RF-Star RF-BM-ND02 User manual

RF-BM-ND02
Bluetooth 4.2 Low Energy Module
Version 1.1
Shenzhen RF-star Technology Co., Ltd.
Sep. 22nd, 2020

RF-BM-ND02
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Nordic BLE Module List
➢nRF51 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF51822
M0
256
16
4
RF-BM-ND01
PCB
15  24.8
100
RF-BM-ND02
PCB
13.5  16.2
80
RF-BM-ND02I
IPEX
13.5  16.2
100
Contact me
nRF51802
M0
256
16
4
RF-BM-ND01C
PCB
15  24.8
100
RF-BM-ND02C
PCB
13.5  16.2
80
RF-BM-ND02CI
IPEX
13.5  16.2
100
Contact me
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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➢nRF52 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF52832
M4F
512
64
4
RF-BM-ND04
PCB
15  24.8
100
RF-BM-ND04I
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08I
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52810
M4
192
24
4
RF-BM-ND04C
PCB
15  24.8
100
RF-BM-ND04CI
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08C
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08CI
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52811
M4
192
24
4
RF-BM-ND04A
PCB
15  24.8
100

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RF-BM-ND08A
PCB/Half-
hole
15.2  11.2
80
nRF52833
M4
512
128
8
RF-BM-ND07
Chip/IPE
X/Pad
12.2  17
300
nRF52840
M4F
1024
256
8
RF-BM-ND05
PCB
15  24.8
500
RF-BM-ND05I
IPEX/Half
-hole
15  24.8
500
RF-BM-ND06
PCB/Pad
20.5  24
500
nRF52805
M4
192
24
4
RF-BM-ND09
Pad
7  7
100
M4
192
24
4
RF-BM-ND09A
PCB/Pad
7  9
80
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

RF-BM-ND02
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1 Device Overview
1.1 Description
RF-BM-ND02 is an RF module based on Nordic BLE SoC nRF51822 with ARM® Cortex®-M0 32-bit processor. It
integrates a 16.0 MHz crystal, an LC filter, an antenna matching and a meander line inverted-F PCB antenna. It features
low power consumption, compact size, robust connection distance, and rigid reliability. It supports Bluetooth® v4.2 Low
Energy and 2.4 GHz proprietary wireless applications and can be pre-programmed with SPI master/slave, I2C master
and UART for simple programming. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB
design. RF-BM-ND02 is pin-2-pin compatible with RF-BM-ND02C/ND02I.
1.2 Key Features
•Bluetooth® low energy mode
•TX power: -20 to +4 dBm
•16 MHz ARM® Cortex®-M0 32-bit processor
•Supply voltage range 1.8 V ~ 3.6 V
•Memory
- 256 kB flash
- 16 kB RAM
•Peripherals
- 10 bit ADC
- 24 GPIOs
- SPI Master/Slave
- I2C Master
- UART (CTS/RTS)
•Quadrature Decoder (QDEC)
•AES HW encryption
•Real Timer Counter (RTC)
•Transmission range: 80 m
•Dimension: 16.2 mm x 13.5 mm x 1.3 mm
•Certificates: BQB
1.3 Applications
•Mouse and keyboard
•Mobile HID
•Multi-touch trackpad
•Remote control
•Gaming controller
•Wearables
•Virtual reality headsets
•Health/fitness sensor and monitor device
•Industrial lighting
•Smart toys
•Medical devices
•Beacons

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND02
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND02 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND02
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
02
Module Version
nRF51822 Version
nRF51822
GPIO
Debug
Reset
PCB Antenna
LC Filter
Power Supply
1.8 V ~ 3.6 V
Antenna
Matching
16.0 MHz

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Table of Contents
Nordic BLE Module List ................................................................................................................................................... 1
➢nRF51 Series ....................................................................................................................................................... 1
➢nRF52 Series ....................................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features ....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 4
1.4 Functional Block Diagram .............................................................................................................................. 5
1.5 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions ...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram ......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Schematic Diagram.........................................................................................................................................13
4.4 Antenna................................................................................................................................................................13
4.4.1 Antenna Design Recommendation ..............................................................................................13
4.5 Basic Operation of Hardware Design ......................................................................................................14
4.6 Trouble Shooting..............................................................................................................................................15
4.6.1 Unsatisfactory Transmission Distance........................................................................................15
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................15
4.7 Electrostatics Discharge Warnings ...........................................................................................................15
4.8 Soldering and Reflow Condition.................................................................................................................16

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4.9 Optional Packaging.........................................................................................................................................17
5 Certification .....................................................................................................................................................................18
5.1 BQB.......................................................................................................................................................................18
6 Revision History ............................................................................................................................................................19
7 Contact Us.......................................................................................................................................................................20
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND02................................................................................. 5
Figure 2. Part Number Conventions of RF-BM-ND02 ................................................................................ 5
Figure 3. Pin Diagram of RF-BM-ND02............................................................................................................ 9
Figure 4. Photos of RF-BM-ND02.....................................................................................................................12
Figure 5. Recommended PCB Footprint of RF-BM-ND02 (mm) ..........................................................12
Figure 6. Schematic Diagram of RF-BM-ND02 ...........................................................................................13
Figure 7. Recommendation of Antenna Layout ...........................................................................................14
Figure 8. Recommended Reflow for Lead-Free Solder ...........................................................................17
Figure 9. Optional Packaging Mode.................................................................................................................17
Figure 10. BQB Certificate...................................................................................................................................18
Table of Tables
Table 1. Parameters of RF-BM-ND02 ............................................................................................................... 8
Table 2. Pin Functions of RF-BM-ND02 ........................................................................................................... 9
Table 3. Recommended Operating Conditions of RF-BM-ND02..........................................................11
Table 4. Handling Ratings of RF-BM-ND02 ..................................................................................................11
Table 5. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND02
Chipset
nRF51822
Supply Power Voltage
1.8 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +4.0 dBm (typical: 0 dBm)
Receiving Sensitivity
-93 dBm
Power Consumption
13 mA peak RX, 10.5 mA peak TX (@ 0 dBm)
9.7 mA peak RX, 8.0 mA peak TX (@ 0 dBm with DC/DC)
GPIO
24
Crystal
16 MHz
RAM
16 kB
Flash
256 kB
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
16.2 mm x 13.5 mm x 1.3 mm
Type of Antenna
PCB antenna
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND02
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND02
Pin
Name
Chip Pin
Pin Type
Description
1
P21
P0_21
I/O
2
P24
P0_24
I/O
3
P25
P0_25
I/O
4
P26
P0_26
I/O
5
P27
P0_27
I/O
6
P28
P0_28
I/O
7
P29
P0_29
I/O
8
VCC
VCC
I
Power supply 1.8 V ~ 3.6 V, Recommend 3.3 V
9
GND
GND
I
Ground
10
P00
P0_00
I/O
11
P01
P0_01
I/O

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12
P02
P0_02/AIN0
I/O
13
P03
P0_03/AIN1
I/O
14
P04
P0_04/AIN2
I/O
15
P05
P0_05/AIN3
I/O
16
P06
P0_06
I/O
17
P07
P0_07
I/O
18
P08
P0_08
I/O
19
P09
P0_09
I/O
20
P10
P0_10
I/O
21
P11
P0_11
I/O
22
P12
P0_12
I/O
23
P13
P0_13
I/O
24
P14
P0_14
I/O
25
SWDIO /
nRESET
JTAG SWD
I/O
System reset (active low). Serial wire debug I/O for
debugging and programming.
26
SWCLK
JTAG CLK
I/O
Serial wire debug clock input for debugging and
programming.

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND02
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.8
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND02
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND02
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND02 (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND02
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is

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minimally affected.
Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.

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8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the
ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:

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1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 8. Recommended Reflow for Lead-Free Solder
4.9 Optional Packaging
Figure 9. Optional Packaging Mode
Note: Default tray packaging.

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5 Certification
5.1 BQB
Declaration ID: D041509
Figure 10. BQB Certificate

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6 Revision History
Date
Version No.
Description
2016.08.31
V1.0
The initial version is released.
2016.10.11
V1.0
Add chipset ROM.
2017.06.19
V1.0
Update module thickness.
2017.12.20
V1.1
Update module parameters.
2018.03.02
V1.1
Update module parameters.
2018.08.02
V1.1
Update company address.
2020.01.10
V1.1
Add Nordic BLE module list.
2020.09.22
V1.1
Update Nordic BLE module list.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.