RF-Star SimpleLink RF-TI1352B1 CC1352R User manual

RF-TI1352B1 CC1352R SimpleLinkTM High-
Performance Sub-1G + 2.4 G Dual-band Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Apr. 14th, 2020
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-TI1352B1 is an RF module based on TI lower-power SoC CC1352R. It integrates a 48 MHz and a 32.768 kHz crystal,
a 256 KB ROM, a 352 KB Flash, and two IPEXs to guarantee the external antenna connection. Its ARM® Cortex®-M4F
core application processor can operate at extremely low current at flexible power modes. It features small size, robust
connection distance, and rigid reliability. It supports Sub GHz and 2.4 GHz multi-protocol and can be preprogrammed
with a serial interface communication protocol for Thread, ZigBee, BLE5.3 and TI 15.4-Stack (Sub 1GHz). 1.27-mm pitch
stamp stick package for easy assembling and cost-effective PCB design.
1.2 Key Features
•RF Section
- Bluetooth 5.3 Low Energy
- ZigBee, Thread
- IEEE 802.15.4
- IPv6-nabld smart objects (6LoWPAN)
- MIOTY®
- Wireless M-Bus
- Wi-SUN®
- KNX RF
- Amazon Sidewalk
- Proprietary systems
- SimpleLinkTM TI 15.4-Stack (Sub-1 GHz)
- Dynamic Multiprotocol Manager (DDM) driver
•TX power:
- Up to +5 dBm (2.4 GHz) with temperature
compensation
- Up to +14 dBm (Sub-1 GHz) with temperature
compensation
•Excellent receiver sensitivity
- -121 dBm @ Sub-1 GHz (SimpleLink Long-
range Mode)
- -110 dBm @ Sub-1 GHz (50 kbps)
- -105 dBm for Bluetooth 125 kbps (LE coded
PHY)
•Wide Operation Range
- 1.8 V to 3.8 V single power supply
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Microcontroller
- Powerful 48 MHz ARM® Cortex®-M4F
processor
- 2-pin cJTAG and JTAG debugging
- Supports OTA upgrade
•Memory
- 352 KB of in-system programmable flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of Cache SRAM
- 80 KB of ultra-low leakage SRAM
•Ultra-low power sensor controller with 4KB of
SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
•Rich Peripherals
- 28 GPIOs, digital peripherals can be routed
to any GPIOs
- 4× 32-bit or 8× 16-bit general-purpose

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timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2 × comparators with internal reference DAC
(1 × continuous time, 1 × ultra-low power)
- Programmable current source
- 2 × UART
- 2 × SSI (SPI, MICROWIRE, TI)
- I2C
- I2S
- Real-time clock (RTC)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•Security Enablers
- AES 128-bit and 256-bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
•External system
- On-chip buck DC/DC converter
- TCXO support
•Dimension: 26.5 mm × 16.8 mm × 2.2 mm
1.3 Applications
•Home automation
•Smart plug and metering
•Home appliances
•Sensor nodes
•Security systems
•Industrial control
•Wearables
•Building automation
•Sensor networks
•Medical devices
•Gaming controller
•Remote controls

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-TI1352B1
1.5 Part Number Conventions
The part numbers are of the form of RF-TI1352B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-TI1352B1
RF
TI
1352
RF-STAR
Company Name
Chip Manufacturer
TI
Chipset
TI CC1352R
-
B1
Module Version
The First Version
CC1352R
28 GPIOs
Power Filter
48.0 MHz
32.768 kHz
Reset
Sub-1 GHz
Antenna Matching
2.4 GHz
Antenna Matching
IPEX
Connector
IPEX
Connector
Half Hole
Interface
Half-hole
Interface
Power Supply
1.8 V ~ 3.8 V

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
3.3 Pin Functions....................................................................................................................................................... 8
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Reference Design............................................................................................................................................12
4.5 Antenna................................................................................................................................................................13
4.5.1 Antenna Design Recommendation ..............................................................................................13
4.5.2 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................13
4.5.3 IPEX Connector Specification........................................................................................................15
4.6 Basic Operation of Hardware Design ......................................................................................................15
4.7 Trouble Shooting..............................................................................................................................................16
4.7.1 Unsatisfactory Transmission Distance........................................................................................16
4.7.2 Vulnerable Module..............................................................................................................................17
4.7.3 High Bit Error Rate .............................................................................................................................17
4.8 Electrostatics Discharge Warnings ...........................................................................................................17
4.9 Soldering and Reflow Condition.................................................................................................................17
5 Optional Package Specification ..............................................................................................................................19

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6 Revision History ............................................................................................................................................................22
7 Contact Us.......................................................................................................................................................................23

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-TI1352B1
Chipset
CC1352R
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
Sub-1 GHz: 868 MHz ~ 928 MHz
2.4 GHz: 2402 MHz ~ 2480 MHz
Maximum Transmit Power
+14.0 dBm @ Sub-1 GHz
+5.0 dBm @ 2.4 GHz
Receiving Sensitivity
-121 dBm @ Sub-1 GHz (Long-range Mode)
-110 dBm @ Sub-1 GHz (50 kbps)
-104 dBm @ Sub-1 GHz (100 kbps)
-97 dBm @ Bluetooth 5.0 (1 Mbps)
-92 dBm @ Bluetooth 5.0 (2 Mbps)
-105 dBm @ Bluetooth 5.0 (125 kbps LE Coded PHY)
GPIO
28
Flash
352 KB
ROM
256 KB
SRAM
88 KB
Power Consumption
RX current: 5.8 mA @3.6 V, 868 MHz
6.9 mA @3.0 V, 2.4 GHz
TX current: 8.0 mA @ 0 dBm, 3.6 V, 868 MHz
24.9 mA @ +14 dBm, 3.6 V, 868 MHz
7.1 mA @ 0 dBm, 3.0 V, 2.4 GHz
MCU 48 MHz (CoreMark): 2.9 mA (60 μA/MHz)
Sensor Controller: 30.1 μA @ low power mode, 2 MHz, running infinite loop
808 μA @ active mode, 24 MHz, running infinite loop
Standby mode: 0.85 µA
Sleep Mode: 150 nA
Support Protocol
Thread, Zigbee®, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled
smart objects, (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-SUN®, KNX RF,
Amazon Sidewalk, proprietary systems, SimpleLink ™ TI 15.4-Stack (Sub-1

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GHz)
Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (1.27-mm half-hole pitch stamp stick)
Dimension
26.5 mm × 16.8 mm × 2.2 mm
Type of Antenna
IPEX connector, half-hole ANT pin
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃
2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-TI1352B1

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3.3 Pin Functions
Table 2. Pin Functions of RF-TI1352B1
Pin
Name
Chip Pin
Function
Description
1
P03
DIO_3
Digital
GPIO
2
P04
DIO_4
Digital
GPIO
3
P05
DIO_5
Digital
GPIO, high-drive capability
4
P06
DIO_6
Digital
GPIO, high-drive capability
5
P07
DIO_7
Digital
GPIO, high-drive capability
6
P08
DIO_8
Digital
GPIO
7
P09
DIO_9
Digital
GPIO
8
P10
DIO_10
Digital
GPIO
9
P11
DIO_11
Digital
GPIO
10
P12
DIO_12
Digital
GPIO
11
P13
DIO_13
Digital
GPIO
12
P14
DIO_14
Digital
GPIO
13
P15
DIO_15
Digital
GPIO
14
VDD
VDDS
VDD
Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V
15
GND
GND
GND
Ground
16
TMS
JTAG_TMSC
Digital
JTAG TMSC, high-drive capability
17
TCK
JTAG_TCKC
Digital
JTAG TCKC
18
RST
RESET_N
Digital
Reset, active low. Internal pullup.
19
P16
DIO_16
Digital
GPIO, JTAG_TDO, high-drive capability
20
P17
DIO_17
Digital
GPIO, JTAG_TDI, high-drive capability
21
P18
DIO_18
Digital
GPIO
22
P19
DIO_19
Digital
GPIO
23
P20
DIO_20
Digital
GPIO
24
P21
DIO_21
Digital
GPIO
25
P22
DIO_22
Digital
GPIO

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26
P23
DIO_23
Digital or Analog
GPIO, analog capability
27
P24
DIO_24
Digital or Analog
GPIO, analog capability
28
P25
DIO_25
Digital or Analog
GPIO, analog capability
29
P26
DIO_26
Digital or Analog
GPIO, analog capability
30
P27
DIO_27
Digital or Analog
GPIO, analog capability
31
P28
DIO_28
Digital or Analog
GPIO, analog capability
32
P29
DIO_29
Digital or Analog
GPIO, analog capability
33
P30
DIO_30
Digital or Analog
GPIO, analog capability
34
GND
GND
Ground
Ground
35
2G4-OUT
RF Out
2.4 GHz antenna pin out
36
GND
GND
Antenna Ground
Antenna Ground
37
SUB-OUT
RF Out
Sub 1GHz antenna pin out
38
GND
GND
Ground
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-TI1352B1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
3.2 Handling Ratings
Table 4. Handling Ratings of RF-TI1352B1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-TI1352B1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-TI1352B1

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-TI1352B1
4.4 Reference Design
Figure 7. Reference Design of RF-TI1352B1

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4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure that
the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-
quality antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5.2 External Antenna Design Recommendation of the Half-Hole ANT Pin
1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces.
The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to
change layers. More GND vias are placed around the RF traces.

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Figure 9. Reference Design of the External Antenna
Figure 10. Reference Design of the External Antenna Traces
2. The RF trace width and copper-clad spacing can be calculated by SI9000 software, and the impedance is controlled
to 50 Ω according to the actual board thickness, number of layers, plate, dielectric thickness, dielectric constant,
copper thickness, line width, line spacing, and solder mask thickness.
Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is
0.8254 mm, and the spacing between traces and copper is 0.22 mm.
Figure 11. SI9000 Impedance Calculation Diagram

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4.5.3 IPEX Connector Specification
RF-TI1352B1 module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follows:
Figure 12. Specification of Antenna Seat
The specification of the IPEX wire end is as follows:
Figure 13. Specification of IPEX Wire
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power

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supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performances of ground absorption and reflection of radio waves will be poor when the module is tested close
to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.

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5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.8 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly

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Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃~ 235 ℃
230 ℃~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 14. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.