RF-Star RF-BM-ND04C User manual

RF-BM-ND04C
Bluetooth 5.0 Low Energy Module
Version 1.1
Shenzhen RF-star Technology Co., Ltd.
Sep. 22nd, 2020

RF-BM-ND04C
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Nordic BLE Module List
➢nRF51 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF51822
M0
256
16
4
RF-BM-ND01
PCB
15  24.8
100
RF-BM-ND02
PCB
13.5  16.2
80
RF-BM-ND02I
IPEX
13.5  16.2
100
Contact me
nRF51802
M0
256
16
4
RF-BM-ND01C
PCB
15  24.8
100
RF-BM-ND02C
PCB
13.5  16.2
80
RF-BM-ND02CI
IPEX
13.5  16.2
100
Contact me
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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➢nRF52 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF52832
M4F
512
64
4
RF-BM-ND04
PCB
15  24.8
100
RF-BM-ND04I
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08I
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52810
M4
192
24
4
RF-BM-ND04C
PCB
15  24.8
100
RF-BM-ND04CI
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08C
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08CI
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52811
M4
192
24
4
RF-BM-ND04A
PCB
15  24.8
100

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RF-BM-ND08A
PCB/Half-
hole
15.2  11.2
80
nRF52833
M4
512
128
8
RF-BM-ND07
Chip/IPE
X/Pad
12.2  17
300
nRF52840
M4F
1024
256
8
RF-BM-ND05
PCB
15  24.8
500
RF-BM-ND05I
IPEX/Half
-hole
15  24.8
500
RF-BM-ND06
PCB/Pad
20.5  24
500
nRF52805
M4
192
24
4
RF-BM-ND09
Pad
7  7
100
M4
192
24
4
RF-BM-ND09A
PCB/Pad
7  9
80
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

RF-BM-ND04C
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1 Device Overview
1.1 Description
RF-BM-ND04C is an RF module based on Nordic BLE SoC nRF52810 with ARM® Cortex®-M4 32-bit processor. It
integrates a 32.768 kHz and a 32 MHz crystal, an LC filter, an antenna matching and a meander line inverted-F PCB
antenna. It supports Bluetooth 5.0 LE, including the high-speed 2 Mbps feature and ANT and 2.4 GHz proprietary
protocols for simple programming. The module has numerous digital peripherals and interfaces such as PDM, PWM,
UART, SPI, I2C and 12-bit ADC. It features low power consumption, small size, robust connection distance, and rigid
reliability. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design. RF-BM-ND04C is
pin-to-pin compatible with RF-BM-ND04/ND04I/ND04CI/ND05/ND05I.
1.2 Key Features
•RF features
- Bluetooth 5.0 low energy
- ANT
- 2.4 GHz proprietary
•TX power: -20 to +4 dBm
•ARM® Cortex®-M4 32-bit processor, 64 MHz
•Supply voltage range 1.7 V ~ 3.6 V
•Memory
- 192 kB flash
- 24 kB RAM
•Support for concurrent multi-protocol
•Peripherals
- 12-bit, 200 ksps ADC
- 29 GPIOs
- 4-channel PWM
- Digital microphone interface (PDM)
- SPI master/slave
- I2C master/slave
- UART (CTS/RTS)
•Programmable peripheral interconnect (PPI)
•Quadrature decoder (QDEC)
•AES HW encryption
•Transmission range: 100 m
•Dimension: 24.8 mm x 15.0 mm x 2.3 mm
•Certificates: SRRC, FCC, RoHS
1.3 Applications
•Mouse and keyboard
•Mobile HID
•Remote controls
•Wearables
•Virtual reality headsets
•Health and medical
•Industrial lighting
•Retail
•Commercial
•Beacons

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND04C
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND04C where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND04C
nRF52810
GPIO
Debug
Reset
PCB
Antenna
LC Filter
Power Supply
1.7 V ~ 3.6 V
Antenna
Matching
32.0 MHz
32.768 kHz
RF BM ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
--04C
Module Version
nRF52810 Version

RF-BM-ND04C
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Table of Contents
Nordic BLE Module List ................................................................................................................................................... 1
➢nRF51 Series ....................................................................................................................................................... 1
➢nRF52 Series ....................................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features ....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 4
1.4 Functional Block Diagram .............................................................................................................................. 5
1.5 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 8
2 Module Configuration and Functions ...................................................................................................................... 9
2.1 Module Parameters........................................................................................................................................... 9
2.2 Module Pin Diagram .......................................................................................................................................10
2.3 Pin Functions.....................................................................................................................................................10
3 Specifications .................................................................................................................................................................12
3.1 Recommended Operating Conditions .....................................................................................................12
3.2 Handling Ratings..............................................................................................................................................12
3.3 Power Consumption .......................................................................................................................................12
4 Application, Implementation, and Layout.............................................................................................................13
4.1 Module Photos..................................................................................................................................................13
4.2 Recommended PCB Footprint....................................................................................................................13
4.3 Schematic Diagram.........................................................................................................................................14
4.4 Reference Design............................................................................................................................................14
4.5 Antenna................................................................................................................................................................15
4.5.1 Antenna Design Recommendation ..............................................................................................15
4.6 Basic Operation of Hardware Design ......................................................................................................15
4.7 Trouble Shooting..............................................................................................................................................16
4.7.1 Unsatisfactory Transmission Distance........................................................................................16

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4.7.2 Vulnerable Module..............................................................................................................................17
4.7.3 High Bit Error Rate .............................................................................................................................17
4.8 Electrostatics Discharge Warnings ...........................................................................................................17
4.9 Soldering and Reflow Condition.................................................................................................................17
4.10 Optional Packaging ......................................................................................................................................19
5 Certification .....................................................................................................................................................................20
5.1 SRRC ...................................................................................................................................................................20
5.2 FCC.......................................................................................................................................................................20
5.3 RoHS ....................................................................................................................................................................21
6 Revision History ............................................................................................................................................................22
7 Contact Us.......................................................................................................................................................................23
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND04C.............................................................................. 5
Figure 2. Part Number Conventions of RF-BM-ND04C ............................................................................. 5
Figure 3. Pin Diagram of RF-BM-ND04C.......................................................................................................10
Figure 4. Photos of RF-BM-ND04C .................................................................................................................13
Figure 5. Recommended PCB Footprint of RF-BM-ND04C (mm) .......................................................13
Figure 6. Schematic Diagram of RF-BM-ND04C........................................................................................14
Figure 7. Reference Design of RF-BM-ND04C ...........................................................................................14
Figure 8. Recommendation of Antenna Layout ...........................................................................................15
Figure 9. Recommended Reflow for Lead-Free Solder ...........................................................................18
Figure 10. Optional Packaging Mode ..............................................................................................................19
Figure 11. SRRC Certificate................................................................................................................................20
Figure 12. FCC Certificate ...................................................................................................................................20
Figure 13. RoHS Certificate ................................................................................................................................21

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Table of Tables
Table 1. Parameters of RF-BM-ND04C ............................................................................................................ 9
Table 2. Pin Functions of RF-BM-ND04C......................................................................................................10
Table 3. Recommended Operating Conditions of RF-BM-ND04C.......................................................12
Table 4. Handling Ratings of RF-BM-ND04C...............................................................................................12
Table 5. Power Consumption..............................................................................................................................12
Table 6. Temperature Table of Soldering and Reflow................................................................................17

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND04C
Chipset
nRF52810
Supply Power Voltage
1.7 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +4.0 dBm (typical: 0 dBm)
Receiving Sensitivity
-96 dBm
Data Rate
1 Mbps, 2 Mbps
Power Consumption
4.6 mA peak current in TX (@ 0 dBm)
4.6 mA peak current in RX
GPIO
29
Crystal
32 MHz, 32.768 kHz
RAM
24 kB
Flash
192 kB
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
24.8 mm x 15.0 mm x 2.3 mm
Type of Antenna
PCB Antenna
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND04C
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND04C
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
GND
GND
2
VCC
VCC
Power
Power supply 1.7 V ~ 3.6 V, Recommend 3.3 V
3
P21 / RST
P0_21 / RESET
I/O
Reset, active low.
4
P22
P0_22
I/O
5
P23
P0_23
I/O
6
P24
P0_24
I/O
7
P25
P0_25
I/O
8
P28
P0_28 / AIN4
I/O
9
P29
P0_29 / AIN5
I/O

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10
P30
P0_30 / AIN6
I/O
11
P26
P0_26
I/O
12
P27
P0_27
I/O
13
P02
P0_2 / AIN0
I/O
14
P03
P0_3 / AIN1
I/O
15
P04
P0_4 / AIN2
I/O
16
P05
P0_5 / AIN3
I/O
17
P06
P0_6
I/O
18
P07
P0_7
I/O
19
P08
P0_8
I/O
20
P09
P0_9
I/O
21
P10
P0_10
I/O
22
P11
P0_11
I/O
23
P12
P0_12
I/O
24
P13
P0_13
I/O
25
P14
P0_14
I/O
26
P15
P0_15
I/O
27
P16
P0_16
I/O
28
SWDIO
JTAG SWD
I/O
Serial wire debug I/O for debugging and
programming
29
SWCLK
JTAG CLK
I/O
Serial wire debug clock input for debugging and
programming
30
P17
P0_17
I/O
31
P18
P0_18
I/O
32
P19
P0_19
I/O
33
P20
P0_20
I/O

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND04C
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND04C
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
2
Charged Device Model
±1000
V
3.3 Power Consumption
Table 5. Power Consumption
Event
Average Current
Testing Conditions / Remark
Sleeping
1.23 µA
EN disconnected
Broadcast
70.33 µA
Broadcast cycle: 200 ms
Broadcast
28.38 µA
Broadcast cycle: 500 ms
Broadcast
14.02 µA
Broadcast cycle: 1000 ms
Broadcast
7.64 µA
Broadcast cycle: 2000 ms
Broadcast
3.49 µA
Broadcast cycle: 5000 ms
Connection
64.72 µA
Connection cycle: 50 ms
Connection
33.80 µA
Connection cycle: 100 ms

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND04C
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND04C (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND04C
4.4 Reference Design
Figure 7. Reference Design of RF-BM-ND04C

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4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

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which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the
ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.

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4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.8 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s

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Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 9. Recommended Reflow for Lead-Free Solder

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4.10 Optional Packaging
Figure 10. Optional Packaging Mode
Note: Default tray packaging.