, recommended to 3.3 V
16 PD01 PD01 I/O GPIO
17 PD00 PD00 I/O GPIO
18 PC00 PC00 I/O GPIO
19 PC01 PC01 I/O GPIO
20 PC02 PC02 I/O GPIO
21 PC03 PC03 I/O GPIO
22 PC04 PC04 I/O GPIO
23 PC05 PC05 I/O GPIO
24 GND GND - Ground
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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 4. Recommended Operating Conditions of RF-BM-BG22A1
Items Condition Min. Typ. Max. Unit
Operating Supply Voltage Battery Mode 1.71 3.3 3.8 V
Frequency Range 2402 2480 MHz
Operating Temperature / -40 +25 +85 ℃
Environmental Hot Pendulum / -20 +20 ℃/min
3.2 Handling Ratings
Table 5. Handling Ratings of RF-BM-BG22A1
Items Condition Min. Typ. Max. Unit
Storage Temperature Tstg -40 +25 +125 ℃
Human Body Model HBM ±2000 V
Moisture Sensitivity Level 2
Charged Device Model ±500 V
3.3 Current Consumption
Unless otherwise indicated, typical conditions are: TA= 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD
= PAVDD = 1.8V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz.
Testinstruments: FLUKE15B+ multimeter, DSA1030 spectrum analyzer, offset: 0.2, RBW=100KHz
Test Results: Data after adding an attenuator.
Table 6. Current Consumption of RF-BM-BG22A1
Stand-by 1µA
Transmitting Current Set Tx Power Actual Tx Power Actual Current
0 dBm -0.5 dBm 4.0 mA
Receiving Current 2.5 mA
Note:The test method is closely related to the current. For example, the output load antenna is different from the
standard 50 Ω test data.
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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-BG22A1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-BG22A1 (mm)
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4.3 Schematic Diagram and Reference Design
The schematic diagram is as follows:
Figure 6. Schematic Diagram of RF-BM-BG22A1
The reference design is as follows:
Figure 7. Reference Design of RF-BM-BG22A1
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1. In principle, the module supports a minimum voltage of 1.71 V and a maximum voltage of 3.8 V. However, in order
to be stable and reliable, it is recommended that customers use a DC power supply not lower than 2.2 V and not
higher than 3.8 V. It is recommended to be 3.3 V.
2. The decoupling capacitor of the power supply is preferably 2.2µF.
4.4 Basic Operation of Hardware Design
1. It is recommended to offerthe module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine.The module should be far away
from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic
interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power
routing.If it has toroute the wire on the bottom of module, for example, it is assumed that the module is soldered to
the Top Layer,the copper must be spread on the connection part of the top layer and the module, and be close to
the digital part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module,which will greatly affect
themodule performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same2.4 GHzphysical layer, for
example: USB3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
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weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge(corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module is
minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position (yellow part) is based on the antenna used, and RF-star recommend the distance is no
less than 10 mm.
4.5 Trouble Shooting
4.5.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly
weakened.Temperature, humidity, and co-channel interference will lead to an increase in communication packet
loss rate.The performances of ground absorption andreflectionof radio waves will be poor, when the module is
tested close to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or themodule is placed inside of the
metal shell.
4. The incorrect power register set or the high data ratein an open air may shorten the communication distance.The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
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6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.5.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supplyand no frequently
fluctuatedvoltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and
application.If there is no special demand, it is not recommended to use at too high or too low temperature.
4.5.3 High Bit Error Rate
1. There areco-channel signal interferences nearby.It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.6Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3
precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.7 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 /Ag3.0 /Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 7. Temperature Table of Soldering and Reflow
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63 / Pb37 Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin) 100 ℃150 ℃
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Max. Preheating Temperature (Tmax) 150 ℃200 ℃
Preheating Time (Tmin to Tmax) (t1) 60 s ~ 120 s 60 s ~ 120 s
Average Ascend Rate (Tmax to Tp) Max. 3 ℃/s Max. 3 ℃/s
Liquid Temperature (TL) 183 ℃217 ℃
Time above Liquidus (tL) 60 s ~ 90 s 30 s ~ 90 s
Peak Temperature (Tp) 220 ℃~ 235 ℃230 ℃~ 250 ℃
Average Descend Rate (Tpto Tmax) Max. 6 ℃/s Max. 6 ℃/s
Time from 25
℃
to Peak Temperature (t2) Max. 6 minutes Max. 8 minutes
Time of Soldering Zone (tP) 20±10 s 20±10 s
Figure 9. Recommended Reflow for Lead Free Solder
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4.8 Optional Packaging
Figure 10. Optional Packaging Mode
Note: Default tray packaging.
5 Revision History
Date Version No. Description
2020.09.10 V1.0 The initial version is released.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.
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6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China
Tel.: [phone]
Chengdu Branch:
Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.szrfstar.com
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