RF-Star RF-BMPA-2541B1 User manual

RF-BMPA-2541B1
Bluetooth Low Energy Module
Version 1.1
Shenzhen RF-star Technology Co., Ltd.
May 15th, 2020

RF-BMPA-2541B1
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Shenzhen RF-star Technology Co., Ltd. Page 1 of 20
TI CC254X BLE Module List
Chipset
Core
Flash
(Byte)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
CC2540
8051
256
8
+4
RF-BM-S01
PCB
13.7  17.4
100
RF-BM-S02
PCB
11.2  15.2
100
RF-BM-S02I
IPEX
11.2  15.2
150
RF-CC2540A1
PCB
15.2  24.1
100
CC2541
8051
256
8
0
RF-BM-S01A
PCB
13.7  17.4
70
RF-BM-S02A
PCB
11.2  15.2
70
RF-BMPA-
2541B1
PCB /
IPEX
13.7  31.4
300
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

RF-BMPA-2541B1
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1 Device Overview
1.1 Description
RF-BMPA-2541B1 is a Bluetooth Low Energy (BLE) module based on TI CC2541F256, an 8051 core BLE System-on-
Chip (SoC) and a PA of CC2592. This PCB module integrates one 32 MHz crystal, one 32.768 kHz crystal, an LC balun,
a chip matching, a high-performance PCB antenna, an IPEX connector, and half-hole antenna interface for different
customer needs to develop. It is pre-programmed with the BLE 4.0 stack and an application communication protocol
over its serial interface. It enables users to quickly connect their application MCUs to build reliable BLE connection from
their products to smart phones.
1.2 Key Features
•RF
- 2.4 GHz Bluetooth low energy 4.0 compatible and
proprietary RF system-on-chip
- Supports 250 kbps, 500 kbps, 1 Mbps, 2 Mbps
data rates
- Excellent link budget, enabling long-range
applications without external front end
- Excellent receiver sensitivity (-94 dBm at 1 Mbps),
selectivity, and Blocking performance
- Suitable for systems targeting compliance with
worldwide radio frequency regulations: ETSI EN
300 328 and EN 300 440 Class 2 (Europe), FCC
CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
•Microcontroller
- High-performance and low-power 8051
microcontroller core with code prefetch
- In-system-programmable flash of 256 KB
- 8-KB RAM with retention in all power modes
- Hardware debug support
- Extensive baseband automation, including auto-
acknowledgment and address decoding
- Retention of all relevant registers in all power modes
•Layout
- Few external components
- 31.4 mm x 13.7 mm in SMT Package
•Peripherals
- Powerful five-channel DMA
- 12 Bit ADC with eight channels and configurable
resolution
- Integrated high-power comparator
- General-purpose timers (one 16-bits, two 8-bits)
- 19 General-purpose I/O pins (21 × 4 mA, 2 × 20 mA)
- 32 kHz sleep timer with capture
- Two powerful USARTs with support for several
serial protocols
- IR generation circuity
- AES security coprocessor
- Battery monitor and temperature sensor
- I2C interface
- 2 I/O pins have LED driving capabilities
- Watchdog timer
1.3 Applications
•2.4-GHz Bluetooth low energy system
•Mobile phone accessories
•Sports and leisure equipment
•Consumer electronics
•Human interface devices
•Keyboard, mouse

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•Remote control
•Health care and medical
•Smart lighting
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BMPA-2541B1
1.5 Part Number Conventions
The part numbers are of the form of RF-BMPA-2541B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BMPA-2541B1
CC2541
F256
GPIO
I2C
UART
32.768 kHz
Reset
Chip
Matching
PCB
Antenna
CC25
92
IPEX
Connector
Antenna
Matching
Half Hole
Interface
Power Filter
Power Filter
Switch
Power
32.0 MHz
LC Balun
Power
Supply
2.0 V ~ 3.6
RF
BM
2541
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
TI CC2541
-
-
B1
Module Version
The First Version
PA
Power Amplifier
TI CC2592

RF-BMPA-2541B1
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Table of Contents
TI CC254X BLE Module List .......................................................................................................................................... 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features.................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
Table of Figures................................................................................................................................................................... 5
Table of Tables..................................................................................................................................................................... 5
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
3.3 Current Consumption ....................................................................................................................................... 9
3.4 RF Test.................................................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Antenna................................................................................................................................................................12
4.4 Schematic Diagram.........................................................................................................................................13
4.5 Basic Operation of Hardware Design ......................................................................................................13
4.6 Trouble Shooting..............................................................................................................................................15
4.6.1 Unsatisfactory Transmission Distance........................................................................................15
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................16
4.7 Electrostatics Discharge Warnings ...........................................................................................................16

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4.8 Soldering and Reflow Condition.................................................................................................................16
4.9 Optional Packaging.........................................................................................................................................17
5 Certification .....................................................................................................................................................................18
5.1 RoHS ....................................................................................................................................................................18
6 Revision History ............................................................................................................................................................19
7 Contact Us.......................................................................................................................................................................20
Table of Figures
Figure 1. Functional Block Diagram of RF-BMPA-2541B1 ....................................................................... 3
Figure 2. Part Number Conventions of RF-BMPA-2541B1....................................................................... 3
Figure 3. Pin Diagram of RF-BMPA-2541B1.................................................................................................. 7
Figure 4. Photos of RF-BMPA-2541B1...........................................................................................................11
Figure 5. Recommended PCB Footprint of RF-BMPA-2541B1 (mm).................................................11
Figure 6. Location of C17, C18 and C23 .......................................................................................................12
Figure 7. Specification of Antenna Seat .........................................................................................................12
Figure 8. Specification of IPEX Wire................................................................................................................13
Figure 9. Schematic Diagram of RF-BMPA-2541B1 .................................................................................13
Figure 10. Recommendation of Antenna Layout.........................................................................................15
Figure 11. Recommended Reflow for Lead Free Solder .........................................................................17
Figure 12. Optional Packaging Mode ..............................................................................................................17
Figure 13. RoHS Certificate ................................................................................................................................18
Table of Tables
Table 1. Parameters of RF-BMPA-2541B1...................................................................................................... 6
Table 2. Pin Functions of RF-BMPA-2541B1 ................................................................................................. 7
Table 3. Recommended Operating Conditions of RF-BMPA-2541B1 .................................................. 9
Table 4. Handling Ratings of RF-BM-ND04 .................................................................................................... 9
Table 5. Table of Current Consumption ............................................................................................................ 9
Table 6. Table of RF Test......................................................................................................................................10
Table 7. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BMPA-2541B1
Chipset
CC2541F256+CC2592
Supply Power Voltage
2.0 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
Programmable: -3.0 dBm ~ +19.0 dBm
Receiving Sensitivity (high gain mode)
-93 dBm
GPIO
19
Crystal
32 MHz, 32.768 kHz
RAM
8 KB
Flash
256 KB
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
31.40 mm x 13.7 mm x (2.1 ±0.1) mm
Type of Antenna
PCB Antenna / IPEX connector / Half-hole antenna interface
Operating Temperature (high-temperature mode)
-40 ℃～+85 ℃
Storage Temperature (high-temperature mode)
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BMPA-2541B1
2.3 Pin Functions
Table 2. Pin Functions of RF-BMPA-2541B1
Pin
Name
Chip Pin
Pin Type
Description
1
GND
－
GND
Suitable for long distance requirements
2
VCC
－
Power supply
3
P22
P2.2
Debug DC
Debug DC
4
P21
P2.1
Debug DD
Debug DD
5
P20
P2.0
I/O
6
P17
P1.7
I/O
7
P16
P1.6
I/O
8
I2C+
I2C+
I2C+
I2C+
9
I2C-
I2C-
I2C-
I2C-
10
GND
GND
Ground

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11
P15
P1.5
I/O
12
P14
P1.4
I/O
13
P13
P1.3
I/O @ LNA EN
Control CC2592 LNA enable
14
P12
P1.2
I/O @ PA EN
Control CC2592 PA enable
15
P11
P1.1
I/O @ gain
Control CC2592 LNA high & low gain
16
P10
P1.0
I/O
17
P07
P0.7
I/O
18
P06
P0.6
I/O
19
P05
P0.5
I/O
20
P04
P0.4
I/O
21
P03
P0.3
I/O
22
P02
P0.2
I/O
23
P01
P0.1
I/O
24
P00
P0.0
I/O
25
RESET
RST
RESET
Active low
26
GND
-
GND
Ground
27
ANT
-
ANT
External antenna
28
GND
-
GND
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BMPA-2541B1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
2.0
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND04
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±1000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V
3.3 Current Consumption
Table 5. Table of Current Consumption
When measured on the RF-BMPA-2541B1 reference design with T A = 25 ℃, V BAT = 3.3 V, Fc = 2440 MHz with
DC/DC enabled unless otherwise noted.
Event
Average Current
(Integral
Computed1)
Average Current
(Ammeter
Measured2)
Duration
Testing Conditions
Sleeping
0 mA
0 mA
/
EN is in high low
Broadcasting
0.79 mA
0.6 mA ~ 1.3 mA
4.42 ms
Broadcasting cycle: 200 ms
Connection
1.8 mA
1.9 mA ~2.1 mA
2.73 ms
Connection interval: 100 ms
Module receiving
UART data and
send to APP
0.95 mA
9.1 mA
0.512 ms
20 bytes,10 times/s
Module receiving
APP data and send
to MCU
0.94 mA
8.8 mA ~ 8.9 mA
0.512 ms
20 bytes,10 times/s