RF-Star RF-SM-1312B1 Instruction Manual

RF-SM-1312B1 Ultra-Low-Power
868 MHz & 915 MHz Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
March 9th, 2020

RF-SM-1312B1
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TI CC13XX Sub-1 GHz Module List
Chipset
Core
FLASH
(KB)
RAM
(KB)
Model
Antenna
Freq.
(MHz)
Dimension
(mm)
TX
Power
(dBm)
Range
(M)
Photo
CC1310
F128RGZ
M3
128
8
RF-SM-1077B1
IPEX
868
915
18  26
14
2500
RF-SM-1077B2
IPEX
433
470
18  26
15
2500
CC1310
F128RSM
M3
128
8
RF-SM-1044B1
PCB
868
915
14  22
14
2500
RF-SM-1044B2
PCB
868
915
9  12.5
14
2500
RF-SM-1044B4
Half-
hole
868
915
14  22
14
2500
CC1352R
M4F
352
80
RF-TI1352B1
IPEX
868
915
16.8  26.5
5
BLE:
500
5
ZigBee:
300
14
868 MHz:
1500
CC1352P
M4F
352
80
RF-TI1352P1
Half-
hole
868
915
16.4  25
20
BLE 1M:
350
20
BLE
Long
Range:
2200
20
ZigBee:
1100
20
868
MHz:
2500
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

RF-SM-1312B1
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1 Device Overview
1.1 Description
RF-SM-1312B1 is an RF module based on TI SimpleLinkTM ultra-low-power Sub-1 GHz wireless SoC CC1312R with 48
MHz ARM® Cortex®-M4F processor. It integrates a 48 MHz crystal, a balun, an antenna matching and a high-
performance spring antenna or wire-wound antenna. It features low power consumption, robust connection distance,
and rigid reliability. It supports IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOYU®, Wi-SUN®, proprietary
and 862 MHz ~ 931 MHz ISM applications and can be preprogrammed with a serial interface communication protocol
for simple programming. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design.
1.2 Key Features
•RF Performance
- Flexible high-performance Sub-1 GHz RF
Transceiver
- Excellent receiver sensitivity using long-range
mode: -121 dBm
- Excellent receiver sensitivity at 50 kbps: -110
dBm
- Programmable output power with
temperature compensation: up to +14 dBm
- Differential RF interface
•Wireless protocols
- IEEE 802.15.4g, IPv6-enabled smart objects
- (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-
SUN®, KNX RF, Amazon Sidewalk,
proprietary systems, SimpleLink ™ TI 15.4
stack
- (Sub-1 GHz), and dynamic multiprotocol
manager (DMM) driver.
•Microcontroller
- Powerful ARM® Cortex®-M4F processor, 48
MHz
- EEMBC CoreMark® Score: 148
- 352 KB of in-system programmable flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of cache SRAM
- 80 KB of ultra-low leakage SRAM
- 2 pin cJTAG and JTAG debugging
- Supports Over-the-Air (OTA) update
- 2 KB of ultra-low-leakage SRAM for code and
data
•Low Power
- Wide supply voltage range: 1.8 V ~ 3.8 V
- Active mode RX: 5.8 mA (3.6 V, 868 MHz)
- Active mode TX at +14 dBm: 24.9 mA
- Active mode MCU 48 MHz running Coremark:
2.9 mA (60 μA/MHz)
- Standby: 0.85 μA (RTC running and 80 KB
RAM and CPU retention)
- Shutdown: 150 nA (wakeup on external
events)
•Peripheral
- All digital peripheral pins can be routed to any
GPIO
- 4× 32-bit or 8 × 16-bit general-purpose
timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2× comparators with internal reference DAC
(1× continuous time, 1× ultra-low power)
- Programmable current source
- 2× UART
- 2× SSI (SPI, MICROWIRE, TI)
- I2C
- I2S
- Real-time clock (RTC)
- AES-128 security module

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- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
1.3 Applications
•915 MHz ISM and SRD system
•Home and building automation
•Wireless alarm and security systems
•Industrial monitoring and control
•Smart grid and automatic meter reading
•Wireless sensor networks
• Energy-harvesting applications
• Electronic shelf label (ESL)
• Long-range sensor applications
• Heat-cost allocators
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-SM-1312B1
1.5 Part Number Conventions
The part numbers are of the form of RF-SM-1312B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-SM-1312B1
RF
SM
1312
Company Name
RF-Star
Wireless Type
Sub-1 GHz Module
Chipset Model
TI CC1312R
-
-
B1
Module Version
The First Version
CC1312R
GPIOs
cJtag
Power Filter
48.0 MHz
32.768 kHz
Reset
Balun
Filter
Power Supply
1.8 V ~ 3.8 V
Antenna
Matching
Switch
Spring Antenna
or Wire-Wound
Antenna
Half Hole Interface
LPF

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Table of Contents
TI CC13XX Sub-1 GHz Module List............................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 3
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
Table of Figures................................................................................................................................................................... 5
Table of Tables..................................................................................................................................................................... 5
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
4 Application, Implementation, and Layout.............................................................................................................10
4.1 Module Photos..................................................................................................................................................10
4.2 Recommended PCB Footprint....................................................................................................................10
4.3 Schematic Diagram.........................................................................................................................................11
4.4 Basic Operation of Hardware Design ......................................................................................................11
4.5 Trouble Shooting..............................................................................................................................................13
4.5.1 Unsatisfactory Transmission Distance........................................................................................13
4.5.2 Vulnerable Module..............................................................................................................................13
4.5.3 High Bit Error Rate .............................................................................................................................13
4.6 Electrostatics Discharge Warnings ...........................................................................................................13
4.7 Soldering and Reflow Condition.................................................................................................................14
4.8 Optional Packaging.........................................................................................................................................15
5 Revision History ............................................................................................................................................................16

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6 Contact Us.......................................................................................................................................................................17
Table of Figures
Figure 1. Functional Block Diagram of RF-SM-1312B1............................................................................. 3
Figure 2. Part Number Conventions of RF-SM-1312B1 ............................................................................ 3
Figure 3. Pin Diagram of RF-SM-1312B1........................................................................................................ 7
Figure 4. Photos of RF-SM-1312B1.................................................................................................................10
Figure 5. Recommended PCB Footprint of RF-SM-1312B1 (mm) ......................................................10
Figure 6. Schematic Diagram of RF-SM-1312B1 .......................................................................................11
Figure 7. Recommendation of Antenna Layout ...........................................................................................12
Figure 8. Recommended Reflow for Lead Free Solder............................................................................15
Figure 9. Optional Packaging Mode.................................................................................................................15
Table of Tables
Table 1. Parameters of RF-SM-1312B1 ........................................................................................................... 6
Table 2. Pin Functions of RF-SM-1312B1 ....................................................................................................... 7
Table 3. Recommended Operating Conditions of RF-SM-1312B1........................................................ 9
Table 4. Handling Ratings of RF-SM-1312B1 ................................................................................................ 9
Table 5. Temperature Table of Soldering and Reflow................................................................................14

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-SM-1312B1
Chipset
TI CC1312R
Supply Power Voltage
1.8 V ~ 3.8 V, recommended to 3.3 V
Center Frequency
862 MHz ~ 931 MHz
Receiving Sensitivity
-121 dBm (long range mode)
-110 dBm (@ 50 kbps)
Max. Tx Power
+14 dBm
Crystal
48 MHz, 32.768 kHz
RAM
80 KB
ROM
256 KB
Flash
352 KB
GPIO
13
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
24.0 mm x 16.0 mm x (2.1 ± 0.1) mm
Type of Antenna
PCB antenna
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-SM-1312B1
2.3 Pin Functions
Table 2. Pin Functions of RF-SM-1312B1
Pin
Name
Chip Pin
Pin Type
Description
1
RESET
RESET_N
-
Reset pin, active low.
2
ADC
DIO16
I/O
GPIO, JTAG_TDO, high-drive capability
3
GPIO04
DIO17
I/O
GPIO, JTAG_TDI, high-drive capability
4
GPIO00
DIO24
I/O
GPIO, analog capability
5
SWO
DIO25
I/O
GPIO, analog capability
6
TXD1
DIO26
I/O
GPIO, analog capability
7
RXD1
DIO27
I/O
GPIO, analog capability
8
VCC
3V3
-
Power supply 1.8 V ~ 3.8 V, Recommend 3.3 V
9
GND
GND
-
Ground
10
GPIO2
DIO7
I/O
GPIO, high-drive capability
11
TMSC
TMSC
I/O
JTAG TMSC, high-drive capability

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12
TCKC
TCKC
I/O
JTAG TCKC
13
PWM2
DIO21
I/O
GPIO
14
GPIO3
DIO20
I/O
GPIO
15
RXD
DIO5
I/O
GPIO, high-drive capability
16
TXD
DIO6
I/O
GPIO, high-drive capability
17
GND
GND
-
Ground
18
ANT
EXT-ANT
-
External antenna
19
GND
GND
-
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-SM-1312B1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-SM-1312B1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
4000
V
Moisture Sensitivity Level
2
Charged Device Model
750
V