RF-Star RF-BM-ND06 User manual

RF-BM-ND06 Bluetooth 5.0 Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Dec. 06, 2018

RF-BM-ND06
www.szrfstar.comVer1.0 - Dec., 2018
1 Device Overview
1.1 Description
RF-BM-ND06an RF module based on Nordic Bluetooth 5.0 BLE SoC nRF52840-QIAA-R with best-in-class 32-bit
ARM®Cortex®-M4 processor. It integrates a 32.768 kHz and a 32 MHz crystal, a power filter, an antenna matching, and
a meander line inverted-F PCB antenna. It features high-performance digital interfaces, robust connection distance,
and rigid reliability. It supports BLE stack v5.0 and can be preprogrammed with a serial interface communication
protocol for simple programming. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB
design. All pins of RF-BM-ND06 are pulled out.
1.2 Key Features
•Bluetooth 5.0,
-95 dBm conductive sensitivity in BLE mode
-103 dBm sensitivity in 125kbps BLE mode
(long range)
On-air compatible with nRF52, nRF51,
nRF24L and nRF24AP series
Supported data rates:
- Bluetooth ®5: 2 Mbps, 1Mbps, 500kbps
and 125 kbps
Single-ended antenna output (on-chip
balun)
128-bit AES/ECB/CCM/AAR co-processor
(on-the-fly packet encryption)
4.8 mA peak current in TX (0 dBm)
4.6 mA peak current in RX
RSSI (1 dB resolution)
•ARM®Cortex®-M4 32-bit processor with FPU,
64 MHz
212 EEMBC Core Mark score running from
flash memory
52 μA/MHz running from flash memory
Watch point and trace debug modules
(DWT, ETM and ITM)
Serial wire debug (SWD)
•Rich set of security features
ARM®Trust Zone®Cryptocell 310 security
subsystem
Security boot ready
Secure erase
•Flexible power management
Supply voltage range: 1.8 V ~ 5.5 V
Automated peripheral power management
Fast wake-up using 64 MHz internal
oscillator
0.4 μA at 3 V in System OFF mode, no
RAM retention
1.5 μA at 3 V in System On mode, no RAM
retention, wake on RTC
•1 MB flash and 256 kB RAM
•Advanced on-chip interfaces
QSPI 32 MHz interface
High-speed 32 MHz SPI
Type 2 near field communication (NFC-A)
tag with wake-on field
- Touch-to-pair support
Programmable Peripheral interconnect
(PPI)
29 general purpose I/O pins
Easy DMA automated data transfer
between memory and peripherals
•Nordic Soft Device ready with support for
concurrent multi-protocol
•12-bit, 200 ksps ADC - 8 configurable channels
with programmable gain
•64 level comparator
•15 level low-power comparator with wake-up
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from System OFF mode
•Temperature sensor
•4x 4-channel pulse width modulator (PWM)
unit with EasyDMA
•Audio peripherals: I2S, digital microphone
interface (PDM)
•5x 32-bit timer with counter mode
•Up to 4xSPI master/3x SPI slave with
EasyDMA
•Up to 2x I2C compatible 2-wire master/slave
•2xUART (CTS/RTS) with EasyDMA
•Quadrature decoder (QDEC)
•3xreal-time counter (RTC)
1.3 Applications
•Internet of Things (IoT)
•Internet Gateway
•Cloud Connectivity
•Industrial Control
•Home Automation
•Smart Plug and Metering
•Home Appliances
•Wireless Audio
•Access Control
•IP Network Sensor Nodes
•Security Systems
•Wearables
•Building automation
•Retail
•Sensor networks
•Medical devices
•Gaming controller
•Remote controls
1.4 Functional Block Diagram
Confidential
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND06 where the fields are defined as follows:
Figure 1. Part Number Conventions of RF-BM-ND06
RF BM ND
RF-STAR
Company Name
Bluetooth Module
Wireless Type
Chipset Manufacturer
Nordic Semiconductor
--06
Module Version
Version Number
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FCC Statement
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
Integral antenna with antenna gain 0dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
2ABN2-RF-BM-ND06 Or Contains FCC ID: 2ABN2-RF-BM-ND06”
When the module is installed inside another device, the user manual of the host must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
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(2) This device must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described
in the user documentation that comes with the product.
Any company of the host device which install this modular with modular approval should perform the test of
radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 &
15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 &
15.207 ,15B Class B requirement，then the host can be sold legally.
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Table of Contents
1 Device Overview..................................................................................................................................... 1
1.1 Description....................................................................................................................................1
1.2 Key Features................................................................................................................................ 1
1.3 Applications.................................................................................................................................. 2
1.4 Functional Block Diagram........................................................................................................... 2
1.5 Part Number Conventions ..........................................................................................................2
Table of Contents.......................................................................................................................................5
Table of Figures .........................................................................................................................................6
Table of Tables...........................................................................................................................................6
2 Module Configuration and Functions.................................................................................................... 7
2.1 Module Parameters..................................................................................................................... 7
2.2 Module Pin Diagram....................................................................................................................8
2.3 Pin Functions ...............................................................................................................................8
3 Specifications........................................................................................................................................ 10
3.1 Recommended Operating Conditions..................................................................................... 10
3.2 Handling Ratings ....................................................................................................................... 11
3.3 Current Consumption................................................................................................................ 11
4 Application, Implementation, and Layout........................................................................................... 14
4.1 Module Photos........................................................................................................................... 14
4.2 Recommended PCB Footprint................................................................................................. 15
4.3 Schematic Diagram................................................................................................................... 15
4.5 Basic Operation of Hardware Design...................................................................................... 15
4.6 Trouble Shooting........................................................................................................................ 17
4.6.1 Unsatisfactory Transmission Distance.......................................................................... 17
4.6.2 Vulnerable Module.......................................................................................................... 18
4.6.3 High Bit Error Rate.......................................................................................................... 18
4.7 Electrostatics Discharge Warnings.......................................................................................... 18
4.8 Soldering and Reflow Condition............................................................................................... 18
4.9 Optional Packaging................................................................................................................... 19
5 Certification........................................................................................................................................... 19
5.1 RoHS .......................................................................................................................................... 19
6 Revision History.................................................................................................................................... 20
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7 Contact Us............................................................................................................................................. 20
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND06 ..................................................................... 2
Figure 2. Part Number Conventions of RF-BM-ND06....................................................................2
Figure 3. Pin Diagram of RF-BM-ND06...........................................................................................8
Figure 4. Photos of RF-BM-ND06.................................................................................................. 14
Figure 5. Top View of RF-BM-ND06 (mm)..................................................................................... 15
Figure 6. Schematic Diagram of RF-BM-ND06............................................................................. 15
Figure 7. Recommendation of Antenna Layout............................................................................. 17
Figure 8. Recommended Reflow for Lead Free Solder................................................................ 19
Figure 9. Optional Packaging Mode............................................................................................... 19
Figure 10. RoHS Certificate............................................................................................................ 20
Table of Tables
Table 1. Parameters of RF-BM-ND06.............................................................................................. 7
Table 2. Pin Functions of RF-BM-ND06........................................................................................... 8
Table 3. Recommended Operating Conditions of RF-BM-ND06................................................. 10
Table 4. Handling Ratings of RF-BM-ND06................................................................................... 11
Table 5. Current Consumption of RF-BM-ND06 ........................................................................... 11
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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND06
Chipset nRF52840QIAA-R
Supply Power Voltage 1.8 V ~ 5.5 V, recommended to 3.3 V
Frequency 2402 MHz ~ 2480 MHz
Maximum Transmit Power -20.0 dBm ~ +8.0 dBm
Receiving Sensitivity -96 dBm
GPIO 48
Crystal 32 MHz, 32.768 kHz
RAM 256 KB
Flash 1 MB
Package LGAPackaging
Frequency Error ±20 kHz
Dimension 24.0 mm x 20.5 mm x (2.20 ± 0.1) mm
Type of Antenna PCB Antenna
Operating Temperature -20 ℃～+70℃
Storage Temperature -40 ℃～+125 ℃
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2.2 Module Pin Diagram
Figure 2. Pin Diagram of RF-BM-ND06
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND06
Pin Name Chip Pin Pin Type Description
1 P0.12 SIO_12 - -
2 VCC Power 1.7V ~ 3.6V - 1.7V ~ 3.6V
3 VDD_HV Power 2.5V ~ 5.5V - 2.5V ~ 5.5V
4 VDD_USB 4.35V ~ 5.5V - 4.35V ~ 5.5V
5 D- D- Data- USB-
6 D+ D+ Data+ USB+
7 P0.13 GPIO_13 - LED
8 P0.14 GPIO_14 - LED
9 P0.15 GPIO_15 - LED
10 P0.16 GPIO_16 - LED
11 P0.17 GPIO_17 QSPI_CS LED
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12 P0.18 nRESET - System reset (active low)
13 P0.19 GPIO_19 QSPI_CLK -
14 P0.20 GPIO_20 QSPI_DIO0 -
15 P0.21 GPIO_21 QSPI_DIO1 -
16 P0.22 GPIO_22 QSPI_DIO2 -
17 P0.23 GPIO_23 QSPI_DIO3 -
18 P0.24 GPIO_24 - -
19 P0.25 GPIO_25 - -
20 P1.00 GPIO_1.00 - -
21 SWDIO SWDIO - Connect to j - link
22 SWCLK SWCLK - Connect toj - link
23 NFC1 NFC1/SIO_09 - -
24 NFC2 NFC2/SIO_10 - -
25 P1.01 GPIO_1.01 - -
26 P1.02 GPIO_1.02 - -
27 P1.03 nAutoRUN nAutoRUN FTDI USB_DTR via jumper on
J12pin1-2.
28 P1.04 GPIO_1.04 - -
29 P1.05 GPIO_1.05 - -
30 P1.06 GPIO_1.06 - -
31 RF_OUT RF-interface - -
32 P1.07 GPIO_1.07 - -
33 P1.10 GPIO_1.10 - -
34 P1.11 GPIO_1.11 - -
35 P1.12 GPIO_1.12 SPI_CS
36 P1.13 GPIO_1.13 - -
37 P1.14 GPIO_1.14 - -
38 P1.15 GPIO_1.15 - -
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39 P0.03 GPIO_0.03 - Temperature sensor analog
40 P0.02 GPIO_0.02 - Internal pull low. External pull high to
enter into VSP services.
41 P0.28 GPIO_0.28 - -
42 P0.29 GPIO_0.29 - -
43 P0.30 GPIO_0.30 - -
44 P0.31 GPIO_0.31 - -
45 P0.26 GPIO_0.26 I2C_SDA I2C RTC chip. I2C data line
46 P0.27 GPIO_0.27 I2C_SCL I2C RTC chip. I2C clock line.
47 P0.04 GPIO_0.04 SPI_MISO
SPI EEPROM.
SPI_Eeprom_MISO, Input.
SPIOPEN in smartBASIC selects SPI
function; MOSI and CLK are outputs
when in SPI master mode
48 P0.05 GPIO_0.05 UART_RTS
49 P0.06 GPIO_0.06 UART_TX
50 P0.07 GPIO_0.07 UART_CTS
51 P0.08 GPIO_0.08 UART_RX
52 P1.08 GPIO_1.08 SPI_MOSI
53 P1.09 GPIO_1.09 SPI_CLK
3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND06
Items Condition Min. Typ. Max. Unit
Operating Supply Voltage Battery Mode 1.8 3.3 5.5 V
Operating Temperature / -20 +25 +70 ℃
Environmental Hot Pendulum / -20 +20 ℃/min
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Notes:
(1) The operating temperature is limited to the operating temperature range of crystal. The temperature range can be
wider by changing the crystal.
(2) To ensure the RF performance, the ripple wave on the source must be less than ±200 mV.
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND06
Items Condition Min. Typ. Max. Unit
Storage Temperature Tstg -40 +25 +85 ℃
Human Body Model HBM ±2000 V
Moisture Sensitivity Level 2
Charged Device Model ±750 V
Notes:
(1) The storage temperature is limited to the storage temperature range of crystal. The temperature range can be wider
by changing the crystal.
3.3 Current Consumption
The current consumption characteristics of this module are categorized into different running modes. The overall
product level current consumption is averaged over time on different power modes the device runs on. The peripheral
circuitry’s current consumption also adds in.
Table 5. Current Consumption of RF-BM-ND06
Symbol Description Min. Typ. Max. Unit
Current Consumption: Sleep
ION_RAMOFF_EVENT System ON, no RAM retention, wake on any event 0.97 μA
ION_RAMON_EVENT System ON, full 256 kB RAM retention, wake on any event 2.35 μA
ION_RAMON_POF System ON, full 256 kB RAM retention, wake on any event,
power-fail comparator enabled 2.35 μA
ION_RAMON_GPIOTE System ON, full 256 kB RAM retention, wake on GPIOTE
input (event mode) 17.37 μA
ION_RAMON_GPIOTEPORT System ON, full 256 kB RAM retention, wake on GPIOTE
PORT event 2.36 μA
ION_RAMOFF_RTC System ON, no RAM retention, wake on RTC (running from
LFRC clock) 1.50 μA
ION_RAMON_RTC System ON, full 256 kB RAM retention, wake on RTC 3.16 μA
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(running from LFRC clock)
IOFF_RAMOFF_RESET System OFF, no RAM retention, wake on reset 0.40 μA
IOFF_RAMOFF_LPCOMP System OFF, no RAM retention, wake on LPCOMP 0.86 μA
IOFF_RAMON_RESET System OFF, full 256 kB RAM retention, wake on reset 1.86 μA
ION_RAMOFF_EVENT_5V System ON, no RAM retention, wake on any event, 5 V
supply on VDDH, REG0 output = 3.3 V 1.29 μA
IOFF_RAMOFF_RESET_5V System OFF, no RAM retention, wake on reset, 5 V supply
on VDDH, REG0 output = 3.3 V 0.95 μA
Current Consumption: COMP Active
ICOMP,LP COMP enabled, low power mode 30.1 μA
ICOMP,NORM COMP enabled, normal mode 31.8 μA
ICOMP,HS COMP enabled, high-speed mode 35.1 μA
Current Consumption: CPU running
ICPU0
CPU running CoreMark @64 MHz from Flash, Clock =
HFXO, Regulator = DC/DC 3.3 mA
ICPU1
CPU running CoreMark @64 MHz from Flash, Clock =
HFXO 6.3 mA
ICPU2
CPU running CoreMark @64 MHz from RAM, Radio Rx,
Clock = HFXO, Regulator = DC/DC 2.8 mA
ICPU3
CPU running CoreMark @64 MHz from RAM, Radio Rx,
Clock = HFXO 5.2 mA
ICPU4 CPU running CoreMark @64 MHz from flash, Clock =
HFINT, Regulator = DC/DC 3.1 mA
Current Consumption: NFCT Active
Isense Current in sense state 100 nA
Iactivated Current in activated state 400 μA
Current Consumption: Radio Transmitting / Receiving
IRADIO_TX0 Radio transmitting @ 8 dBm output power, 1 Mbps
BLEmode, Clock = HFXO, Regulator = DC/DC 16.4 mA
IRADIO_TX1 Radio transmitting @ 0 dBm output power, 1 Mbps BLE
mode, Clock = HFXO, Regulator = DC/DC 6.4 mA
IRADIO_TX2 Radio transmitting @ -40 dBm output power, 1 Mbps BLE 3.83 mA
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mode, Clock = HFXO, Regulator = DC/DC
IRADIO_TX3 Radio transmitting @ 0 dBm output power, 1 Mbps BLE
mode, Clock = HFXO 10.80 mA
IRADIO_TX4 Radio transmitting @ -40 dBm output power, 1 Mbps BLE
mode, Clock = HFXO 4.82 mA
IRADIO_TX5 Radio transmitting @ 0 dBm output power, 250 kbit/s IEE
802.15.4-2006 mode, Clock = HFXO, Regulator = DC/DC 6.40 mA
IRADIO_RX0 Radio receiving @ 1 Mbps BLE mode, Clock = HFXO,
Regulator = DC/DC 6.26 mA
IRADIO_RX1 Radio receiving @ 1 Mbps BLE mode, Clock = HFXO 10.10 mA
IRADIO_RX2 Radio receiving @ 250 kbit/s IEE 802.15.4-2006 mode,
Clock = HFXO, Regulator = DC/DC 6.53 mA
Current Consumption: RNG Active
IRNG0 RNG running 635 μA
Current Consumption: SAADC Active
ISAADC,RUN SAADC sampling @ 16 ksps, Acquisition time = 20 μs, Clock
= HFXO, Regulator = DC/DC 1.24 mA
Current Consumption: TEMP Active
ITEMP0 TEMP started 1.05 mA
Current Consumption: TIMER Running
ITIMER0 One TIMER instance running @ 1 MHz, Clock = HFINT 418 μA
ITIMER1 Two TIMER instances running @ 1 MHz, Clock = HFINT 418 μA
ITIMER2 One TIMER instance running @ 1 MHz, Clock = HFXO 646 μA
ITIMER3 One TIMER instance running @ 16 MHz, Clock = HFINT 595 μA
ITIMER4 One TIMER instance running @ 16 MHz, Clock = HFXO 823 μA
Current Consumption: WDT Active
IWDT,STARTED WDT started 3.1 μA
Current Consumption: WDT Active
IS0
CPU running CoreMark from flash, Radio transmitting @ 0
dBm output power, 1 Mbps Bluetooth® low energy (BLE)
mode, Clock = HFXO, Regulator = DC/DC
8.1 mA
IS1 CPU running CoreMark from flash, Radio receiving @ 1 8.6 mA
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Mbps BLE mode, Clock = HFXO, Regulator = DC/DC
IS2 CPU running CoreMark from flash, Radio transmitting @ 0
dBm output power, 1 Mbps BLE mode, Clock = HFXO 15.4 mA
IS3 CPU running CoreMark from flash, Radio receiving @ 1
Mbps BLE mode, Clock = HFXO 16.2 mA
IS4
CPU running CoreMark from flash, Radio transmitting @ 0
dBm output power, 1 Mbps BLE mode, Clock = HFXO,
Regulator = DC/DC, 5 V supply on VDDH, REG0 output =
3.3 V
11.9 mA
IS5
CPU running CoreMark from flash, Radio receiving @ 1
Mbps BLE mode, Clock = HFXO, Regulator = DC/DC, 5 V
supply on VDDH, REG0 output = 3.3 V
12.7 mA
4 Application, Implementation, and Layout
4.1 Module Photos
Figure 3. Photos of RF-BM-ND06
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4.2 Recommended PCB Footprint
Figure 4. Top View of RF-BM-ND06 (mm)
4.3 Schematic Diagram
Confidential
Figure 5. Schematic Diagram of RF-BM-ND06
4.5 Basic Operation of Hardware Design
1. It is recommended to offerthe module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine.The module should be far away
from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic
interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power
routing.If it has toroute the wire on the bottom of module, for example, it is assumed that the module is soldered to
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the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to
the digital part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to somedegrees;
6. Assuming that there are devices with large electromagnetic interference around the module,which will greatly affect
themodule performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same2.4 GHzphysical layer, for
example: USB3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of
antenna is a key factor to increase the data rate and transmission range.
Therefore,the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge(corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module is
minimally affected.
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Figure 6. Recommendation of Antenna Layout
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly
weakened.Temperature, humidity, and co-channel interference will lead to an increase in communication packet
loss rate.The performances of ground absorption andreflectionof radio waves will be poor, when the module is
tested close to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or themodule is placed inside of the
metal shell.
4. The incorrect power register set or the high data ratein an open air may shorten the communication distance.The
higher the data rate, the closer the distance.
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5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supplyand no frequently
fluctuatedvoltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and
application.If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There areco-channel signal interferences nearby.It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3
precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent methods.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
6. Peak temperature: 245 ℃.
Shenzhen RF-star Technology Co., Ltd. Page 18 of 21

RF-BM-ND06
www.szrfstar.comVer1.0 - Dec., 2018
Figure 7. Recommended Reflow for Lead Free Solder
4.9 Optional Packaging
Figure 8. Optional Packaging Mode
Note: Default tray packaging.
5 Certification
5.1 RoHS
RoHS Report No.: BLA-C-201811-A05-01
Shenzhen RF-star Technology Co., Ltd. Page 19 of 21