RF-Star RF-BM-2652B1 User manual

RF-BM-2652B1
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Shenzhen RF-star Technology Co., Ltd. Page 1 of 21
RF-BM-2652B1 CC2652R SimpleLink™
Multiprotocol 2.4 GHz Wireless Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Oct. 19th, 2022

RF-BM-2652B1
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TI CC26XX BLE Module List
Chipset
Core
Flash
(KB)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
CC2640
R2FRSM
M3
128
28
2
RF-BM-4044B2
PCB
11.2  16.6
300
RF-BM-4044B3
IPEX
11.2  15.2
500
RF-BM-4044B4
CHIP
8  8
150
CC2640
R2FRGZ
M3
128
28
5
RF-BM-4077B1
PCB
17  23.5
500
CC2640
R2FRGZ –
Q1
RF-BM-4077B2
PCB
17  23.5
500
CC2642R
M4F
352
80
5
RF-BM-2642B1
PCB
17  23.5
500
CC2652R
M4F
352
80
5
RF-BM-2652B1
PCB
17  23.5
BLE:
500
ZigBee:
300
CC2652P
M4F
352
80
20
RF-BM-2652P1
Half-hole
16.4  25
BLE 1M:
350
BLE Long
Range:
2200
ZigBee:
1100
M4F
352
80
20
RF-BM-2652P2
PCB /
IPEX /
16.4  30
BLE 1M:
350

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Half-hole
BLE Long
Range:
2200
ZigBee:
1100
CC1352R
M4F
352
80
5 / 14
RF-TI1352B1
IPEX
16.8  26.5
BLE:
500
ZigBee:
300
868 MHz:
1000
CC1352P
M4F
352
80
20
RF-TI1352P1
Half-hole
16.4  25
BLE 1M:
350
BLE Long
Range:
2200
ZigBee:
1100
868 MHz:
2500
Note:
1. The transmission range is the longest distance obtained by testing the module's maximum transmission power in
an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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1 Device Overview
1.1 Description
RF-BM-2652B1 is an RF module based on TI lower-power CC2652R SoC. It integrates a 48 MHz crystal and a 32.768
kHz crystal, 352 KB of in-system Programmable Flash, 256 KB ROM, 8 KB of Cache SRAM, 80 KB of ultra-low leakage
SRAM. Its ARM® Cortex®-M4F core application processor can operate at an extremely low current at flexible power
modes. Its 2.4 GHz RF transceiver is compatible with Bluetooth 5 Low Energy and IEEE 802.15.4 PHY and MAC. It
features a small size, robust connection distance, and rigid reliability.
1.2 Key Features
•RF Features
- Thread, Zigbee®
- Bluetooth® 5.2 Low Energy
- SimpleLink™ TI 15.4-stack
- 6LoWPAN
- Proprietary systems
•Modulation
- 2-(G)FSK
- 4-(G)FSK
- MSK
•TX power: up to +5 dBm with temperature
compensation
•RF sensitivity
- -100 dBm for 802.15.4 (2.4 GHz)
- -105 dBm for Bluetooth 125 kbps (LE coded PHY)
•Microcontroller
- Powerful 48 MHz ARM® Cortex®-M4F processor
- EEBMC CoreMark® score: 148
•Memory
- 352 KB of in-system programmable flash
- 256 KB of ROM for Protocols and library
functions
- 8 KB of cache SRAM
- 80 KB of ultra-low leakage SRAM
•2-pin cJTAG and JTAG debugging
•Support OTA upgrade
•Wide Operation Range
- Power supply: 1.8 V to 3.8 V
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Wide Peripherals
- Up to 31 GPIOs, digital peripherals can be
routed to any GPIO
- Four 32-bit or eight 16-bit general-purpose
timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 8-bit DAC
- Two comparators with internal reference DAC (1
× continuous time, 1 × ultra-low power)
- Programmable current source
- Two UART, two SSI, I2C, I2S
- Real-time clock (RTC)
- Integrated temperature and battery monitor
- AES 128 and 256 bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
•Dimension: 23.50 mm × 17.03 mm × 2.2 mm

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1.3 Applications
•Home and building automation
•Smart grid and automatic meter reading
•Wireless sensor networks
•Factory automation
•Wireless healthcare applications
•Energy harvesting applications
•Asset tracking and management
•Electronic Shelf Label (ESL)
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-2652B1
1.6 Part Number Conventions
The part numbers are of the form of RF-BM-2652B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-2652B1
CC2652R
31 GPIOs
48.0 MHz
32.768 kHz
Reset
LC Balun
PCB Antenna
RF-N
RF-P
ANT Matching
Power Supply
1.8 V ~ 3.8 V
Power EMI
Filter
RF
BM
2652
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
TI CC2652R
-
-
B1
Module Version
The First Version

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Table of Contents
TI CC26XX BLE Module List.......................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features ....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 5
1.4 Functional Block Diagram .............................................................................................................................. 5
1.6 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions ...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram ......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Schematic Diagram.........................................................................................................................................13
4.4 Antenna................................................................................................................................................................13
4.4.1 Antenna Design Recommendation ..............................................................................................13
4.5 Basic Operation of Hardware Design ......................................................................................................14
4.6 Trouble Shooting..............................................................................................................................................15
4.6.1 Unsatisfactory Transmission Distance........................................................................................15
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................15
4.7 Electrostatics Discharge Warnings ...........................................................................................................15
4.8 Soldering and Reflow Condition.................................................................................................................16

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4.9 Optional Package Specification .................................................................................................................18
6 Revision History ............................................................................................................................................................20
7 Contact Us.......................................................................................................................................................................21
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-2652B1............................................................................. 5
Figure 2. Part Number Conventions of RF-BM-2652B1 ............................................................................ 5
Figure 3. Pin Diagram of RF-BM-2652B1........................................................................................................ 9
Figure 4. Photos of RF-BM-2652B1.................................................................................................................12
Figure 5. Recommended PCB Footprint of RF-BM-2652B1 (mm) ......................................................12
Figure 6. Schematic Diagram of RF-BM-2652B1 .......................................................................................13
Figure 7. Recommendation of Antenna Layout ...........................................................................................14
Figure 8. Recommended Reflow for Lead-Free Solder ...........................................................................17
Figure 9. Default Package by Tray ...................................................................................................................18
Figure 10. Package by Tape & Reel ................................................................................................................19
Table of Tables
Table 1. Parameters of RF-BM-2652B1 ........................................................................................................... 8
Table 2. Pin Functions of RF-BM-2652B1 ....................................................................................................... 9
Table 3. Recommended Operating Conditions of RF-BM-2652B1......................................................11
Table 4. Handling Ratings of RF-BM-2652B1 ..............................................................................................11
Table 5. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-2652B1
Chipset
CC2652R
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
2402 MHz ～2480 MHz
Maximum Transmit Power
+5.0 dBm
Receiving Sensitivity
-100 dBm @ 802.15.4 (2.4 GHz)
-105 dBm @ Bluetooth 125 kbps (LE Coded PHY)
GPIO
31
Support Protocol
Bluetooth 5.2 Low Energy, ZigBee, Thread, IEEE 802.15.4, 6LoWPAN
Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (Half hole)
Dimension
23.50 mm × 17.03 mm × (2.2 ±0.1) mm
Type of Antenna
PCB antenna
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-2652B1
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-2652B1
Pin
Name
Function
Description
1
P00
GPIO
GPIO, Sensor Controller
2
P01
GPIO
GPIO, Sensor Controller
3
P02
GPIO
GPIO, Sensor Controller
4
P03
GPIO
GPIO, Sensor Controller
5
P04
GPIO
GPIO, Sensor Controller
6
P05
GPIO
GPIO, Sensor Controller, high-drive capability
7
P06
GPIO
GPIO, Sensor Controller, high-drive capability
8
P07
GPIO
GPIO, Sensor Controller, high-drive capability
9
P08
GPIO
GPIO
10
P09
GPIO
GPIO

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11
P10
GPIO
GPIO
12
P11
GPIO
GPIO
13
P12
GPIO
GPIO
14
P13
GPIO
GPIO
15
P14
GPIO
GPIO
16
P15
GPIO
GPIO
17
JTAG_TMSC
JTAG_TMSC
JTAG TMSC, high-drive capability
18
JTAG_TCKC
JTAG_TCKC
JTAG TCKC
19
P16
GPIO
GPIO, JTAG_TDO, high-drive capability
20
P17
GPIO
GPIO, JTAG_TDI, high-drive capability
21
P18
GPIO
GPIO
22
P19
GPIO
GPIO
23
P20
GPIO
GPIO
24
P21
GPIO
GPIO
25
P22
GPIO
GPIO
26
P23
GPIO
GPIO, Sensor Controller, Analog
27
P24
GPIO
GPIO, Sensor Controller, Analog
28
P25
GPIO
GPIO, Sensor Controller, Analog
29
P26
GPIO
GPIO, Sensor Controller, Analog
30
P27
GPIO
GPIO, Sensor Controller, Analog
31
P28
GPIO
GPIO, Sensor Controller, Analog
32
P29
GPIO
GPIO, Sensor Controller, Analog
33
P30
GPIO
GPIO, Sensor Controller, Analog
34
VDD_EB
VDD
Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V
35
GND
GND
Ground
36
NRESET
RESET_N
Reset, active-low. With internal pullup

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-2652B1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
3.2 Handling Ratings
All measurements are based on the Silicon Labs reference design and datasheet.
Table 4. Handling Ratings of RF-BM-2652B1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-2652B1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-2652B1 (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-2652B1
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.

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Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.

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8. It is recommended to stay away from devices whose TTL protocol is the same 2.4 GHz physical layer, for example,
USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performance of ground absorption and reflection of radio waves will be poor when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions

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below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 8. Recommended Reflow for Lead-Free Solder

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4.9 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 9. Default Package by Tray

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Figure 10. Package by Tape & Reel

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6 Revision History
Date
Version No.
Description
2019.09.12
V1.0
The initial version is released.
2020.01.19
V1.0
Add TI CC26XX BLE module list.
2020.05.14
V1.0
Update TI CC26XX BLE module list.
Update module PCB Footprint diagram.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.rfstariot.com and www.szrfstar.com.